EP1935599B1 - Device and method for the separation and the transport of substrates - Google Patents

Abstract

The device has a support device (104) arranged within a fluid, where an individual substrate (102) is arranged in transverse direction (105) sequentially staying behind one another in form of a stack of the substrate. A removing device (107) is for separating and transporting of the substrate. The removing device has a gripper (108) with units, where the substrate is held and is drive away from the support device. A flow device (117) for fan out of a part of a stack substrate (103), and a contact pressure element (122) that counteracts the fan out substrates. An independent claim is also included for a method for fanning out, separating and transporting disk-shaped formed substrates, which involves arranging a support device within a fluid.

Description

Technical area

The invention relates to a device for separating and transporting substrates. The substrates are disc-shaped and susceptible to breakage. For separating a carrier device is provided, which receives the individual substrates in the formation of a substrate stack and holds ready for the separation. A removal device carries out the process of separating and transporting.

Furthermore, the invention relates to a method for separating and transporting substrates provided in a substrate stack.

definitions

The "substrates" are disc-shaped or surface-shaped and generally rectangular. They are obtained after a sawing process from a substrate block. They have circumferential edges, which are substantially straight, wherein the corners can be configured rectangular, rounded or bevelled.

Several substrates stacked on top of each other or side by side or behind one another result in a "substrate stack ". If the substrate surfaces run horizontally, then according to the invention, a "lying" stack of superimposed substrates is used; If the substrate surfaces run vertically, this corresponds to a "standing" stack of adjacent substrates. The individual substrates are already detached from a holding device necessary for the sawing process and stacked freely and independently of one another. Frequently, the individual substrates adhere due to the previous sawing process but unintentionally together areally. For the further processing, it is normally necessary to separate these stacked substrates. This means that the substrate provided at the end of an upright substrate stack is to be removed from the substrate stack by means of a device and transferred to the further processing process.

The "stacking direction" of the substrates in a substrate stack is predetermined by the position of the substrate to be separated. The individual substrates are aligned so that they are substantially contiguous with their surfaces. In the special case of exactly and completely abutting substrate surfaces, the stacking direction corresponds exactly to the direction of the surface normal of the substrate or of the substrates, the positive direction pointing to that end of the stack from which the substrate to be separated is to be removed. Unless this substrate is on the right side of the in one

Carrier device arranged "standing" substrate stack is arranged, thus showing the stacking direction in the direction of arrow right.

The "feed direction" of a stack essentially corresponds to the stacking direction.

The "stack start" designates that end of the substrate stack at which the next substrate to be singulated is located. This is the end that points in the feed direction. However, if it is generally spoken of "stack end", it is not specified whether it is the beginning of the stack or the opposite end of the stack.

The substantially vertically or upright positioned substrate stacks are provided in a "carrier device " . In this case, an edge of the respective substrate rests on the carrier device. The carrier device picks up the substrate stack, for example, after sawing and / or removal of the adhesive often used to secure the initially ungagged substrates to a holding plate and transports this to a removal device in which the separation is to take place. The carrier device is preferably designed such that it receives the substrate stack as a whole, ie, the individual substrates are substantially flat against each other or behind each other.

If desired, the carrier device can enable or force a certain tilting of the substrates which contact one another in a planar manner against the original stacking direction, resulting in a structurally predetermined "angle of inclination" of the substrates relative to the original stacking direction, which is designated α in the context of the present invention. This is enclosed between the surface normal of a substrate and the feed direction, wherein the surface normal of that substrate side is to be selected which points more in the feed direction, so that tilt angles between -90 ° and + 90 ° can result. Positive angles indicate a tilting of the substrates to the rear (opposite to the feed direction), negative angles indicate a tilting of the substrates forward (in the feed direction). Preferred inclination angles are in the range of + 5 ° to + 35 °; Particularly preferred are inclination angles of + 15 ° to + 20 °.

The "removal device " is used for separating and removing a substrate from the substrate stack. In this case, the substrate arranged at the one end of the substrate stack to be separated is picked up by the removal device, For example, via suction, detached from the substrate stack and thus isolated, and fed to a further processing or transport process. The removal device serves to remove the substrate to be separated from the substrate stack. The "removal" can take place in several directions. On the one hand, the removal can take place in the stacking direction, ie the substrate to be separated is picked up by the removal device and pulled away parallel to the planar formation of the following substrate in the stacking direction, so that between the substrate to be separated and the subsequent substrate tensile or compressive forces due to existing adhesion arise. On the other hand, it can be provided that the substrate is removed by displacement relative to the following substrate, so that only shearing forces arise between the two substrates. In this case, the substrate to be separated in the direction of the planar extension of the respective substrate, preferably approximately perpendicular to the plane of the carrier device, moved up or removed.

Depending on the removal direction, therefore, different forces of different magnitude act on the substrate to be separated and the substrates still in the stack, wherein these forces are exposed to the substrate following the substrate being removed.

For separating the substrate stack is provided to arrange this together with the support means in a fluid, which in this case essentially liquid media are to be understood. Within the fluid are provided "flow means" which flow the substrate stack from the side and / or from below or above with fluid in such a way that a flow is achieved which aims at the substrate stack and causes the individual substrates to be " fan out "and in the Distance from each other. This means that between the individual substrates creates a gap which is filled with fluid.

This fanning may, according to a preferred embodiment, still be effected by further suitable means, e.g. be supported with positioned in particular in the fan area ultrasonic emitters. This is particularly advantageous if the adhesion forces between the substrates touching each other are so high that penetration of the fluid otherwise takes place only very slowly.

