DE102006059809B4 - Device and method for separating and transporting substrates - Google Patents

Abstract

Device for separating and transporting disc-shaped substrates, wherein the device essentially comprises the following components:
A carrier device (104; 204) arranged within a liquid medium, in which the individual substrates (102; 202) are arranged sequentially one behind the other in a feed direction (105; 205) in the form of a substrate stack (103; 203),
A removal device (107, 207) for separating and transporting at least one substrate (102, 202), wherein the removal device (107, 207) comprises a gripper (108, 208) with means with which the substrate (102, 202) can be received and can be guided away from the carrier device (104; 204),
A flow device (117, 217) for fanning at least part of the substrate stack (103, 203), and
- A pressure element (122, 222), which counteracts the fanned-out substrates (102, 202).

Description

Technical area

The The invention relates to a device for separating and transporting of substrates. The substrates are disc-shaped and susceptible to breakage. For separating a carrier device provided that the individual substrates in the training of a Substrate stack receives and for the separation holds. A removal facility leads the process of singulating and transporting.

Further The invention relates to a method for separating and Transporting substrates provided in a substrate stack.

definitions

The "substrates" are disc or formed surface-shaped and usually rectangular. They are after a sawing process obtained from a substrate block. They have circumferential edges, which are substantially straight, the corners being at right angles, rounded or bevelled can be configured.

Several stacked on top of each other or side by side or behind each other Substrates result in a "substrate stack." If the substrate surfaces are horizontal, Thus, according to the invention of a "lying" stack one above the other lying substrates spoken; the substrate surfaces run vertically, this corresponds to a "standing" stack next to each other standing substrates. The individual substrates are already from one for the Sawing process necessary Detached holding device and free and independent stacked from each other. Often the individual substrates adhere due to the previous sawing process but still unintentionally flat together. For the Further processing is normally necessary, this to separate so stacked substrates. This means that each provided at the end of an upright positioned substrate stack Substrate removed by means of a device of the substrate stack and to be transferred to the further processing process.

The "stacking direction" of the substrates in a stack of substrates is determined by the position of the to be separated Substrate specified. The individual substrates are aligned in such a way that with their surfaces are essentially contiguous. The stacking direction corresponds in a special case exactly and completely abutting substrate surfaces exactly the direction of the surface normals of the substrate or substrates, wherein the positive direction that end of the stack points, from which each one to be separated Substrate should be removed. Unless this substrate is on the right side of the in a carrier device arranged "standing" substrate stack is arranged, shows the stacking direction accordingly in the arrow direction right.

The "feed direction" of a stack corresponds essentially the stacking direction.

The "stack start" denotes that end of the substrate stack, to which the next substrate to be separated located. This is the end that points in the feed direction. Becomes however, generally speaking of "stack end", so is not closer indicates whether it is the beginning of the stack or the opposite End of the stack is.

The substantially vertically or upright positioned substrate stack are provided in a "carrier device". In this case, an edge of the respective substrate rests on the carrier device. The carrier device takes the substrate stack, for example, after sawing and / or removing the frequently for attaching the first ungesägten Substrates on a holding plate used adhesive and transported this to a removal device in which the separation should be done. The carrier device is preferably designed such that it as the substrate stack Whole takes up, d. H. the individual substrates are essentially flat one another or one behind the other.

The support means if desired a certain tilting of the surface touching each other Substrates against the original Allow stacking direction or force, so that a structurally predetermined "tilt angle" of the substrates over the original Stacking results in the context of the present invention denoted by α becomes. This is between the surface normal of a substrate and the feed direction included, wherein the surface normal to choose that substrate side is, which points more in the feed direction, so that tilt angle between -90 ° and + 90 ° can. Positive angles indicate a tilting of the substrates to the rear (opposite the feed direction), negative angles tipping the substrates forward (in feed direction). Preferred angles of inclination are in the range of + 5 ° to + 35 °; especially tilt angles of + 15 ° to + 20 ° are preferred.

The substrate is picked up and transported away from the substrate stack by means of the removal device, for example via suction devices, from which the substrate is arranged at the one end of the substrate stack to be separated Substrate stack detached and thus isolated, and fed to another processing or transport process. The removal device serves to remove the substrate to be separated from the substrate stack. On the one hand, the removal can take place in the stacking direction, ie, the substrate to be separated is picked up by the removal device and pulled away parallel to the planar formation of the following substrate in the stacking direction, so that between the substrate to be separated and On the other hand, it can be provided that the substrate is removed by displacement relative to the following substrate, so that only shearing forces arise between the two substrates, in which case the substrate to be separated is moved in the direction of the substrate planar extension of the respective substrate, preferably approximately perpendicular to the plane of the carrier device, moved up or removed.

ever After removal direction therefore different forces act differently Strength on the substrate to be separated and those still in the stack Substrates, with these forces especially the substrate just following the substrate to be removed is exposed.

