CN106935536B - 芯片收纳托盘 - Google Patents

芯片收纳托盘 Download PDF

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CN106935536B
CN106935536B CN201611151774.XA CN201611151774A CN106935536B CN 106935536 B CN106935536 B CN 106935536B CN 201611151774 A CN201611151774 A CN 201611151774A CN 106935536 B CN106935536 B CN 106935536B
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关家一马
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Abstract

提供芯片收纳托盘，该芯片收纳托盘与芯片的大小无关而且能够高效率地将芯片从治具转移至芯片收纳托盘并且容易进行所收纳的芯片的拾取。一种芯片收纳托盘，其对多个芯片进行收纳，该芯片收纳托盘具有：保持片，其具有粘合力并将芯片保持在正面上；以及框体，其由底壁和侧壁构成，该底壁对保持片的背面进行支承，该侧壁从底壁立起设置并围绕保持片，在保持片和框体的底壁上形成有朝向保持片的正面开口的多个细孔，从底壁侧通过细孔而提供空气并向保持在保持片上的芯片的下表面喷出空气，从而将芯片剥离。

Description

芯片收纳托盘
技术领域
本发明涉及芯片收纳托盘，其对通过切削装置等划片机分割得到的半导体芯片等进行收纳。
背景技术
在半导体器件制造工艺中，在大致圆板形状的半导体晶片的正面上在呈格子状排列的多个区域内形成IC、LSI等器件，沿着对形成有该器件的各区域进行划分的分割预定线将晶片切断从而制造出各个半导体芯片。对这样分割得到的半导体芯片进行封装而广泛地应用在移动电话或个人计算机等电子设备中。
随着移动电话或个人计算机等电子设备追求更轻量化、小型化，半导体芯片的封装也开发出称为芯片尺寸封装(CSP)的能够小型化的封装技术。作为CSP技术之一，实用化称为Quad Flat Non-lead Package(QFN)的封装技术。关于该称为QFN的封装技术，在形成有多个与半导体芯片的连接端子对应的连接端子并且呈格子状形成有对每个半导体芯片进行划分的分割预定线的铜板等金属板上呈矩阵状配设多个半导体芯片，通过从半导体芯片的背面侧注塑了树脂的树脂部将金属板与半导体芯片一体化从而形成CSP基板(封装基板)。通过将该封装基板沿着分割预定线切断而分割成各个封装后的芯片尺寸封装。
上述封装基板的切断一般由具有切削刀具的切削装置来实施。该切削装置具有如下的治具：在与分割预定线对应的区域内呈格子状形成有使切削刀具的切削刃退避的退刀槽，并且在由退刀槽划分出的多个区域内分别具有设置有吸引孔，将封装基板吸引保持在定位于保持工作台的该治具上，一边使切削刀具旋转一边使保持工作台沿着封装基板的分割预定线相对移动，由此，将封装基板沿着分割预定线切断，并分割成各个芯片尺寸封装。之后，各个分割得到的芯片尺寸封装被收纳在具有多个收纳室的芯片收纳托盘中而被搬送至组装工序(例如参照专利文献1)。
专利文献1：日本特开2001-239365号公报
但是，设置在芯片收纳托盘中的多个收纳室与芯片(芯片尺寸封装)的大小对应地分别被隔壁划分，因此必须准备与芯片(芯片尺寸封装)的大小对应的种类的芯片收纳托盘，存在管理变繁杂的问题。
发明内容
本发明是鉴于上述事实而完成的，其主要的技术课题在于提供芯片收纳托盘，该芯片收纳托盘与芯片的大小无关，而且能够高效率地将芯片从治具转移至芯片收纳托盘并且容易进行所收纳的芯片的拾取。
根据本发明，提供一种芯片收纳托盘，其对多个芯片进行收纳，其中，该芯片收纳托盘具有：保持片，其将芯片保持在具有多个第1细孔的正面上，该正面具有粘合力；以及框体，其由底壁和侧壁构成，该底壁具有多个第2细孔并对该保持片的背面进行支承，该侧壁从该底壁立起设置并围绕该保持片，从该框体的该底壁侧通过第2细孔而提供空气并向保持在该保持片上的芯片的下表面喷出空气，从而将芯片剥离。
由于本发明的芯片收纳托盘具有：保持片，其具有粘合力并将芯片保持在正面上；以及框体，其由底壁和侧壁构成，该底壁对该保持片的背面进行支承；该侧壁从该底壁立起设置并围绕保持片，所以不需要设置与各个芯片对应地划分的多个收纳室，不需要准备与各个芯片的大小对应的种类的托盘。因此，能够使用1种芯片收纳托盘来对应各种芯片，使管理简化。