A "position determination device " is used to determine the position and / or the position of the substrate to be separated and / or the substrate stack. If a correspondingly arranged electronics with a sensor receives a corresponding signal, which is synonymous with the fact that the substrate to be removed is arranged in position and position, the operation of the removal device is released for separating. If the substrate to be separated is not in positional and positional position on the position-determining device, then another signal is output which must then be correspondingly interpreted. The position determination device can also serve to move the substrate to be separated by means of suitable, for example geometric, constraints into the desired position, which is necessary to release the signal for the removal device, and / or to hold the substrate there.

State of the art

In one of the known production processes for substrates, as used for example for the production of solar or semiconductor wafers, silicon blocks or silicon columns (called substrate blocks in the present case) are used, which are sawed into thin, fragile discs (called substrates in the present case). The substrates produced in this way typically have thicknesses of a few tens to 300 μm and are generally square or rectangular. You then preferred a respective edge length up to 210 mm.

The substrate blocks are usually glued to a holding device for sawing. This holding device typically consists of a metal carrier, on which in turn a glass plate is applied as an intermediate carrier, wherein the substrate block to be processed is glued to the glass plate. Alternatively, other materials for the formation of the holding device may be provided according to the prior art.

To produce the substrates mentioned above, it is necessary to completely saw through the substrate block in the manner of a disk, so that the saw cut itself extends beyond the substrate block into the glass plate. After sawing, the substrate produced in this way continues to adhere to the glass plate with its one edge via an adhesive bond. After the substrate block has been completely divided into individual substrates, a comb-like structure is formed.

Before the individual substrates, which now have a disc-shaped design, are detached from the holding device, a pre-cleaning usually takes place.

To carry out the sawing process, a medium is needed which essentially comprises glycol and optionally further chemical additives and a release agent such as silicon carbide granules. This medium is called "slurry" and serves to carry out the sawing process. Normally, a certain amount of slurry always remains in the space between the individual sawn ones Substrates. In the worst case, the slurry during the processing process or subsequently to a pasty structure, since it mixes with the silicon particles formed from the substrate block and with the abrasion of the saw wire used for the sawing process and the release agent or certain components of the batch together react. Due to their consistency, the slurry adheres to the surface of the wafer. Despite a subsequent to the sawing of the substrate blocks in the normal case pre-cleaning are still very often residues of the mixture between the substrates.

The EP 0 762 483 A1 shows a device with which, inter alia, the separation of flat substrates can be done. The substrates are already isolated in a carrying device ready, where they initially touch evenly. For separation and transfer into a container, the substrates are transported away from the stack by means of a slide and possibly with the aid of rollers and / or liquid jets, wherein the substrates must necessarily be in a horizontal, ie lying position. In accordance with the above clarification, the substrates are thus arranged in the form of a "lying" stack of superimposed substrates. Alternatively, the document shows a separation by using a suction gripper, which is to be supplied during the entire gripping and transporting process with gas vacuum and the substrate directly touched, ie without a protective fluid film between gripper and substrate surface.

In the WO 01/28745 A1 describes methods and devices for detaching disc-shaped substrates. A robot-like device engages the substrate to be detached via suction devices (active generation of a negative pressure via, for example, a vacuum pump), whereby the substrate is released from the holding device by an oscillating movement of the device. In this case, oscillating movements are provided in different directions. The gripping of the substrate to be separated takes place with the aid of a suction device arranged above the surface of the substrate and attached to the device. To release the substrate, a certain overpressure is generated within the suction device, so that the detached substrate is removable from the device again.

From the DE 199 00 671 A1 Methods and devices for detaching disc-shaped substrates, in particular wafers, are known. It is proposed that the substrates adhering to each other immediately after the sawing process, which are still fastened with their one side (edge) on the holding device, by a targeted fluid jet from each other at a distance. A wedge device ensures that a separation of the substrate to be detached takes place from the holding device. At the same time the isolated substrate by means of a Suction devices having grasping arm-like device removed from the holding device.

From the DE 697 22 071 T2 For example, an apparatus for loading wafers obtained by sawing a substrate block into a storage element is known. There are proposed handling devices that allow to take round or oval substrates in cross-section and to convert them into a stand-like structure. In this case, a plurality of substrates are recorded simultaneously and transferred to a footprint, which receives the isolated substrates.

From the DE 199 04 834 A1 a device for detaching individual thin, fragile and disc-like substrates is known. The substrate block with the already sawn substrates is in a container filled with a fluid. In contrast to the previously known prior art, the holding device is vertically aligned together with the still fixed to the holding device substrates, so that the substrate to be separated is arranged parallel to the fluid surface. A wedge device ensures that a separation between the glass plate and the substrate to be separated takes place. An arranged in close proximity to the substrate conveyor belt ensures that the detached and floating substrates are removed. A sliding device provides that the holding device is repeatedly brought into the same position and moved horizontally against the wedge device for detachment of the respective substrate. On the other side of the conveyor belt, a device is provided with which the separated substrates are automatically inserted into a stand. The aim of the replacement is that the separated, disc-like substrates stacked after their removal from the holding device and in a predetermined Institutions are inserted or placed directly on schedule.

Disadvantages of the prior art

The separation of the respective substrates is difficult.

For the singling movements are necessary, which require complex facilities, if you want to do without manual operation. Since, however, the substrates are very fragile and thin, plate-like designed substrates, they can not be easily taken over conventional gripper arm-like systems. For this it is necessary to provide very precise and sensitive devices.

From the prior art, therefore, only those devices are known which take the respective substrate by means of a suction device. Immediately after starting the suction device to the planar configuration of the substrate to be separated, a vacuum is generated between the suction device and substrate to be separated via a vacuum pump, so that the substrate can adhere to a handling device. However, care should be taken because the substrate to be separated may break due to excessive negative pressure.