To the Separation of the substrate stack is provided, this together with the carrier device To arrange in a fluid, which hereby essentially liquid media to be understood. Within the fluid "flow means" are provided, the the substrate stack from the side and / or from below or flow upwards with fluid in such a way that a flow which aims at the substrate stack and causes the individual substrates "fan out" and at a distance to each other being held. This means that between each substrate creates a gap which is filled with fluid.

This fan out can according to a preferred embodiment still with other suitable means such. B. with particular in the fan-out area positioned ultrasonic emitters are supported. This is special then advantageous if the adhesion forces between the touching one another Substrates are so high that the penetration of the fluid otherwise only very slowly.

A "position determination device" serves the purpose of Location and / or the position of the substrate to be separated and / or of the substrate stack. If a correspondingly arranged electronics with a sensor receives a corresponding signal, what synonymous with it is that the substrate to be removed arranged in position and position is, the operation of the removal device is released for separation. Is the substrate to be separated not in position and position at the orientation device, then another signal output that then has to be interpreted accordingly. The orientation device can also serve to isolate the substrate to be separated by means of suitable, for. B. geometric, constraints in the desired position to move to release the signal for the Removal device is necessary, and / or the substrate there to hold.

State of the art

at one of the known production methods for substrates, as for example be used for the production of solar or semiconductor wafers, become silicon blocks or silicon columns (present substrate blocks called) used in thin, Fragile discs (in the present case called substrates) are sawed. The substrates produced in this way typically have Thicknesses of a few 10 to 300 microns on and are usually square or rectangular. You then preferred a respective edge length up to 210 mm.

The substrate blocks be used for sawing usually glued to a holding device. This holding device consists typically made of a metal carrier, on which in turn a Glass plate as intermediate carrier is applied, wherein the substrate block to be processed on the Glued glass plate. Alternatively, according to the prior art also other materials for the formation of the holding device can be provided.

to Preparation of the aforementioned substrates it is necessary to Saw substrate block completely like a disk, so that the saw cut itself over extends beyond the substrate block into the glass plate. To sawing The substrate thus prepared adheres to its one Edge over an adhesive bond continues on the glass plate. After the substrate block Completely has been divided into individual substrates, creating a comb-like Structure.

Before the individual substrates, which now have a disc-shaped design, detached from the holding device usually a pre-cleaning takes place.

To carry out the sawing process, a medium is needed which is essentially glycol and optionally further chemical additives and a release agent such. Silicon carbide granules. This medium is called "slurry" and serves to carry out the sawing process. Normally, a certain amount of slurry always remains in the space between the individual sawn substrates. In the worst case, the slurry during the processing process or subsequently to a pasty structure, since it mixes with the silicon particles formed from the substrate block and with the abrasion of the saw wire used for the sawing process and the release agent or certain components of the batch together react. Due to their consistency, the slurry adheres to the surface of the wafer. Despite a subsequent to the sawing of the substrate blocks in the normal case pre-cleaning are still very often residues of the mixture between the substrates.

In the WO 01/28745 A1 describes methods and devices for detaching disc-shaped substrates. A robot-like device grips the substrate to be detached by means of suction devices (active generation of a negative pressure via, for example, a vacuum pump), whereby the substrate is released from the holding device by an oscillating movement of the device. In this case, oscillating movements are provided in different directions. The gripping of the substrate to be separated takes place with the aid of a suction device arranged above the surface of the substrate and attached to the device. To release the substrate, a certain overpressure is generated within the suction device, so that the detached substrate is removable from the device again.

From the DE 199 00 671 A1 Methods and devices for detaching disc-shaped substrates, in particular wafers, are known. It is proposed that the substrates adhering to each other immediately after the sawing process, which are still fastened with their one side (edge) on the holding device, by a targeted fluid jet from each other at a distance. A wedge device ensures that a separation of the substrate to be detached takes place from the holding device. At the same time, the isolated substrate is removed from the holding device by means of a suction device having a gripping arm-like device.

From the DE 697 22 071 T2 For example, there is known an apparatus for loading projectors obtained by sawing a substrate block into a storage element. There are proposed handling devices that allow to take round or oval substrates in cross-section and to convert them into a stand-like structure. In this case, a plurality of substrates are recorded simultaneously and transferred to a footprint, which receives the isolated substrates.

From the DE 199 04 834 A1 a device for detaching individual thin, fragile and disc-like substrates is known. The substrate block with the already sawn substrates is in a container filled with a fluid. In contrast to the previously known prior art, the holding device is vertically aligned together with the still fixed to the holding device substrates, so that the substrate to be separated is arranged parallel to the fluid surface. A wedge device ensures that a separation between the glass plate and the substrate to be separated takes place. An arranged in close proximity to the substrate conveyor belt ensures that the detached and floating substrates are removed. A sliding device provides that the holding device is repeatedly brought into the same position and moved horizontally against the wedge device for detachment of the respective substrate. On the other side of the conveyor belt, a device is provided with which the separated substrates are automatically inserted into a stand. The aim of the detachment is that the separated, disc-like substrates are stacked after their removal from the holding device and inserted into predetermined facilities or placed directly on schedule.

