TW201732987A - 晶片收容托盤 - Google Patents

晶片收容托盤 Download PDF

Info

Publication number
TW201732987A
TW201732987A TW105136684A TW105136684A TW201732987A TW 201732987 A TW201732987 A TW 201732987A TW 105136684 A TW105136684 A TW 105136684A TW 105136684 A TW105136684 A TW 105136684A TW 201732987 A TW201732987 A TW 201732987A
Authority
TW
Taiwan
Prior art keywords
wafer
holding
suction
bottom wall
wafers
Prior art date
Application number
TW105136684A
Other languages
English (en)
Other versions
TWI706499B (zh
Inventor
Kazuma Sekiya
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW201732987A publication Critical patent/TW201732987A/zh
Application granted granted Critical
Publication of TWI706499B publication Critical patent/TWI706499B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

本發明的課題，係提供無關於晶片的大小，且可有效率地將晶片從治具移送至晶片收容托盤，並且容易進行被收容之晶片的拾取的晶片收容托盤。本發明的解決手段是一種收容複數晶片的晶片收容托盤，具備於具有附著力的表面，保持晶片的保持片，與由支持保持片之背面的底壁和從底壁豎立設置，圍繞保持片的側壁所構成的框體；於保持片與框體的底壁形成有開口於保持片之表面的複數細孔，從底壁側透過細孔來供給空氣，對被保持片保持之晶片的下面噴出空氣，藉此剝離晶片。