Another critical point here is that the respective substrate has to be approached by the handling device, ie it has to be touched. Since the substrate must not be pushed away from the device in any case, an exact positioning is necessary. This is difficult, since on the one hand a relative movement of the holding device for positioning the substrate to be separated in the region of Holding device is provided, and the holding device itself thus has corresponding degrees of freedom. Therefore, tolerances are possible, which lead to possible damage to the substrate to be separated. On the other hand, such movements generally take place in a fluid, so that there is a risk that a flow pressure, in particular in the direction of the substrates, is created by the individual movements of the devices, which can lead to positional displacements of the substrates or even to breakage.

A hand carried out singling involves the risk that the very thin and fragile and disk-shaped substrates break, especially due to the increased adhesive forces.

Object of the invention

The object of the invention is therefore to provide devices and methods with which a virtually damage-free removal of thin, fracture-sensitive and stacked substrates is made possible.

Solution of the task

The solution of the problem is to propose a device according to claim 1 and a method according to the features of claim 16.

Advantages of the invention

One of the significant advantages of the invention is that the substrates can be shatter-proofed in a fast cycle completely and automatically singulated.

The solution is that the substantially perpendicular to the feed direction, but slightly inclined at an angle aligned substrates within the substrate stack are fanned by a flow device. Preferably, the first five to ten substrates flow around flows generated by flow nozzles, so that the individual substrates are kept at a distance from each other and so-called fluid damping pads between the individual substrates arise. If a force acts on the substrates against the stacking or feed direction, the individual substrates of the method according to the invention are not further compressed; Rather, an opposing force is generated completely over the entire surface, which, however, allows, within certain limits, a residual mobility, in particular of the substrate at the beginning of the stack. This counterforce is utilized together with the residual mobility, so that the gripper of the removal device can press against the substrate to be separated. Without indirect damping by means of the fluid damping pads between the fanned-out substrates, the substrate would likely break.

If it is a standing stack, the gripper is preferably introduced from above, ie parallel to the longitudinal extent of the respective substrates and thus approximately transversely to the stacking direction and then guided against the substrate to be separated. The holes provided in the gripper serve to suck the fluid out of the space between the gripper and the substrate to be separated. For this purpose, a negative pressure is necessary, which can be generated both by means of dynamic methods (eg pump), static method (vacuum tank) or other methods inside or outside the device. Finally, if the gripper and the substrate are in direct contact, or if only a very thin fluid film (a few nanometers up to 50 micrometers) is present between the gripper and the substrate, adhesion forces build up, which automatically adhere or adhere the substrate to the substrate Enable gripper. These adhesion forces are in particular greater than those for the following substrate, so that the removal of the substrate to be separated with the gripper can take place parallel to the surface direction of the following substrate. At most only slight shearing forces act on the substrate to be separated, as a result of which the breakage rate is considerably reduced. Tensile and compressive forces are avoided. Fast removal from the substrate stack is possible in a timely manner. The adhesion forces are furthermore so great that, depending on the geometrical configuration of the gripper and substrate weight, they allow substrate to adhere to the gripper even without active underpressure generation, especially when the substrate is outside the fluid surrounding the substrate stack. It should be noted that the functional relationship between the bore diameter and number in the gripper surface, the size of the gripper surface, as well as the size of the vacuum necessary for the suction of the fluid and for sucking the substrate is taken into account.

The gripper itself is preferably designed such that it consists exclusively of a beam. Alternative embodiments can provide that bar-shaped, O-shaped, U-shaped, triangular and in the gripper movement direction tapered (V-shaped), or are also designed surface gripper provided. Particularly preferred are those designs which have a low flow resistance in gripper movement direction and / or generate the least possible turbulence when removing the substrate from the substrate stack and the subsequent separation movement. The grippers of all embodiments furthermore have the advantage that only one gripper has to be used for different formats of substrates, and that the principle of gripping the substrate to be separated can be carried out functionally even for those substrates which are already broken and therefore no longer have the usual dimensions. Another advantage is that different formats of substrates can be accommodated with a gripper design. This is due to the fact that not a suction, but an adhesion force is achieved, which is areally extending over the contact surface between gripper and substrate.

According to the invention, the negative pressure is generated at the beginning of the extraction phase. Even if this negative pressure only has to be maintained until the above-mentioned fluid film is obtained between the substrate and the contact surface of the gripper, the negative pressure can also be maintained until the substrate has been deposited on the transport device.

The carrier device itself is constructed so that it can accommodate at least one of a plurality of substrates or wafers existing substrate stack. Furthermore, the carrier device has means by which it is ensured that the individual substrates have a certain inclination, the inclination being such that the angle of inclination α, formed between the feed direction of the stack and the surface directional normal of a substrate pointing in the feed direction, is greater 0 degrees, so positive. In the case of a standing stack, this means that the edge of the substrate lying on the carrier device is arranged in the feed direction in front of the upper edge. This has the advantage that the gripper can dip into the fluid parallel to this orientation and thus remove the substrate again in this direction. This also avoids that the stationary stack tilts forward in a further transport of the support means within the fluid and thus loses its positional orientation.

Thus, the carrier device is displaceable at least in one direction. Preferably, it is displaceable in the feed direction, namely initially so far, until the first to be separated substrate of the substrate stack reaches the orientation device. Then she is in eg Slidable steps whose step size preferably corresponds to the respective, in the normal case over the stack towards constant substrate thickness, and indeed until, finally, the last substrate of the stack is brought to the removal device. Alternatively, the carrier device may be stationary. In this case, suitable means would be provided with which the substrate stack can be moved on the carrier device in the feed direction. Alternatively or additionally, the gripping device and the position-determining device can have correspondingly greater degrees of freedom, so that they can be moved counter to the feed direction in the direction of the stack beginning.

The position determining device is a device with which the position and position of the substrate to be separated is detected. For this purpose, it is provided that the position-determining device comprises pressure pins, which are aligned in the direction of the substrate stack. By reducing the distance between the position-determining device and the substrate stack, the fanned-out beginning of the substrate stack is aligned until the substrate to be separated rests against all provided pressure pins. An additional sensor element, for example in the form of a touch sensor, emits a corresponding signal, as a result of which the gripper can now preferably dip between the pressure pins and singulate and transport the substrate to be separated.

