CN109420937A - Method for grinding - Google Patents
Method for grinding Download PDFInfo
- Publication number
- CN109420937A CN109420937A CN201810927965.3A CN201810927965A CN109420937A CN 109420937 A CN109420937 A CN 109420937A CN 201810927965 A CN201810927965 A CN 201810927965A CN 109420937 A CN109420937 A CN 109420937A
- Authority
- CN
- China
- Prior art keywords
- grinding
- retaining surface
- machined object
- ground
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
Abstract
Method for grinding is provided, the machined object of the warpage with paddy shape is ground, have following steps: detecting step detects the shape for the machined object to be ground；Retaining surface is ground step, the grinding emery wheel rotation for making the shape according to machined object and rotary shaft being made to have tilted defined angle relative to vertical direction, and keep the holding workbench with retaining surface mobile to be ground using grinding emery wheel to retaining surface on the direction parallel with retaining surface, the curved shape of paddy shape is formed in retaining surface；Step is kept, machined object is positioned in the retaining surface for keeping workbench, attracting holding is carried out to machined object using holding workbench；With grinding step, make according to the shape of machined object detected in detecting step and makes rotary shaft relative to grinding emery wheel rotation inclined vertically, and make that workbench is kept to move on the direction of the moving direction along the holding workbench in retaining surface grinding step, to be ground to machined object.
Description
Technical field
The present invention relates to the method for grinding being ground to the machined object with warpage.
Background technique
Multiple devices are provided on the substrate of the plates such as package substrate or semiconductor wafer.When to substrate progress thinning
And device chip when cutting off, after forming each thinning.In the process for carrying out thinning to device chip, using with to the base
The grinding attachment of holding workbench and the grinding unit that the substrate is ground that plate is kept.In this grinding device,
The substrate being maintained on the holding workbench is ground using the grinding unit.The upper surface of the holding workbench is pair
The retaining surface that the substrate is kept.
When being ground to the substrate, the substrate after grinding is set to become uniform thick using workbench is kept
Degree, retaining surface of the holding workbench for example with the side view for being formed as circular cone, the circular cone have the side of minimum gradient
(referring to patent document 1).When using the holding workbench, grinding trace can be left on the ground face of the substrate by being able to suppress
Grinding burn or the substrate damage.
The grinding unit includes main shaft, substantially parallel with vertical direction；Mounting base is taken turns, is configured under the main shaft
End；And grinding emery wheel, it is mounted on the lower surface of the wheel mounting base.Along periphery on the lower surface of the grinding emery wheel
The mode of arrangement is equipped with grinding grinding tool.
When being ground to the substrate, for example, rotating the main shaft and rotating the grinding emery wheel, and make the holding
Worktable rotary makes the grinding unit to movement below vertical direction.Then, when the grinding grinding tool for being installed on the grinding emery wheel
When being contacted with the substrate, which is ground.Make to be configured in this way and keeps processing unit decline above workbench and right
The method that machined object is ground also referred to as cuts the grinding of (infeed) formula.
The grinding attachment the holding workbench top for example configured with porous part.Including the holding workbench
Portion has attraction road, and one end of the attraction road is connected to the porous part, and the other end of the attraction road is connect with source is attracted.When
The machined objects such as the substrate are positioned on the porous part and acts the attraction source and passes through the attraction road and be somebody's turn to do
When porous part is to the machined object negative pressure, which is attracted to maintain on keeping workbench.
Patent document 1: Japanese Unexamined Patent Publication 2000-288881 bulletin
For example, the package substrate of multiple devices comprising being covered with by resin can be sometimes with the side for being formed with the resin
Inside is in paddy shape warpage.Due to being ground using the package substrate of the warpage with paddy shape as machined object to the resin,
So when the package substrate to be positioned in the retaining surface so that the resin exposes upwards, it can be in the retaining surface and the encapsulation
Gap is generated between substrate.
In order to by the machined object suitably attracting holding in the retaining surface, it is necessary to the machined object is suitably acted on
Negative pressure.However, negative pressure can be from the clearance leakage when generating gap in this way between the retaining surface and the machined object
And it is difficult to carry out attracting holding.If suitably attracting holding can not be carried out to the machined object, mill can not be appropriately carried out
It cuts.
Summary of the invention
The present invention is completed in view of the problem, it is intended that providing can be to the machined object with warpage
The method for grinding for suitably carrying out attracting holding and being ground.