Description

晶片收容托盤
本發明細觀於收容藉由切削裝置等的切割鋸刀所分割之半導體晶片等的晶片收容托盤。
於半導體裝置製程中，在大略圓形板形狀之半導體晶圓的表面格子狀地排列之多數區域形成IC、LSI等的裝置，沿著區劃形成該裝置的各區域的預定分割線進行切斷，藉此製造各個半導體晶片。如此分割的半導體晶片，係被封裝而廣泛利用於手機或電腦等的電氣機器。
手機或電腦等的電氣機器被要求更加輕量化、小型化，半導體晶片的封裝也開發有稱為晶片尺寸封裝(CSP)之可小型化的封裝技術。作為CSP技術之一，稱為Quad Flat Non-lead Package(QFN)的封裝技術實用化。稱為該QFN的封裝技術，係形成有複數之對應半導體晶片之連接端子的連接端子，並且於依每一半導體晶片區劃的預定分割線形成為格子狀之銅板等的金屬板，將複數個半導體晶片配設成矩陣狀，藉由從半導體晶片的背面側對樹脂模造加工(Molding)的樹脂部，使金屬板與半導體晶 片一體化，藉此形成CSP基板(封裝基板)。藉由沿著預定分割線切斷該封裝基板，個別地分割成被封裝的晶片尺寸封裝。
前述封裝基板的切斷，一般藉由具備切削刀的切削裝置實施。該切削裝置係具備於與預定分割線對應的區域，格子狀地形成有讓切削刀的刀刃退避的退刀溝，並且於藉由凹溝區劃的複數區域，分別設置吸引孔的治具，於位於保持台上的該治具吸引保持封裝基板，一邊使切削刀旋轉，一邊使保持台沿著封裝基板的預定分割線相對移動，藉此沿著預定分割線切斷封裝基板，分割成各個晶片尺寸封裝。之後，個別被分割的晶片尺寸封裝，係被具備複數收容室的晶片收容托盤收容，搬送至組裝工程(例如參照專利文獻1)。
[先前技術文獻] [專利文獻]
[專利文獻1]日本特開2001-239365號公報
然而，設置於晶片收容托盤之複數收容室對應晶片(晶片尺寸封裝)的大小，分別藉由間隔壁區劃，所以，必須準備對應晶片(晶片尺寸封裝)的大小之種類的晶片收容托盤，有管理煩雜的問題。
本發明係有鑑於前述事實所發明者，其主要的技術課題係提供無關於晶片的大小，且可有效率地將晶片從治具移送至晶片收容托盤，並且容易進行被收容之晶片的拾取的晶片收容托盤。
依據本發明，提供一種晶片收容托盤，係收容複數晶片的晶片收容托盤，具備：保持片，係於具有附著力及複數第1細孔的表面，保持晶片；及框體，係由具有複數第2細孔，支持該保持片之背面的底壁，與從該底壁豎立設置，圍繞該保持片的側壁所構成；從該框體的該底壁側透過第2細孔來供給空氣，對被該保持片保持之晶片的下面噴出空氣，藉此剝離晶片。
本發明的晶片收容托盤，係具備具有附著力，於表面保持晶片的保持片，與由支持該保持片之背面的底壁和從該底壁直立設置，包圍保持片的側壁所成的框體，所以，不需要設置對應各個晶片所區劃之複數收容室，也不需要準備對應各個晶片的大小之種類的托盤。所以，可利用1種類的晶片收容托盤對應各種晶片，管理可簡單化。
又，本發明所致之晶片收容托盤，係藉由於保持片與框體的底壁形成開口於保持片之表面的複數細孔，從底壁 側透過細孔來供給空氣，對被保持片保持的晶片下面噴出空氣，來剝離晶片，所以，在拾取被保持片藉由附著力保持的晶片時，藉由對對應應拾取之晶片的細孔供給空氣，可容易剝離應拾取的晶片。
1‧‧‧封裝基板
2‧‧‧保持治具
3‧‧‧切削裝置
5‧‧‧晶片收容托盤
6‧‧‧裝置搬送裝置
7‧‧‧拾取裝置
11‧‧‧金屬板
11a‧‧‧表面
12‧‧‧合成樹脂部
20‧‧‧吸引保持部
21‧‧‧退刀溝
22‧‧‧退刀溝
23‧‧‧吸引孔
24‧‧‧孔洞
31‧‧‧裝置殼體
32‧‧‧吸引台
33‧‧‧主軸單元
34‧‧‧攝像手段
51‧‧‧保持片
51a‧‧‧細孔
52‧‧‧框體
61‧‧‧吸引保持墊
62‧‧‧搬送機械臂
71‧‧‧拾取手段
72‧‧‧空氣噴出手段
111‧‧‧第1預定分割線
112‧‧‧第2預定分割線
113‧‧‧晶片
321‧‧‧吸引凹部
323‧‧‧定位銷
331‧‧‧主軸殼體
332‧‧‧旋轉主軸
333‧‧‧切削刀
333a‧‧‧箭頭
521‧‧‧底壁
521a‧‧‧支持面
521b‧‧‧卡合凹部
521c‧‧‧細孔
522‧‧‧側壁
611‧‧‧墊本體
611a‧‧‧凹部
611b‧‧‧吸引口
612‧‧‧吸附墊
612a‧‧‧吸引孔
711‧‧‧拾取筒夾
721‧‧‧氣缸
722‧‧‧空氣噴出筒
[圖1]作為被加工物的封裝基板的立體圖及剖面圖。
