SG10201610082WA - Chip accommodation tray - Google Patents

Chip accommodation tray

Info

Publication number
SG10201610082WA
SG10201610082WA SG10201610082WA SG10201610082WA SG10201610082WA SG 10201610082W A SG10201610082W A SG 10201610082WA SG 10201610082W A SG10201610082W A SG 10201610082WA SG 10201610082W A SG10201610082W A SG 10201610082WA SG 10201610082W A SG10201610082W A SG 10201610082WA
Authority
SG
Singapore
Prior art keywords
accommodation tray
chip accommodation
chip
tray
accommodation
Prior art date
Application number
SG10201610082WA
Inventor
Sekiya Kazuma
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201610082WA publication Critical patent/SG10201610082WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Packaging Frangible Articles (AREA)
SG10201610082WA 2015-12-24 2016-12-01 Chip accommodation tray SG10201610082WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015251182A JP6605946B2 (en) 2015-12-24 2015-12-24 Method for picking up chips from the chip storage tray

Publications (1)

Publication Number Publication Date
SG10201610082WA true SG10201610082WA (en) 2017-07-28

Family

ID=59010834

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201610082WA SG10201610082WA (en) 2015-12-24 2016-12-01 Chip accommodation tray

Country Status (7)

Country Link
US (1) US10475681B2 (en)
JP (1) JP6605946B2 (en)
KR (1) KR102465718B1 (en)
CN (1) CN106935536B (en)
DE (1) DE102016225805A1 (en)
SG (1) SG10201610082WA (en)
TW (1) TWI706499B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6887722B2 (en) * 2016-10-25 2021-06-16 株式会社ディスコ Wafer processing method and cutting equipment
JP2019016700A (en) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 Holding member, method for manufacturing holding member, holding device, conveyance device, and device for manufacturing electronic component
JP6890894B2 (en) * 2017-08-21 2021-06-18 株式会社ディスコ Manufacturing method of holding jig
US11172600B2 (en) 2017-09-29 2021-11-09 Shinkawa Ltd. Mounting device
JP7304709B2 (en) * 2019-02-19 2023-07-07 株式会社ディスコ Workpiece processing method
KR102633195B1 (en) * 2021-12-10 2024-02-01 세메스 주식회사 Film mounting module and semiconductor strip sawing and sorting equipment including the same

