JP6901908B2 - チップ収容方法、搬送装置及び分割装置 - Google Patents

チップ収容方法、搬送装置及び分割装置 Download PDF

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Publication number
JP6901908B2
JP6901908B2 JP2017110383A JP2017110383A JP6901908B2 JP 6901908 B2 JP6901908 B2 JP 6901908B2 JP 2017110383 A JP2017110383 A JP 2017110383A JP 2017110383 A JP2017110383 A JP 2017110383A JP 6901908 B2 JP6901908 B2 JP 6901908B2
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suction
chips
chip accommodating
air
chip
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Japanese (ja)
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JP2018206929A (ja
Inventor
孝一 越間
孝一 越間
彩子 小池
彩子 小池
高橋　昌之
昌之 高橋
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Disco Corp
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Disco Corp
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Priority to JP2017110383A priority Critical patent/JP6901908B2/ja
Priority to CN201810536167.8A priority patent/CN108987326B/zh
Publication of JP2018206929A publication Critical patent/JP2018206929A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
JP2017110383A 2017-06-02 2017-06-02 チップ収容方法、搬送装置及び分割装置 Active JP6901908B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017110383A JP6901908B2 (ja) 2017-06-02 2017-06-02 チップ収容方法、搬送装置及び分割装置
CN201810536167.8A CN108987326B (zh) 2017-06-02 2018-05-30 芯片收纳方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017110383A JP6901908B2 (ja) 2017-06-02 2017-06-02 チップ収容方法、搬送装置及び分割装置

Publications (2)

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JP2018206929A JP2018206929A (ja) 2018-12-27
JP6901908B2 true JP6901908B2 (ja) 2021-07-14

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ID=64542742

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JP2017110383A Active JP6901908B2 (ja) 2017-06-02 2017-06-02 チップ収容方法、搬送装置及び分割装置

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JP (1) JP6901908B2 (zh)
CN (1) CN108987326B (zh)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014116461A (ja) * 2012-12-10 2014-06-26 Disco Abrasive Syst Ltd 分割装置
JP6333648B2 (ja) * 2014-07-16 2018-05-30 Ｔｏｗａ株式会社 個片化物品の移送方法、製造方法及び製造装置

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Publication number Publication date
JP2018206929A (ja) 2018-12-27
CN108987326B (zh) 2024-02-20
CN108987326A (zh) 2018-12-11

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