KR20220040984A - Processing apparatus - Google Patents

Abstract

A processing apparatus suppresses process waste generated during one processing from adversely affecting the other processing. When a wafer (100) is processed by a grinding wheel (98), a processing chamber (20) is partitioned into upper and lower parts such that a first partition plate (11) and a second partition plate (12) surround the grinding wheel (98) with a first semicircular recess (111) and a second semicircular recess (121). Therefore, a polishing pad (93) located on the upper side of the processing chamber (20) can be protected from the process waste generated when the tip of the grinding wheel (98) located on the lower side of the processing chamber (20) processes the wafer (100). Accordingly, the process waste can be suppressed from adhering to the polishing pad (93). Thereby, a back surface (102) of the wafer (100), which is polished by the polishing pad (93), can be prevented from being damaged by the process waste.

Description

Processing equipment {PROCESSING APPARATUS}

The present invention relates to a processing apparatus.

In a TSV wafer having TSV (Through Silicon Via) as a through electrode, the back surface is planarized by grinding and CMP (chemical mechanical polishing), and the through electrode exposed on the front surface side is planarized by CMP. In recent years, since wiring of a through electrode has been switched from an aluminum wiring to a copper wiring, the through electrode is planarized by turning with a bite and CMP. Therefore, as disclosed in Patent Document 1, by enabling turning and CMP with a bite as a processing means of one processing apparatus, the apparatus is downsized and productivity is improved.

Japanese Patent Laid-Open No. 2016-92281

In the apparatus described in Patent Document 1, turning and CMP are performed in the same processing chamber. Therefore, there is a possibility that turning chips from the turning process adhere to the lower surface of the polishing pad, which may cause scratches on the polished surface of the wafer during CMP.

Further, even when the processing means is capable of performing grinding and CMP, there is a possibility that grinding chips from grinding may adhere to the lower surface of the polishing pad, and the polishing target surface of the wafer may be scratched during CMP.

Therefore, the objective of this invention is suppressing that the other process performed after that receives a bad influence by the processing waste which generate|occur|produced when one process was performed.

A processing apparatus (the present processing apparatus) of the present invention includes a processing unit including a chuck table for holding a wafer by a holding surface, a processing tool for processing the wafer held on the chuck table, and the processing unit for holding the processing unit A machining apparatus comprising: a machining feed means for machining and feeding in a direction perpendicular to a surface; and a machining chamber for accommodating the chuck table and the machining tool, wherein the machining means is located at a lower end of a spindle extending in the vertical direction. A first mount having an upper surface connected to it and a first processing tool mounted on a lower surface thereof, and an inner diameter larger than the outer diameter of the first mount, in an annular shape concentric with the first mount , a second mount on which the second processing tool is mounted on the lower surface, and by relatively moving the first mount and the second mount in the vertical direction, the first processing tool or the second processing tool is selectively moved selecting means for bringing the holding surface closer to the holding surface, wherein the processing chamber causes the first processing tool to approach the holding surface rather than the second processing tool by the selection means, and to transfer the wafer held on the holding surface to the first processing tool. A partition mechanism is provided that surrounds the first processing tool and divides the processing chamber up and down while the processing tool is processing the first processing tool and protects the second processing tool from the processing debris of the wafer processed by the first processing tool. and the partition mechanism includes a first semi-circular recess along the outer surface of the first processing tool, a first partition plate extending in the horizontal direction, and the first semi-circular recess along the outer surface of the first processing tool A second partition plate having opposite second semicircular recesses and extending in the horizontal direction; a first horizontal movement mechanism for moving the first partition plate in the horizontal direction; A second horizontal movement mechanism is provided, and when processing a wafer held on its holding surface by the second processing tool, the first partition plate and the second partition plate are separated from each other in a horizontal direction away from the spindle. Thus, the first semicircle recess and the second semicircle The second processing tool allows the passage between the recesses, and when processing a wafer held on the holding surface by the first processing tool, the first partition plate and the second partition plate are aligned in a horizontal direction with each other. close to the spindle, and surrounds the first processing tool by a circle formed by connecting the first semi-circular recess and the second semi-circular recess, the first processing tool from processing debris generated by processing the wafer Protect the second processing tool.

