JP2006156793A - Flexible substrate detacher - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible substrate detacher capable of easily peeling a flexible substrate from an adhesive sheet without causing breakage or flaw on the substrate. <P>SOLUTION: The adhesive sheet 2 to which the flexible substrate 1 is glued is mounted on a case 3. Compressed air is blown upward from a blower 4 through a blowing port 4a. The compressed air which has been blown out is fed upward through a compressed air passage 3a and a hole 2a and flows out of the upper opening of the hole 2a. The pressure and a flow rate of the compressed air blown out from the blower 4 are then controlled by a pressure/flow rate regulator 5. The compressed air flowing out of the hole 2a enters between the upper surface of the adhesive sheet 2 and the lower surface of the flexible substrate 1. As a result, a void occurs between the substrate 1 and the sheet 2. While the void occurs, the flexible substrate 1 is peeled from the adhesive sheet 2 by means of tweezers. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a flexible substrate peeling apparatus for easily peeling a flexible substrate attached to an adhesive sheet from an adhesive sheet.

  In the manufacturing process of the semiconductor device, the cutting out of the flexible substrate is performed in a state where the wafer is adhered to the adhesive sheet, and the cut out flexible substrate is placed on the conveying plate while being adhered to the adhesive sheet, and is conveyed, An operator peels the flexible substrate from the adhesive sheet using tweezers at a predetermined position.

As a technique related to the present invention, when peeling a single semiconductor chip attached to an adhesive sheet, each semiconductor chip is removed from the adhesive sheet by pushing up the semiconductor chip by an ejector from the lower surface side of the adhesive sheet. A technique for peeling is proposed (see, for example, Patent Documents 1 and 2).
JP-A-6-85060 JP 2004-165244 A

  Conventionally, the flexible substrate attached to the adhesive sheet is peeled off using tweezers. However, since there is no gap between the flexible substrate and the adhesive sheet, the flexible substrate may be bent or damaged. There is a problem that it is often given. On the other hand, it is difficult to apply the techniques of Patent Documents 1 and 2 to peeling a flexible substrate having high flexibility.

  This invention is made | formed in view of such a situation, and provides the peeling apparatus of the flexible substrate which can peel a flexible substrate easily from an adhesive sheet, without producing a bending or a damage | wound to a flexible substrate. Objective.

  A peeling apparatus for a flexible substrate according to a first invention is an apparatus for peeling a flexible substrate attached to an adhesive sheet in which a plurality of holes are formed from the adhesive sheet, and a blowing means for blowing out compressed air into the holes. It is characterized by providing.

  In the first invention, the compressed air is blown out by the blowing means into the hole formed in the adhesive sheet. Since a gap is generated between the flexible substrate and the adhesive sheet by the blown-out compressed air, the flexible substrate can be easily peeled from the adhesive sheet without damaging the flexible substrate.

  A peeling apparatus for a flexible substrate according to a second aspect of the present invention peels from a pressure-sensitive adhesive sheet a flexible substrate attached to a pressure-sensitive adhesive sheet formed with a plurality of holes conveyed by a conveyance plate in which a plurality of holes are formed. The apparatus is characterized by comprising blowing means for blowing compressed air into the holes formed in the transport plate and the adhesive sheet.

  In the second invention, the compressed air is blown out to the holes formed in the transport plate and the adhesive sheet by the blowing means. Since a gap is generated between the flexible substrate and the adhesive sheet by the blown-out compressed air, the flexible substrate can be easily peeled from the adhesive sheet without damaging the flexible substrate.

  A flexible substrate peeling apparatus according to a third aspect of the invention is characterized in that, in the first aspect or the second aspect of the invention, the flexible board peeling apparatus includes an adjusting means for adjusting the pressure and / or flow rate of the compressed air blown from the blowing means.

  In the third invention, the pressure and / or flow rate of the compressed air to be blown out is adjusted by the adjusting means. Therefore, the flexible substrate can be lifted reliably and stably, and the flexible substrate can be easily peeled off from the adhesive sheet.