并且，关于本发明的芯片收纳托盘，由于在保持片和框体的底壁上形成有朝向保持片的正面开口的多个细孔，从底壁侧通过细孔而提供空气并向保持在保持片上的芯片的下表面喷出空气从而将芯片剥离，所以当对因粘合力而保持在保持片上的芯片进行拾取时，向与待拾取的芯片对应的细孔提供空气，由此，能够容易地将待拾取的芯片剥离。
附图说明
图1的(a)和(b)是作为被加工物的封装基板的立体图和剖视图。
图2的(a)和(b)是示出用于对图1所示的封装基板进行保持的保持治具和将封装基板保持在保持治具上的状态的立体图。
图3是用于将图1所示的封装基板分割成各个芯片的切削装置的立体图。
图4的(a)和(b)是由图3所示的切削装置实施的切断工序的说明图。
图5是示出实施了图4所示的切断工序的封装基板被分割成各个芯片的状态的立体图。
图6是本发明实施方式的芯片收纳托盘的立体图。
图7的(a)和(b)是图6中的A-A剖视图。
图8的(a)、(b)和(c)是示出将图5所示的多个芯片转移至图6和图7所示的芯片收纳托盘的状态的说明图。
图9的(a)、(b)和(c)是示出对如图8所示被转移至芯片收纳托盘中的多个芯片进行拾取的状态的说明图。
标号说明
1：封装基板；113：器件；2：保持治具；20：吸引保持部；21、22：退刀槽；23：吸引孔；3：切削装置；32：吸引工作台；33：主轴单元；333：切削刀具；5：芯片收纳托盘；51：保持片；52：框体；6：器件搬送装置；61：吸引保持垫；7：拾取装置。
具体实施方式
以下，参照附图对由本发明构成的芯片收纳托盘的优选的实施方式进行更详细地说明。
在图1的(a)和(b)示出了作为被加工物的封装基板1的立体图和剖视图。封装基板1具有金属板11，在金属板11的正面11a上呈格子状形成有在规定的方向上延伸的多条第1分割预定线111和在与该第1分割预定线111垂直的方向上延伸的第2分割预定线112。在由第1分割预定线111和第2分割预定线112划分出的多个区域内分别配置有芯片113，通过合成树脂部12从金属板11的背面侧对该芯片113进行注塑(molding)。将这样形成的封装基板1沿着第1分割预定线111和第2分割预定线112切断并分割成各个封装后的芯片(芯片尺寸封装)113。
要想将上述封装基板1沿着多条第1分割预定线111和第2分割预定线112切断，则如图2的(a)和(b)所示通过保持治具2来保持封装基板1。如图2的(a)所示，保持治具2形成为矩形并在其正面中央部突出设置有对上述封装基板1进行吸引保持的吸引保持部20。在吸引保持部20的上表面(保持面)，在与形成于封装基板1的第1分割预定线111和与第1分割预定线111垂直形成的第2分割预定线112对应的区域内呈格子状形成有使后述的切削刀具的切削刃退避的退刀槽21和22。并且，在吸引保持部件20中，在由第1分割预定线111和第2分割预定线112划分出的多个区域内分别形成有吸引孔23，该吸引孔23与未图示的吸引构件连通。另外，在保持治具2的4个角上设置有定位用的孔24。在这样构成的保持治具2上，如图2的(b)所示在吸引保持部20的上表面(保持面)上载置有上述封装基板1。
接着，参照图3对将载置在上述的保持治具2上的封装基板1沿着第1分割预定线111和第2分割预定线112切断的切削装置进行说明。图3所示的切削装置3具有大致长方体状的装置外壳31。在该装置外壳31内配设有对被加工物进行保持的吸引工作台32，该吸引工作台32能够在作为切削进给方向的箭头X所示的方向上移动。在吸引工作台32的上表面设置有吸引凹部321，与未图示的吸引构件连通的吸引口322在该吸引凹部321上开口。并且，在吸引工作台32的上表面的4个角上立起设置有与设置于上述保持治具2的4个角的定位用的孔24嵌合的定位销323。并且，吸引工作台32构成为能够通过未图示的旋转机构而旋转。这样构成的吸引工作台32通过未图示的切削进给构件在箭头X所示的切削进给方向上移动。
切削装置3具有作为切削构件的主轴单元33。主轴单元33通过未图示的分度进给构件在图3中箭头Y所示的分度进给方向上移动，并且通过未图示的切入进给构件在图3中箭头Z所示的切入进给方向上移动。该主轴单元33具有：主轴外壳331，其安装在未图示的移动基台上并在作为分度方向的箭头Y所示的方向和作为切入方向的箭头Z所示的方向上进行移动调整；旋转主轴332，其被该主轴外壳331支承为自由旋转；以及切削刀具333，其安装在该旋转主轴332的前端部。
并且，切削装置3具有拍摄构件34，该拍摄构件34用于对保持在上述吸引工作台32上的被加工物的正面进行拍摄并对需由上述切削刀具333切削的区域进行检测。该拍摄构件34具有由显微镜构成的光学系统和拍摄元件(CCD)，并将拍摄得到的图像信号发送至未图示的控制构件。