[圖2]揭示圖1所示之用以保持封裝基板的保持治具及於保持治具保持封裝基板之狀態的立體圖。
[圖3]用以將圖1所示之封裝基板分割成各個晶片的切削裝置的立體圖。
[圖4]藉由圖3所示之切削裝置所實施的切斷工程的說明圖。
[圖5]揭示實施了圖4所示之切斷工程的封裝基板被分割成各個晶片之狀態的立體圖。
[圖6]本發明實施形態之晶片收容托盤的立體圖。
[圖7]圖6的A-A剖面圖。
[圖7]揭示將圖5所示之複數晶片移送至圖6及圖7所示之晶片收容托盤之狀態的說明圖。
[圖9]揭示拾取如圖8所示移送至晶片收容托盤之複數晶片之狀態的說明圖。
以下，針對遵從本發明所構成之晶片收容托盤的理想實施形態，參照添附圖面，進一步詳細進行說明。
於圖1(a)及(b)，揭示作為被加工物的封裝基板1的立體圖及剖面圖。封裝基板1係具備金屬板11，於金屬板11的表面11a格子狀地形成有延伸於所定方向的複數第1預定分割線111，與延伸於與該第1預定分割線111正交之方向的第2預定分割線112。於藉由第1預定分割線111與第2預定分割線112所區劃的複數區域分別配置有晶片113，該晶片113從金屬板11的背面側藉由合成樹脂部12模造加工。如此形成的封裝基板1，係沿著第1預定分割線111及第2預定分割線112切斷，個別地分割成封裝的晶片(晶片尺寸封裝)113。
對於將前述封裝基板1沿著複數第1預定分割線111及第2預定分割線112切斷來說，如圖2(a)及(b)所示，藉由保持治具2保持。保持治具2係如圖2(a)所示，於形成為矩形狀的表面中央部突出設置有吸引保持前述封裝基板1的吸引保持部20。於吸引保持部20的上面(保持面)，在與形成於封裝基板1之第1預定分割線111及正交於第1預定分割線111所形成之第2預定分割線112對應的區域，格子狀地形成有讓後述切削刀的刀刃退避的退刀溝21及22。又，於吸引保持構件20，在藉由第1預定分割線111及第2預定分割線112所區劃的複數區域分別形成有吸引孔23，該吸引孔23連通於未圖示的吸 引手段。再者，於保持治具2的4角落，設置有定位用的孔洞24。於如此構成的保持治具2，如圖2(b)所示，於吸引保持部20的上面(保持面)載置封裝基板1。
接著，針對將上述之載置於保持治具2的封裝基板1，沿著第1預定分割線111及第2預定分割線112切斷的切削裝置，參照圖3進行說明。圖3所示之切削裝置3係具備大略長方體狀的裝置殼體31。於該裝置殼體31內，保持被加工物的吸引台32可往切削進送方向即箭頭X所示方向移動地配設。於吸引台32的上面，設置有吸引凹部321，與未圖示的吸引手段連通的吸引口322開口於該吸引凹部321。又，於吸引台32的上面之4角落，直立設置有設置在前述保持治具2的4角之定位用的孔洞24嵌合的定位銷323。又，吸引台32構成為可藉由未圖示的旋轉機構旋轉。如此構成的吸引台32藉由未圖示的切削進送手段，往箭頭X所示的切銷進送方向移動。
切削裝置3具備作為切削手段的主軸單元33。主軸單元33係藉由未圖示的指數標定手段，往圖3中箭頭Y所示之指數標定(indexing)方向移動，並且藉由未圖示的進刀手段，往圖3中箭頭Z所示之進刀(Infeed)方向移動。該主軸單元33係具備安裝於未圖示的移動基台，可往指數標定方向即箭頭Y所示之方向及進刀方向即箭頭Z所示之方向移動調整的主軸殼體331、被可旋轉地支持於該主軸殼體331的旋轉主軸332、安裝於該旋轉主 軸332的前端部的切削刀333。
又，切削裝置3係具備對被保持於前述吸引台32上之被加工物的表面進行攝像，用以檢測出應藉由前述切削刀333切削之區域的攝像手段34。該攝像手段34係具備由顯微鏡等的光學系與攝像元件(CCD)，將攝像的畫像訊號送至未圖示的控制手段。
圖3所示之切削裝置3如以上所述構成，以下，針對使用切削裝置3，將前述封裝基板1沿著複數第1預定分割線111及第2預定分割線112切斷的切斷作業，進行說明。首先，於切削裝置3的吸引台32上載置載置封裝基板1的保持治具2。此時，藉由將設置於保持治具2的4角落的複數定位用孔洞24，嵌合於配設於吸引台32的4角落的定位銷323，載置封裝基板1的保持治具2被定位於所定位置。然後，藉由未圖示的吸引手段動作，透過吸引台32的吸引口322、吸引凹部321、設置於保持治具2的複數吸引孔23，負壓作用於載置在保持治具2的吸引保持部20之封裝基板1的各晶片113，封裝基板1的各晶片113被吸引保持於保持治具2的吸引保持部20上(封裝基板保持工程)。