  In the flexible substrate peeling apparatus of the first invention, since compressed air is blown into the holes formed in the adhesive sheet, a gap is formed between the flexible substrate and the adhesive sheet to damage the flexible substrate. The flexible substrate can be easily peeled off from the adhesive sheet.

  In the peeling device for the flexible substrate of the second invention, since the compressed air is blown out to the holes formed in the transport plate and the adhesive sheet, a gap is generated between the flexible substrate and the adhesive sheet, and the flexible substrate is damaged. The flexible substrate can be easily peeled off from the pressure-sensitive adhesive sheet without imparting the above.

  In the flexible substrate peeling apparatus according to the third aspect of the invention, the pressure and / or flow rate of the compressed air to be blown out is adjusted, so that the flexible substrate can be lifted reliably and stably, and the flexible substrate can be easily peeled from the adhesive sheet. it can.

Hereinafter, the present invention will be specifically described with reference to the drawings illustrating embodiments thereof.
(First embodiment)
FIG. 1 is a diagram showing a usage state of a first embodiment of a peeling apparatus for a flexible substrate according to the present invention. In FIG. 1, reference numeral 1 denotes a flexible substrate attached to an adhesive sheet 2 made of a silicon-based adhesive. The flexible substrate 1 has a thickness of about 150 μm and a rectangular shape with one side of 10 to 50 mm, and is made of, for example, polyimide resin. The adhesive sheet 2 has a plurality of holes 2a having a diameter of about 2 mm.

  An adhesive sheet 2 on which a plurality of flexible substrates 1 are attached is placed on a case 3. In the case 3, a blower 4 is disposed as blowout means for blowing out the compressed air. On the upper surface of the blower 4, a plurality of blowout ports 4 a for blowing the compressed air upward are formed. In the case 3, a compressed air flow path 3 a is provided in such a manner as to communicate with these outlets 4 a. Further, these compressed air flow paths 3 a communicate with holes 2 a formed in the adhesive sheet 2.

  The blower 4 is connected to a pressure / flow rate adjusting unit 5 as an adjusting means for adjusting the pressure / flow rate of the compressed air to be blown out. The blower 4 blows out the compressed air whose pressure / flow rate is adjusted by the control of the pressure / flow rate adjusting unit 5 from the blowout port 4a. The compressed air blown out is sent between the upper surface of the pressure-sensitive adhesive sheet 2 and the lower surface of the flexible substrate 1 through the compressed air flow path 3a and the hole 2a.

  Next, the operation will be described. The pressure-sensitive adhesive sheet 2 to which the flexible substrate 1 is attached is placed on the case 3. The blown air is blown upward from the blower 4 through the blowout port 4a. The blown-out compressed air is sent upward through the compressed air flow path 3a and the hole 2a, and flows out from the upper opening of the hole 2a. At this time, the pressure / flow rate adjusting unit 5 adjusts the pressure and flow rate of the compressed air blown out from the blower 4. For example, the pressure of the compressed air is controlled in the range of 0.1 to 0.5 MPa, and the flow rate of the compressed air is controlled in the range of 5 to 20 liters / minute.

  The compressed air that has flowed out of the hole 2 a enters between the upper surface of the adhesive sheet 2 and the lower surface of the flexible substrate 1. As a result, a gap is generated between the flexible substrate 1 and the adhesive sheet 2. And in the state which this space | gap has arisen, the flexible substrate 1 is peeled from the adhesive sheet 2 using tweezers.

  Since the peeling process of the flexible substrate 1 is performed while sending out the compressed air as described above, the floating occurs between the flexible substrate 1 and the adhesive sheet 2, so that the flexible substrate 1 is not damaged (folded, scratched, etc.). The flexible substrate 1 can be easily peeled off from the adhesive sheet 2. Moreover, since the adhesive force of the flexible substrate 1 and the adhesive sheet 2 is reduced, the flexible substrate 1 can be peeled from the adhesive sheet 2 with a relatively light force. Further, since the pressure / flow rate of the compressed air to be sent out is adjusted, the flexible substrate 1 can be floated more reliably, so that the flexible substrate 1 can be stably peeled off from the adhesive sheet 2.