图3所示的切削装置3如以上那样构成，以下，对使用切削装置3将上述封装基板1沿着多条第1分割预定线111和第2分割预定线112切断的切断作业进行说明。首先，将载置有封装基板1的保持治具2载置在切削装置3的吸引工作台32上。此时，通过使配设在吸引工作台32的4个角上的定位销323与设置在保持治具2的4个角上的多个定位用的孔24嵌合，载置有封装基板1的保持治具2被定位在规定的位置。并且，通过使未图示的吸引构件工作，经由吸引工作台32的吸引口322、吸引凹部321和设置在保持治具2上的多个吸引孔23对载置在保持治具2的吸引保持部20上的封装基板1的各芯片113作用负压，封装基板1的各芯片113被吸引保持在保持治具2的吸引保持部20上(封装基板保持工序)。
在实施了上述封装基板保持工序之后，使未图示的切削进给构件工作而将保持着封装基板1的保持治具2移动至拍摄构件34的正下方。当保持治具2被定位在拍摄构件34的正下方时，执行校准作业，通过拍摄构件34和未图示的控制构件对封装基板1的待切削加工的加工区域进行检测。即，拍摄构件34和未图示的控制构件执行图案匹配等图像处理，并实施对待切削加工的加工区域进行检测的校准作业，其中，该图案匹配等图像处理用于进行形成在封装基板1的规定的方向上的第1分割预定线111与沿着第1分割预定线111进行切削的切削刀具333的位置对位。并且，对在与形成在封装基板1上的上述规定的方向垂直的方向上延伸的第2分割预定线112也同样地实施对待切削加工的加工区域进行检测的校准作业。
如上述那样，在实施了对封装基板1的待切削加工的加工区域进行检测的校准作业之后，将保持治具2移动至切削区域，并如图4的(a)所示将规定的第1分割预定线111的一端定位在比切削刀具333的正下方稍靠图4的(a)中的右侧的位置。并且，一边使切削刀具333按照箭头333a所示的方向旋转，一边使未图示的切入进给构件工作而使切削刀具333按照箭头Z1所示的方向切入进给规定的量，将其定位在规定的切入深度。该切入深度被设定在切削刀具333的切削刃的外周缘到达形成在保持治具2的吸引保持部20上的退刀槽21(参照图2的(a))的位置。接着，使未图示的切削进给构件工作而使吸引工作台32在图4的(a)中箭头X1所示的方向上以规定的切削进给速度移动。并且，如图4的(b)所示，当隔着保持治具2保持在吸引工作台32上的封装基板1的规定的第1分割预定线111的另一端到达比切削刀具333的正下方稍靠左侧的位置，则停止吸引工作台32的移动，并且使切削刀具333按照箭头Z2所示的方向上升，接着分度进给至待切削的第1分割预定线111而重复切削作业。其结果是，封装基板1沿着第1分割预定线111被切断(第1切断工序)。
在沿着全部的第1分割预定线111实施了上述的第1切断工序之后，使吸引工作台32回转90度，将形成在隔着保持治具2保持在吸引工作台32上的封装基板1上的第2分割预定线112定位在作为切削进给方向的箭头X所示的方向上，并且，与上述第1切断工序同样沿着全部的第2分割预定线112对封装基板1实施切断作业(第2切断工序)。
如图5所示，以上那样实施了第1切断工序和第2切断工序的封装基板1沿着第1分割预定线111和第2分割预定线112被切断，并分割成各个封装后的芯片(芯片尺寸封装)113。这样分割得到的各个芯片(芯片尺寸封装)113维持被吸引保持在保持治具2的吸引保持部20上的状态。
如上述那样分割得到的芯片113(芯片尺寸封装)被收纳在后述的芯片收纳托盘中并被移送至作为下一个工序的组装工序。这里，参照图6、图7的(a)和(b)对由本发明构成的芯片收纳托盘5进行说明。
图6和图7的(a)、(b)所示的芯片收纳托盘5由矩形的保持片51和矩形的框体52构成，其中，该保持片51在其正面上保持多个芯片，该框体52对该保持片51进行支承。保持片51由具有粘合力的片材构成，通过粘合力将多个芯片保持在作为上表面的正面上。作为具有粘合力的片材，能够使用新タック化成株式会社制造销售的商品名为“セパレス”或“ハンデコタック”的商品。框体52由底壁521和侧壁522、522、522、522构成，其中，该底壁521具有对保持片51的下表面即背面进行支承的支承面521a，该侧壁522、522、522、522从该底壁521立起设置并围绕保持片51。在底壁521的下表面分别设置有在宽度方向两侧与未图示的搬送装置的支承部件卡合的两个卡合凹部521b、521b(在图6中仅示出一侧的卡合凹部521b、521b)。如图7的(b)所示，在构成了这样构成的芯片收纳托盘5的保持片51和框体52的底壁521上形成有朝向保持片51的正面开口的多个细孔51a和521c。另外，细孔51a和521c能够通过以下方式来形成：从保持片51的正面侧照射激光光线而贯通框体52的底壁521。
