JP6910723B2 - 研削方法 - Google Patents

研削方法 Download PDF

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Publication number
JP6910723B2
JP6910723B2 JP2017159527A JP2017159527A JP6910723B2 JP 6910723 B2 JP6910723 B2 JP 6910723B2 JP 2017159527 A JP2017159527 A JP 2017159527A JP 2017159527 A JP2017159527 A JP 2017159527A JP 6910723 B2 JP6910723 B2 JP 6910723B2
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JP
Japan
Prior art keywords
grinding
holding
workpiece
holding surface
grinding wheel
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Active
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JP2017159527A
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English (en)
Japanese (ja)
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JP2019038044A (ja
Inventor
俊幸 立石
俊幸 立石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2017159527A priority Critical patent/JP6910723B2/ja
Priority to CN201810927965.3A priority patent/CN109420937A/zh
Priority to KR1020180095339A priority patent/KR102554989B1/ko
Priority to TW107128811A priority patent/TWI760551B/zh
Publication of JP2019038044A publication Critical patent/JP2019038044A/ja
Application granted granted Critical
Publication of JP6910723B2 publication Critical patent/JP6910723B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2017159527A 2017-08-22 2017-08-22 研削方法 Active JP6910723B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017159527A JP6910723B2 (ja) 2017-08-22 2017-08-22 研削方法
CN201810927965.3A CN109420937A (zh) 2017-08-22 2018-08-15 磨削方法
KR1020180095339A KR102554989B1 (ko) 2017-08-22 2018-08-16 연삭 방법
TW107128811A TWI760551B (zh) 2017-08-22 2018-08-17 研削方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017159527A JP6910723B2 (ja) 2017-08-22 2017-08-22 研削方法

Publications (2)

Publication Number Publication Date
JP2019038044A JP2019038044A (ja) 2019-03-14
JP6910723B2 true JP6910723B2 (ja) 2021-07-28

Family

ID=65514536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017159527A Active JP6910723B2 (ja) 2017-08-22 2017-08-22 研削方法

Country Status (4)

Country Link
JP (1) JP6910723B2 (ko)
KR (1) KR102554989B1 (ko)
CN (1) CN109420937A (ko)
TW (1) TWI760551B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7222797B2 (ja) * 2019-04-09 2023-02-15 株式会社ディスコ クリープフィード研削方法
JP7325357B2 (ja) * 2020-02-25 2023-08-14 三菱電機株式会社 半導体装置の製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3290455B2 (ja) * 1991-05-13 2002-06-10 積水化学工業株式会社 管端部の研削方法、それに用いられる研削装置及び研削量調整装置
JPH1170447A (ja) * 1997-08-28 1999-03-16 Nippon Seiko Kk 工作物の面の研削方法
JP4154067B2 (ja) 1999-04-06 2008-09-24 株式会社ディスコ 研削装置
KR100753302B1 (ko) * 2004-03-25 2007-08-29 이비덴 가부시키가이샤 진공 척, 흡착판, 연마 장치 및 반도체 웨이퍼의 제조 방법
JP4703141B2 (ja) * 2004-07-22 2011-06-15 株式会社荏原製作所 研磨装置、基板処理装置、基板飛び出し検知方法
JP2006305713A (ja) * 2005-03-28 2006-11-09 Nikon Corp 吸着装置、研磨装置、半導体デバイス及び半導体デバイス製造方法
JP5149020B2 (ja) * 2008-01-23 2013-02-20 株式会社ディスコ ウエーハの研削方法
JP2011189411A (ja) * 2010-03-11 2011-09-29 Renesas Electronics Corp ウェハ研削装置、ウェハ研削方法、ウェハ研削プログラム、及び、ウェハ研削制御装置
JP5912311B2 (ja) * 2011-06-30 2016-04-27 株式会社ディスコ 被加工物の研削方法
CN202398851U (zh) * 2011-11-28 2012-08-29 延锋彼欧汽车外饰系统有限公司 一种汽车外饰用钻孔装置
JP2013255964A (ja) * 2012-06-13 2013-12-26 Komatsu Ntc Ltd 研削加工装置および研削加工装置の制御方法
JP2015199153A (ja) * 2014-04-07 2015-11-12 株式会社ディスコ 保持テーブル、該保持テーブルを用いた研削方法及び切削方法
JP2016092281A (ja) * 2014-11-07 2016-05-23 株式会社ディスコ 表面加工装置
JP6441056B2 (ja) * 2014-12-10 2018-12-19 株式会社ディスコ 研削装置
JP6457275B2 (ja) * 2015-01-21 2019-01-23 株式会社ディスコ 研削装置
CN210163336U (zh) 2015-06-12 2020-03-20 Ａｇｃ株式会社 玻璃板、显示装置和车辆用透明部件
CN204771964U (zh) * 2015-07-22 2015-11-18 中国石油集团渤海石油装备制造有限公司 一种高精度超声波探头耦合套自动磨削装置
JP6576747B2 (ja) * 2015-09-03 2019-09-18 株式会社ディスコ 研削装置
JP6654850B2 (ja) * 2015-10-13 2020-02-26 株式会社ディスコ 加工装置
CN105538087A (zh) * 2015-12-04 2016-05-04 天津津航技术物理研究所 一种多功能球面光学元件数控铣磨工装
TWM532337U (zh) * 2016-07-11 2016-11-21 Gallant Prec Machining Co Ltd 彈性平面研磨設備
CN206047807U (zh) * 2016-08-19 2017-03-29 兴科电子(东莞)有限公司 一种手机壳打磨机
CN206154102U (zh) * 2016-08-25 2017-05-10 兴科电子科技有限公司 一种打磨治具

Also Published As

Publication number Publication date
TWI760551B (zh) 2022-04-11
KR20190021164A (ko) 2019-03-05
KR102554989B1 (ko) 2023-07-12
TW201912306A (zh) 2019-04-01
JP2019038044A (ja) 2019-03-14
CN109420937A (zh) 2019-03-05

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