In this processing apparatus, the 1st processing tool may be a turning byte or a grinding wheel, and the 2nd processing tool may be a polishing pad.

Moreover, this processing apparatus may further equip the 1st partition plate and its 2nd partition plate with the water jet port which ejects water toward the 1st processing tool.

In the present processing apparatus, when processing a wafer by the first processing tool, the processing chamber is such that the first partition plate and the second partition plate surround the first processing tool by the first semicircular recessed portion and the second semicircular recessed portion. divide it up and down Accordingly, it is possible to protect the second processing tool located above the processing chamber from processing chips generated when the tip of the first processing tool located below the processing chamber processes the wafer. Thereby, it can suppress that a processing waste adheres to a 2nd processing tool. For this reason, it becomes possible to suppress that the to-be-processed surface of the wafer processed by a 2nd process tool is damaged by a process waste.

1 : is sectional drawing which shows the structure of a processing apparatus.
Fig. 2 is a cross-sectional view showing the configuration of the processing apparatus.
Fig. 3 is an explanatory view showing a first partition plate and a second partition plate connected to each other;
4 : is sectional drawing which shows the structure of a processing apparatus.
Fig. 5 is an explanatory view showing a first partition plate and a second partition plate placed far from each other;
6 is an explanatory view showing a first partition plate and a second partition plate provided with a water jet.

As shown in FIG. 1 , a processing apparatus 1 according to the present embodiment is an apparatus for grinding and polishing a wafer 100 as a workpiece, and a control unit 5 for controlling each member of the processing apparatus 1 . is equipped with

The wafer 100 is, for example, a circular semiconductor wafer. The surface 101 of the wafer 100 holds a plurality of devices, and is protected by attaching the protective tape 103 . The back surface 102 of the wafer 100 becomes a to-be-processed surface to which grinding processing and grinding|polishing processing are given.

The processing apparatus 1 is equipped with the holding means 30 for holding a to-be-processed object. The holding means 30 includes a chuck table 31 , a support member 33 for supporting the chuck table 31 , and a rotation means 34 for rotating the chuck table 31 .

The chuck table 31 includes a holding surface 32 for holding the wafer 100 , and a frame body 36 surrounding the holding surface 32 . In the present embodiment, the upper surface of the frame body 36 is formed substantially flush with the holding surface 32 , and has the same height as the holding surface 32 .

The holding surface 32 of the chuck table 31 is made of, for example, a porous material, and is communicated with a suction source (not shown) to suction and hold the wafer 100 via the protective tape 103 . That is, the chuck table 31 holds the wafer 100 by the holding surface 32 .

In addition, the chuck table 31 is in a state in which the wafer 100 is held by the holding surface 32 by the rotating means 34 provided below, and the Z-axis direction passes through the center of the holding surface 32 . It is rotatable about a central axis extending to Accordingly, the wafer 100 is held on the holding surface 32 and rotated about the center of the holding surface 32 .

A cover plate 37 is formed around the support member 33 . Moreover, a pleated box cover (not shown) that expands and contracts in the Y-axis direction is connected to the +Y side and the -Y side of the cover plate 37 . And below the holding means 30, the Y-axis direction moving means 40 is arrange|positioned. The Y-axis direction moving means 40 moves the holding means 30 along the Y-axis direction.

The Y-axis direction moving means 40 relatively moves the holding means 30 and the processing means 70 in the Y-axis direction parallel to the holding surface 32 . In the present embodiment, the Y-axis direction moving means 40 is configured to move the holding means 30 in the Y-axis direction with respect to the processing means 70 .

In addition, the processing apparatus 1 may have a turntable which has several holding means 30 as a horizontal movement means instead of the Y-axis direction movement means 40 .

The Y-axis direction movement means 40 includes a Y-axis guide rail 42 parallel to the Y-axis direction, a Y-axis movement table 45 that slides on the Y-axis guide rail 42 , and a Y-axis guide rail 42 . ) parallel to the Y-axis ball screw 43 , a Y-axis motor 44 connected to the Y-axis ball screw 43 , and a holder 41 for holding them.

