JP2016092281A - Surface machining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve productivity when turning by a tool and CMP or dry-polishing are performed on a wafer.SOLUTION: Machining means 30 provided on a surface machining device 1 is equipped with tool turning means 40 circulating a tool 44 about a rotation shaft 49 extending in a vertical direction to a holding surface 21 of holding means 20 holding a wafer W; polishing means 50 for rotating a polishing pad 53 about the rotation shaft 49 in the inside of a circulation path of the circulating tool 44; and advancing/retracting means 60 for relatively moving the tool 44 and the polishing pad 53 in directions coming close to or separating from the holding surface 21. Either one of the tool 44 or the polishing pad 53 can be selectively acted on a surface W1 of the wafer W to be machined, and turning machine by the tool 44 and polishing machine by the polishing pad 53 are enabled by one device. Therefore, it is not necessary to carry the wafer W between devices, and productivity is improved.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a surface processing apparatus having a function of performing turning and polishing with a cutting tool on a surface of a wafer.

  Since devices such as ICs are built on the surface of the wafer, if there are irregularities on the wafer surface, the coverage in the process of forming a thin film on the wafer surface will deteriorate, and the yield will decrease due to the disconnection of wiring, There arises a problem that a step is generated in the wiring film and reliability is lowered. In addition, if the wafer surface is uneven, a difference in photoresist film thickness occurs in the lithography process, and the focal length varies during exposure, which makes it difficult to resolve a fine pattern. In particular, since logic ICs require multilayer wiring, the leveling accuracy of the surface step is required. Therefore, the surface of the wafer before the device is built is polished and flattened.

  In a TSV wafer having TSV (Through Silicon Via) as a through electrode, the back surface is flattened by grinding and CMP (chemical mechanical polishing), and the through electrode exposed on the front side is flattened by CMP. Since the electrode is switched from the aluminum wiring to the copper wiring, the through electrode is flattened by turning with a cutting tool and CMP. A technique for polishing the surface of a wafer by CMP is described in Patent Document 1, for example. Devices that perform turning with a cutting tool are described in Patent Documents 2 and 3, for example.

  Also, for those containing metals and resins, such as resistors, thyristors, and inductors, crushing of the grinding wheel tends to be clogged with flattening by grinding. Mirror finish by dry polishing (not used).

JP 2012-209568 A JP 2009-54920 A JP 2007-59524 A

  However, since turning with a tool and CMP or dry polishing are performed in different apparatuses, there is a problem in that the wafers must be transferred between the apparatuses and productivity is low.

  The present invention has been considered in view of such problems, and it is an object of the present invention to improve productivity when turning a wafer with a cutting tool and CMP or dry polishing.

  The present invention includes a holding unit having a holding surface for holding the back surface of a wafer, a processing unit that enables turning with a cutting tool and polishing with a polishing pad on the surface of the wafer held by the holding unit, and a holding unit. A machining device comprising: machining moving means positioned at least at a machining position by the machining means, wherein the machining means rotates the cutting tool around a rotation axis extending in a direction perpendicular to the holding surface. And a polishing means for rotating a polishing pad having an outer diameter smaller than the circular orbit of the cutting tool rotated by the cutting tool, and a direction in which the cutting tool approaches and separates the cutting tool from the holding surface. Move the polishing pad in a direction away from the holding surface rather than the cutting tool when turning using the cutting tool and the tool that moves relative to the tool. It was, during the polishing process using a polishing pad so as to move in a direction away from the holding surface than the polishing pad bytes, and a switching control unit for controlling the moving means.

  The tool processing means and the polishing means are individually provided with a tool rotating means for rotating the tool and a pad rotating means for rotating the polishing pad, and the rotating shaft of the tool rotating means and the rotating shaft of the pad rotating means are on the same axis. It is good also as a structure which has on a line.

  In the surface processing apparatus according to the present invention, the advancing / retreating means can relatively move the cutting tool and the polishing pad in the direction of approaching and separating from the holding surface under the control of the switching control unit. Any one of the polishing pads can be selectively applied to the surface of the wafer for processing. Accordingly, cutting with a cutting tool and polishing with a polishing pad can be performed with one apparatus, and it is not necessary to transfer a wafer between apparatuses, thereby improving productivity.