實施了前述封裝基板保持工程的話，未圖示的切削進送手段動作，使保持封裝基板1的保持治具2移動至攝像手段34的正下方為止。保持治具2位於攝像手段34的正下方的話，藉由攝像手段34及未圖示的控制手段，執行檢測出封裝基板1之應進行切削加工的加工區域 的校準作業。亦即，攝像手段34及未圖示的控制手段，係執行用以進行形成於封裝基板1之所定方向的第1預定分割線111，與沿著第1預定分割線111切削的切削刀333之對位的圖案匹配等的畫像處理，實施檢測出應進行切削加工之加工區域的校準作業。又，對於延伸於與形成於封裝基板1之前述所定方向正交的方向之第2預定分割線112，也同樣地實施檢測出應進行切削加工之加工區域的校準作業。
如上所述，實施了檢測出應進行封裝基板1的切削加工之加工區域的校準作業的話，則將保持治具2移動至切削區域，如圖4(a)所示，使所定第1預定分割線111的一端，位於比切削刀333的正下方更稍微靠圖4(a)中右側。然後，一邊使切削刀333往箭頭333a所示方向旋轉，一邊使未圖示的進刀手段動作，將切削刀333往箭頭Z1所示方向進刀所定量，位於所定切削深度。該切削深度係設定為切削刀333的刀刃的外周緣到達形成於保持治具2之吸引保持部20的退刀溝21(參照圖2(a))的位置。接著，使未圖示的切削進送手段動作，使吸引台32往圖4(a)中箭頭X1所示方向以所定切削進送手段移動。然後，隔著保持治具2被保持於吸引台32的封裝基板1之所定第1預定分割線111的另一端如圖4(b)所示，到達切削刀333的正下方稍微靠左側的話，則停止吸引台32的移動，並且使切削刀333往箭頭Z2所示方向上升，標數指定於接下來應切削的第1預定分割線111，重複切削 作業。結果，封裝基板1沿著第1預定分割線111被切斷(第1切斷工程)。
沿著所有第1預定分割線111實施了上述之第1切斷工程的話，則使吸引台32進行90度旋動，並使形成在隔著保持治具2被保持於吸引台32的封裝基板1之第2預定分割線112，位於切削進送方向即箭頭X所示方向，然後，對於封裝基板1，同樣地沿著所有第2預定分割線112進行前述第1切斷工程，來實施切斷作業(第2切斷工程)。
如上述實施了第1切斷工程及第2切斷工程的封裝基板1，係如圖5所示，沿著第1預定分割線111及第2預定分割線112被切斷，個別分割成被封裝的晶片(晶片尺寸封裝)113。如此分割之各個晶片(晶片尺寸封裝)113，係在被保持治具2的吸引保持部20吸引保持之狀態下維持。
如上述般分割的晶片113(晶片尺寸封裝)，被收容於後述的晶片收容托盤，移送至下個工程即組裝工程。在此，針對遵從本發明所構成的晶片收容托盤5，參照圖6、圖7A及圖7B進行說明。
圖6及圖7(a)(b)所示之晶片收容托盤5，係由於表面保持複數晶片之矩形狀的保持片51，與支持該保持片51之矩形狀的框體52所成。保持片51係由具有附著力的薄片所成，在上面的表面藉由附著力保持複數晶片。作為具有附著力的薄片，可使用日本新達可化成(New Tac Kasei) 股份有限公司所製造販賣之產品名稱「」或「 」。框體52係由具有支持保持片51之下面即背面的支持面521a的底壁521，與從該底壁521直立設置，圍繞保持片51的側壁522、522、522、522所成。於底壁521的下面，於短邊方向兩側分別設置有與未圖示之搬送裝置的支持構件卡合的兩個卡合凹部521b、521b(於圖6僅揭示一方之側的卡合凹部521b、521b)。於構成如此構成之晶片收容托盤5的保持片51及框體52的底壁521，如圖7(b)所示，形成有開口於保持片51之表面的複數細孔51a及521c。再者，細孔51a及521c能以從保持片51的表面側照射雷射光線，貫通框體52的底壁521之方式形成。
接著，如前述圖5所示，針對從保持治具2的吸引保持部20上，將個別分割之複數晶片(晶片尺寸封裝)113收容至晶片收容托盤5的方法，參照圖8進行說明。