The Y-axis movement table 45 is slidably provided on the Y-axis guide rail 42 via a slide member 451 . A nut portion 401 is being fixed to the lower surface of the Y-axis movement table 45 . A Y-axis ball screw 43 is screwed to the nut portion 401 . The Y-axis motor 44 is connected to one end of the Y-axis ball screw 43 .

In the Y-axis direction movement means 40 , the Y-axis motor 44 rotates the Y-axis ball screw 43 , so that the Y-axis movement table 45 moves along the Y-axis guide rail 42 in the Y-axis direction. do. The support member 33 of the holding means 30 is mounted on the Y-axis movement table 45 via the support column 35 . Therefore, with the movement of the Y-axis movement table 45 in the Y-axis direction, the holding means 30 including the chuck table 31 moves in the Y-axis direction.

In this embodiment, the holding means 30 moves between the processing position of the rear (+Y direction side) and the carrying-in/out position of the front (-Y direction side) by the Y-axis direction moving means 40, moved along the axial direction.

Moreover, as shown in FIG. 1, the column 3 is formed in the back (+Y direction side) of the holding means 30 upright. A processing means 70 for processing the wafer 100 and a processing transfer means 50 are formed on the front surface of the column 3 .

The machining feed means 50 is a vertical moving means for machining the holding means 30 and the machining means 70 in the Z-axis direction (machine feed direction) that is relatively perpendicular to the holding surface 32 . In the present embodiment, the machining feed means 50 is configured to machine feed the machining means 70 to the holding means 30 in the Z-axis direction perpendicular to the holding surface 32 .

The machining feed means 50 includes a Z-axis guide rail 51 parallel to the Z-axis direction, a Z-axis movement table 53 sliding on the Z-axis guide rail 51 , a Z-axis guide rail 51 and A memory for storing the detection results of the Z-axis encoder 55 for detecting the rotation angle of the parallel Z-axis ball screw 52, the Z-axis motor 54, and the Z-axis motor 54, and the Z-axis encoder 55 A portion 57 and a holder 56 attached to the front surface (surface) of the Z-axis movement table 53 are provided. The holder 56 holds the processing means 70 .

The Z-axis movement table 53 is slidably provided on the Z-axis guide rail 51 via a slide member 531 . A nut part 501 is being fixed to the rear surface side (back surface side) of the Z-axis movement table 53. As shown in FIG. A Z-axis ball screw 52 is screwed to the nut portion 501 . The Z-axis motor 54 is connected to one end of the Z-axis ball screw 52 .

In the machining transport means 50 , the Z-axis motor 54 rotates the Z-axis ball screw 52 , so that the Z-axis movement table 53 moves along the Z-axis guide rail 51 in the Z-axis direction. Accordingly, the holder 56 attached to the Z-axis movement table 53 and the processing means 70 held by the holder 56 also move together with the Z-axis movement table 53 in the Z-axis direction.

The processing means 70 includes a spindle unit 71 . The spindle unit 71 includes a spindle 72 extending in a direction perpendicular to the holding surface 32 , a spindle motor 73 rotating the spindle 72 , and a spindle 72 and a spindle motor 73 . A surrounding casing 74 is provided.

The spindle 72 is provided with the 1st shaft part 721 and the 2nd shaft part 723 formed with a larger diameter than the 1st shaft part 721. A thrust plate 722 is disposed between the first shaft portion 721 and the second shaft portion 723 . The spindle 72 further has a large cylinder diameter portion 724 formed below the second shaft portion 723 , and a small cylinder diameter portion 725 formed below the large cylinder diameter portion 724 .

An air flow passage 60 is formed inside the casing 74 . The air flow path 60 is connected to the air supply source 39 . Moreover, the air flow path 60 is branched into the some branch path in the inside of the casing 74. The air flow passage 60 communicates with the openings of the upper surface 61 , the side surface 62 , and the lower surface 63 of the casing 74 .

The air supplied from the air supply source 39 passes through the air flow path 60 of the casing 74, and from the openings of the upper surface 61, the side surface 62, and the lower surface 63 of the casing 74, the casing 74 ) is ejected to the outside of

Air is blown out from the upper surface 61, the side surface 62, and the lower surface 63 of the casing 74, so that between the casing 74 and the thrust plate 722 of the spindle 72, the casing 74 and the spindle A gap is formed between the second shaft portion 723 of the 72 and between the casing 74 and the large cylinder diameter portion 724 of the spindle 72 . Thereby, in these gaps, the bearing which rotatably supports the spindle 72 by air non-contact is formed.