If the substrate stack comprises substrates whose thickness exceeds the average thickness set for adjusting the pressure elements and thus the resulting step size, this state is detected by the position determining device, so that the substrate stack is moved correspondingly in the feed direction until the next substrate to be separated contacts the pressure elements ,

Alternatively or additionally, the position-determining device can be supplemented by a protractor. In this way, the position of the substrate to be separated can be determined exactly and, if desired, used as a parameter for checking the quality of the substrate to be separated.

The advantage of the device thus lies in the fact that an apparatus, in particular for separating and transporting substrates, has been created by the interaction of carrier device, removal device, flow device and position determining device, by means of which the method steps are automated and with an extremely low breakage rate compared with the prior art can be executed. This advantage is aided by the fluid damping pad provided by the flow means.

The design of the removal device itself as well as the hereby predetermined removal of the substrate transversely to the stacking direction causes no or only slight tensile or compressive forces act on the substrate to be separated. Advantageously, this removal device is designed such that the removal takes place parallel to the surface extension of the respective substrate, so that as little tensile, compressive or bending forces act on the corresponding substrate.

The further transport preferably takes place within the fluid. However, it is also envisaged to lead the gripper out of the fluid and deposit the adhesion-adhering substrate from the gripper onto a conveying means such as a conveyor belt such that fluid is expelled via the holes provided in the gripper in the direction of the substrate, so that the flat formed substrate of the gripper can solve easily and without effect by externally attacking tensile and / or compressive forces.

The cycle can be repeated as often as desired.

One of the significant advantages of a further embodiment of the invention is that the intended gripping arm can have a certain tolerance in its approach to the substrate. It is not necessary that the gripper arm stops exactly in front of the substrate to be separated and is positioned there. Rather, the damping, which arises due to the arrangement of the substrates within the fluid and by the flow device can be advantageously exploited by the gripper moves against the feed direction against the substrate stack with little force and so produces a surface contact with the substrate to be separated, which is resiliently supported due to the underlying fluid damping cushion.

A further advantage of the invention relates to the provision of a device with which the adhesive forces between the gripper arm and the substrate are automatically and thus automatically utilized so that each individual substrate is removed in a relatively simple manner without fracture, regardless of its size and outer contour, by the transport partially even pre-cleaned within the fluid and can be transferred to a specific device such as a transport device.

A further alternative embodiment of the removal device shows a device which has a defined degree of flexibility, so that tolerances in the positioning region are compensated with regard to the planar arrangement of the receptacle to the substrate to be separated. In this case, the gripper, the handling device and / or the connection between the two components is designed to be flexible and correspondingly deformable.

In order to increase the cycle times for the separation, according to a particularly preferred embodiment, a further means for taking over the isolated substrate from the removal device is provided. Within the time span in which the substrate is deposited on a conveyor belt by this further means, the removal device can already pick up a further substrate from the substrate stack. Alternatively or additionally, two substantially identical removal devices may be provided, which are connected in phase shift.

Further advantageous embodiments will become apparent from the following description, the claims and the drawings.

drawings

Fig. 1 [A-F]

eine schematische Darstellung der erfindungsgemäßen Vorrichtung, insbesondere des Ablaufs eines Vereinzelungs- und Transportprozesses eines zu vereinzelnden Substrats;

Fig. 2

eine schematische Darstellung eines Ausführungsbeispiels der erfindungsgemäßen Vorrichtung gemäß Fig. 1 in Seitenansicht;

Fig. 3

eine schematische Darstellung der in Fig. 2 gezeigten Ausführungsform in perspektivischer Ansicht;

Fig. 4 [A]

eine schematische Darstellung eines ersten Verfahrensschritts der erfindungsgemäßen Vorrichtung gemäß Fig. 2 in Seitenansicht;

Fig. 4 [B]

eine schematische Darstellung eines ersten Verfahrensschritts der erfindungsgemäßen Vorrichtung gemäß Fig. 2 in perspektivischer Ansicht;

Fig. 5 [A]

eine schematische Darstellung eines zweiten Verfahrensschritts der erfindungsgemäßen Vorrichtung gemäß Fig. 2 in Seitenansicht;

Fig. 5 [B]

eine schematische Darstellung eines zweiten Verfahrensschritts der erfindungsgemäßen Vorrichtung gemäß Fig. 2 in perspektivischer Ansicht;

Fig. 6 [A]

eine schematische Darstellung eines dritten Verfahrensschritts der erfindungsgemäßen Vorrichtung gemäß Fig. 2 in Seitenansicht;

Fig. 6 [B]

eine schematische Darstellung eines dritten Verfahrensschritts der erfindungsgemäßen Vorrichtung gemäß Fig. 2 in perspektivischer Ansicht;

Fig. 7 [A]

eine schematische Darstellung eines vierten Verfahrensschritts der erfindungsgemäßen Vorrichtung gemäß Fig. 2 in Seitenansicht;

Fig. 7 [B]

eine schematische Darstellung eines vierten Verfahrensschritts der erfindungsgemäßen Vorrichtung gemäß Fig. 2 in perspektivischer Ansicht;

Fig. 8 [A]

eine schematische Darstellung eines fünften Verfahrensschritts der erfindungsgemäßen Vorrichtung gemäß Fig. 2 in Seitenansicht;

Fig. 8 [B]

eine schematische Darstellung eines fünften Verfahrensschritts der erfindungsgemäßen Vorrichtung gemäß Fig. 2 in perspektivischer Ansicht;

Fig. 9 [A]

eine schematische Darstellung eines sechsten Verfahrensschritts der erfindungsgemäßen Vorrichtung gemäß Fig. 2 in Seitenansicht;

Fig. 9 [B]

eine schematische Darstellung eines sechsten Verfahrensschritts der erfindungsgemäßen Vorrichtung gemäß Fig. 2 in perspektivischer Ansicht.

