CN109420937A - 磨削方法 - Google Patents

磨削方法 Download PDF

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Publication number
CN109420937A
CN109420937A CN201810927965.3A CN201810927965A CN109420937A CN 109420937 A CN109420937 A CN 109420937A CN 201810927965 A CN201810927965 A CN 201810927965A CN 109420937 A CN109420937 A CN 109420937A
Authority
CN
China
Prior art keywords
grinding
retaining surface
machined object
ground
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810927965.3A
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English (en)
Chinese (zh)
Inventor
立石俊幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN109420937A publication Critical patent/CN109420937A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201810927965.3A 2017-08-22 2018-08-15 磨削方法 Pending CN109420937A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017159527A JP6910723B2 (ja) 2017-08-22 2017-08-22 研削方法
JP2017-159527 2017-08-22

Publications (1)

Publication Number Publication Date
CN109420937A true CN109420937A (zh) 2019-03-05

Family

ID=65514536

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810927965.3A Pending CN109420937A (zh) 2017-08-22 2018-08-15 磨削方法

Country Status (4)

Country Link
JP (1) JP6910723B2 (ko)
KR (1) KR102554989B1 (ko)
CN (1) CN109420937A (ko)
TW (1) TWI760551B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7222797B2 (ja) * 2019-04-09 2023-02-15 株式会社ディスコ クリープフィード研削方法
JP7325357B2 (ja) * 2020-02-25 2023-08-14 三菱電機株式会社 半導体装置の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523958A (ja) * 1991-05-13 1993-02-02 Sekisui Chem Co Ltd 管端部の研削方法、それに用いられる研削装置及び研削量調整装置
CN202398851U (zh) * 2011-11-28 2012-08-29 延锋彼欧汽车外饰系统有限公司 一种汽车外饰用钻孔装置
CN204771964U (zh) * 2015-07-22 2015-11-18 中国石油集团渤海石油装备制造有限公司 一种高精度超声波探头耦合套自动磨削装置
CN105538087A (zh) * 2015-12-04 2016-05-04 天津津航技术物理研究所 一种多功能球面光学元件数控铣磨工装
CN206047807U (zh) * 2016-08-19 2017-03-29 兴科电子(东莞)有限公司 一种手机壳打磨机
CN206154102U (zh) * 2016-08-25 2017-05-10 兴科电子科技有限公司 一种打磨治具

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1170447A (ja) * 1997-08-28 1999-03-16 Nippon Seiko Kk 工作物の面の研削方法
JP4154067B2 (ja) 1999-04-06 2008-09-24 株式会社ディスコ 研削装置
KR100753302B1 (ko) * 2004-03-25 2007-08-29 이비덴 가부시키가이샤 진공 척, 흡착판, 연마 장치 및 반도체 웨이퍼의 제조 방법
JP4703141B2 (ja) * 2004-07-22 2011-06-15 株式会社荏原製作所 研磨装置、基板処理装置、基板飛び出し検知方法
JP2006305713A (ja) * 2005-03-28 2006-11-09 Nikon Corp 吸着装置、研磨装置、半導体デバイス及び半導体デバイス製造方法
JP5149020B2 (ja) * 2008-01-23 2013-02-20 株式会社ディスコ ウエーハの研削方法
JP2011189411A (ja) * 2010-03-11 2011-09-29 Renesas Electronics Corp ウェハ研削装置、ウェハ研削方法、ウェハ研削プログラム、及び、ウェハ研削制御装置
JP5912311B2 (ja) * 2011-06-30 2016-04-27 株式会社ディスコ 被加工物の研削方法
JP2013255964A (ja) * 2012-06-13 2013-12-26 Komatsu Ntc Ltd 研削加工装置および研削加工装置の制御方法
JP2015199153A (ja) * 2014-04-07 2015-11-12 株式会社ディスコ 保持テーブル、該保持テーブルを用いた研削方法及び切削方法
JP2016092281A (ja) * 2014-11-07 2016-05-23 株式会社ディスコ 表面加工装置
JP6441056B2 (ja) * 2014-12-10 2018-12-19 株式会社ディスコ 研削装置
JP6457275B2 (ja) * 2015-01-21 2019-01-23 株式会社ディスコ 研削装置
CN210163336U (zh) 2015-06-12 2020-03-20 Ａｇｃ株式会社 玻璃板、显示装置和车辆用透明部件
JP6576747B2 (ja) * 2015-09-03 2019-09-18 株式会社ディスコ 研削装置
JP6654850B2 (ja) * 2015-10-13 2020-02-26 株式会社ディスコ 加工装置
TWM532337U (zh) * 2016-07-11 2016-11-21 Gallant Prec Machining Co Ltd 彈性平面研磨設備

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523958A (ja) * 1991-05-13 1993-02-02 Sekisui Chem Co Ltd 管端部の研削方法、それに用いられる研削装置及び研削量調整装置
CN202398851U (zh) * 2011-11-28 2012-08-29 延锋彼欧汽车外饰系统有限公司 一种汽车外饰用钻孔装置
CN204771964U (zh) * 2015-07-22 2015-11-18 中国石油集团渤海石油装备制造有限公司 一种高精度超声波探头耦合套自动磨削装置
CN105538087A (zh) * 2015-12-04 2016-05-04 天津津航技术物理研究所 一种多功能球面光学元件数控铣磨工装
CN206047807U (zh) * 2016-08-19 2017-03-29 兴科电子(东莞)有限公司 一种手机壳打磨机
CN206154102U (zh) * 2016-08-25 2017-05-10 兴科电子科技有限公司 一种打磨治具

Also Published As

Publication number Publication date
TWI760551B (zh) 2022-04-11
KR20190021164A (ko) 2019-03-05
KR102554989B1 (ko) 2023-07-12
TW201912306A (zh) 2019-04-01
JP2019038044A (ja) 2019-03-14
JP6910723B2 (ja) 2021-07-28

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Application publication date: 20190305

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