The upper surface of the disk mount 95 as the first mount is connected to the lower end of the cylinder small diameter portion 725 that is the lower end of the spindle 72 . Moreover, between the lower surface of the cylinder large diameter part 724 of the spindle 72 and the disk mount 95, the guide part 84 which connects both is arrange|positioned and formed.

A grinding wheel 96 is attached to the lower surface of the disk mount 95 . The grinding wheel 96 includes a wheel base 97 and a plurality of substantially rectangular parallelepiped grinding wheels 98 arranged annularly at the lower end of the wheel base 97 .

The grinding wheel 98 can be rotated by the spindle motor 73 via the spindle 72 , the disk mount 95 and the wheel base 97 .

Moreover, the advancing and retreating mechanism 80 is arrange|positioned in the cylinder large diameter part 724 and the cylinder small diameter part 725 in the spindle 72. As shown in FIG. The advancing and retreating mechanism 80 is provided with the accommodation chamber 81 arrange|positioned and formed in the cylinder large-diameter part 724 of the spindle 72. A piston 82 is accommodated in the accommodation chamber 81 .

A plurality of piston rods 83 are connected to the lower portion of the piston 82 . The plurality of piston rods 83 are formed at equal intervals in the circumferential direction of the piston 82 . In addition, in FIG. 1, only one piston rod 83 is shown.

An annular plate 90 is connected to the lower end of the piston rod 83 . Moreover, the through-hole 901 through which the above-mentioned guide part 84 penetrates is formed in the annular plate 90. As shown in FIG.

An annular mount 91 as a second mount is connected to the lower surface of the annular plate 90 . On the lower surface of the annular mount 91 , an annular polishing pad 93 serving as a second processing tool for polishing a workpiece is mounted via a platen 92 .

The annular mount 91 , the platen 92 and the polishing pad 93 have an inner diameter larger than the outer diameters of the disk mount 95 and the grinding wheel 96 , and are formed in an annular shape concentric with the disk mount 95 . has been

The abrasive pad 93 can be rotated by the spindle motor 73 via the spindle 72 , the annular plate 90 , the annular mount 91 , and the platen 92 about the center of the abrasive pad 93 . Do.

The polishing pad 93 and the grinding wheel 98 described above are an example of a processing tool for processing the wafer 100 held by the chuck table 31 . In addition, the grinding wheel 98 is an example of the 1st processing tool with which the inside was equipped, and the polishing pad 93 is an example of the 2nd processing tool provided with the outside.

An air source 86 is connected to the accommodation chamber 81 of the advancing and retreating mechanism 80 via a regulator 85 . In the advancing and retreating mechanism 80, by supplying air from the air source 86 to the accommodation chamber 81 from above via the regulator 85, the pressure in the -Z direction is applied to the piston 82, , it is possible to lower the piston 82 in the Z-axis direction.

Moreover, by supplying air to the accommodation chamber 81 from below, the pressure to +Z direction is applied to the piston 82, and it is possible to raise the piston 82 in the Z-axis direction.

When the piston 82 moves up and down in the Z-axis direction, the annular plate 90 connected to the piston 82 via the piston rod 83 moves up and down while being guided by the guide part 84 . In connection with this, the polishing pad 93 attached to the annular plate 90 moves up and down. In this way, the polishing pad 93 and the grinding wheel 98 move forward and backward relatively along the Z-axis direction.

In this way, the advancing and retreating mechanism 80 relatively moves the disk mount 95 and the annular mount 91 in the Z-axis direction, which is a direction perpendicular to the holding surface 32, so that the grinding wheel 98 or the abrasive pad ( 93) selectively serves as a selection means for approaching the holding surface 32 .

Further, as described above, the annular mount 91 , the platen 92 , and the polishing pad 93 have inner diameters larger than the outer diameters of the disk mount 95 and the grinding wheel 96 . Accordingly, the disk mount 95 and the grinding wheel 96 are accommodated inside the annular mount 91, the platen 92 and the polishing pad 93 without contacting them, and the abrasive pad ( 93) becomes relatively movable in the vertical direction.