Show it:

Fig. 1 [AF]

a schematic representation of the device according to the invention, in particular the sequence of a separation and transport process of a substrate to be separated;

Fig. 2

a schematic representation of an embodiment of the device according to the invention according to Fig. 1 in side view;

Fig. 3

a schematic representation of in Fig. 2 embodiment shown in a perspective view;

Fig. 4 [A]

a schematic representation of a first process step of the device according to the invention according to Fig. 2 in side view;

Fig. 4 [B]

a schematic representation of a first process step of the device according to the invention according to Fig. 2 in perspective view;

Fig. 5 [A]

a schematic representation of a second process step of the device according to the invention according to Fig. 2 in side view;

Fig. 5 [B]

a schematic representation of a second process step of the device according to the invention according to Fig. 2 in perspective view;

Fig. 6 [A]

a schematic representation of a third process step of the device according to the invention according to Fig. 2 in side view;

Fig. 6 [B]

a schematic representation of a third process step of the device according to the invention according to Fig. 2 in perspective view;

Fig. 7 [A]

a schematic representation of a fourth process step of the device according to the invention Fig. 2 in side view;

Fig. 7 [B]

a schematic representation of a fourth process step of the device according to the invention Fig. 2 in perspective view;

Fig. 8 [A]

a schematic representation of a fifth method step of the device according to the invention according to Fig. 2 in side view;

Fig. 8 [B]

a schematic representation of a fifth method step of the device according to the invention according to Fig. 2 in perspective view;

Fig. 9 [A]

a schematic representation of a sixth method step of the device according to the invention according to Fig. 2 in side view;

Fig. 9 [B]

a schematic representation of a sixth method step of the device according to the invention according to Fig. 2 in perspective view.

description

In FIG. 1 , Representations AF, is shown schematically the inventive device 101 and the inventive method. This device 101 is suitable for separating and transporting disk-shaped substrates 102.

In the illustrated embodiment, the substrates 102 are arranged in a substrate stack 103, wherein the substrate stack 103 is mounted in a carrier device 104. The individual substrates 102 are already released from a holding device. Preferably, the surface normals of the surfaces of the individual substrates 102 pointing in the direction of advance are at an angle α (inclination angle) (in FIG FIG. 2 shown) arranged to the feed direction. In the case of the arrangement of the device within a fluid, in the case of a stationary substrate stack 103, this oblique position prevents the individual substrates 102 from floating or unintentionally leaving the carrier device 104. Also let the individual substrates 102 are easier to receive through the removal device 107, which will be described later.

The individual flat-shaped substrates 102 are lined up in such a way that touch their surfaces. Adhesive forces acting thereon from the very small gap between the substrates on the one hand and possibly impurities, for example, act between them. resulting from a previous sawing step. As a result of this arrangement, the substrates 102 predefine a defined feed direction 105.

In the illustrated drawings, the substrates are shown schematically. The block diagram shown schematically means that the substrates in this area are very close to each other. In the wider area, namely the removal area, the substrates are fanned out and have a gap. The adhesion forces between the fanned-out substrates are preferably zero.

Furthermore, a removal device 107 is provided according to the invention, which is designed like a claw. It is shown schematically in the embodiment shown here and essentially shows a gripper 108. On the gripper 108 is a handling device (in FIG. 1 [A] shown), which allows the gripper 108 to move in different directions and / or to pivot. Preferably, the gripper 108 is pivotable in the direction of arrow 110 and about an axis in the direction of arrow 112.

Furthermore, a transport device 113 is provided. This transport device 113 consists of a conveyor belt 114, which is driven via an axis 115 in the direction of arrow 116.

It is preferably provided that at least certain parts of the device 101, namely the carrier device 104, the Substrate stack 103, and parts of the removal device 107 are disposed within a fluid. This ensures that the substrates do not fall dry over the duration of the entire process, at least until they are deposited on the transport device. Optionally, the remaining parts of the removal device 107 and the transport device 113 may also be arranged within the fluid, wherein the transport device may alternatively also have their own means for moistening the substrates.

Furthermore, to improve the separation of the respective substrates 102, at least one flow device 117 with flow nozzles 118 is arranged, through which fluid is introduced into intermediate spaces 119, this intermediate space 119 being located between the substrate 102 to be separated and the following substrate 102. The respective intermediate space 119 preferably remains as long as fluid flows out of the flow nozzles 118 into the intermediate spaces 119. Advantageously, in a defined area, in which a plurality of substrates 102 are arranged, 102 spaces 119 between each two substrates.

In order to prevent the individual substrates 102 from leaving the carrier device 104 as a result of the flow, a pressure element 122 is provided which substantially comprises pressure pins 123 in the exemplary embodiment shown in the figures. When moving the substrate stack in the feed direction, the substrate to be separated presses against the pressure pins 123, whereby a counter force to the force is generated, which is generated by the inflow of the fluid into the spaces 119.

In the spaces 119 arise so-called fluid pillows, can be ensured by the fact that the individual to the respective fluid pad adjacent substrates 102 are kept at a distance from each other. Furthermore, these fluid pads have the property that due to the exertion of the counterforce on the one hand by the pressure element 122, but also by the start of the gripper 108 to the substrate 102 to be separated a damping effect arises.