According to one method of the present invention, method for grinding is provided, the machined object of the warpage with paddy shape is ground,
It is characterized in that, the method for grinding has following step: detecting step examines the shape for the machined object to be ground
It surveys；Retaining surface is ground step, make according to the shape of machined object detected in the detecting step and make rotary shaft relative to
Vertical direction has tilted the grinding emery wheel rotation of defined angle, and the grinding emery wheel is located in defined height and position,
And make the holding workbench with the retaining surface kept to machined object from the peripheral side of the grinding emery wheel according in the mill
The mode that the underface of skiving wheel is passed through relatively moves on the direction parallel with the retaining surface, to utilize the grinding emery wheel
The retaining surface is ground and is formed in the retaining surface curved shape of paddy shape；Step is kept, the retaining surface is being implemented
It is ground after step, it should in the way of making the shape of the machined object match with the curved shape for being formed by the retaining surface
Machined object is positioned in the retaining surface, and carries out attracting holding to machined object using the holding workbench；And grinding step
Suddenly, after implementing the holding step, make to make to rotate according to the shape of the machined object detected in the detecting step
The grinding emery wheel rotation that axis has been tilted relative to vertical direction, and the grinding emery wheel is located in defined height and position,
And make to remain the holding workbench of the machined object from the peripheral side of the grinding emery wheel according to the grinding emery wheel just under
The mode just passed through relatively is moved on the direction of the moving direction along the holding workbench in retaining surface grinding step
It is dynamic, to be ground to machined object.
Also, another mode according to the present invention, provides method for grinding, to the machined object of the warpage with paddy shape into
Row grinding, which is characterized in that the method for grinding has following step: detecting step, to the shape for the machined object to be ground
It is detected；Retaining surface is ground step, makes to make rotary shaft according to the shape of the machined object detected in the detecting step
The retaining surface grinding emery wheel rotation of defined angle has been tilted relative to vertical direction, and the retaining surface is used and is ground emery wheel
It is located in defined height and position, and makes the holding workbench with the retaining surface kept to machined object from the holding
The peripheral side of face grinding emery wheel is in the way of the underface process in retaining surface grinding emery wheel flat with the retaining surface
Relatively moved on capable direction, thus using the retaining surface with grinding emery wheel to the retaining surface be ground and in the retaining surface
The upper curved shape for forming paddy shape；Step is kept, after implementing retaining surface grinding step, according to making the machined object
The machined object is positioned in the retaining surface by shape with the mode that the curved shape for being formed by the retaining surface matches, and is utilized
The holding workbench carries out attracting holding to machined object；And grinding step makes basis after implementing the holding step
The shape of the machined object detected in the detecting step and this for having tilted rotary shaft relative to vertical direction is processed
Object grinding emery wheel rotation, and the machined object is located in defined height and position with grinding emery wheel, and make to remain this
The holding workbench of machined object is from the peripheral side of machined object grinding emery wheel according in machined object grinding mill
The mode that the underface of wheel is passed through is on the direction of the moving direction along the holding workbench in retaining surface grinding step
It relatively moves, to be ground to machined object.
It is tilted relative to vertical direction when making to be ground emery wheel and makes the holding workbench according to the grinding emery wheel in rotation
The mode passed through of lower section when relatively moving, keep the retaining surface of workbench ground and formed with the most lower of the grinding emery wheel
The passed through region of point is the curved shape of the paddy shape of the lowest point.In the method for grinding of one embodiment of the present invention, to paddy
The shape of the machined object of the warpage of shape detect and set according to the shape of the machined object inclination of grinding emery wheel, because
This curved shape for being formed in the paddy shape of the retaining surface is shape similar in shape with the machined object.
When the machined object is positioned in this in such a way that the shape of the shape of the machined object and the retaining surface matches
When in retaining surface, the gap between the retaining surface and the machined object is minimum.Then, utilize the holding workbench to this when desired
Machined object carry out attracting holding when negative pressure be not easy to leak, therefore the machined object by suitably attracting holding in the holding work
Make on platform.
Later, the grinding emery wheel is made to tilt and rotate relative to vertical direction in the same manner as when forming the retaining surface, and
And making the holding workbench by when relatively moving in the way of the lower section of the grinding emery wheel is passed through, the machined object is along guarantor
The shape for holding face is suitably ground.In addition, this make the holding workbench by such a way that the lower section of the grinding emery wheel is passed through
The method for relatively moving and being ground to machined object is referred to as creep feed (creep feed) grinding.
Therefore, according to one method of the present invention, the machined object with warpage can suitably be attracted by providing
The method for grinding for keeping and being ground.
Detailed description of the invention
(A) of Fig. 1 is the top view for schematically showing the face side of package substrate, and (B) of Fig. 1 is to schematically show
The top view of the back side of package substrate, (C) of Fig. 1 are the side views for schematically showing the package substrate.
Fig. 2 is the perspective view for schematically showing grinding attachment.
(A) of Fig. 3 is the side for schematically showing the detecting step detected to the shape of the face side of package substrate
View, (B) of Fig. 3 are the side views for schematically showing the detecting step detected to the shape of the back side of package substrate
Figure.
(A) of Fig. 4 is the cross-sectional view for schematically showing retaining surface grinding step, and (B) of Fig. 4 is to schematically show guarantor
The top view of face grinding step is held, (C) of Fig. 4 is to schematically show to be ground the holding that step is ground by retaining surface
The cross-sectional view in face.
(A) of Fig. 5 is to schematically show the cross-sectional view for keeping step, and (B) of Fig. 5 is to schematically show grinding step
Cross-sectional view.
