JP6904300B2 - 噴流式はんだ付け装置 - Google Patents

噴流式はんだ付け装置 Download PDF

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Publication number
JP6904300B2
JP6904300B2 JP2018081589A JP2018081589A JP6904300B2 JP 6904300 B2 JP6904300 B2 JP 6904300B2 JP 2018081589 A JP2018081589 A JP 2018081589A JP 2018081589 A JP2018081589 A JP 2018081589A JP 6904300 B2 JP6904300 B2 JP 6904300B2
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Japan
Prior art keywords
nozzle
jet
straightening
straightening vane
molten solder
Prior art date
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Active
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JP2018081589A
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English (en)
Japanese (ja)
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JP2019188416A (ja
Inventor
博光 奥山
博光 奥山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp filed Critical Omron Corp
Priority to JP2018081589A priority Critical patent/JP6904300B2/ja
Priority to CN201910170970.9A priority patent/CN110385498B/zh
Publication of JP2019188416A publication Critical patent/JP2019188416A/ja
Application granted granted Critical
Publication of JP6904300B2 publication Critical patent/JP6904300B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2018081589A 2018-04-20 2018-04-20 噴流式はんだ付け装置 Active JP6904300B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018081589A JP6904300B2 (ja) 2018-04-20 2018-04-20 噴流式はんだ付け装置
CN201910170970.9A CN110385498B (zh) 2018-04-20 2019-03-07 喷流式焊接装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018081589A JP6904300B2 (ja) 2018-04-20 2018-04-20 噴流式はんだ付け装置

Publications (2)

Publication Number Publication Date
JP2019188416A JP2019188416A (ja) 2019-10-31
JP6904300B2 true JP6904300B2 (ja) 2021-07-14

Family

ID=68284898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018081589A Active JP6904300B2 (ja) 2018-04-20 2018-04-20 噴流式はんだ付け装置

Country Status (2)

Country Link
JP (1) JP6904300B2 (zh)
CN (1) CN110385498B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7486009B1 (ja) 2023-12-25 2024-05-17 千住金属工業株式会社 噴流はんだ装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52170831U (zh) * 1976-06-21 1977-12-26
JPS61137670A (ja) * 1984-12-11 1986-06-25 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPS629767A (ja) * 1985-07-09 1987-01-17 Omron Tateisi Electronics Co 噴流半田槽
JPS63130261A (ja) * 1986-11-20 1988-06-02 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH0534849Y2 (zh) * 1987-07-02 1993-09-03
US5794837A (en) * 1996-11-25 1998-08-18 Delco Electronics Corporation Directional flow control device for a wave soldering apparatus
JP2000208929A (ja) * 1999-01-18 2000-07-28 Nihon Dennetsu Keiki Co Ltd はんだ付け装置
JP2003315116A (ja) * 2002-04-18 2003-11-06 Denso Corp 流量測定装置
JP2003332724A (ja) * 2002-05-13 2003-11-21 Nihon Dennetsu Keiki Co Ltd はんだ波形成装置
US6701963B1 (en) * 2003-05-12 2004-03-09 Horiba Instruments, Inc. Flow conditioner
EP1859886B1 (en) * 2005-03-18 2016-10-12 Senju Metal Industry Co., Ltd. Jet solder vessel
JP4900912B2 (ja) * 2006-04-14 2012-03-21 リコーエレメックス株式会社 単箱式接線流羽根車式計量装置
CN201201093Y (zh) * 2008-04-25 2009-03-04 东莞市健时自动化设备有限公司 波峰焊锡炉立体稳流器
KR101213444B1 (ko) * 2008-05-09 2012-12-18 주식회사 지승개발 우수배관용 비점오염물질제거장치
JP5332654B2 (ja) * 2009-01-27 2013-11-06 千住金属工業株式会社 噴流はんだ槽
JP5659461B2 (ja) * 2009-04-17 2015-01-28 東洋製罐株式会社 充填バルブ
KR200462553Y1 (ko) * 2012-02-10 2012-09-14 주식회사 케이워터텍 조류 발생 억제 장치
CN104339060B (zh) * 2013-07-23 2016-04-13 深圳市堃琦鑫华股份有限公司 一种喷流焊接方法
JP6226028B1 (ja) * 2016-05-20 2017-11-08 千住金属工業株式会社 噴流はんだ槽及び噴流はんだ付け装置

Also Published As

Publication number Publication date
CN110385498B (zh) 2022-02-18
JP2019188416A (ja) 2019-10-31
CN110385498A (zh) 2019-10-29

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