  Further, the cutting tool processing means and the polishing means are individually provided with a cutting tool rotating means for rotating the cutting tool and a pad rotating means for rotating the polishing pad, and the rotating shaft of the cutting tool rotating means and the rotating shaft of the pad rotating means are the same axis. If it is configured to be on the line, it is not necessary to rotate the polishing pad during turning with the cutting tool, and it is not necessary to rotate the cutting tool during polishing with the polishing pad, so the rotating tool (biting tool or polishing pad) It is not affected by the vibration caused by the rotation of the other tool.

It is a perspective view which shows the state which can be grind | polished in the surface processing apparatus of 1st Embodiment. It is a longitudinal cross-sectional view which shows the state which grind | polishes a wafer in the surface processing apparatus of 1st Embodiment. It is a perspective view which shows the state which can be turned in the surface processing apparatus of 1st Embodiment. It is a longitudinal cross-sectional view which shows the state which turns a wafer in the surface processing apparatus of 1st Embodiment. It is sectional drawing which shows schematically the state which turns a wafer in the surface processing apparatus of 2nd Embodiment. It is sectional drawing which shows schematically the state which grind | polishes a wafer in the surface processing apparatus of 2nd Embodiment. It is sectional drawing which shows schematically the state which turns a wafer in the surface processing apparatus of 3rd Embodiment. It is sectional drawing which shows schematically the state which grind | polishes a wafer in the surface processing apparatus of 3rd Embodiment.

1 First Embodiment A surface processing apparatus 1 shown in FIG. 1 includes a holding unit 20 having a holding surface 21 for holding a back surface W2 of a wafer, and a cutting tool 44 with respect to the surface W1 of the wafer W held by the holding unit 20. Processing means 30 that enables turning and polishing with the polishing pad 53, and processing movement means 22 that positions the holding means 20 at least at a processing position 27 by the processing means 30 are provided.

  The holding unit 20 is driven by the processing moving unit 22 and can move in the front-rear direction (Y-axis direction) of the surface polishing apparatus 1. The processing movement means 22 is screwed into the ball screw 24, a ball screw 23 having an axis in the Y-axis direction, a motor 24 for rotating the ball screw 23, a pair of guide rails 25 arranged in parallel to the ball screw 24, and the ball screw 24. A moving base 26 having a nut inside and a lower part slidably contacting the guide rail 25 is provided. When the motor 24 rotates the ball screw 23, the moving base 26 is guided by the guide rail 25 and is in the Y-axis direction. It is configured to move to. The holding means 20 is fixed to the moving base 26. When the moving base 26 moves in the Y-axis direction, the holding means 20 also moves in the same direction. The processing moving means 22 can move the holding means 20 in the Y-axis direction and position it at the processing position 27.

  The processing means 30 includes a cutting tool means 40, a polishing means 50, and an advancing / retracting means 60 that relatively moves the cutting tool 44 and the polishing pad 53 forward and backward in a direction approaching and moving away from the holding surface 21.

  The cutting tool means 40 includes a first spindle 41 having an axis in the Z-axis direction, a mount 42 coupled to the lower part of the first spindle 41, a base 43 attached to the mount 42, and a lower part of the base 43 And a cutting tool rotating means 45 that rotates the base 43 to rotate the cutting tool 44.

  The bite rotation means 45 includes a motor 46, a shaft portion 47 that is driven by the motor 46 and rotates around a rotation axis in the Z-axis direction, and a drive belt 48 wound around the shaft portion 47 and the first spindle 41. It has. In the tool rotation means 45, when the motor 46 rotates the shaft portion 47, the rotational force is transmitted to the first spindle 41 by the drive belt 48 and extends in a direction perpendicular to the holding surface 21 of the holding means 20. The cutting tool 44 can be rotated around the rotating shaft 49.