Label declaration
1: package substrate；1a: front；1b: the back side；1c: the 2 direction；1d: the 1 direction；3: metal frame；5: platform；7: electricity
Pole pad；9: resin；11: label；2: grinding attachment；4: device base station；4a: opening；6: chuck table；6a: retaining surface；
6b: attraction road；8:X axis mobile work platform；10: carrying-in/carrying-out region；12: machining area；14: grinding unit；16: supporting part；
18:Z axis rail；20:Z axis movable plate；22:Z axis ball-screw；24:Z axis pulse motor；26: main shaft shell；28: main shaft；
28a: wheel mounting base；30: grinding emery wheel；30a: grinding wheel inclination change mechanism；32: grinding grinding tool；34: distance measuring unit；36: carrying
Set face.
Specific embodiment
It is illustrated referring to embodiment of the attached drawing to a mode of the invention.The method for grinding of present embodiment is added
Work object is, for example, the base made of the materials such as materials or sapphire, glass, quartz such as silicon, SiC (silicon carbide), other semiconductors
Plate.Alternatively, the machined object is the package substrate covered using resin to device.
It is for example clathrate on the machined object to be set with cutting preset lines, in each area divided by the cutting preset lines
Device is provided in domain.The machined object for being formed with device is carried out being ground thinning by the method for grinding of present embodiment,
When cutting off the machined object along the cutting preset lines, it is capable of forming each slim device chip.
Hereinafter, using by package substrate as being illustrated to present embodiment in case where machined object.(A) of Fig. 1
It is the positive top view for schematically showing package substrate, (B) of Fig. 1 is to schematically show the back side of package substrate to bow
View.(C) of Fig. 1 is the side view for schematically showing package substrate.Package substrate 1 includes metal frame 3, the metal frame
3 are formed as a generally rectangular in plan view.Metal frame 3 is such as the made of metal as 42 alloys (alloy of iron and nickel) or copper
At.
As shown in (B) of Fig. 1, multiple 5 are configured in the back side side 1b of package substrate 1.In the face side (encapsulation of platform 5
The positive side 1a of substrate 1), by with each 5 it is Chong Die in a manner of be provided with IC (Integrated Circuit: integrated circuit), LSI
Devices (not shown) such as (Large Scale Integration: large-scale integrated).It is equipped on package substrate 1 by the device
The resin 9 of part sealing.Resin 9 is formed as defined thickness, and the resin 9 is prominent from metal frame 3 in a thickness direction.At each
On 5, device is covered by resin 9.
Multiple electrodes pad 7 is equipped in rectangular around each 5.The face side of each electrode pad 7 is covered by resin 9
Lid, and the back side of each electrode pad 7 is exposed.Before forming resin 9, the electrode is welded by metal wire (not shown) etc.
Disk 7 is connect with each electrode of each device.Electrode pad 7 positioned at the position clamped by two adjacent devices it is adjacent with this two
A device connection.When package substrate 1 is cut and forms each device chip, which is disconnected and becomes each
The electrode terminal of device chip.
Label 11 is formed in the back side side 1b of package substrate 1.The label 11 is used for as when cutting off package substrate 1
Make the mark for processing unit and defined aligned in position come using.When between pair of marks 11 according to each electrode pad 7 will
When resin 9 is cut off, each device chip is formed.That is, each row and each column that multiple electrodes pad 7 is arranged are turned off preset lines.
Then, using Fig. 2 to being ground from the positive side 1a to package substrate 1 to form slim device chip
Grinding attachment is illustrated.Fig. 2 is the perspective view for schematically showing an example of grinding attachment.
The upper surface of the device base station 4 of grinding attachment 2 is provided with opening 4a.There is the mobile work of X-axis in opening 4a
Make platform 8, the holding workbench 6 for carrying out attracting holding to machined object is placed in the upper surface of the X-axis moving table 8.The X
Axis mobile work platform 8 can be moved in the X-axis direction by X-direction mobile mechanism (not shown).The X-axis moving table 8
It is positioned in carrying-in/carrying-out region 10 and machining area 12, wherein mobile by the X-direction in the carrying-in/carrying-out region 10
Machined object loads and unloads on keeping workbench 6 in mechanism, in the machining area 12 to attracting holding on the holding workbench 6
Machined object carries out grinding.
It is equipped with porous part in the upper surface of the holding workbench 6, which has and the machined object
The corresponding upper surface of flat shape, the upper surface of the porous part becomes the retaining surface kept to the machined object
6a.The holding workbench 6 has attraction road 6b (referring to (A) etc. of Fig. 4), one end of attraction road 6b and the Porous internal
Members, the other end are connect with attraction source (not shown).When acting the attraction source, to being positioned in retaining surface 6a
On machined object negative pressure, the machined object be attracted to maintain keep workbench 6 on.Also, 6 energy of holding workbench
It is enough to be rotated around the axis vertical with retaining surface 6a.