Disadvantages of the prior art

The Separation of the respective substrates is difficult.

For singling movements are necessary that require complex facilities, if you want to do without manual operation. There However, it is in the substrates to very fragile and thin, plate-like configured substrates, they can not readily over conventional gripper arm-like systems be recorded. For this it is necessary, very precise and sensitive Provide facilities.

Out the prior art are thus exclusively such devices known, the respective substrate by means of a suction device take. Immediately after starting the suction on the areal Design of the substrate to be separated is between suction and to einzzelndem substrate over a vacuum pump generates a vacuum, allowing the substrate to adhere is possible on a handling device. It is, however, careful offered because the substrate to be separated by too high a vacuum can break.

Another critical point here is that the respective substrate of the Handha approached, ie has to be touched. Since the substrate must not be pushed away from the device in any case, an exact positioning is necessary. This is difficult because, on the one hand, a relative movement of the holding device for positioning the substrate to be separated is provided in the region of the holding device, and the holding device itself therefore has corresponding degrees of freedom. Therefore, tolerances are possible, which lead to possible damage to the substrate to be separated. On the other hand, such movements generally take place in a fluid, so that there is a risk that a flow pressure, in particular in the direction of the substrates, is created by the individual movements of the devices, which can lead to positional displacements of the substrates or even to breakage.

A done by hand Separation carries the risk of being very thin and fragile as well as disk-shaped broken substrates in particular due to the increased adhesive forces.

Object of the invention

The The object of the invention is therefore to provide devices and methods that allow almost damage-free removal of thin, break-sensitive and stacked substrates is made possible.

solution the task

Of the The core idea of the invention is a carrier device on which a substrate stack with sequentially arranged sequentially substrates located, and to propose a withdrawal facility with the property that in each case arranged at the stack beginning of the substrate stack substrate on its surface facing away from the substrate stack via the removal device taken up, slightly removed from the subsequent substrate and then parallel to its face orientation away from the substrate stack and thus away from the carrier device. It is essential that the arranged in a fluid substrate stack from one through nozzles generated flow flows through which, in particular, at the free end of the substrate stack arranged substrates are kept apart from each other. Thereby An adhesion of the respective substrates is avoided. simultaneously causes this flow between the individual substrates the formation of a fluid damping pad, so that on the substrate to be separated when approaching the removal device a damping effect arises and thus a break of the individual substrates can be avoided. A gripper arm of the removal device detects the to be separated Substrate with a gripper such that between the gripper and Adhesion forces through the substrate a suction of the fluid from the intermediate space by means of the gripper located holes and thus the gripper surface one Suction force on the substrate causes.

Consequently is the solution the task therein, a device according to claim 1 and / or a method according to the characteristics of claim 16 to propose.

Advantages of the invention

one the main advantages of the invention is that the Substrate shatterproof in a fast cycle completely and automated can be separated.

Of the Core idea of the solution is that the substantially perpendicular to the feed direction, but slightly inclined at an angle substrates be fanned within the substrate stack by a flow device. Preferably, the first five to ten substrates of generated by flow nozzles currents flows around, so that the individual substrates are kept at a distance from each other and so-called fluid damping pads arise between the individual substrates. If against the stacking or feed direction a force acts on the substrates become the individual substrates in the context of the method according to the invention not further compressed; Rather, it is completely about the the whole area generates a counterforce, but within certain limits a residual mobility in particular allows the substrate located at the beginning of the stack. This drag is exploited along with the residual mobility so that the gripper of the removal device against the to be separated Press substrate can. Without indirect damping by means of between the fanned-out substrates located fluid damping pad would the Substrate with high probability of breaking.

If it is a standing stack, the gripper is preferably introduced from above, ie parallel to the longitudinal extent of the respective substrates and thus approximately transversely to the stacking direction and then guided against the substrate to be separated. The holes provided in the gripper serve to suck the fluid out of the space between the gripper and the substrate to be separated. For this purpose, a negative pressure is necessary, which can be generated both by means of dynamic methods (eg pump), static methods (vacuum tank) or other methods inside or outside the device. Finally, the gripper and substrate are in direct contact, or is only a very thin Fluid film (a few nanometers to 50 microns) between the gripper and the substrate, so build adhesion forces, which allow an automatic sticking or adhesion of the substrate to the gripper. These adhesion forces are in particular greater than those for the following substrate, so that the removal of the substrate to be separated with the gripper can take place parallel to the surface direction of the following substrate. At most only slight shearing forces act on the substrate to be separated, as a result of which the breakage rate is considerably reduced. Tensile and compressive forces are avoided. Fast removal from the substrate stack is possible in a timely manner. The adhesion forces are furthermore so great that, depending on the geometrical configuration of the gripper and substrate weight, they allow substrate to adhere to the gripper even without active underpressure generation, especially when the substrate is outside the fluid surrounding the substrate stack. It should be noted that the functional relationship between the bore diameter and number in the gripper surface, the size of the gripper surface, as well as the size of the vacuum necessary for the suction of the fluid and for sucking the substrate is taken into account.