In the presentation Figure 1 [B] For example, the gripper 108 of the device 107 is already arranged parallel to the surface of the substrate 102. The gripper 108 moves parallel in the direction of the arrow 110 and in a further subsequent step on the surface of the substrate 102, and as far as until this, as in FIG. 1 [C] is shown, the substrate 102 to be separated has contacted. Due to the starting pressure generated by the gripper 108 when it contacts the substrate 102, the respective gap between two substrates 102 is reduced. Due to the arrangement of the fluid within the interstices 119 between substrates 102 to be separated in each case, a damping effect is created. In this illustration [C], the holes not shown in the drawing are activated within the gripper 108 by a negative pressure is generated in accordance with the above illustration. The negative pressure causes the gripper 108 to suck the substrate 102 to be separated so far that the gap between the substrate 102 and the gripper 108 is greatly reduced and an adhesion force is formed between the contact surfaces. The fanning is assisted by the outflow of fluid from the flow nozzles 118.

The gripper 108 moves with the adhering substrate 102 as shown [D] until it can deposit the substrate 102 on the transport device 113. In this process, the unit of substrate and gripper must be moved a piece against the feed direction 105, so that it in the subsequent removal movement to no contacting of the pressure pins 123 comes with the substrate surface. To release the wafer, alternatively, the position-determining device can be moved a little bit in the feed direction. These two movements can also be combined according to the invention. As shown in [E], the substrate 102 is positioned flat on the conveyor 114. For separating the next substrate 102, as shown in Fig. [F], the gripper 108 is again moved to the position shown in Fig. [B].

The adhesion forces that are created when aspirating the substrate 102 to be separated are dimensioned such that they are sufficient to transport the substrate 102 accommodated by the gripper 108 within the fluid.

In the Figures 2 and 3 schematically a device 201 is shown, in comparison to Fig. 1 represents a development of the basic idea.

The device 201 is particularly suitable for separating and transporting disk-shaped substrates 202.

In the exemplary embodiment illustrated here, the substrates 202 are arranged in a substrate stack 203, wherein the substrate stack 203 is mounted in a carrier device 204 and the individual substrates 202 are already detached from a holding device.

Preferably, the individual substrates 202 are at an angle of inclination α ( Fig. 2 ) is arranged between the feed direction 205 and the surface normal of the substrate which points more in the feed direction. This inclination prevents the arrangement of the device within a fluid and in a standing position of the substrate stack 203 that the Float individual substrates 202 and leave the carrier 204 unintentionally. The substrates 202 are arranged such that their surfaces touch. The individual substrates 202 thereby form a juxtaposition, which results in a defined feed direction 205.

Furthermore, a removal device 207 is provided according to the invention, which is designed like a claw. It is shown schematically in the embodiment shown here and essentially shows a gripper 208. On the gripper 208, a handling device 209 is arranged, which makes it possible to move the gripper 208 in different directions (arrow directions 210, 211, 212) and to pivot , The gripper 208 and the handling device 209 together form a gripping arm.

Furthermore, a transport device 213 is provided. This transport device 213 consists of a conveyor belt 214 which is driven via an axis 15 in the direction of arrow 216.

In the preferred embodiment, it is provided that at least certain parts of the entire device 201, namely the carrier device 204, the substrate stack 203, and parts of the removal device 207, are arranged within a fluid. This ensures that the substrates do not fall dry over the duration of the entire process, at least until they are deposited on the transport device. Optionally, the remaining parts of the removal device 207 and the transport device 213 may be arranged in the fluid, wherein the transport device may alternatively also have their own means for moistening the substrates.

Furthermore, in order to improve the separation of the respective substrates 202 in the vicinity of the beginning of the stack, at least one flow device 217 with flow nozzles 218 is arranged, is introduced by the fluid in a gap 219, wherein the gap 219 is formed between each of the substrate 202 to be separated and the subsequent substrate 202. The flow nozzles 218 are arranged in particular in the region of the substrate stack 203, which is intended directly for the fanning. Typically, this will affect at least the first four to nine substrates 202 following the substrate 202 being singulated. This results in a plurality of gaps 219, each gap 219 is bounded to the left and right of a substrate 202. Within the space 219, a fluid cushion is formed, which has damping properties.

Furthermore, in Fig. 2 and Fig. 3 a position determining device 220 is shown. This position-determining device 220 consists essentially of a further handling device 221 and a pressure element 222 arranged at a free end of the handling device 221. The pressure element 222 further comprises pressure pins 223 which correspond to the surface of the respective substrates 202 Fig. 2 and 3 touch in a defined position or bring it by touch in a defined position and hold there. The further handling device 221 is displaceably mounted in and opposite to the direction of arrow 230.

Furthermore, the position-determining device 220 is assigned a sensor element 224. This sensor element 224 has the task of detecting whether there is a planar contact of the substrate 202 to be separated on the pressure element 222 and / or on the pressure pins 223.

A particular embodiment of this sensor element 224 is in the Fig. 2 and 3 shown. This sensor element 224 mechanically scans the presence of the substrate 202 to be singulated. For this purpose, different positions are provided, the be detected via a proximity switch 229. The sensor element 224 has a knee-lever-like design, wherein this is mounted on a hinge 225 pivotally in and against the arrow 226 direction. The one free end 227 serves to rest on the surface of the substrate 202 to be detected. The other end 228 is provided for arrangement in the region of the proximity switch 229. The basic position of the sensor element 224 is assumed when no substrate 202 is detected at the free end 227. The free end 227 is an imaginary line between the free ends of the pressure pins 223, and the other free end 228 is configured such that the distance of the free end 228 to the proximity switch is almost zero. As soon as the free end 227 experiences pressure, the sensor element 224 pivots, and the distance between the free end 228 and the proximity switch increases. If the latter has assumed a previously calibrated position, it can be determined automatically whether a substrate 202 rests against the free ends of the pressure pins 223. Without pressure at the free end 227, the sensor element 224 returns to its normal position. In alternative, unspecified embodiments of the sensor element 224, the detection of the presence of the substrate and its position by other suitable devices, such as by means of optical or acoustic proximity switches, where appropriate, on the mechanical transmission of the touch information by toggle and joint 225 can be waived.