The grinding unit 14 processed to the machined object is equipped in the top of the machining area 12.In device base station
4 rear side setting is provided with supporting part 16, supports grinding unit 14 by the supporting part 16.In the front surface of supporting part 16
On be provided with a pair of of the Z axis guide rail 18 extended in the Z-axis direction, Z axis movable plate 20 is mounted on each Z in a manner of it can slide
On axis rail 18.
It is provided with nut portions (not shown) in the back side (back-surface side) of Z axis movable plate 20, the nut portions and is parallel to Z
The Z axis ball-screw 22 of axis rail 18 screws togather.The one end and Z axis pulse motor 24 of Z axis ball-screw 22 link.If sharp
Rotate Z axis ball-screw 22 with Z axis pulse motor 24, then Z axis movable plate 20 is along Z axis guide rail 18 in Z-direction
Upper movement.
The grinding unit 14 for implementing the grinding of machined object is fixed in the front-surface side lower part of Z axis movable plate 20.
If moving Z axis movable plate 20 in the Z-axis direction, grinding unit 14 can move in the Z-axis direction.
Grinding unit 14 includes main shaft 28, is rotated by the motor linked with base end side；It is ground emery wheel
30, it is mounted on the front end side of the main shaft 28, is rotated with the rotation of the main shaft 28；And grinding grinding tool 32, configuration exist
On the lower surface of the grinding emery wheel 30.The motor configures in main shaft shell 26.
The grinding unit 14 and grinding wheel inclination change mechanism 30a link.The grinding wheel inclination change mechanism 30a have make the mill
Main shaft 28 and the grinding emery wheel 30 for cutting unit 14 are tilted defined in XZ plane (plane comprising X-direction and Z-direction)
The function of angle.For example, main shaft 28 is set as original state along the state of Z axis (vertical direction), which changes machine
Structure 30a tilts the main shaft 28 towards X-direction.
When carrying out grinding in the grinding attachment 2, carrying-region is moved out firstly, machined object is positioned in be positioned at
On the retaining surface 6a of the holding workbench 6 in domain 10, by machined object attracting holding on the holding workbench 6, and make to keep work
Make platform 6 and is moved to machining area 12.Then, which is made by grinding wheel inclination change mechanism 30a
Emery wheel 30) relative to angle as defined in vertical direction inclination, so that Z axis movable plate 20 is moved in the Z-axis direction and emery wheel will be ground
30 are located in defined height and position.
Then, it rotates the main shaft 28 and makes to be ground the rotation of emery wheel 30, make the holding workbench 6 according in grinding emery wheel 30
The mode passed through of lower section 16 side of supporting part of grinding attachment 2 is moved to along X-direction.Lower end and quilt when grinding grinding tool 32
When machining object contacts, the machined object is ground.It is this to pass through the holding workbench 6 according in the lower section of the grinding emery wheel 30
Mode relatively move and the method that is ground to machined object is referred to as creep feed (creep feed) grinding.
Here, when the short side direction of package substrate 1 is set as the 1st direction 1d, longitudinal direction is set as the 2nd direction 1c when, such as
Shown in (C) of Fig. 1, package substrate 1 is in paddy shape by inside of the positive side 1a from the side comprising the 1st direction 1d sometimes
Warpage.
In the case where the package substrate 1 has warpage, filled as machined object using grinding when by the package substrate 1
When setting 2 and being ground from the positive side 1a, it is not easy to by the package substrate 1 suitably attracting holding on keeping workbench 6.This is
Because when being positioned in the package substrate 1 with warpage on holding workbench 6, due in retaining surface 6a and the package substrate
Gap is generated between 1, so negative pressure also can be from the clearance leakage even if acting the attraction source for keeping workbench 6.
Therefore, in the method for grinding of present embodiment, in advance to the retaining surface 6a implementation creep feed mill for keeping workbench 6
It cuts, retaining surface 6a is processed into the shape to match with the warpage of package substrate 1.Hereinafter, to the method for grinding of present embodiment into
Row explanation.
In the method for grinding of present embodiment, examinations step detects the shape for the machined object to be ground.Fig. 3
(A) be to schematically show the detection step detected to the shape of the positive side 1a of the package substrate 1 as machined object
Rapid side view, (B) of Fig. 3 be schematically show to the shape of the back side side 1b of the package substrate 1 as machined object into
The side view of the detecting step of row detection.By distance measuring unit 34 come examinations step, which has pair
It is placed in the function that the shape of the machined object of mounting surface 36 is detected.
The mounting surface 36 is flat face, to be positioned in this by the distance measuring unit 34 come the measured object for detecting shape
In mounting surface 36.The distance measuring unit 34 is, for example, laser rangefinder.The distance measuring unit 34 is to being placed in mounting surface 36
Measured object irradiate laser beam, and the laser beam for being reflected by the measured object and being reached the distance measuring unit 34 is examined
It surveys.It can play the time until the laser beam reaches the distance measuring unit 34 according to from starting to irradiate laser beam and measure from this
Distance of the distance measuring unit 34 until measured object.