Of the Gripper itself is preferably designed such that it exclusively out a bar exists. Alternative embodiments may provide that bar-shaped, O-shaped, U-shaped, triangular and in gripper movement direction tapered (V-shaped), or in terms of space Grippers are provided. Particularly preferred are such designs, which has a low flow resistance have in the direction of gripper movement and / or the least possible turbulence when removing the substrate from the substrate stack and the following Create separation movement. The grippers of all versions continue to have the advantage that only one gripper for different Formats of substrates must be used and that the principle gripping the substrate to be separated even in such substrates functionally executed can be, which are already broken and therefore no longer the usual dimensions exhibit. Another advantage is that with a gripper design different Formats of substrates can be recorded. This is due to the fact that not a suction, but an adhesion force is achieved, the in terms of area over the Contact area between Gripper and substrate extends.

According to the invention Low pressure generated at the beginning of the extraction phase. Even if this Negative pressure only until the receipt of the above-mentioned fluid film between Substrate and contact surface of the Gripper must be maintained, the negative pressure can also maintained until the deposition of the substrate on the transport device stay.

The support means itself is constructed such that it contains at least one of a Record variety of substrates or wafers existing substrate stack can. Furthermore, the carrier device Means by which it is ensured that the individual Substrates have a certain inclination, the inclination of such is formed such that the inclination angle α, formed between the feed direction the stack and the surface normal pointing in the feed direction a substrate, greater than 0 degrees, So it is positive. In the case of a standing stack this means that on the carrier device lying edge of the substrate in the feed direction in front of the upper Edge is arranged. This has the advantage that the Immerse gripper parallel to this orientation in the fluid and The substrate can be removed in this direction again. Thereby It also avoids that the standing stack in a further transport the carrier device within the fluid tilts forward and thus loses its positional orientation.

Consequently is the carrier device at least in one direction displaceable. Preferably, it is in the feed direction relocatable, and initially so far, until the first substrate to be separated of the substrate stack to the Orientation device arrives. Then she is z. In steps displaceable whose step size preferably the respective, im Normally about the stack corresponds to constant substrate thickness, and so far, until finally the last substrate of the stack is brought to the removal device. Alternatively, the carrier device stationary be educated. In this case, appropriate resources would be provided be, with which the substrate stack on the support device in the feed direction can be moved. Alternatively or additionally, the gripping device and the orientation device over correspondingly greater degrees of freedom dispose of it they counter to the feed direction in the direction of the stack start are movable.

The position determining device is a device with which the position and position of the substrate to be separated is detected. For this purpose, it is provided that the position-determining device comprises pressure pins, which are aligned in the direction of the substrate stack. By reducing the distance between the position-determining device and the substrate stack, the fanned-out beginning of the substrate stack is aligned until the substrate to be separated rests against all provided pressure pins. An additional sensor element, for example in the form of a touch sensor, emits a corresponding signal, whereby the gripper now preferably between the pressure pins immerse and singulate the substrate to be separated and transported away.

Provided the substrate stack comprises substrates whose thickness is suitable for adjustment the Andruckelemente set average thickness and thus the resulting increment exceeds, this condition is detected by the orientation device, so that the substrate stack moved accordingly in the feed direction will be until the next to be separated substrate contacts the pressing elements.

alternative or additionally the orientation device can be supplemented by a protractor. In this way, the position of the substrate to be separated can be exact determined and if desired as a measure to check the quality of the too isolating substrate are used.

Of the Advantage of the device is thus that through the interaction from carrier device, Extraction device, flow device as well Position determining device, a device in particular for separating and transporting substrates has been created by means of which automates the process steps and with a comparison the prior art extremely low breakage rate accomplished can be. This advantage is provided by the due to the flow device Fluid damping pads supported.

Also the embodiment of the removal device itself and the thereby predetermined removal of the substrate transversely to the stacking causes that little or no tension is applied to the substrate to be separated. or compressive forces Act. Advantageously, this removal device is designed such that the removal parallel to the areal extent of the respective Substrate takes place, so that possible little tensile, compressive or bending forces act on the corresponding substrate.

Of the Further transport preferably takes place within the fluid. It is However, also provided to lead out the gripper from the fluid and the above adhesion adherent substrate from the gripper to a conveyor such. B. a conveyor belt store so that fluid over the holes provided in the gripper in the direction of the substrate pushed out will, so that the area trained substrate from the gripper easily and without effect through from the outside can solve attacking tensile and / or compressive forces.