對於從保持治具2的吸引保持部20上將複數晶片113收容至晶片收容托盤5來說，於圖示的實施形態中，使用晶片搬送裝置6來實施。晶片搬送裝置6係具備吸引保持複數晶片的吸引保持墊61，與將該吸引保持墊61支持於一端部的搬送機械臂62，搬送機械臂62藉由未圖示的動作機構進行動作。吸引保持墊61係由具備與在下面形成前述複數晶片113的封裝基板1相同大小之矩形狀的凹部611a的墊本體611，與嵌合於該墊本體611之凹部 611a的吸附墊612所成。墊本體611係於中央部設置有連通於前述凹部611a的吸引口611b。該吸引口611b連通於未圖示的吸引手段。前述吸附墊612形成為矩形狀，與設置於前述保持治具2的吸引保持部20之吸引孔23相同，在與複數晶片113對應的位置設置有複數吸引孔612a。所以，未圖示的吸引手段動作的話，透過吸引口611b及凹部611a，負壓會作用於複數吸引孔612a。
對於使用上述之裝置搬送裝置6，從保持治具2的吸引保持部20上將複數晶片113收容至晶片收容托盤5來說，如圖8(a)所示，使未圖示的動作機構動作，讓吸引保持墊61的吸附墊612的下面，位於被載置於保持治具2的吸引保持部20上之複數晶片113的上面。然後，解除連通於吸引台32側的吸引手段所致之吸引，並且使連通吸引保持墊61的吸引口611b之未圖示的吸引手段動作，藉此，透過吸引口611b及凹部611a，使負壓作用於設置在吸附墊612的複數吸引孔612a。結果，複數晶片113被設置於吸附墊612的複數吸引孔612a吸引保持。如此，將複數晶片113吸引保持於設置在吸附墊612的複數吸引孔612a的話，使未圖示的動作機構動作，如圖8(b)所示，將吸引保持墊61搬送至晶片收容托盤5上，並將被吸引保持於吸附墊612的下面(吸附面)之複數晶片113的下面，載置於框體52之底壁521的支持面521a所支持的保持片51上。接著，解除未圖示的吸引手段所致之吸引，並且使未圖示的動作機構動作，使吸引保 持墊61從晶片收容托盤5上退避，如圖8(c)所示，複數晶片113被移送至構成晶片收容托盤5之底壁521的支持面521a所支持之具有附著力的保持片51上。再者，被移送至晶片收容托盤5的保持片51上之複數晶片113，藉由保持片51上的附著力而不脫落地被保持。
如上所述，本發明的晶片收容托盤5，因為在構成框體52之底壁521的支持面521a支持具有附著力的保持片51，所以，不需要設置對應各個晶片113所區劃之複數收容室，也不需要準備對應各個晶片113之大小的各種類的托盤。所以，可利用1種類的晶片收容托盤5對應各種晶片113，管理可簡單化。又，本發明的晶片收容托盤5，因為在構成框體52之底壁521的支持面521a支持具有附著力的保持片51，所以，可從保持治具2的吸引保持部20上將複數晶片113如上所述般藉由裝置搬送裝置6總括進行移送，可提升生產性。
如上所述，被收容於晶片收容托盤5的複數晶片113，係被搬送至組裝工程。於組裝工程中，藉由圖9(a)所示之拾取裝置7，對應每一晶片113進行拾取(拾取工程)。圖9(a)所示之拾取裝置7，係具備於晶片收容托盤5的上側中可移動地配設在與被晶片收容托盤5保持之複數晶片113對應的位置的拾取手段71，與於晶片收容托盤5的下側中和前述拾取手段71同步，可移動地配設在與被晶片收容托盤5保持之複數晶片113對應的位置的空氣噴出手段72。拾取手段71係具備吸引保持晶片113的 拾取筒夾711，該拾取筒夾711連接於未圖示的吸引手段。前述空氣噴出手段72係具備構成為可藉由氣缸721升降的空氣噴出筒722，該空氣噴出筒722連接於未圖示的空氣供給手段。
對於使用圖9(a)所示之拾取裝置7，實施拾取工程來說，使拾取手段71及空氣噴出手段72動作，如圖9(b)所示，使拾取筒夾711位於應拾取的晶片113的上面，並且使空氣噴出筒722位於與構成晶片收容托盤5的底壁521之應拾取之晶片113的下面。接著，使拾取手段71之未圖示的吸引手段動作，讓負壓作用於拾取筒夾711，藉此吸引保持應拾取之晶片113的上面，並且使空氣噴出手段72之未圖示的空氣供給手段動作，對空氣噴出筒722供給空氣。結果，被供給至空氣噴出筒722的空氣，通過形成於構成晶片收容托盤5之框體52的底壁521之細孔521c及形成於保持片51的細孔51a，向應拾取之晶片113的下面噴出。所以，藉由將拾取手段71的拾取筒夾711往上方移動，如圖9(c)所示，藉由附著力被保持於保持片51的表面之應拾取的晶片113，可藉由從下面噴出的空氣而容易剝離。
5‧‧‧晶片收容托盤
7‧‧‧拾取裝置
51‧‧‧保持片
51a‧‧‧細孔
52‧‧‧框體
71‧‧‧拾取手段
72‧‧‧空氣噴出手段
113‧‧‧晶片
521‧‧‧底壁
521c‧‧‧細孔
522‧‧‧側壁
711‧‧‧拾取筒夾
721‧‧‧氣缸
722‧‧‧空氣噴出筒