  The polishing means 50 includes a second spindle 51 having an axis in the Z-axis direction, a mount 52 connected to the second spindle 51, a polishing pad 53 attached to the mount 52, and a motor that rotates the second spindle 51. And a slurry supply port 55 through which the slurry flows into the second spindle 51. The polishing pad 53 has an outer diameter smaller than the circular orbit of the cutting tool 44. As the polishing pad 53, for example, resin, nonwoven fabric, urethane foam or the like is used. The lower surface of the polishing pad 53 preferably has an area larger than the area of the surface W1 of the wafer W to be polished.

  The pad rotating means 54 can rotate the polishing pad 53 around the rotating shaft 49 common to the cutting tool rotating means 45 inside the rotation path of the cutting tool 44 rotated by the cutting tool rotating means 45.

  The advancing / retracting means 60 includes a ball screw 61 having an axis in the Z-axis direction, a pair of guide rails 62 arranged in parallel to the ball screw 61, a motor 63 for rotating the ball screw 61, and a nut screwed to the ball screw 61. And a lift part 64 whose side part is in sliding contact with the guide rail 62. The motor 63 rotates the ball screw 61 so that the lift part 64 can be lifted and lowered along the guide rail 62. The elevating unit 64 holds the pad rotating means 54, and the pad rotating means 54 can be moved up and down as the elevating unit 64 moves up and down. That is, the advancing / retracting means 60 moves the pad rotating means 54 and the pad rotating means 54 relatively in the direction of approaching and separating from the holding surface 21 of the holding means 20 by moving the pad rotating means 54 up and down. A switching control unit 65 is connected to the motor 63, and the advance / retreat means 60 can move the pad rotating means 54 up and down under the control of the switching control unit 65.

  The machining means 30 is driven by the machining feed means 70 and can be moved up and down in the Z-axis direction. The machining feed means 70 is disposed in parallel with the ball screw 71 having an axis in the Z-axis direction and the ball screw 71. A pair of guide rails 72, a motor 73 that rotates the ball screw 71, and a lifting part 74 that has a nut that is screwed into the ball screw 71 and whose side part is in sliding contact with the guide rail 72. By rotating the ball screw 71, the elevating part 74 can be raised and lowered along the guide rail 72. The lifting unit 74 holds the entire processing unit 30, that is, the cutting tool unit 40, the polishing unit 50, and the advancing / retreating unit 60, and when the lifting unit 74 moves up and down, the cutting unit 40, the polishing unit 50, and the advancing / retracting unit 60 can be moved up and down.

  As shown in FIG. 2, a drive pulley 49 a is fixed to the shaft portion 47 connected to the motor 46. On the other hand, a driven pulley 49b is fixed to the outer periphery of the first spindle 41, and a driving belt 48 is wound around the driving pulley 49a and the driven pulley 49b. The first spindle 41 is rotatably supported by a bearing 41a disposed on the outer peripheral side thereof. When the motor 46 rotates the shaft portion 47, the first spindle 41 passes through the driving pulley 49a, the driving belt 48, and the driven pulley 49b. Thus, the first spindle 41 can be rotated.

  The cutting tool 44 is disposed on the outer peripheral side of the polishing pad 53. When the first spindle 41 rotates, the cutting tool 44 circulates in a circle larger than the outer circumferential circle of the polishing pad 53 on the outer circumferential side of the polishing pad 53.

  A bearing 51a is interposed between the first spindle 41 and the second spindle 51, and the bearing 51a supports the second spindle 51 in a rotatable manner. Inside the second spindle 51, a slurry flow passage 57 having an upper end opened at the slurry supply port 55 and a lower end opened at the slurry discharge port 56 is formed. The slurry discharge port 56 is opened on the inner peripheral side of the polishing pad 53 formed in a ring shape.

  As shown in FIG. 1, the wafer W to be processed is held on the holding surface 21 of the holding means 20 on the back surface W <b> 2 side with the surface W <b> 1 to be processed exposed upward. Then, the processing moving means 22 moves the holding means 20 in the Y-axis direction and positions the wafer W at the processing position 27. An example of the wafer W is a TSV wafer having TSV (Through Silicon Via).