Of the Cycle can be repeated as often as you like.

one the significant advantages of a further embodiment of the invention is that the intended gripper arm in its approach to the substrate can have a certain tolerance. It is not required that the gripper arm exactly in front of the substrate to be separated persists and is positioned there. Rather, the damping can be due to the arrangement the substrates within the fluid as well as through the flow device arises, can be advantageously exploited by the gripper with little force moves against the feed direction against the substrate stack and such a flat Makes contact with the substrate to be separated, due to the underlying fluid damping cushion is resiliently stored.

One Another advantage of the invention relates to the provision of a Device with which the existing between gripper arm and substrate Adhesion forces by machine and thus automatically be exploited so that each individual substrate is relatively independent of its size and outer contour taken in a simple manner without breakage, by the transport partly even prepurified within the fluid and into a specific one Device such as transferred to a transport device can.

A another alternative embodiment of the Removal device shows a device that has a defined degree of flexibility so that tolerances in the positioning range in terms on the plane Arrangement of the recording balanced to the substrate to be separated become. In this case, the gripper, the handling device and / or the Connection between two components designed to be flexible and deformable accordingly.

Around the cycle times for to increase the singulation, is according to a particularly preferred embodiment, another means for takeover the isolated substrate provided by the removal device. Within the time span in which the substrate passes through this Means on a conveyor belt is stored, the removal device can already another Pick up the substrate from the substrate stack. Alternatively or additionally, two be provided substantially identical removal devices, which are switched out of phase.

Further advantageous embodiments will become apparent from the following description, the claims and the drawings.

drawings

It demonstrate:

1 [A-F] is a schematic representation of the inventive core of the device according to the invention, in particular the sequence of a separating and transporting process to unite tentative substrate;

2 a schematic representation of an embodiment of the device according to the invention according to 1 in side view;

3 a schematic representation of in 2 embodiment shown in a perspective view;

4 [A] a schematic representation of a first process step of the device according to the invention according to 2 in side view;

4 [B] a schematic representation of a first process step of the device according to the invention according to 2 in perspective view;

5 [A] a schematic representation of a second process step of the device according to the invention according to 2 in side view;

5 [B] a schematic representation of a second process step of the device according to the invention according to 2 in perspective view;

6 [A] a schematic representation of a third process step of the device according to the invention according to 2 in side view;

6 [B] a schematic representation of a third process step of the device according to the invention according to 2 in perspective view;

7 [A] a schematic representation of a fourth process step of the device according to the invention 2 in side view;

7 [B] a schematic representation of a fourth process step of the device according to the invention 2 in perspective view;

8 [A] a schematic representation of a fifth method step of the device according to the invention according to 2 in side view;

8 [B] a schematic representation of a fifth method step of the device according to the invention according to 2 in perspective view;

9 [A] a schematic representation of a sixth method step of the device according to the invention according to 2 in side view;

9 [B] a schematic representation of a sixth method step of the device according to the invention according to 2 in perspective view.

description

In 1 , Representations A-F, is schematically the core idea of the inventive device 101 and the method according to the invention. This device 101 is suitable for separating and transporting disc-shaped substrates 102 ,

In the illustrated embodiment, the substrates 102 in a substrate stack 103 arranged, wherein the substrate stack 103 in a carrier device 104 is stored. The individual substrates 102 are already solved by a holding device. Preferably, the surface normals are the surfaces of the individual substrates which point more in the direction of advance 102 at an angle α (inclination angle) (in 2 shown) arranged to the feed direction. In the arrangement of the device within a fluid is in the case of a stationary stack of substrates 103 By this inclination prevents the individual substrates 102 float up or the carrier device 104 leave unintentionally. In addition, the individual substrates can be 102 through the extraction device to be described later 107 easier to record.

The individual flat substrates 102 are lined up in such a way that touch their surfaces. Between them, adhesion forces act on the part of the very small gap between the substrates on the one hand and possibly of impurities z. B. originate from a previous sawing step. By this arrangement, the substrates give 102 a defined feed direction 105 in front.

In the illustrated drawings, the substrates are shown schematically. In this case, the block diagram shown schematically means that the substrates in this area are very close together. In the wider area, namely the removal area, the substrates are fanned out and have a gap on. The adhesion forces between the fanned out Substrates are preferably zero.

Furthermore, according to the invention a removal device 107 provided, which is designed claw-like. It is shown schematically in the embodiment shown here and essentially shows a gripper 108 , At the gripper 108 is a handling device (in 1 [A] shown), which allows the gripper 108 to move in different directions and / or to pivot. Preferably, the gripper 108 in arrow 110 and around an axis in the direction of the arrow 112 pivotable.

Furthermore, a transport device 113 intended. This transport device 113 consists of a conveyor belt 114 that's about an axis 115 in the direction of the arrow 116 is driven.

It is preferably provided that at least certain parts of the device 101 namely the carrier device 104 , the substrate stack 103 , as well as parts of the removal device 107 are arranged within a fluid. This ensures that the substrates do not fall dry over the duration of the entire process, at least until they are deposited on the transport device. Optionally, the remaining parts of the removal device 107 as well as the transport device 113 may also be disposed within the fluid, wherein the transport device may alternatively have their own means for moistening the substrates.