The entire upper surface for making the laser beam flying measured object, find out each point of the upper surface height (away from this away from
With a distance from measuring appliance 34), so as to detect the measured object upper surface shape.
In addition, the distance measuring unit is also possible to the height-gauge of contact.It is contact in the distance measuring unit
In the case where height-gauge, when making the upper of the measuring head (not shown) for the lower end for being configured at the distance measuring unit and measured object
When surface contacts, it can measure by the height of contact site.
Grinding attachment 2 also can have distance measuring unit 34, in this case, by grinding attachment 2 come examinations step
Suddenly.In addition, in the case where grinding attachment 2 does not have distance measuring unit 34, external in grinding attachment 2 implements detection step
Suddenly.
In detecting step, as shown in (A) of Fig. 3, firstly, according to make the back side side 1b downward, keep positive 1a upward
Package substrate 1 as machined object is positioned in mounting surface 36 by the mode just exposed.Then, make distance measuring unit 34 at this
The top of package substrate 1 is scanned, and the height of each point of the positive 1a of the package substrate 1 is detected by the distance measuring unit 34
Degree.Thus, it is possible to detect the shape of the positive 1a of the package substrate 1.
In addition, in detecting step, as shown in (B) of Fig. 3, can also according to make the positive side 1b downward, make the back side
Package substrate 1 is positioned in mounting surface 36 by the mode that 1b exposes upwards, and detects the envelope by the distance measuring unit 34
Fill the shape of the back side 1b of substrate 1.
In the method for grinding of present embodiment, implement retaining surface and be ground step, using grinding emery wheel 30 to grinding attachment 2
Holding workbench 6 be ground and form the bending with paddy shape similar in the shape of the package substrate 1 on retaining surface 6a
Shape.(A) of Fig. 4 is the cross-sectional view for schematically showing retaining surface grinding step, and (B) of Fig. 4 is to schematically show holding
The top view of face grinding step.
In aftermentioned holding step, which is positioned in and is kept on workbench 6.It is ground and walks in the retaining surface
In rapid, the curved shape of paddy shape similar in the shape with the package substrate 1 is formed on retaining surface 6a, to keep step
In do not generate gap between the package substrate 1 and retaining surface 6a.
In retaining surface grinding step, according to the shape of the package substrate 1 detected in the detecting step, mill is utilized
Wheel inclination change mechanism 30a makes the grinding emery wheel 30 tilt defined angle.That is, making main shaft 28 relative to vertical direction (Z axis side
To) inclination.Then, which is located in defined height and position, the main shaft 28 is made to rotate and make the grinding emery wheel
30 rotations.Then, make the holding workbench 6 by the underface of the grinding emery wheel 30 pass through in the way of with retaining surface 6a
It is relatively moved on parallel direction (X-direction), to be ground to retaining surface 6a.
(C) of Fig. 4 is to schematically show the cross-sectional view that the retaining surface 6a that step is ground is ground by retaining surface.
When being ground in the state that main shaft 28 is tilted relative to Z-direction (vertical direction) to retaining surface 6a, in the retaining surface
The region passed through using the lowest point of the grinding emery wheel is formed on 6a as the curved shape of the paddy shape of the lowest point.It is formed by Curved
Shape is determined according to the inclined size of main shaft 28.Therefore, in retaining surface grinding step, according in the detecting step
The shape of the package substrate 1 detected determines the inclination of the main shaft 28.
In the case where detecting the shape of the back side side 1b of the package substrate 1 by the detecting step, the master is calculated
The inclination of axis 28 on retaining surface 6a to form the curved shape with paddy shape similar in the detected shape.Also,
In the package substrate 1 of warpage with paddy shape, the positive side 1a is also bent in the same manner as the side 1b of the back side.Therefore, passing through the inspection
Survey in the case that step detects the shape of the positive side 1a of the package substrate 1, can also calculate the inclination of the main shaft 28 with
Just the curved shape with paddy shape similar in the shape detected is formed on retaining surface 6a.
Then, the holding step of the method for grinding of present embodiment is illustrated.(A) of Fig. 5 is to schematically show
Keep the cross-sectional view of step.In the holding step, makes the back side side 1b downward and making the positive 1a as ground face
In the state that lateral top is exposed, the package substrate 1 as machined object is positioned in the retaining surface of the holding workbench 6
On 6a.At this point, according to the shape of the package substrate 1 and the paddy shape for the retaining surface 6a for being ground step formation by retaining surface is made
The package substrate 1 is positioned on retaining surface 6a by the mode that curved shape matches.
Then, it acts the attraction source (not shown) for keeping workbench 6 and passes through attraction road 6b to the package substrate 1
Negative pressure carries out attracting holding to package substrate 1 using the holding workbench 6.Due to the back side 1b of the package substrate 1 and this
Gap between retaining surface 6a is minimum, so attracting holding can suitably be carried out to the package substrate 1 without letting out the negative pressure
Leakage.