  Next, as shown in FIGS. 3 and 4, under the control of the switching control unit 65, the advancing / retreating means 60 raises the polishing pad 53, and the polishing pad 53 is separated to a position farther from the holding surface 21 than the cutting tool 44. The lower end of the cutting tool 44 is positioned below the lower surface of the polishing pad 53.

  Then, the processing feed means 70 lowers the entire processing means 30 and positions the lower end of the cutting tool 44 at a predetermined height on the surface W1 side of the wafer W. Thereafter, the tool rotating means 45 rotates the tool 44, and the processing moving means 22 sends the holding means 20 in the Y-axis direction. Then, the lower end of the cutting tool 44 cuts the surface W1 of the wafer W, and the surface W1 is turned. When the entire surface W1 is turned, the processing feed means 70 raises the entire processing means 30, and the cutting tool 44 is spaced apart from the surface W1 of the wafer W to finish the turning process. By this turning process, when the wafer W is a TSV wafer, for example, the height of the tip of the TSV can be made uniform. Note that the pad rotating means 54 does not rotate the polishing pad 53 during turning with the cutting tool 44.

Next, the processing moving means 22 moves the holding means 20 in the Y-axis direction, and positions the wafer W below the polishing pad 53. The advance / retreat means 60 lowers the polishing pad 53 under the control of the switching control unit 65, so that the cutting tool 44 is moved away from the holding surface 21 more than the polishing pad 53, as shown in FIGS. In this state, the lower surface of the polishing pad 53 is positioned below the lower end of the cutting tool 44.

In this state, while the pad rotating means 54 rotates the polishing pad 53, the processing feeding means 70 lowers the processing means 30 to lower the polishing pad 53, and the rotating polishing pad 53 is moved to the surface W1 of the wafer W. The surface W1 is polished by contacting and pressing. During polishing, the slurry is supplied from the slurry supply port 55 and discharged from the slurry discharge port 56 shown in FIG. 2, whereby the slurry is supplied between the polishing pad 53 and the surface W1 of the wafer W, Mechanical polishing (CMP) is performed. As the slurry, for example, silica (SiO ₂ ), alumina (Al ₂ O ₃ ), ceria (CeO ₂ ), manganese oxide (Mn ₂ O ₃ ), or the like is used.

  During polishing, it is preferable that the processing moving means 22 moves the holding means 20 back and forth in the Y-axis direction. The surface processing apparatus 1 does not include the slurry supply port 55, the slurry discharge port 56, and the slurry flow passage 57, and the surface W1 can be processed by dry polishing that is polishing performed without supplying slurry.

  After the surface W1 is thus polished, the processing feed means 70 raises the processing means 30 to separate the polishing pad 53 and the cutting tool 44 from the wafer W, and the processing ends. By this polishing process, when the wafer W is, for example, a TSV wafer, the tip of the TSV can be flattened. During the turning process with the polishing pad 53, the tool rotating means 45 does not rotate the tool 44.

  As described above, the surface processing apparatus 1 includes the cutting tool 30 and the polishing means 40, and the advancing / retreating means 60 is relative to the direction in which the cutting tool 44 and the polishing pad 53 approach and separate from the holding surface 21. Therefore, any one of the cutting tool 44 and the polishing pad 53 can be selectively applied to the surface W1 of the wafer W for processing. Therefore, turning with the cutting tool 44 and polishing with the polishing pad 53 can be performed with one apparatus, and there is no need to transfer a wafer between apparatuses, thereby improving productivity. Further, since the cutting tool rotating means 45 and the pad rotating means 54 rotate the cutting tool 44 and the polishing pad 53 around the common rotating shaft 49, the apparatus configuration can be made compact. Further, the cutting tool means 40 and the polishing means 50 are individually provided with a cutting tool rotating means 45 for rotating the cutting tool 44 and a pad rotating means 54 for rotating the polishing pad 53. The rotating shaft of the cutting tool rotating means 45 and the pad rotating means are provided. Since the rotation axis of 54 is on the same axis, the polishing pad 53 does not need to be rotated during the turning process with the cutting tool 44, and the cutting tool 44 does not have to be rotated during the polishing process with the polishing pad 53. The rotating tool (the cutting tool 44 or the polishing pad 53) is not affected by vibration due to the rotation of the other tool.