接着，参照图8对将如上述图5所示各个分割得到的多个芯片(芯片尺寸封装)113从保持治具2的吸引保持部20上收纳在芯片收纳托盘5中的方法进行说明。
要想将多个芯片113从保持治具2的吸引保持部20上收纳在芯片收纳托盘5中，在图示的实施方式中使用芯片搬送装置6来实施。芯片搬送装置6具有：吸引保持垫61，其对多个芯片进行吸引保持；以及搬送臂62，其在一端部支承该吸引保持垫61，搬送臂62通过未图示的工作机构来进行工作。吸引保持垫61由垫主体611和吸附垫612构成，其中，在垫主体611的下表面具有与形成上述多个芯片113的封装基板1同样大小的矩形的凹部611a，该吸附垫612与该垫主体611的凹部611a嵌合。在垫主体611的中央部设置有与上述凹部611a连通的吸引口611b。该吸引口611b与未图示的吸引构件连通。上述吸附垫612形成为矩形，与设置于上述保持治具2的吸引保持部20的吸引孔23同样，在与多个芯片113对应的位置处设置有多个吸引孔612a。因此，当未图示的吸引构件工作时，经由吸引口611b和凹部611a对多个吸引孔612a作用负压。
要想使用上述的器件搬送装置6将多个芯片113从保持治具2的吸引保持部20上收纳在芯片收纳托盘5中，则如图8的(a)所示使未图示的工作机构工作而将吸引保持垫61的吸附垫612的下表面定位在载置于保持治具2的吸引保持部20上的多个芯片113的上表面上。并且，解除由与吸引工作台32侧连通的吸引构件进行的吸引并且使与吸引保持垫61的吸引口611b连通的未图示的吸引构件工作，由此，经由吸引口611b和凹部611a对设置于吸附垫612的多个吸引孔612a作用负压。其结果是，多个芯片113被吸引保持在设置于吸附垫612的多个吸引孔612a上。在这样将多个芯片113吸引保持在设置于吸附垫612的多个吸引孔612a上之后，使未图示的工作机构工作而如图8的(b)所示将吸引保持垫61搬送到芯片收纳托盘5上，将吸引保持在吸附垫612的下表面(吸附面)上的多个芯片113的下表面载置在保持片51上，该保持片51被框体52的底壁521的支承面521a支承。接着，解除由未图示的吸引构件进行的吸引并且使未图示的工作机构工作而使吸引保持垫61从芯片收纳托盘5上退避，由此，如图8的(c)所示多个芯片113被转移到具有粘合力的保持片51上，该保持片51被构成芯片收纳托盘5的底壁521的支承面521a支承。另外，转移到芯片收纳托盘5的保持片51上的多个芯片113通过保持片51的粘合力而以不会脱落的方式被保持。
如以上那样，关于本发明的芯片收纳托盘5，由于具有粘合力的保持片51被支承在构成框体52的底壁521的支承面521a上，所以不需要设置与各个芯片113对应地划分的各个收纳室，不需要准备与各个芯片113的大小对应的种类的托盘。因此，能够使用1种芯片收纳托盘5来对应各种芯片113，并使管理简化。并且，关于本发明的芯片收纳托盘5，由于具有粘合力的保持片51被支承在构成框体52的底壁521的支承面521a上，所以如上述那样能够通过器件搬送装置6将多个芯片113从保持治具2的吸引保持部20上成批进行转移，能够提高生产性。
如以上那样被收纳在芯片收纳托盘5中的多个芯片113被搬送至组装工序。在组装工序中，通过图9的(a)所示的拾取装置7来按照每个芯片113进行拾取(拾取工序)。图9的(a)所示的拾取装置7具有：拾取构件71，其在芯片收纳托盘5的上侧被配设成能够移动至与保持在芯片收纳托盘5上的多个芯片113对应的位置；以及空气喷出构件72，其在芯片收纳托盘5的下侧被配设成能够与上述拾取构件71同步地移动至与保持在芯片收纳托盘5上的多个芯片113对应的位置。拾取构件71具有对芯片113进行吸引保持的拾取夹头711，该拾取夹头711与未图示的吸引构件连接。上述空气喷出构件72具有构成为能够通过气缸721进行升降的空气喷出筒722，该空气喷出筒722与未图示的空气提供构件连接。
要想使用图9的(a)所示的拾取装置7来实施拾取工序，则使拾取构件71和空气喷出构件72工作而如图9的(b)所示将拾取夹头711定位在待拾取的芯片113的上表面，并且将空气喷出筒722定位在与构成芯片收纳托盘5的底壁521上的待拾取的芯片113对应的下表面。接着，使拾取构件71的未图示的吸引构件工作而对拾取夹头711作用负压，由此，对待拾取的芯片113的上表面进行吸引保持，并且使空气喷出构件72的未图示的空气提供构件工作而向空气喷出筒722提供空气。其结果是，提供到空气喷出筒722的空气通过形成于构成芯片收纳托盘5的框体52的底壁521的细孔521c和形成于保持片51的细孔51a而喷出到待拾取的芯片113的下表面。因此，如图9的(c)所示，通过使拾取构件71的拾取夹头711移动至上方，因粘合力而保持在保持片51的正面上的待拾取的芯片113因喷出到下表面的空气而被容易地剥离。