Then, the grinding step of the method for grinding of present embodiment is illustrated.(B) of Fig. 5 is to schematically show
It is ground the cross-sectional view of step.In the grinding step, according to the shape of the package substrate 1 detected in the detecting step, benefit
It is ground with positive 1a side of the grinding emery wheel 30 to the package substrate 1.
In the grinding step, according to the shape of the package substrate 1 detected in the detecting step, grinding wheel inclination is utilized
Change mechanism 30a makes the grinding emery wheel 30 tilt defined angle.That is, main shaft 28 is made to incline relative to vertical direction (Z-direction)
Tiltedly.Then, which is located in defined height and position, rotates the main shaft 28 and revolves the grinding emery wheel 30
Turn.Then, make the holding workbench 6 in the way of in the underface of the grinding emery wheel 30 process parallel with retaining surface 6a
Direction (X-direction) on relatively move, to be ground to the package substrate 1.
That is, making to be ground emery wheel 30 according to angle tilt same as retaining surface grinding step in the grinding step.And
And in retaining surface grinding step, which is located in can be to the height position that retaining surface 6a is ground
It sets.In contrast, in retaining surface grinding step, package substrate 1 of the attracting holding on retaining surface 6a is ground
And by the grinding emery wheel 30 be located in can thinning at defined thickness height and position.When implementing the grinding step, have
The package substrate 1 of the warpage of paddy shape is suitably ground to substantially within the scope of whole region along the shape of retaining surface 6a
Even thickness.
As discussed above, method for grinding according to the present embodiment, can be to the machined object with warpage
Suitably attract and is kept and be ground.
In addition, various changes can be implemented the present invention is not limited to the record of above embodiment.For example, above-mentioned
In embodiment, following situation is illustrated: the grinding attachment 2 has a grinding unit 14, is ground using a grinding
The both sides of the retaining surface 6a and package substrate 1 that take turns 30 pairs of holding workbench 6 are ground, but one embodiment of the present invention and unlimited
Due to this.For example, the grinding attachment used in the method for grinding of one embodiment of the present invention also can have two grindings
Unit.
That is, the grinding attachment also can have to the retaining surface for keeping the retaining surface of workbench to be ground grinding emery wheel
With machined object the two the grinding emery wheels of grinding emery wheel being ground to the machined object.In this case, using holding
Retaining surface grinding step is implemented in face with grinding emery wheel, is implemented to be ground step with grinding emery wheel using the machined object.Pass through
Using two grinding emery wheels, to be divided into the grinding emery wheel for being suitable for retaining surface grinding and the grinding for being suitable for machined object grinding
Emery wheel come using.
Also, in the above-described embodiment, by machined object along short side direction in come in case where paddy shape warpage into
Row explanation, but the present invention is not limited to this.It according to one method of the present invention, is in paddy shape along longitudinal direction in machined object
In the case where warpage, also can by by grinding emery wheel according to the warpage of the machined object it is consistent in the way of to keep work
The retaining surface of platform carries out grinding and keeps implementing to be ground on workbench to which the machined object to be properly maintained at.
Also, in the case where being continuously ground multiple same machined objects, do not need to implement to be somebody's turn to do to all
Machined object examinations step is simultaneously ground step according to the retaining surface of the shape of each machined object grinding retaining surface.As long as should
The manufacturing method of multiple machined objects is identical, then there is the identical trend of warpage degree of all machined objects.
Therefore, as long as when being ground to multiple machined object by detecting step to the shape of initial machined object
Shape carries out detecting and implementing according to the shape retaining surface grinding step, then the machined object after the 2nd can also be protected
Hold the suitably attracting holding of workbench 6.That is, being related to detecting step and holding in the method for grinding of one embodiment of the present invention
The machined object of face grinding step may not be identical be processed with the machined object for being related to holding step and grinding step
Object can also play the effect for machined object suitably being kept and being implemented grinding in this case.
As long as in addition, the construction of above embodiment, method etc. just can fit in the range of not departing from the object of the invention
When change is implemented.
Claims (2)
1. a kind of method for grinding is ground the machined object of the warpage with paddy shape, which is characterized in that method for grinding tool
There is following step:
Detecting step detects the shape for the machined object to be ground；
Retaining surface is ground step, make according to the shape of machined object detected in the detecting step and make rotary shaft relative to
Vertical direction has tilted the grinding emery wheel rotation of defined angle, and the grinding emery wheel is located in defined height and position,
And make the holding workbench with the retaining surface kept to machined object from the peripheral side of the grinding emery wheel according in the mill
The mode that the underface of skiving wheel is passed through relatively moves on the direction parallel with the retaining surface, to utilize the grinding emery wheel
The retaining surface is ground and is formed in the retaining surface curved shape of paddy shape；
Step is kept, after implementing retaining surface grinding step, according to the shape for making the machined object and is formed by this
The machined object is positioned in the retaining surface by the mode that the curved shape of retaining surface matches, and using the holding workbench to quilt
Machining object carries out attracting holding；And
It is ground step, after implementing the holding step, makes the shape according to the machined object detected in the detecting step
Shape and the grinding emery wheel rotation for having tilted rotary shaft relative to vertical direction, and as defined in the grinding emery wheel is located in
Height and position, and grind the holding workbench that remain the machined object according in the grinding from the peripheral side of the grinding emery wheel
The mode that the underface of wheel is passed through is on the direction of the moving direction along the holding workbench in retaining surface grinding step
It relatively moves, to be ground to machined object.