The pressure element 222 is preferably arranged at an angle to the handling device 221, which corresponds to the inclination angle α. Thus, the individual pressure pins 223 preferably have the same length.

Alternatively, it can be provided that the pressure element 222 is arranged perpendicular to the handling device 221, and the pressure pins 223 have different lengths, so that always touch the free ends of the pressure pins 223, the surface of the substrate 202 in the position shown.

The mode of operation of the position-determining device 220 is such that the substrate stack 203 is moved in the feed direction 205 until the surface of the substrate 202 to be separated contacts the free ends of the pressure pins 223 of the pressure device 222. If the substrate 202 to be separated is aligned in position and position, the sensor element 224 is moved in one of the arrow directions 226, and the proximity switch 229 detects the correct position.

If the position of the substrate 202 to be separated is correct, the removal device 207 can dip into the intermediate space formed by the pressure pins 223 and receive the substrate 202 to be singulated.

In the following, the individual process steps are based on the Fig. 4 to 9 explained in more detail.

In Fig. 4 A and B the so-called loading situation of the device 201 according to the invention is shown. The carrier device 204 is ready for receiving a substrate stack not shown in detail.

By appropriate means, the desired inclination angle α of the substrate stack is already predetermined. The removal device 207 and the position determination device 220 are in their initial situation and can be moved in the direction of the arrow 210 or the direction of the arrow 230. The sensor element 224 disposed on the pressing member 222 is also in FIG its initial position and detects no voltage applied to the pressure pins 223 substrate.

The gripper 208 of the removal device 207 is also in an initial situation, so that it can dive between the pressure pins 223 of the pressure element 222.

The transport device 213 is ready to receive substrates. The flow nozzles 218 of the flow device 217 are still switched off.

Fig. 5 A and B show that the carrier 204 is now loaded by the substrate stack 203. This carrier device 204 or the substrate stack 203 is moved in the advancing direction 205, namely until the position determining device 220 positioned by movement in the direction of the arrow 230 has assumed a defined position. In this position, the pressure element 222 or its pressure pins 223 touch the surface of the substrate 202 to be separated.

In order to effect a specific positional and conformal alignment of the substrates 202, the flow nozzles 218 of the flow device 217 guide fluid onto the substrate stack 203, so that at least part of the substrate stack 203 fancles and gap-like intermediate spaces 219 arise. Due to the pressing of the pressure element 222 prevents the individual substrates 202 fanned on. It is thereby also achieved that the substrates 202 remain on the carrier device 204. If the corresponding position of the substrate 202 to be separated 202 is reached by fanning, the exact position is detected by the sensor unit 224. If this is not achieved, then either the position-determining device 220 proceeds further in the direction of arrow 230, and / or it is further effected that the substrate stack 203 is further fanned out. Both measures do not reach that the sensor unit 224 outputs a corresponding signal for releasing the removal device 207, a fault message is signaled.

In Fig. 6 A and B The flow nozzles 218 continue to flow fluid into the gap 219 to, in particular, to achieve a so-called fluid cushion in the spaces 219. This fluid cushion serves to achieve a corresponding damping effect between the individual substrates. Now, the release takes place due to the positional position of the substrates 202, since the sensor element 224 is pivoted such that the proximity switch 229 has been actuated.

The removal device 207 now moves in the direction of arrow 210 in such a way that the gripper 208 dips between the pressure pins 223 of the pressure element 222 of the position-determining device 220 and reaches the region of contact of the surface of the substrate 202 to be separated. By pivoting the removal device 207 in the direction of arrow 211, an abutment of the gripper 208 is effected on the surface of the substrate 202. By occurring adhesion forces, which are reinforced in particular by the fact that between the gripper 208 and the surface of the substrate 202 to be separated a negative pressure is formed, the substrate can be against the direction of the arrow 210 as in Fig. 7 A and B shown removed. Alternatively or additionally, it is provided that the gripper in the direction of arrow 212 ( Fig. 7 A ) to pivot until a flat contact with the surface of the substrate 202 takes place. As a result, the substrate to be separated is released and can, as in Fig. 7 A and B shown, are taken in the direction of arrow 210 to then store it on the conveyor 213.

However, in order to prevent the surface of the substrate 202 to be separated from being damaged, as shown in FIG Fig. 7 A and B shown, either the pressure element 222 a piece moved back, or the support means 204 and the substrate stack 203 moves against the feed direction 205 a piece back. The sensor element 224 pivots back into its initial position and the proximity switch detects that the substrate 202 to be separated no longer abuts against the pressure pins 223.

In the period ( Fig. 8A and B ), in which the removal device 207 or its gripper 208 is pivoted in the direction of arrow 212 in order to deposit the substrate 202 to be separated on the transport device 213 or on its conveyor belt 214, the carrier device 204 or the substrate stack 203 again moves in the direction of advance 205 against the Orientation device 220, until again a plant of the substrate 202 to be separated takes place on the pressure element 222 and on its Andruckstiften 223.

The storage of the substrate 202 by the removal device 207 is in the Fig. 9A and B shown. The substrate 202 is deposited on the conveyor belt 214 of the transport device 213 and transported away by a drive on the axis 215 in the direction of arrow 216.

Either during this process or subsequently, fluid is again conducted through the flow device 217 or its flow nozzles 218 into the interspaces 219 of the substrate stack 203, so that a corresponding fanning takes place, namely, until the substrate 202 to be separated again in contact with the pressure pins 223 of the pressure element 222 of the orientation device 220 passes. In this case, the sensor unit 224 generates the signal for enabling the picking up of the substrate 202 to be separated by the removal device 207.

In this way, the corresponding process is repeated as often as necessary.

As soon as no substrate 202 is present in the substrate stack 203, the absence of substrates 202 is detected by the pressure element 222 or the sensor element 224, and a corresponding error message is output.