Furthermore, to improve the separation of the respective substrates 102 at least one flow device 117 with flow nozzles 118 arranged through the fluid into spaces 119 is introduced, with this gap 119 in each case between the substrate to be separated 102 and the subsequent substrate 102 located. Preferably, the respective gap remains 119 exist as long as from the flow nozzles 118 Fluid in the interstices 119 flows. Advantageously, form in a defined area in which several substrates 102 are arranged between each two substrates 102 interspaces 119 out.

To prevent the individual substrates 102 through the flow, the carrier device 104 leave, is a pressure element 122 provided, which in the embodiment illustrated in the figures essentially Andruckstifte 123 includes. When the substrate stack is moved in the feed direction, the substrate to be separated presses against the pressure pins 123 , whereby a counterforce is exerted to the force caused by the inflow of the fluid into the interstices 119 is produced.

In the intervals 119 arise so-called fluid cushion, by which it can be ensured that the individual adjacent to the respective fluid cushion substrates 102 kept apart from each other. Furthermore, these fluid pads have the property that due to the exertion of the counterforce on the one hand by the pressure element 122 , but also by the approach of the gripper 108 to the substrate to be separated 102 a damping effect arises.

In the presentation 1 [B] is the gripper 108 the device 107 already parallel to the surface of the substrate 102 arranged. The gripper 108 moves parallel in the direction of the arrow 110 and in a further subsequent step on the surface of the substrate 102 until, until this, as it is in 1 [C] is shown, the substrate to be separated 102 has contacted. Due to the starting pressure caused by the gripper 108 is generated when he is the substrate 102 touches, the respective gap between two substrates 102 reduced. Due to the arrangement of the fluid within the interstices 119 between each to be separated substrates 102 creates a damping effect. In this illustration [C], the holes not shown in detail in the drawing within the gripper 108 activated by a negative pressure is generated as shown above. The negative pressure causes the gripper 108 the substrate to be separated 102 so far sucks, that the gap between the substrate 102 and the gripper 108 greatly reduced and forms an adhesion between the contact surfaces. The fanning is caused by the outflow of fluid from the flow nozzles 118 supported.

The gripper 108 moves with the adherent substrate 102 as shown [D] until it reaches the substrate 102 on the transport device 113 can take off. In this process, the unit of substrate and gripper must be a piece opposite to the feed direction 105 be moved so that there is no contact with the Andruckstifte in the subsequent removal movement 123 comes with the substrate surface. To release the wafer, alternatively, the position-determining device can be moved a little bit in the feed direction. These two movements can also be combined according to the invention. As shown in [E], the substrate becomes 102 flat on the conveyor belt 114 positioned. For separating the next substrate 102 becomes according to representation [F] the gripper 108 move back to the position shown in illustration [B].

The adhesion forces, the suction of the substrate to be separated 102 are created, are such that they are sufficient, that by the gripper 108 absorbed substrate 102 to transport within the fluid.

In the 2 and 3 is schematically a device 201 shown that compared to 1 represents a development of the basic idea.

The device 201 is in particular for separating and transporting disc-shaped substrates 202 suitable.

In the Ausführungsbei shown here play are the substrates 202 in a substrate stack 203 arranged, wherein the substrate stack 203 in a carrier device 204 is stored and the individual substrates 202 already solved by a holding device.

The individual substrates are preferred 202 at an inclination angle α ( 2 ) between the feed direction 205 and arranged the more in the feed direction facing surface normals of the substrate. By this inclination is in the arrangement of the device within a fluid and at a standing position of the substrate stack 203 prevents the individual substrates 202 float up and the carrier device 204 leave unintentionally. The substrates 202 are arranged so that their surfaces touch. The individual substrates 202 thereby form a juxtaposition, the defined feed direction 205 results.

Furthermore, according to the invention a removal device 207 provided, which is designed claw-like. It is shown schematically in the embodiment shown here and essentially shows a gripper 208 , At the gripper 208 is a handling device 209 arranged, which allows the gripper 208 in different directions (arrow directions 210 . 211 . 212 ) to move and to pivot. The gripper 208 and the handling device 209 together form a gripper arm.

Furthermore, a transport device 213 intended. This transport device 213 consists of a conveyor belt 214 that's about an axis 15 in the direction of the arrow 216 is driven.

In the preferred embodiment it is provided that at least certain parts of the entire device 201 namely the carrier device 204 , the substrate stack 203 , and parts of the sampling facility 207 , are arranged within a fluid. This ensures that the substrates do not fall dry over the duration of the entire process, at least until they are deposited on the transport device. Optionally, the remaining parts of the removal device 207 as well as the transport device 213 may be arranged in the fluid, wherein the transport device may alternatively have its own means for moistening the substrates.