2. a kind of method for grinding is ground the machined object of the warpage with paddy shape, which is characterized in that method for grinding tool
There is following step:
Detecting step detects the shape for the machined object to be ground；
Retaining surface is ground step, make according to the shape of machined object detected in the detecting step and make rotary shaft relative to
Vertical direction has tilted the retaining surface grinding emery wheel rotation of defined angle, and the retaining surface is located in grinding emery wheel
Defined height and position, and grind the holding workbench with the retaining surface kept to machined object from the retaining surface
The peripheral side of skiving wheel is in the way of the underface process in retaining surface grinding emery wheel in the side parallel with the retaining surface
It relatively moves upwards, to be ground with grinding emery wheel to the retaining surface using the retaining surface and be formed in the retaining surface
The curved shape of paddy shape；
Step is kept, after implementing retaining surface grinding step, according to the shape for making the machined object and is formed by this
The machined object is positioned in the retaining surface by the mode that the curved shape of retaining surface matches, and using the holding workbench to quilt
Machining object carries out attracting holding；And
It is ground step, after implementing the holding step, makes the shape according to the machined object detected in the detecting step
Shape and the machined object grinding emery wheel rotation for having tilted rotary shaft relative to vertical direction, and the machined object is used
Grinding emery wheel is located in defined height and position, and uses the holding workbench that remain the machined object from the machined object
It is ground in the way of the underface process in machined object grinding emery wheel along the retaining surface peripheral side for being ground emery wheel
It cuts and is relatively moved on the direction of the moving direction of the holding workbench in step, to be ground to machined object.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-159527 | 2017-08-22 | ||
| JP2017159527A JP6910723B2 (en) | 2017-08-22 | 2017-08-22 | Grinding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109420937A true CN109420937A (en) | 2019-03-05 |
Family
ID=65514536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810927965.3A Pending CN109420937A (en) | 2017-08-22 | 2018-08-15 | Method for grinding |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6910723B2 (en) |
| KR (1) | KR102554989B1 (en) |
| CN (1) | CN109420937A (en) |
| TW (1) | TWI760551B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7222797B2 (en) * | 2019-04-09 | 2023-02-15 | 株式会社ディスコ | Creep feed grinding method |
| JP7325357B2 (en) * | 2020-02-25 | 2023-08-14 | 三菱電機株式会社 | Semiconductor device manufacturing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0523958A (en) * | 1991-05-13 | 1993-02-02 | Sekisui Chem Co Ltd | Grinding method for pipe end, grinding attachment therewith and stock removal regulator |
| CN202398851U (en) * | 2011-11-28 | 2012-08-29 | 延锋彼欧汽车外饰系统有限公司 | Drilling device for auto exterior trimming |
| CN204771964U (en) * | 2015-07-22 | 2015-11-18 | 中国石油集团渤海石油装备制造有限公司 | High accuracy ultrasonic transducer coupling cover automatic grinding device |
| CN105538087A (en) * | 2015-12-04 | 2016-05-04 | 天津津航技术物理研究所 | Multifunctional numerical-control spherical optical element milling and grinding tool |
| CN206047807U (en) * | 2016-08-19 | 2017-03-29 | 兴科电子(东莞)有限公司 | A kind of mobile phone shell polisher |
| CN206154102U (en) * | 2016-08-25 | 2017-05-10 | 兴科电子科技有限公司 | Polishing jig |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1170447A (en) * | 1997-08-28 | 1999-03-16 | Nippon Seiko Kk | Grinding method of surfaces of work |
| JP4154067B2 (en) | 1999-04-06 | 2008-09-24 | 株式会社ディスコ | Grinding equipment |
| KR100753302B1 (en) * | 2004-03-25 | 2007-08-29 | 이비덴 가부시키가이샤 | Vacuum chuck, suction board, polishing device, and method for manufacturing of semiconductor wafer |
| JP4703141B2 (en) * | 2004-07-22 | 2011-06-15 | 株式会社荏原製作所 | Polishing apparatus, substrate processing apparatus, and substrate jumping detection method |