  In the first embodiment, the advancing / retreating means 60 is configured to move the pad rotating means 54 up and down, but the advancing / retreating means 60 may be configured to move the tool rotating means 45 up and down, or the tool rotating means 45 and the pad rotating means. It is good also as a structure which raises / lowers both of the means 54. FIG. Further, the wafer to be processed is not limited to a TSV wafer.

2 Second Embodiment A surface processing apparatus 10 shown in FIG. 5 is an apparatus that performs turning with a cutting tool and polishing with a polishing pad on the surface of a wafer, similarly to the surface processing apparatus 1 shown in FIGS. It is. In the surface processing apparatus 10, portions that are configured in the same manner as the surface processing apparatus 1 are denoted by common reference numerals, and detailed description thereof is omitted.

  The surface processing apparatus 10 includes a holding unit 20 having a holding surface 21 that holds the back surface W2 of the wafer, a turning process with a cutting tool 161 on a surface W1 of the wafer W held by the holding unit 20, and a polishing process with a polishing pad 171. And processing means 8 that enable the above. The holding means 20 is positioned at a processing position by the processing means 8 by a mechanism similar to the processing movement means 22 shown in FIG.

  The processing means 8 includes a spindle 11 having a rotation axis extending in a direction perpendicular to the holding surface 21, a spindle housing 12 that rotatably supports the spindle 11, and a motor 13 connected to the upper end of the spindle 11. And a turning tool 16 and a polishing tool 17 mounted concentrically on the lower end of the spindle 11 via a mount 14.

  The turning tool 16 includes an annular first base 160 and a cutting tool 161 attached to the lower portion of the first base 160. On the other hand, the polishing tool 17 includes a disk-shaped second base 170 having an outer diameter smaller than the inner diameter of the first base 160, and a polishing pad 171 fixed to the lower surface of the second base 170. It is composed of

  The mount 14 includes a first mounting portion 140 for mounting the first base 160, a second mounting portion 141 for mounting the second base 170, the first mounting portion 140, and the first mounting portion 140. The second mounting portion 141 and the advancing / retracting means 15 for moving the mounting portion 141 in a direction approaching and separating from the holding surface 21 of the holding means 20 are provided.

  The advancing / retracting means 15 is disposed below the first mounting portion 140, moves in a direction approaching and separating from the chuck table 4, and surrounds the piston 150, and moves the piston 150 in the vertical direction. And a cylinder 151 for guiding. A second mounting portion 141 is connected to the piston 150.

  The second mounting portion 141 is formed with a contact portion 141a bent at a substantially right angle on the outer peripheral edge thereof, and a rotation transmission portion 142 that can rotate as the spindle 11 rotates is connected to the contact portion 141a. Has been. The rotation transmission part 142 is comprised by the pin, for example.

  A space that can accommodate the second mounting portion 141 and the polishing tool 17 is formed on the lower side of the first mounting portion 140, and the contact portion 141a can slide in the vertical direction on the outermost peripheral portion of the space. A groove 18 is formed.

  A first positioning portion 19a is formed at one end (upper end) of the groove 18, and the contact portion 141a contacts the first positioning portion 19a so that the cutting tool 161 protrudes downward from the polishing pad 171. Thus, the turning tool 16 can be positioned at a desired position. On the other hand, a second positioning portion 19b is formed at the other end (lower end) of the groove 18, and the abutting portion 141a contacts the second positioning portion 19b so that the polishing pad 171 is positioned below the cutting tool 161. Thus, the polishing tool 17 can be positioned at a desired position.

  A first flow path 81 and a second flow path 83 are formed inside the spindle 11 and the mount 14 to communicate the air supply source 85 and the cylinder 151. A first supply port 82 for supplying air from the side of the cylinder 151 is formed at one end of the first flow path 81. A second supply port 84 that supplies air from above the cylinder 151 is formed at one end of the second flow path 83.