Furthermore, to improve the separation of the respective substrates 202 at least one flow device near the beginning of the stack 217 with flow nozzles 218 arranged through the fluid into a space 219 is introduced, with the gap 219 in each case between the substrate to be separated 202 and the subsequent substrate 202 arises. The flow nozzles 218 are especially in the area of the substrate stack 203 arranged directly for the fanning out. As a rule, this concerns at least the first four to nine substrates 202 , the substrate just to be separated 202 consequences. This creates several spaces 219 , with each gap 219 left and right of a substrate 202 is limited. Inside the gap 219 A fluid cushion forms, which has damping properties.

Furthermore, in 2 and 3 a position determining device 220 shown. This orientation device 220 consists essentially of a further handling device 221 and one at a free end of the handling device 221 arranged pressure element 222 , The pressure element 222 also includes pressure pins 223 covering the surface of the respective substrates 202 according to 2 and 3 touch in a defined position or bring it by touch in a defined position and hold there. The further handling device 221 is in and opposite to the arrow 230 slidably mounted.

Furthermore, the orientation device is 220 a sensor element 224 assigned. This sensor element 224 has the task of detecting whether on the pressure element 222 and / or on the pressure pins 223 a flat arrangement of the substrate to be separated 202 is present.

A special design of this sensor element 224 is in the 2 and 3 shown. This sensor element 224 mechanically senses the presence of the substrate to be separated 202 from. For this purpose, different positions are provided, which via a proximity switch 229 be detected. The sensor element 224 has a knee-lever-like training, which at a joint 225 swiveling in and against the direction of the arrow 226 is stored. The one free end 227 serves as a support on the surface of the substrate to be detected 202 , The other end 228 is to be arranged in the vicinity of the proximity switch 229 intended. The basic position of the sensor element 224 is then taken when at the free end 227 no substrate 202 is detected. The free end 227 stands over an imaginary line between the free ends of the pressure pins 223 , and the other free end 228 is designed such that the distance of the free end 228 to the proximity switch is almost zero. Once the free end 227 Pressure experiences, pivots the sensor element 224 , and the distance of the free end 228 to the proximity switch increases. If this has taken a previously calibrated position, it can be automatically determined whether at the free ends of the pressure pins 223 a substrate 202 is applied. Without pressure on the free end 227 goes the sensor element 224 be back in ne basic position over. In alternative, unspecified embodiments of the sensor element 224 For example, the detection of the presence of the substrate and its position may also be effected by other suitable means, such as e.g. B. optical or acoustic proximity switch, carried out, where appropriate, on the mechanical transmission of the touch information by toggle and joint 225 can be waived.

The pressure element 222 is preferably at an angle to the handling device 221 arranged, which corresponds to the inclination angle α. This is how the individual pressure pins point 223 preferably the same length.

Alternatively, it can be provided that the pressure element 222 perpendicular to the handling device 221 is arranged, and the pressure pins 223 have different lengths, so that in the position shown always the free ends of the pressure pins 223 the surface of the substrate 202 touch.

The operation of the orientation device 220 is such that the substrate stack 203 in the feed direction 205 is driven, and so far, to the surface of the substrate to be separated 202 the free ends of the pressure pins 223 the pressure device 222 contacted. For positional and positional alignment of the substrate to be separated 202 becomes the sensor element 224 in one of the arrow directions 226 moves, and the proximity switch 229 detects the correct position.

Is the location of the substrate to be separated 202 in the right position, so the removal device 207 in the of the pressure pins 223 Immerse the space formed and the substrate to be separated 202 take up.

In the following, the individual process steps are based on the 4 to 9 explained in more detail.

In 4A and B is the so-called loading situation of the device according to the invention 201 shown. The carrier device 204 is ready to receive a substrate stack not shown yet.

By appropriate means, the desired inclination angle α of the substrate stack is already predetermined. The removal device 207 and the orientation device 220 are in their initial situation and can be in the direction of the arrow 210 or arrow direction 230 be moved. The sensor element 224 that on the pressure element 222 is arranged, is also in its initial position and detects none at the Andruckstiften 223 adjacent substrate.

The gripper 208 the removal device 207 is also in an initial situation, so he between the pressure pins 223 of the pressure element 222 can dive.

The transport device 213 is ready to accept substrates. The flow nozzles 218 the flow device 217 are still off.

5A and B show that the carrier device 204 now through the substrate stack 203 loaded. This carrier device 204 or the substrate stack 203 is in the feed direction 205 until the time by movement in the direction of arrow 230 positioned orientation device 220 has taken a defined position. In this position touch the pressure element 222 or its pressure pins 223 the surface of the substrate to be separated 202 ,

To a certain positional and conforming orientation of the substrates 202 cause the flow nozzles 218 the flow device 217 Fluid on the substrate stack 203 , so that at least part of the substrate stack 203 fanned out and gap-like spaces 219 arise. Due to the pressure of the pressure element 222 will prevent the individual substrates 202 further fan out. It is thereby achieved that the substrates 202 on the carrier device 204 remain. If by fanning the corresponding position of the substrate to be separated 202 is reached, by the sensor unit 224 detected the exact location. If this is not achieved, then either the orientation device moves 220 continue in the direction of the arrow 230 , and / or it is further causes the substrate stack 203 is further fanned out. Both measures do not reach that of the sensor unit 224 a corresponding signal to release the removal device 207 outputs, a fault message is signaled.