Moreover, as shown in FIG. 1 and FIG. 2 which is sectional drawing which shows the processing apparatus 1 along the Y-axis direction, the processing apparatus 1 is below the processing means 70, and is a substantially casing-shaped processing chamber. (20) has The processing chamber 20 includes a chuck table 31 of the holding means 30 for holding the wafer 100 when the wafer 100 is processed, a grinding wheel 98 serving as a processing tool of the processing means 70 , and It is formed so as to receive the polishing pad 93 .

1 and 2 , the processing chamber 20 is provided with an upper plate 21 having a processing tool introduction hole 211 . The processing tool introduction hole 211 is formed in order to make it possible to introduce the grinding wheel 98 and the polishing pad 93 which are the processing tools of the processing means 70 into the processing chamber 20 . The processing chamber 20 includes the top plate 21 , the side plate 22 , the front plate 23 on the -Y side, the rear plate 24 on the +Y side, and the cover plate 37 of the holding means 30 serving as the bottom plate. ) is configured to include The front plate 23 has a length that enables the holding means 30 to move into the processing chamber 20 along the Y-axis direction, and is formed so as to be lowered from the upper plate 21 .

In addition, a corrugated box cover that connects the lower surfaces of the upper plates 21 and 56 of the processing chamber 20 and blocks the processing tool introduction hole 211 in the vertical direction in a cylindrical shape is provided, so that processing debris is removed from the processing tool The ejection from the introduction hole 211 is prevented.

Moreover, the processing chamber 20 is equipped with the partition mechanism 10, as shown in FIG.1 and FIG.2. The partition mechanism 10 brings the grinding wheel 98 closer to the holding surface 32 than the polishing pad 93 by the advancing and retreating mechanism 80 , and the wafer 100 held by the holding surface 32 is moved to the grinding wheel. When processing by (98), it surrounds the grinding wheel 98, divides the processing chamber 20 up and down, and the grinding wheel 98 removes the polishing pad 93 from the processing debris which processed the wafer 100. protect

The partition mechanism 10 is provided with the 1st partition plate 11 and the 2nd partition plate 12 which extend together in the horizontal direction, as shown in FIG.

3 , the processing chamber 20 and the partition mechanism 10 are shown from above. As shown in this FIG. 3 , the first partition plate 11 is provided with a first semicircular concave portion 111 along the outer surface of the grinding wheel 98 . Moreover, the 2nd partition plate is provided with the 2nd semicircular recessed part 121 which faces the 1st semicircular recessed part 111 along the outer surface of the grinding wheel 98. As shown in FIG.

In addition, the partition mechanism 10 includes a first horizontal movement mechanism 13 for horizontally moving the first partition plate 11 along the X-axis direction, and a second partition plate ( 12) is provided with a second horizontal movement mechanism 14 that horizontally moves along the X-axis direction.

The first horizontal movement mechanism 13 and the second horizontal movement mechanism 14 are attached to the lower surface of the upper plate 21 in the processing chamber 20 .

The 1st horizontal movement mechanism 13 and the 2nd horizontal movement mechanism 14 are arm part 201 connected to the 1st partition plate 11 and the 2nd partition plate 12, respectively, as shown in FIG. , and a driving device 200 for moving the arm portion 201 along the X-axis direction. In the first horizontal movement mechanism 13 and the second horizontal movement mechanism 14 , the first partition plate 11 and the second It is possible to move the horizontal movement mechanism 14 in the horizontal direction along the X-axis direction to approach and connect them to each other.

That is, in the partition mechanism 10, the first partition plate 11 and the second partition plate 12 are approached and connected by the first horizontal movement mechanism 13 and the second horizontal movement mechanism 14, The processing chamber 20 so that the 1st partition plate 11 and the 2nd partition plate 12 surround the grinding wheel 98 by the 1st semicircle recessed part 111 and the 2nd semicircular recessed part 121 divide it up and down At this time, the first semicircular concave portion 111 and the second semicircular concave portion 121 are connected to each other to form a circle smaller than the outer diameter of the polishing pad 93 indicated by the broken line in FIG. 3 , A circle surrounds the grinding wheel 98 . Therefore, the partition mechanism 10 can protect the polishing pad 93 from the processing waste which the grinding wheel 98 processed the wafer 100 .