  Between the first flow path 81 and the second flow path 83 and the air supply source 80, a switching control unit 86 for switching the traveling direction of the piston 150 in the cylinder 151 is disposed. The switching control unit 86 includes a switching valve 860 that switches one of the first supply port 82 and the second supply port 84 to an air supply destination, and a rotary joint for supplying air into the rotating spindle 11. 861. When air is supplied to the first supply port 82 under the control of the switching control unit 86, the piston 150 can be moved away from the holding means 20 in the cylinder 151. Further, when air is supplied to the second supply port 84 under the control of the switching control unit 86, the piston 150 can be moved in the direction of approaching the holding means 20 in the cylinder 151.

  Next, an operation example in which the surface processing apparatus 10 performs a turning process with the cutting tool 161 and a polishing process with the polishing pad 171 on the surface W1 of the wafer W will be described.

  As shown in FIG. 5, the wafer W to be processed is held by the holding surface 21 of the holding means 20 on the back surface W <b> 2 side with the surface W <b> 1 to be processed exposed upward. Subsequently, the holding means 20 is moved in the Y-axis direction while rotating the holding means 20.

  Next, the air supply source 85 and the first supply port 82 are communicated with each other at the switching valve 860. As a result, air flows into the first flow path 81 to supply air into the cylinder 151 from the first supply port 82, and the piston 150 is held against the holding means 20 by the air supplied into the cylinder 151. Move in the direction of separation. As the piston 150 moves, the second mounting portion 141 rises until the abutting portion 141a abuts on the first positioning portion 19a, and the lower end of the cutting tool 161 protrudes downward from the lower surface of the polishing pad 171. A turning tool 16 capable of turning with respect to W is positioned.

  1 lowers the entire processing unit 8 and positions the lower end of the cutting tool 161 at a predetermined height on the surface W1 side of the wafer W. Thereafter, the motor 131 rotates the spindle 11 to rotate the cutting tool 161, and the processing moving means 22 shown in FIG. 1 sends the holding means 20 in the Y-axis direction. Then, the lower end of the cutting tool 161 scrapes the surface W1 of the wafer W, and the surface W1 is turned. When the entire surface W1 is turned, the processing feed means 70 raises the entire processing means 8, and the cutting tool 161 is spaced apart from the surface W1 of the wafer W to finish the turning process. By this turning process, when the wafer W is a TSV wafer, for example, the height of the tip of the TSV can be made uniform.

  After turning, as shown in FIG. 6, the switching control unit 86 operates the switching valve 860 to cause the air supply source 85 and the second supply port 84 to communicate with each other. As a result, air flows into the second flow path 83 to supply air into the cylinder 151 from the second supply port 84, and the piston 150 is held against the holding means 20 by the air supplied into the cylinder 151. Move in the direction of approach. As the piston 150 moves, the second mounting portion 141 is lowered and the contact portion 141a of the second mounting portion 141 contacts the second positioning portion 19b, so that the polishing pad 171 is lower than the lower end of the cutting tool 161. The polishing tool 17 is positioned at a position where polishing can be performed on the wafer W.

  Next, while rotating the holding means 20 and rotating the spindle 11 at a predetermined rotation speed, the polishing tool 17 is rotated through the rotation transmission unit 142. Subsequently, the processing means 8 is lowered in the direction approaching the wafer W by the processing feeding means 70 shown in FIG. 1, the rotating polishing pad 171 is pressed against the surface Wa of the wafer W, and polishing processing is performed.

  After the surface W1 is thus polished, the processing feed means 70 raises the processing means 8 to separate the polishing pad 171 and the cutting tool 161 from the wafer W, and the processing ends. By this polishing process, when the wafer W is, for example, a TSV wafer, the tip of the TSV can be flattened.

3 Third Embodiment A surface processing apparatus 10a shown in FIG. 7 uses a cutting tool for the surface of a wafer, like the surface processing apparatus 1 shown in FIGS. 1 to 4 and the surface processing apparatus 10 shown in FIGS. It is an apparatus that performs turning and polishing with a polishing pad. In the surface processing apparatus 10a, portions that are configured in the same manner as the surface processing apparatuses 1 and 10 are denoted by common reference numerals, and detailed description thereof is omitted.

