PL1935599T3 - Device and method for the separation and the transport of substrates - Google Patents
Device and method for the separation and the transport of substratesInfo
- Publication number
- PL1935599T3 PL1935599T3 PL06026054T PL06026054T PL1935599T3 PL 1935599 T3 PL1935599 T3 PL 1935599T3 PL 06026054 T PL06026054 T PL 06026054T PL 06026054 T PL06026054 T PL 06026054T PL 1935599 T3 PL1935599 T3 PL 1935599T3
- Authority
- PL
- Poland
- Prior art keywords
- substrate
- substrates
- support device
- separating
- fluid
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
Abstract
The device has a support device (104) arranged within a fluid, where an individual substrate (102) is arranged in transverse direction (105) sequentially staying behind one another in form of a stack of the substrate. A removing device (107) is for separating and transporting of the substrate. The removing device has a gripper (108) with units, where the substrate is held and is drive away from the support device. A flow device (117) for fan out of a part of a stack substrate (103), and a contact pressure element (122) that counteracts the fan out substrates. An independent claim is also included for a method for fanning out, separating and transporting disk-shaped formed substrates, which involves arranging a support device within a fluid.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06026054A EP1935599B1 (en) | 2006-12-15 | 2006-12-15 | Device and method for the separation and the transport of substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
PL1935599T3 true PL1935599T3 (en) | 2009-01-30 |
Family
ID=37946339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL06026054T PL1935599T3 (en) | 2006-12-15 | 2006-12-15 | Device and method for the separation and the transport of substrates |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1935599B1 (en) |
AT (1) | ATE404341T1 (en) |
DE (1) | DE502006001352D1 (en) |
ES (1) | ES2313535T3 (en) |
PL (1) | PL1935599T3 (en) |
TW (1) | TW200842014A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008075970A1 (en) | 2006-12-19 | 2008-06-26 | Rec Scanwafer As | Method and device for se aration of silicon wafers |
DE102010052987A1 (en) * | 2009-11-30 | 2011-06-01 | Amb Apparate + Maschinenbau Gmbh | separating device |
DE102012221452A1 (en) | 2012-07-20 | 2014-01-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device for separating wafers |
CN115626488A (en) * | 2022-09-08 | 2023-01-20 | 安徽兰迪节能玻璃有限公司 | Piece device is got to vacuum glass production line |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5950643A (en) * | 1995-09-06 | 1999-09-14 | Miyazaki; Takeshiro | Wafer processing system |
DE19900671C2 (en) * | 1999-01-11 | 2002-04-25 | Fraunhofer Ges Forschung | Method and device for separating disk-shaped substrates, in particular for wafer production |
DE19904834A1 (en) * | 1999-02-07 | 2000-08-10 | Acr Automation In Cleanroom | Mechanism for detaching, separating, and storing thin, fragile disc-shaped substrates for solar cells etc. manufacture |
DE19950068B4 (en) * | 1999-10-16 | 2006-03-02 | Schmid Technology Systems Gmbh | Method and device for separating and detaching substrate disks |
DE102005045583A1 (en) * | 2005-05-20 | 2006-11-23 | Brain, Bernhard | Method for separating stacked, disk-shaped elements and separating device |
-
2006
- 2006-12-15 AT AT06026054T patent/ATE404341T1/en not_active IP Right Cessation
- 2006-12-15 DE DE502006001352T patent/DE502006001352D1/en not_active Expired - Fee Related
- 2006-12-15 PL PL06026054T patent/PL1935599T3/en unknown
- 2006-12-15 EP EP06026054A patent/EP1935599B1/en not_active Not-in-force
- 2006-12-15 ES ES06026054T patent/ES2313535T3/en active Active
-
2007
- 2007-12-14 TW TW096148137A patent/TW200842014A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW200842014A (en) | 2008-11-01 |
DE502006001352D1 (en) | 2008-09-25 |
EP1935599B1 (en) | 2008-08-13 |
EP1935599A1 (en) | 2008-06-25 |
ATE404341T1 (en) | 2008-08-15 |
ES2313535T3 (en) | 2009-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY142778A (en) | Device and method for the separation and the transport of substrates | |
US7909374B2 (en) | Handling device and handling method for wafers | |
JP6665021B2 (en) | Film peeling device | |
ATE468185T1 (en) | SEPARATION DEVICE | |
WO2007117583A3 (en) | Cluster tool for epitaxial film formation | |
IL192072A0 (en) | Device, system and method for the surface treatment of substrates | |
TW200608455A (en) | Semiconductor film manufacturing method and substrate manufacturing method | |
US9653337B2 (en) | Transport arm, transport apparatus and transport method | |
WO2007019487A3 (en) | Method and system for fabricating thin devices | |
JP2015213131A (en) | Substrate peeling device for laminate | |
TW200802554A (en) | A method of manufacturing a semiconductor device and device of processing substrate | |
MY138343A (en) | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device | |
PL1935599T3 (en) | Device and method for the separation and the transport of substrates | |
EP2020392A3 (en) | Apparatus for manufacturing thin-film laminated member | |
KR20170001962U (en) | Suction roller coating adhesive device | |
JP2011071331A5 (en) | Method of manufacturing laminated substrate and substrate bonding apparatus | |
WO2009037754A1 (en) | Substrate transfer system | |
CN105044937B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
TWI579222B (en) | Method and device of airflow driving for taking wafer | |
TW200602561A (en) | Vacuum pumping system, driving method thereof, apparatus having the same, and method of transferring substrate using the same | |
JP4812660B2 (en) | Substrate handling equipment and substrate handling method | |
JP2013206503A (en) | Laminating method for substrate and substrate laminating tool | |
JP5405267B2 (en) | Electronic component conveyor | |
JP2006156793A (en) | Flexible substrate detacher | |
JP5384292B2 (en) | Electronic component conveyor |