Claims (1)

  1. 一種晶片收容托盤，係收容複數晶片的晶片收容托盤，其中，具備：保持片，係於具有附著力及複數第1細孔的表面，保持晶片；及框體，係由具有複數第2細孔，支持該保持片之背面的底壁，與從該底壁直立設置，圍繞該保持片的側壁所構成；從該框體的該底壁側透過第2細孔來供給空氣，對被該保持片保持之晶片的下面噴出空氣，藉此剝離晶片。
TW105136684A 2015-12-24 2016-11-10 晶片收容托盤 TWI706499B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015251182A JP6605946B2 (ja) 2015-12-24 2015-12-24 チップ収容トレイからチップをピックアップする方法
JP2015-251182 2015-12-24

Publications (2)

Publication Number Publication Date
TW201732987A true TW201732987A (zh) 2017-09-16
TWI706499B TWI706499B (zh) 2020-10-01

Family

ID=59010834

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105136684A TWI706499B (zh) 2015-12-24 2016-11-10 晶片收容托盤

Country Status (7)

Country Link
US (1) US10475681B2 (zh)
JP (1) JP6605946B2 (zh)
KR (1) KR102465718B1 (zh)
CN (1) CN106935536B (zh)
DE (1) DE102016225805A1 (zh)
SG (1) SG10201610082WA (zh)
TW (1) TWI706499B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11172600B2 (en) 2017-09-29 2021-11-09 Shinkawa Ltd. Mounting device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6887722B2 (ja) * 2016-10-25 2021-06-16 株式会社ディスコ ウェーハの加工方法及び切削装置
JP2019016700A (ja) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置
JP6890894B2 (ja) * 2017-08-21 2021-06-18 株式会社ディスコ 保持冶具の製造方法
JP7304709B2 (ja) * 2019-02-19 2023-07-07 株式会社ディスコ 被加工物の加工方法
KR102633195B1 (ko) 2021-12-10 2024-02-01 세메스 주식회사 필름 결합 모듈 및 이를 포함하는 반도체 스트립 절단 및 분류 장비