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3456159A (en) * 1963-08-08 1969-07-15 Ibm Connections for microminiature functional components
US4395184A (en) * 1980-02-21 1983-07-26 Palomar Systems & Machines, Inc. Means and method for processing miniature electronic components such as capacitors or resistors
US4859498A (en) * 1987-11-18 1989-08-22 Murata Manufacturing Co., Ltd. Chip component holding plate
JPH02158152A (en) * 1988-12-09 1990-06-18 Rohm Co Ltd Jig for containing and aligning pellet
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
JP2682250B2 (en) * 1991-03-20 1997-11-26 株式会社村田製作所 Electronic component chip holder and electronic component chip handling method
US5337893A (en) * 1992-07-22 1994-08-16 Electro Scientific Industries, Inc. High capacity carrier plate
JP2000025881A (en) * 1998-07-10 2000-01-25 Disco Abrasive Syst Ltd Transfer tray
JP2000030990A (en) * 1998-07-16 2000-01-28 Murata Mfg Co Ltd Manufacture of chip component holding plate
US6029427A (en) * 1999-04-05 2000-02-29 Lucent Technologies, Inc. Method and apparatus for handling semiconductor chips
JP3772954B2 (en) * 1999-10-15 2006-05-10 株式会社村田製作所 How to handle chip-like parts
JP4458386B2 (en) 2000-02-28 2010-04-28 有限会社ラムテクノロジーズ Pulse arc welding equipment
US6488158B1 (en) * 2000-06-29 2002-12-03 Advanced Micro Devices, Inc. Boat for organic and ceramic flip chip package assembly
JP4546626B2 (en) * 2000-08-29 2010-09-15 株式会社ディスコ Method for picking up semiconductor element
JP2002066911A (en) * 2000-08-29 2002-03-05 Disco Abrasive Syst Ltd Peeling off method of plate-like object adsorbed and retained to elastic adsorption pad
JP2004055860A (en) * 2002-07-22 2004-02-19 Renesas Technology Corp Semiconductor device fabricating process
US6864295B2 (en) * 2002-07-23 2005-03-08 Asahi Kasei Chemicals Corporation Gas-generating, pressure-sensitive adhesive composition
JP2005302932A (en) * 2004-04-09 2005-10-27 M Tec Kk Chip separation apparatus
JP2006156793A (en) * 2004-11-30 2006-06-15 Sumitomo Metal Micro Devices Inc Flexible substrate detacher
JP4630692B2 (en) * 2005-03-07 2011-02-09 株式会社ディスコ Laser processing method
EP2463910A3 (en) * 2005-03-25 2012-08-15 Fujifilm Corporation Manufacturing method of a solid state imaging device
US7928026B2 (en) * 2005-06-30 2011-04-19 Corning Incorporated Synthetic silica material with low fluence-dependent-transmission and method of making the same
US7608523B2 (en) * 2005-08-26 2009-10-27 Disco Corporation Wafer processing method and adhesive tape used in the wafer processing method
JP2007184465A (en) * 2006-01-10 2007-07-19 Renesas Technology Corp Semiconductor chip tray
WO2008013153A1 (en) * 2006-07-25 2008-01-31 Miraial Co., Ltd. Wafer container provided with cushion sheet
JP2008041987A (en) * 2006-08-08 2008-02-21 Tokyo Ohka Kogyo Co Ltd Method and equipment for peeling support plate and wafer
JP4941527B2 (en) * 2009-09-09 2012-05-30 セイコーエプソン株式会社 Semiconductor chip storage tray
US8698099B2 (en) * 2009-09-30 2014-04-15 Kyocera Corporation Attraction member, and attraction device and charged particle beam apparatus using the same
JP5679735B2 (en) * 2010-08-18 2015-03-04 株式会社ディスコ Package board handling method
NL2005626C2 (en) * 2010-11-04 2012-05-07 Fico Bv CARRIER FOR SEPARATED ELECTRONIC COMPONENTS AND METHOD FOR VISUAL INSPECTION OF SEPARATED ELECTRONIC COMPONENTS.
JP2012144261A (en) * 2011-01-07 2012-08-02 Disco Corp Transport tray
TWI625815B (en) * 2012-08-31 2018-06-01 聯達科技設備私人有限公司 System and method for automatically correcting for rotational misalignment of wafers on film frames
KR102138794B1 (en) * 2013-03-18 2020-07-28 삼성전자주식회사 A Tray for Aligning the Positions of Semiconductor Package, Test Handler Using the Same, A Method for Aligning the Positions of Semiconductor Package and the Test Method Using the Same
JP2014200888A (en) * 2013-04-05 2014-10-27 ローム株式会社 Suction holding device and wafer polishing device
CN203760443U (en) * 2014-01-24 2014-08-06 梁志炜 Etching process-used bearing disc of patterned sapphire substrate
JP6262115B2 (en) 2014-02-10 2018-01-17 東京エレクトロン株式会社 Substrate processing method and substrate processing apparatus
EP2921262B1 (en) * 2014-03-20 2020-06-24 Sofradim Production Porous supports and vacuum hold down device using said supports

Also Published As

Publication number Publication date
KR102465718B1 (en) 2022-11-09
KR20170076562A (en) 2017-07-04
US10475681B2 (en) 2019-11-12
US20170186635A1 (en) 2017-06-29
CN106935536A (en) 2017-07-07
TWI706499B (en) 2020-10-01
JP2017117913A (en) 2017-06-29
CN106935536B (en) 2022-02-18
TW201732987A (en) 2017-09-16
DE102016225805A1 (en) 2017-06-29
JP6605946B2 (en) 2019-11-13

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