The adhesion forces that are created when aspirating the substrate 202 to be separated are dimensioned such that they are just sufficient to transport the substrate 202 accommodated by the gripper 208 within the fluid.

The present invention has been presented with regard to the treatment of silicon wafers. Of course, disc-shaped substrates of other materials such as plastic can be processed according to the invention.

LIST OF REFERENCE NUMBERS

101 201 contraption 102 202 substratum 103 203 substrate stack 104 204 support means 105 205 feed direction 206 drilling 107 207 removal device 108 208 grab 209 handling device 110 210 arrow 211 arrow 112 212 arrow 113 213 transport means 114 214 conveyor belt 115 215 axis 116 216 arrow 117 217 flow device 118 218 flow nozzles 119 219 gap 220 Position detection device 221 further handling device 122 222 presser 123 223 pressing pins 224 sensor element 225 joint 226 arrow 227 free end 228 another free end 229 proximity switch 230 arrow α α tilt angle

Claims (17)

1. Apparatus for the separation and transportation of disc shaped substrates, wherein the apparatus comprises the following assembly groups:

   - a carrying device (104; 204) arranged within a fluid, in which the individual substrates (102; 202), in feed direction (105; 205), are sequentially arranged standing one after another in the form of a substrate stack (103; 203),

   - an unloading device (107; 207) for the separation and transportation of at least one substrate (102; 202), wherein the unloading device (107; 207) comprises a gripper (108; 208) with means by the aid of which the substrate (102; 202) can be taken up and guided away from the carrying device (104; 204),

   - a flow device (117; 217) for fanning of at least a part of the substrate stack (103; 203), and

   - a pressing element (122; 222) that acts against the fanned substrates (102; 202).
2. Apparatus according to claim 1, characterized in that the pressing element (122; 222) comprises a plurality of pressing pins (123; 223) that press against the surface of the substrate to be separated (102; 202).
3. Apparatus according to claim 1 or 2, characterized in that a position detection device (220) is provided for the detection of the position and/or location of at least the substrate to be separated (202).
4. Apparatus according to claim 1, characterized in that the gripper (108; 208) is designed such that the removal of the substrate to be separated (102; 202) takes place perpendicular or at least approximately vertical to the feed direction (105; 205).
5. Apparatus according to claim 4, characterized in that the removal takes place in parallel to the surface plane of the substrate to be separated (102; 202).
6. Apparatus according to claim 1 or 4, characterized in that the gripper (108; 208) has openings, through which fluid can be suctioned or emitted.
7. Apparatus according to claim 1 or claim 4, characterized in that the gripper (108; 208), in a top view, is formed bar shaped, o-shaped, u-shaped, v-shaped, or has a flat shape.
8. Apparatus according to claim 1, characterized in that the carrying device (104; 204) has means through which the substrates to be separated (102; 202) can be oriented along a tilt angle α.
9. Apparatus according to claim 8, characterized in that the tilt angle α is chosen in such a manner that the angle between the feed direction (105; 205) and that surface normal of the substrate surface of the individual substrates (102; 202) that points more in the feed direction is positive, being equivalent with a backward inclination of the substrates.
10. Apparatus according to claim 1, characterized in that the carrying device (104; 204) is movable in at least one direction.
11. Apparatus according to claim 10, characterized in that the carrying device (104; 204) and/or the substrate stack (103; 203) is/are movable against the pressing element (122; 222).
12. Apparatus according to claim 10, characterized in that the carrying device (204) and/or the substrate stack (203) is/are movable against the position detection device (220).
13. Apparatus according to one of the preceding claims, characterized in that it further comprises a transporting device (113; 213) that is arranged above the substrate stack (103; 203) with the substrates to be separated (102; 202).
14. Apparatus according to claim 3, characterized in that the position detection device (220) comprises a sensor (222) for checking of contact of a substrate (202).
15. Apparatus according to claim 2, characterized in that the pressing element (122; 222) is arranged in such a manner that the gripper (108; 208) can be positioned between its pressing pins (123; 223).
16. Method for the fanning, separation and transportation of disc shaped substrates using an apparatus comprising the following assembly groups:

    - a carrying device (104; 204) arranged within a fluid, in which the individual substrates (102; 202), in feed direction (105; 205), are sequentially arranged standing one after another in the form of a substrate stack (103; 203),

    - an unloading device (107; 207) for the separation and transportation of at least one substrate (102; 202), wherein the unloading device (107; 207) comprises a gripper (108; 208) with means by the aid of which the substrate (102; 202) can be taken up and guided away from the carrying device (104; 204),

    - a flow device (117; 217) for fanning of at least a part of the substrate stack (103; 203), and

    - a pressing element (122; 222) that acts against the fanned substrates (102; 202)

    , wherein the method comprises the following steps:

    a. moving of the carrying device (104; 204) together with the substrate stack (103; 203), or of the substrate stack (103; 203), respectively, in feed direction (105; 205) against the pressing element (123; 223) to achieve an unloading position for the substrate to be separated (102; 202),

    b. fanning of at least a region of the substrate stack (103; 203) by a flow device (117; 217) in such a manner that interspaces (119; 219) develop;

    c. separating of the substrate by

    - positioning of the gripper (108; 208) almost parallel to the planar design of the substrate (102; 202),

    - establishment of an adhesive contact between substrate (102; 202) and gripper (108; 208), and

    - removing of the substrate (102; 202) within the fluid perpendicular to the feed direction (105, 205), or parallel to the planar design of the substrates (102; 202), respectively.
17. Method according to claim 16, characterized in that interspaces (119; 219) are developed within the substrate stack (103; 203) due to the fanning by the flow device (117; 217), and that fluid cushions develop in the interspaces (119; 219) due to the fluid stream of the flow device (117; 217), exerting a damping effect on the substrate to be separated (102; 202) upon contacting of the gripper (108; 208).

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