| JP2006305713A (en) * | 2005-03-28 | 2006-11-09 | Nikon Corp | Suction apparatus, polishing device, semiconductor device and semiconductor device manufacturing method |
| JP5149020B2 (en) * | 2008-01-23 | 2013-02-20 | 株式会社ディスコ | Wafer grinding method |
| JP2011189411A (en) * | 2010-03-11 | 2011-09-29 | Renesas Electronics Corp | Wafer grinding device, wafer grinding method, wafer grinding program and wafer grinding control device |
| JP5912311B2 (en) * | 2011-06-30 | 2016-04-27 | 株式会社ディスコ | Workpiece grinding method |
| JP2013255964A (en) * | 2012-06-13 | 2013-12-26 | Komatsu Ntc Ltd | Grinding device and controlling method of grinding device |
| JP2015199153A (en) * | 2014-04-07 | 2015-11-12 | 株式会社ディスコ | Holding table, and grinding method and cutting method using the same |
| JP2016092281A (en) * | 2014-11-07 | 2016-05-23 | 株式会社ディスコ | Surface machining device |
| JP6441056B2 (en) * | 2014-12-10 | 2018-12-19 | 株式会社ディスコ | Grinding equipment |
| JP6457275B2 (en) * | 2015-01-21 | 2019-01-23 | 株式会社ディスコ | Grinding equipment |
| DE112016002662T5 (en) * | 2015-06-12 | 2018-03-08 | Asahi Glass Company, Limited | METHOD FOR PRODUCING A GLASS PLATE, GLASS PLATE AND DISPLAY DEVICE |
| JP6576747B2 (en) * | 2015-09-03 | 2019-09-18 | 株式会社ディスコ | Grinding equipment |
| JP6654850B2 (en) * | 2015-10-13 | 2020-02-26 | 株式会社ディスコ | Processing equipment |
| TWM532337U (en) * | 2016-07-11 | 2016-11-21 | Gallant Prec Machining Co Ltd | Flexible planar grinding equipment |
-
2017
- 2017-08-22 JP JP2017159527A patent/JP6910723B2/en active Active
-
2018
- 2018-08-15 CN CN201810927965.3A patent/CN109420937A/en active Pending
- 2018-08-16 KR KR1020180095339A patent/KR102554989B1/en active IP Right Grant
- 2018-08-17 TW TW107128811A patent/TWI760551B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0523958A (en) * | 1991-05-13 | 1993-02-02 | Sekisui Chem Co Ltd | Grinding method for pipe end, grinding attachment therewith and stock removal regulator |
| CN202398851U (en) * | 2011-11-28 | 2012-08-29 | 延锋彼欧汽车外饰系统有限公司 | Drilling device for auto exterior trimming |
| CN204771964U (en) * | 2015-07-22 | 2015-11-18 | 中国石油集团渤海石油装备制造有限公司 | High accuracy ultrasonic transducer coupling cover automatic grinding device |
| CN105538087A (en) * | 2015-12-04 | 2016-05-04 | 天津津航技术物理研究所 | Multifunctional numerical-control spherical optical element milling and grinding tool |
| CN206047807U (en) * | 2016-08-19 | 2017-03-29 | 兴科电子(东莞)有限公司 | A kind of mobile phone shell polisher |
| CN206154102U (en) * | 2016-08-25 | 2017-05-10 | 兴科电子科技有限公司 | Polishing jig |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102554989B1 (en) | 2023-07-12 |
| TWI760551B (en) | 2022-04-11 |
| JP6910723B2 (en) | 2021-07-28 |
| JP2019038044A (en) | 2019-03-14 |
| TW201912306A (en) | 2019-04-01 |
| KR20190021164A (en) | 2019-03-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4875532B2 (en) | Cutting device | |
| JP4913517B2 (en) | Wafer grinding method | |
| KR101223203B1 (en) | Laser Processing Method | |
| TWI649158B (en) | Processing device | |
| JP2013021017A (en) | Wafer grinding method | |
| TWI743297B (en) | Laser processing device | |
| TWI751354B (en) | Cutting device and wafer processing method | |
| CN109420937A (en) | Method for grinding | |
| CN105312974A (en) | Grinding apparatus and method for grinding rectangular substrate | |
| CN101961886B (en) | Cutting device | |
| US20170243787A1 (en) | Workpiece processing method | |
| JP2010147134A (en) | Alignment mechanism, grinder, aligning method, and grinding method | |
| CN105436999B (en) | The method for grinding of machined object | |
| JP2012146889A (en) | Method for grinding wafer | |
| JP5213815B2 (en) | Electrode processing equipment | |
| JP6042182B2 (en) | Wafer grinding method | |
| JP2008130808A (en) | Grinding method | |
| CN109216270A (en) | The processing method of chip | |
| CN107958841A (en) | The processing method of chip | |
| CN110193774A (en) | Processing unit (plant) | |
| JP7443053B2 (en) | laser processing equipment | |
| US11958132B2 (en) | SiC ingot processing method and laser processing apparatus | |
| CN108389810A (en) | Transport mechanism | |
| CN214956803U (en) | Blade movement adjusting mechanism for bonding energy intensity detection device | |
| JP5578902B2 (en) | Grinding equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190305 |
|
| RJ01 | Rejection of invention patent application after publication |