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3456159A (en) * 1963-08-08 1969-07-15 Ibm Connections for microminiature functional components
US4395184A (en) * 1980-02-21 1983-07-26 Palomar Systems & Machines, Inc. Means and method for processing miniature electronic components such as capacitors or resistors
US4859498A (en) * 1987-11-18 1989-08-22 Murata Manufacturing Co., Ltd. Chip component holding plate
JPH02158152A (ja) * 1988-12-09 1990-06-18 Rohm Co Ltd ペレット収納整列用治具
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
JP2682250B2 (ja) * 1991-03-20 1997-11-26 株式会社村田製作所 電子部品チップ用ホルダおよび電子部品チップの取扱方法
US5337893A (en) * 1992-07-22 1994-08-16 Electro Scientific Industries, Inc. High capacity carrier plate
JP2000025881A (ja) * 1998-07-10 2000-01-25 Disco Abrasive Syst Ltd 搬送トレイ
JP2000030990A (ja) * 1998-07-16 2000-01-28 Murata Mfg Co Ltd チップ部品の保持プレートの製造方法
US6029427A (en) * 1999-04-05 2000-02-29 Lucent Technologies, Inc. Method and apparatus for handling semiconductor chips
JP3772954B2 (ja) * 1999-10-15 2006-05-10 株式会社村田製作所 チップ状部品の取扱方法
JP4458386B2 (ja) 2000-02-28 2010-04-28 有限会社ラムテクノロジーズ パルスアーク溶接装置
US6488158B1 (en) * 2000-06-29 2002-12-03 Advanced Micro Devices, Inc. Boat for organic and ceramic flip chip package assembly
JP2002066911A (ja) * 2000-08-29 2002-03-05 Disco Abrasive Syst Ltd 弾性吸着パッドに吸着保持された板状物の剥離方法
JP4546626B2 (ja) * 2000-08-29 2010-09-15 株式会社ディスコ 半導体素子のピックアップ方法
JP2004055860A (ja) * 2002-07-22 2004-02-19 Renesas Technology Corp 半導体装置の製造方法
US6864295B2 (en) * 2002-07-23 2005-03-08 Asahi Kasei Chemicals Corporation Gas-generating, pressure-sensitive adhesive composition
JP2005302932A (ja) * 2004-04-09 2005-10-27 M Tec Kk チップの分離装置
JP2006156793A (ja) * 2004-11-30 2006-06-15 Sumitomo Metal Micro Devices Inc フレキシブル基板の剥離装置
JP4630692B2 (ja) * 2005-03-07 2011-02-09 株式会社ディスコ レーザー加工方法
WO2006101270A1 (en) * 2005-03-25 2006-09-28 Fujifilm Corporation Solid state imaging device and manufacturing method thereof
US7928026B2 (en) * 2005-06-30 2011-04-19 Corning Incorporated Synthetic silica material with low fluence-dependent-transmission and method of making the same
US7608523B2 (en) * 2005-08-26 2009-10-27 Disco Corporation Wafer processing method and adhesive tape used in the wafer processing method
JP2007184465A (ja) * 2006-01-10 2007-07-19 Renesas Technology Corp 半導体チップトレイ
JP4744603B2 (ja) * 2006-07-25 2011-08-10 ミライアル株式会社 クッションシート付ウエハ収納容器
JP2008041987A (ja) * 2006-08-08 2008-02-21 Tokyo Ohka Kogyo Co Ltd サポートプレートとウェハとの剥離方法及び装置
JP4941527B2 (ja) * 2009-09-09 2012-05-30 セイコーエプソン株式会社 半導体チップ収容トレイ
US8698099B2 (en) * 2009-09-30 2014-04-15 Kyocera Corporation Attraction member, and attraction device and charged particle beam apparatus using the same
JP5679735B2 (ja) * 2010-08-18 2015-03-04 株式会社ディスコ パッケージ基板のハンドリング方法
NL2005626C2 (nl) * 2010-11-04 2012-05-07 Fico Bv Drager voor gesepareerde elektronische componenten en werkwijze voor visuele inspectie van gesepareerde elektronische componenten.
JP2012144261A (ja) * 2011-01-07 2012-08-02 Disco Corp 搬送トレイ
SG11201501086UA (en) * 2012-08-31 2015-04-29 Semiconductor Tech & Instr Inc System and method for automatically correcting for rotational misalignment of wafers on film frames
KR102138794B1 (ko) * 2013-03-18 2020-07-28 삼성전자주식회사 반도체 패키지 위치정렬트레이, 그를 이용하는 테스트 핸들러, 반도체 패키지 위치 정렬 방법, 그리고 그를 이용하는 반도체 패키지 테스트 방법
JP2014200888A (ja) * 2013-04-05 2014-10-27 ローム株式会社 吸引保持装置およびウエハ研磨装置
CN203760443U (zh) * 2014-01-24 2014-08-06 梁志炜 图案化蓝宝石基板的蚀刻制程用承载盘
JP6262115B2 (ja) 2014-02-10 2018-01-17 東京エレクトロン株式会社 基板処理方法及び基板処理装置
EP2921262B1 (en) * 2014-03-20 2020-06-24 Sofradim Production Porous supports and vacuum hold down device using said supports