In addition, in order to facilitate the movement of the first partition plate 11 and the second partition plate 12, a guide rail extending in the X-axis direction may be provided.

In the processing apparatus 1 having such a configuration, when the control unit 5 polishes the wafer 100 held by the holding surface 32 with the polishing pad 93 , as shown in FIGS. 4 and 5 . As shown, the first partition plate 11 and the second partition plate 12 are separated from each other in the horizontal direction from the spindle 72 . Accordingly, between the first semi-circular concave portion 111 of the first partition plate 11 and the second semi-circular concave portion 121 of the second partition plate 12, the polishing pad 93 can pass through. do. And the control part 5 controls the advancing and retreating mechanism 80, and makes the abrasive pad 93 approach the holding surface 32 rather than the grinding wheel 98. In this state, the control unit 5 performs a polishing process using the polishing pad 93 on the wafer 100 held by the holding surface 32 .

On the other hand, when grinding the wafer 100 held by the holding surface 32 with the grinding wheel 98, the control unit 5 controls the advancing and retreating mechanism 80 as shown in FIGS. 2 and 3 . Thus, the grinding wheel 98 is brought closer to the holding surface 32 than the polishing pad 93 . And the control part 5 brings the 1st partition plate 11 and the 2nd partition plate 12 close to the spindle in a mutually horizontal direction, The 1st semicircle recessed part 111 and the 2nd semicircle recessed part 121 ) surrounds the grinding wheel 98 by a circle formed by connecting them. In this state, the control unit 5 performs a grinding process using the grinding wheel 98 on the wafer 100 held by the holding surface 32 .

As described above, in the present embodiment, when the wafer 100 is processed with the grinding wheel 98 , the first partition plate 11 and the second partition plate 12 are formed with the first semicircular concave portion 111 . And the processing chamber 20 is divided up and down so that the grinding wheel 98 may be enclosed by the 2nd semicircular recessed part 121. Therefore, the processing generated by processing the wafer 100 by the tip (lower surface) of the grinding wheel 98 located below the processing chamber 20 for the polishing pad 93 located above the processing chamber 20 . It can be protected from debris. Thereby, it can suppress that processing waste adheres to the polishing pad 93. For this reason, it becomes possible to suppress that the back surface 102 of the wafer 100 grind|polished by the polishing pad 93 is damaged by a process waste.

Moreover, in this embodiment, as shown in FIG. 6, the some water jet port 16 which jets water toward the grinding wheel 98 on the upper surface of the 1st partition plate 11 and the 2nd partition plate 12. ) may be provided. The water jet port 16 is a water source not shown, as indicated by an arrow in FIG. 6 during processing by the grinding wheel 98 to which the first partition plate 11 and the second partition plate 12 are connected. It is for spraying the machining water from the side toward the grinding wheel 98 from the side.

In this configuration, by spraying machining water from the side to the grinding wheel 98 during processing by the grinding wheel 98 , the processing debris generated by the grinding wheel 98 processing the wafer 100 is the first partition plate. It can be suppressed from reaching|attaining the polishing pad 93 from the clearance gap between (11) and the 2nd partition plate 12 and the grinding wheel 98. Accordingly, the polishing pad 93 can be better protected from processing chips.

In addition, the water spout 16 is disposed on the lower surface or inside of the first partition plate 11 and the second partition plate 12 instead of the upper surfaces of the first partition plate 11 and the second partition plate 12, You may be provided so that water can be jetted toward the grinding wheel 98.

Moreover, even if the water jet port 16 is provided on the inner surface of the 1st semi-circular recessed part 111 of the 1st partition plate 11, and the inner surface of the 2nd semi-circular recessed part 121 of the 2nd partition plate 12, do.

Moreover, in this embodiment, the processing apparatus 1 is equipped with the grinding wheel 98 as an inner 1st processing tool, and the polishing pad 93 as an outer 2nd processing tool. The polishing pad 93 may be any polishing pad for CMP polishing or dry polishing.