  The surface processing apparatus 10a includes a holding unit 20 having a holding surface 21 for holding the back surface W2 of the wafer, a turning process by a cutting tool 161 on a surface W1 of the wafer W held by the holding unit 20, and a polishing process by a polishing pad 171. And processing means 9 that enable the above. The holding means 20 is positioned at a machining position by the machining means 9 by a mechanism similar to the machining movement means 22 shown in FIG.

  The processing means 9 includes a spindle 11 having a rotation axis extending in a direction perpendicular to the holding surface 21, a spindle housing 12 that rotatably supports the spindle 11, and a motor 13 connected to the upper end of the spindle 11. And a turning tool 16 and a polishing tool 17 mounted concentrically on the lower end of the spindle 11 via a mount 90.

  The turning tool 16 includes an annular first base 160 and a cutting tool 161 attached to the lower portion of the first base 160. On the other hand, the polishing tool 17 includes a disk-shaped second base 170 having an outer diameter smaller than the inner diameter of the first base 160, and a polishing pad 171 fixed to the lower surface of the second base 170. It is composed of

  The mount 90 includes a first mounting portion 900 for mounting the first base 160, a second mounting portion 901 for mounting the second base 170, the first mounting portion 900, and the first mounting portion 900. And an advancing / retracting means 91 for moving the second mounting portion 901 relative to and away from the holding surface 21 of the holding means 20.

  A first positioning part 93 is formed on the upper part of the second mounting part 901, and the lower surface 900 a of the first mounting part 900 comes into contact with the first positioning part 93, whereby the lower surface of the polishing pad 171. It is possible to position the lower end of the cutting tool 161 by projecting it downward. On the other hand, a second positioning portion 94 is formed at the lower end of the spindle 11, and the upper surface 900 b of the first mounting portion 900 comes into contact with the second positioning portion 94, thereby polishing more than the lower end of the cutting tool 161. The bottom surface of the pad 171 can be positioned and projected.

  The advancing / retreating means 91 is disposed inside the second mounting portion 901, and includes a piston 910 that moves in a direction toward and away from the holding means 20 by air sent from the air supply source 85a, and a piston 910. And a cylinder 911 for guiding the vertical movement of the piston 910. The piston 910 is connected to a rotation transmission portion 92 that can rotate with the rotation of the spindle 11 and supports the first mounting portion 900. When the piston 910 moves in the vertical direction within the cylinder 911, the rotation transmitting portion 92 can pass up and down the turning tool 16 through the through hole 902 formed in the second mounting portion 901.

  Inside the spindle 11 and the mount 90, a first flow path 81a and a second flow path 83a for communicating the air supply source 25a and the cylinder 911 are formed. A first supply port 82a that supplies air from the lower side of the cylinder 911 is formed at one end of the first flow path 81a. In addition, a second supply port 84a that supplies air from above the cylinder 911 is formed at one end of the second flow path 83a. Between the first flow path 81a and the second flow path 83a and the air supply source 85a, a switching control unit 86a for switching the advancing direction of the piston 910 in the cylinder 911 is disposed as in the processing means 10. ing. The switching control unit 86a includes a switching valve 860a that switches one of the first supply port 82a and the second supply port 84a to an air supply destination, and a rotary joint for supplying air to the inside of the rotating spindle 11. 861a.

  When turning the wafer W using the turning tool 16, as shown in FIG. 7, the switching control unit 86a operates the switching valve 860 so that the air supply source 85a, the second supply port 84a, To communicate. As a result, air flows into the second flow path 83a to supply air into the cylinder 911 from the second supply port 84a, and the piston 910 is moved to the holding means 20 by the air supplied into the cylinder 911. Move in the direction of approach. As the piston 910 moves, the first mounting portion 900 is lowered together with the rotation transmitting portion 92 until the lower surface 900 a of the first mounting portion 900 comes into contact with the first positioning portion 93. Also, the lower end of the cutting tool 161 is protruded downward, and the turning tool 16 is positioned at a position where turning can be performed on the wafer W. Thereafter, the processing means 9a performs turning with a cutting tool on the wafer W by the same operation as the processing means 8 described above.