Claims (1)

1.一种芯片收纳托盘，其对多个芯片进行收纳，其中，
该芯片收纳托盘具有：
保持片，其将芯片保持在具有多个第1细孔的正面上，该正面具有粘合力，其中，所述多个第1细孔配置为当所述芯片被收纳在所述芯片收纳托盘中时，每个芯片位于多个第1细孔上；以及
框体，其由底壁和侧壁构成，该底壁具有多个第2细孔并对该保持片的背面进行支承，该侧壁从该底壁立起设置并围绕该保持片，
从该框体的该底壁侧通过第2细孔和形成于保持片的第1细孔而提供空气并向保持在该保持片上的芯片的下表面喷出空气，从而将芯片剥离。
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Families Citing this family (6)

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JP6887722B2 (ja) * 2016-10-25 2021-06-16 株式会社ディスコ ウェーハの加工方法及び切削装置
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020025656A1 (en) * 2000-08-29 2002-02-28 Kazuhisa Arai Semiconductor chip pick-up method
CN1179371C (zh) * 1998-07-16 2004-12-08 株式会社村田制作所 片形元件托盘的制造方法
CN102024728A (zh) * 2009-09-09 2011-04-20 精工爱普生株式会社 半导体芯片收容托盘
CN102582954A (zh) * 2011-01-07 2012-07-18 株式会社迪思科 搬运托盘
CN203760443U (zh) * 2014-01-24 2014-08-06 梁志炜 图案化蓝宝石基板的蚀刻制程用承载盘