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11172600B2 (en) 2017-09-29 2021-11-09 Shinkawa Ltd. Mounting device
TWI746888B (zh) * 2017-09-29 2021-11-21 日商新川股份有限公司 封裝裝置

Also Published As

Publication number Publication date
JP6605946B2 (ja) 2019-11-13
SG10201610082WA (en) 2017-07-28
CN106935536A (zh) 2017-07-07
US20170186635A1 (en) 2017-06-29
TWI706499B (zh) 2020-10-01
DE102016225805A1 (de) 2017-06-29
JP2017117913A (ja) 2017-06-29
CN106935536B (zh) 2022-02-18
US10475681B2 (en) 2019-11-12
KR20170076562A (ko) 2017-07-04
KR102465718B1 (ko) 2022-11-09

Similar Documents

Publication Publication Date Title
TW201732987A (zh) 晶片收容托盤
JP4846411B2 (ja) 半導体パッケージ用治具
KR102313927B1 (ko) 절삭 장치
US10297488B2 (en) Workpiece support jig
JP2013065603A (ja) 分割装置
JP2012144261A (ja) 搬送トレイ
TW202003146A (zh) 搬送用治具以及切割刀片交換方法
JP6301147B2 (ja) 保持治具
JP2020203358A (ja) 切削装置及び交換方法
CN106057715B (zh) 被加工物的搬送托盘
JP5941701B2 (ja) ダイボンダ
CN111300670B (zh) 切削装置
JP2016154168A (ja) 被加工物の受け渡し方法
TW201742186A (zh) 吸盤台
CN107068606B (zh) 加工装置
TW201440949A (zh) 保持治具
TWI715727B (zh) 封裝基板之處置方法
JP2013033882A (ja) パッケージ基板分割装置
JP2014038947A (ja) 搬送トレイ
JP6208587B2 (ja) 切削装置
JP2012182399A (ja) 部品実装機
JP7394664B2 (ja) 被加工物の加工方法及びチップ搬送用治具
CN108987326B (zh) 芯片收纳方法
JP6475085B2 (ja) チップの搬出方法
JP2016201511A (ja) 搬出治具