  When performing polishing on the wafer W that has been turned by using the polishing tool 17, the switching control unit 86a operates the switching valve 260 to connect the air supply source 85a and the first one as shown in FIG. Communication port 82a. As a result, air flows into the first flow path 81a to supply air into the cylinder 911 from the first supply port 82a, and the air supplied into the cylinder 911 moves the piston 910 to the holding means 20. Move in the direction of separation. As the piston 910 moves, the first mounting portion 900 is raised together with the rotation transmitting portion 92 until the upper surface 900b of the first mounting portion 900 comes into contact with the second positioning portion 94. The lower surface of the polishing pad 171 is protruded downward, and the polishing tool 17 is positioned at a position where polishing with respect to the wafer W can be performed. Thereafter, the processing means 9 polishes the wafer W by the same operation as the processing means 8 described above.

  In any of the above embodiments, since the cutting tool and the polishing pad are individually mounted in the processing means, it is possible to replace the cutting tool or the polishing pad individually.

  In addition, if a cylindrical cover is disposed between the circular orbit of the cutting tool and the outer surface of the polishing pad, it is possible to prevent debris generated by turning by the cutting tool from adhering to the polishing pad, It is possible to prevent debris generated by the polishing process using the polishing pad from adhering to the cutting tool.

DESCRIPTION OF SYMBOLS 1, 10, 10a: Surface processing apparatus 20: Holding means 21: Holding surface 22: Processing moving means 23: Ball screw 24: Motor 25: Guide rail 26: Moving base 27: Processing position 30: Processing means 40: Tool processing means 41: first spindle 42: mount 43: base 44: bite 45: bite rotating means 46: motor 47: shaft portion 48: driving belt 49: rotating shaft 49a: driving pulley 49b: driven pulley 50: polishing means 51: first 2 spindle 52: mount 53: polishing pad 54: pad rotating means 55: slurry supply port 56: slurry discharge port 57: slurry flow passage 60: advance / retreat means 61: ball screw 62: guide rail 63: motor 64: lifting part 70: processing Feeding means 71: Ball screw 72: Guide rail 73: Motor 74: Lifting unit 8, 9: Processing hand Stage 11: Spindle 12: Spindle housing 13: Motor 14: Mount 140: First mounting portion 141: Second mounting portion 141a: Abutment portion 142: Rotation transmission portion 15: Advance / retreat means 150: Piston 151: Cylinder 16: Turning tool 160: first base 161: bite 17: polishing tool 170: second base 171: polishing pad 18: groove 19a: first positioning portion 19b: second positioning portion 81, 81a: first , 82a: first supply port 83, 83a: second flow channel 84, 84a: second supply port 85, 85: air supply source 86, 86a: switching controller 860: switching valve 861: Rotary joint 90: mount 900: first mounting portion 901: second mounting portion 902: through hole 91: advance / retreat means 910: piston 911: cylinder 9 2: Rotation transmission unit 93: First positioning unit 94: Second positioning unit

Claims (2)

Holding means having a holding surface for holding the back surface of the wafer, processing means for enabling turning with a cutting tool and polishing with a polishing pad on the surface of the wafer held by the holding means, and processing the holding means with the processing A surface moving device comprising at least a processing moving means positioned at a processing position by the means,
The processing means includes
A bite machining means for rotating the bite around a rotation axis extending in a direction perpendicular to the holding surface;
A polishing means for rotating a polishing pad having an outer diameter smaller than a circular orbit of the cutting tool rotated by the cutting tool, about the rotation axis;
Advancing and retreating means for moving the cutting tool and the polishing pad relative to each other in a direction of approaching and separating from the holding surface;
When turning using the cutting tool, the polishing pad is moved in a direction away from the holding surface than the cutting tool. When polishing using the polishing pad, the cutting tool is held more than the polishing pad. A switching control unit for controlling the advance / retreat means so as to move in a direction away from the surface;
Surface processing equipment with The cutting tool processing means and the polishing means individually include a cutting tool rotating means for rotating the cutting tool and a pad rotating means for rotating the polishing pad,
The surface processing apparatus of Claim 1 which has the rotating shaft of this cutting tool rotating means, and the rotating shaft of this pad rotating means on the same axis line.

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