  Note that the hole 2a of the pressure-sensitive adhesive sheet 2 and the compressed air flow path 3a of the case 3 do not have to be perfectly aligned with each other, and the compressed air sent through the compressed air flow path 3a flows into the hole 2a. It should be. Therefore, exact positioning is not necessary when the adhesive sheet 2 is placed on the case 3.

(Second Embodiment)
FIG. 2 is a diagram showing a usage state of the second embodiment of the flexible substrate peeling apparatus according to the present invention. In FIG. 2, the same parts as those in FIG.

  In FIG. 2, 6 is a conveyance plate made of, for example, Al on which the adhesive sheet 2 to which the flexible substrate 1 is attached is placed. This conveyance plate 6 is conveyed in the line of the front process (IC component mounting process etc. to the flexible substrate 1). The transport plate 6 is placed on the case 3. A plurality of holes 6 a communicating with the holes 2 a of the pressure-sensitive adhesive sheet 2 and the compressed air flow path 3 a of the case 3 are formed in the transport plate 6.

  Next, the operation will be described. A transport plate 6 on which an adhesive sheet 2 to which a flexible substrate 1 is attached is placed on the case 3. The blown air is blown upward from the blower 4 through the blowout port 4a. The blown-out compressed air is sent upward through the compressed air flow path 3a, the hole 6a, and the hole 2a, and flows out from the upper opening of the hole 2a. At this time, the pressure / flow rate adjusting unit 5 adjusts the pressure and flow rate of the compressed air blown out from the blower 4. For example, the pressure of the compressed air is controlled in the range of 0.1 to 0.5 MPa, and the flow rate of the compressed air is controlled in the range of 5 to 20 liters / minute.

  The compressed air that has flowed out of the hole 2 a enters between the upper surface of the adhesive sheet 2 and the lower surface of the flexible substrate 1. As a result, a gap is generated between the flexible substrate 1 and the adhesive sheet 2. And in the state which this space | gap has arisen, the flexible substrate 1 is peeled from the adhesive sheet 2 using tweezers.

  Also in the second embodiment as described above, since the peeling process of the flexible substrate 1 is performed while sending out the compressed air, the same effect as the first embodiment can be obtained.

  Note that the hole 6a of the transport plate 6 and the compressed air flow path 3a of the case 3 do not have to be perfectly aligned with each other, and the compressed air sent through the compressed air flow path 3a flows into the hole 6a. It should be. Therefore, exact positioning is not necessary when the transport plate 6 is placed on the case 3.

It is a figure which shows the use condition of 1st Embodiment of the peeling apparatus of the flexible substrate which concerns on this invention. It is a figure which shows the use condition of 2nd Embodiment of the peeling apparatus of the flexible substrate which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Flexible substrate 2 Adhesive sheet 2a Hole 3 Case 3a Pressure air flow path 4 Blowout device (blowout means)
4a Outlet 5 Pressure / flow rate adjuster (adjustment means)
6 Transport plate 6a Hole

Claims (3)

  An apparatus for peeling a flexible substrate attached to a pressure-sensitive adhesive sheet in which a plurality of holes are formed from the pressure-sensitive adhesive sheet, comprising a blowing means for blowing compressed air into the holes.   Formed on the transport plate and the pressure-sensitive adhesive sheet in the apparatus for peeling the flexible substrate attached to the pressure-sensitive adhesive sheet formed with a plurality of holes transported by the transport plate formed with a plurality of holes. An apparatus for peeling a flexible substrate, comprising blowing means for blowing compressed air into the holes.   The peeling apparatus for a flexible substrate according to claim 1, further comprising an adjusting unit that adjusts the pressure and / or flow rate of the compressed air blown out from the blowing unit.

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