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3456159A (en) * 1963-08-08 1969-07-15 Ibm Connections for microminiature functional components
US4395184A (en) * 1980-02-21 1983-07-26 Palomar Systems & Machines, Inc. Means and method for processing miniature electronic components such as capacitors or resistors
US4859498A (en) * 1987-11-18 1989-08-22 Murata Manufacturing Co., Ltd. Chip component holding plate
JPH02158152A (ja) * 1988-12-09 1990-06-18 Rohm Co Ltd ペレット収納整列用治具
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
JP2682250B2 (ja) * 1991-03-20 1997-11-26 株式会社村田製作所 電子部品チップ用ホルダおよび電子部品チップの取扱方法
US5337893A (en) * 1992-07-22 1994-08-16 Electro Scientific Industries, Inc. High capacity carrier plate
JP2000025881A (ja) * 1998-07-10 2000-01-25 Disco Abrasive Syst Ltd 搬送トレイ
US6029427A (en) * 1999-04-05 2000-02-29 Lucent Technologies, Inc. Method and apparatus for handling semiconductor chips
JP3772954B2 (ja) * 1999-10-15 2006-05-10 株式会社村田製作所 チップ状部品の取扱方法
JP4458386B2 (ja) 2000-02-28 2010-04-28 有限会社ラムテクノロジーズ パルスアーク溶接装置
US6488158B1 (en) * 2000-06-29 2002-12-03 Advanced Micro Devices, Inc. Boat for organic and ceramic flip chip package assembly
JP2002066911A (ja) * 2000-08-29 2002-03-05 Disco Abrasive Syst Ltd 弾性吸着パッドに吸着保持された板状物の剥離方法
JP2004055860A (ja) * 2002-07-22 2004-02-19 Renesas Technology Corp 半導体装置の製造方法
US6864295B2 (en) * 2002-07-23 2005-03-08 Asahi Kasei Chemicals Corporation Gas-generating, pressure-sensitive adhesive composition
JP2005302932A (ja) * 2004-04-09 2005-10-27 M Tec Kk チップの分離装置
JP2006156793A (ja) * 2004-11-30 2006-06-15 Sumitomo Metal Micro Devices Inc フレキシブル基板の剥離装置
JP4630692B2 (ja) * 2005-03-07 2011-02-09 株式会社ディスコ レーザー加工方法
WO2006101270A1 (en) * 2005-03-25 2006-09-28 Fujifilm Corporation Solid state imaging device and manufacturing method thereof
US7928026B2 (en) * 2005-06-30 2011-04-19 Corning Incorporated Synthetic silica material with low fluence-dependent-transmission and method of making the same
US7608523B2 (en) * 2005-08-26 2009-10-27 Disco Corporation Wafer processing method and adhesive tape used in the wafer processing method
JP2007184465A (ja) * 2006-01-10 2007-07-19 Renesas Technology Corp 半導体チップトレイ
US7588150B2 (en) * 2006-07-25 2009-09-15 Miraial Co., Ltd. Wafer container with cushion sheets
JP2008041987A (ja) * 2006-08-08 2008-02-21 Tokyo Ohka Kogyo Co Ltd サポートプレートとウェハとの剥離方法及び装置
US8698099B2 (en) * 2009-09-30 2014-04-15 Kyocera Corporation Attraction member, and attraction device and charged particle beam apparatus using the same
JP5679735B2 (ja) * 2010-08-18 2015-03-04 株式会社ディスコ パッケージ基板のハンドリング方法
NL2005626C2 (nl) * 2010-11-04 2012-05-07 Fico Bv Drager voor gesepareerde elektronische componenten en werkwijze voor visuele inspectie van gesepareerde elektronische componenten.
TWI590372B (zh) * 2012-08-31 2017-07-01 聯達科技設備私人有限公司 用於晶圓及膜片架的單一超平坦晶圓臺結構
KR102138794B1 (ko) * 2013-03-18 2020-07-28 삼성전자주식회사 반도체 패키지 위치정렬트레이, 그를 이용하는 테스트 핸들러, 반도체 패키지 위치 정렬 방법, 그리고 그를 이용하는 반도체 패키지 테스트 방법
JP2014200888A (ja) * 2013-04-05 2014-10-27 ローム株式会社 吸引保持装置およびウエハ研磨装置
JP6262115B2 (ja) 2014-02-10 2018-01-17 東京エレクトロン株式会社 基板処理方法及び基板処理装置
EP2921262B1 (en) * 2014-03-20 2020-06-24 Sofradim Production Porous supports and vacuum hold down device using said supports

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1179371C (zh) * 1998-07-16 2004-12-08 株式会社村田制作所 片形元件托盘的制造方法
US20020025656A1 (en) * 2000-08-29 2002-02-28 Kazuhisa Arai Semiconductor chip pick-up method
CN102024728A (zh) * 2009-09-09 2011-04-20 精工爱普生株式会社 半导体芯片收容托盘
CN102582954A (zh) * 2011-01-07 2012-07-18 株式会社迪思科 搬运托盘
CN203760443U (zh) * 2014-01-24 2014-08-06 梁志炜 图案化蓝宝石基板的蚀刻制程用承载盘

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