In addition, the combination of the 1st processing tool and 2nd processing tool which can be performed in the processing apparatus 1 is not limited to the combination of the grinding wheel 98 and the polishing pad 93. As shown in FIG. For example, the processing apparatus 1 may have a turning bite as an inner 1st processing tool, and may be equipped with the polishing pad 93 as an outer 2nd processing tool. Or the processing apparatus 1 may have the grinding wheel 98 as an inner 1st processing tool, and may be equipped with the turning byte or grinding wheel 98 as an outer 2nd processing tool. Alternatively, the processing apparatus 1 may have a turning bite as an inner 1st processing tool, and may be equipped with the grinding wheel 98 as an outer 2nd processing tool. Alternatively, the processing apparatus 1 may include the polishing pad 93 as an inner first processing tool, and may include a turning byte, a grinding wheel 98 , or a polishing pad 93 as an outer second processing tool. .

1: processing device
3: column
5: control unit
100: wafer
101: surface
102: back side
103: protective tape
10: partition mechanism
11: first partition plate
12: second partition plate
111: first semicircular recess
121: second semicircular recess
13: first horizontal movement mechanism
14: second horizontal movement mechanism
16 : water spout
20: processing room
21: top plate
22: side plate
23: front panel
24: heavy plate
211: processing tool introduction hole
30: maintenance means
31: chuck table
32: holding surface
36: frame body
33: support member
34: rotation means
35: support column
37: cover plate
39: air supply
60: air euro
40: Y-axis direction movement means
50: processing feed means
70: processing means
71: spindle unit
72: spindle
73: spindle motor
74: casing
721: first shaft part
722: thrust plate
723: second shaft
724: cylinder large diameter part
725: cylinder small diameter part
80: advance and retreat mechanism
81: reception room
82: piston
83: piston rod
84: guide part
85: regulator
86: Air One
90: Illusion Edition
91 : annular mount
92 : platen
93: polishing pad
95: disk mount
96: grinding wheel
97 : wheel leaning
98: grinding wheel

Claims (3)

A processing means having a chuck table for holding a wafer by a holding surface, a processing tool for processing the wafer held on the chuck table, and a processing transfer means for processing and transferring the processing means in a direction perpendicular to the holding surface and a processing chamber for accommodating the chuck table and the processing tool, the processing apparatus comprising:
The processing means is
A first mount having an upper surface connected to the lower end of the spindle extending in the vertical direction and a first processing tool mounted on a lower surface thereof;
a second mount having an inner diameter larger than the outer diameter of the first mount and having a second processing tool mounted on the lower surface thereof in an annular shape concentric with the first mount;
selecting means for selectively bringing the first tool or the second tool closer to the holding surface thereof by relatively moving the first mount and the second mount in a vertical direction thereof;
The processing room,
By the selection means, the first processing tool is brought closer to the holding surface than the second processing tool, and when the wafer held on the holding surface is processed by the first processing tool, the first processing tool is surrounded , divides the processing chamber up and down, the first processing sphere is provided with a partition mechanism for protecting the second processing tool from the processing debris processing the wafer,
The partition mechanism is
a first partition plate having a first semicircular recess along an outer surface of the first processing tool and extending in a horizontal direction;
a second partition plate extending in a horizontal direction and having a second semi-circular recess facing the first semi-circular recess along an outer surface of the first processing tool;
a first horizontal movement mechanism for horizontally moving the first partition plate;
a second horizontal movement mechanism for moving the second partition plate in a horizontal direction;
When processing the wafer held on the holding surface by the second processing tool, the first partition plate and the second partition plate are separated from the spindle in the horizontal direction to each other, and the first semicircular recessed portion and the allowing the second processing tool to pass between the second semicircular recesses,
When processing the wafer held on the holding surface by the first processing tool, the first partition plate and the second partition plate are brought close to the spindle in the horizontal direction to each other, the first semicircular recessed portion and the A machining apparatus, wherein the first machining tool is surrounded by a circle formed by connecting the second semicircular recesses, and the first machining tool protects the second tool from machining chips generated by machining the wafer. The method of claim 1,
The first processing tool is a turning bite or a grinding wheel, and the second processing tool is a polishing pad. The method of claim 1,
A processing apparatus further comprising: a water jet port for jetting water toward the first processing port on the first partition plate and the second partition plate.

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