In 6A and B flow the flow nozzles 218 Continue to fluid in the gap 219 in particular, to achieve that in the interstices 219 a so-called fluid pad is formed. This fluid cushion serves to achieve a corresponding damping effect between the individual substrates. Now the release takes place due to the positional position of the substrates 202 because the sensor element 224 pivoted so that the proximity switch 229 has been actuated.

The removal device 207 now moves in the direction of the arrow 210 such that the gripper 208 between the pressure pins 223 of the pressure element 222 the orientation device 220 penetrates and in the area of the plant the surface of the substrate to be separated 202 arrives. By pivoting the removal device 207 in the direction of the arrow 211 becomes a plant of the gripper 208 to the surface of the substrate 202 causes. By occurring adhesion forces, which are reinforced in particular by the fact that between the gripper 208 and the surface of the substrate to be separated 202 a negative pressure is formed, the substrate can be against the arrow direction 210 as in 7A and B are shown. Alternatively or additionally, it is provided, the gripper in the direction of arrow 212 ( 7A ) to pivot until a flat abutment against the surface of the substrate 202 he follows. As a result, the substrate to be separated is released and can, as in 7A and B, in the direction of the arrow 210 be removed to subsequently on the transport device 213 store.

However, to prevent the surface of the substrate to be separated 202 is damaged, as in 7A and B, either the pressure element 222 a piece back, or the carrier device 204 or the substrate stack 203 moves against the feed direction 205 a piece back. The sensor element 224 pivots back to its original position and the proximity switch detects that the substrate to be separated 202 no longer on the pressure pins 223 is applied.

In the period ( 8A and B), in which the removal device 207 or her grapple 208 in the direction of the arrow 212 pivoted to the substrate to be separated 202 on the transport device 213 or on her conveyor belt 214 store, moves the carrier device 204 or the substrate stack 203 again in the feed direction 205 against the orientation device 220 until again a plant of the substrate to be separated 202 on the pressure element 222 or on his Andruckstiften 223 he follows.

The tray of the substrate 202 through the removal device 207 is in the 9A and B are shown. The substrate 202 gets on the conveyor belt 214 the transport device 213 stored and by a drive on the axle 215 in the direction of the arrow 216 transported away.

Either during this process, or subsequently, through the flow device 217 or their flow nozzles 218 turn fluid into the interstices 219 of the substrate stack 203 performed, so that a corresponding fanning takes place, and indeed so far to the substrate to be separated 202 again for contact with the pressure pins 223 of the pressure element 222 the orientation device 220 arrives. The sensor unit generates 224 the signal to enable the collection of the substrate to be separated 202 through the removal device 207 ,

On this way the corresponding process is repeated as often as it is is necessary.

Once no substrate 202 more in the substrate stack 203 is present, the absence of substrates 202 through the pressure element 222 or the sensor element 224 detected, and a corresponding error message is output.

The adhesion forces, the suction of the substrate to be separated 202 arise, are sized so that they are just sufficient, that by the gripper 208 absorbed substrate 202 to transport within the fluid.

The The present invention has been made with regard to the treatment of silicon wafers explained. Of course can also disc-shaped substrates from other materials such. B. plastic processed according to the invention become.

101 201

contraption

102 202

substratum

103 203

substrate stack

104 204

support means

105 205

feed direction

206

drilling

107 207

removal device

108 208

grab

209

handling device

110 210

arrow

211

arrow

112 212

arrow

113 213

transport means

114 214

conveyor belt

115 215

axis

116 216

arrow

117 217

flow device

118 218

flow nozzles

119 219

gap

220

Position detection device

221

Further handling device

122 222

presser

123 223

pressing pins

224

sensor element

225

joint

226

arrow

227

free The End

228

other free end

229

proximity switch

230

arrow

α α

tilt angle

Claims (17)

Device for separating and transporting disc-shaped substrates, wherein the device essentially comprises the following components: a carrier device arranged inside a liquid medium ( 104 ; 204 ), in which the individual substrates ( 102 ; 202 ) sequentially one behind the other in a feed direction ( 105 ; 205 ) in the form of a substrate stack ( 103 ; 203 ), - a withdrawal device ( 107 ; 207 ) for separating and transporting at least one substrate ( 102 ; 202 ), the removal device ( 107 ; 207 ) a gripper ( 108 ; 208 ) with means by which the substrate ( 102 ; 202 ) and from the carrier device ( 104 ; 204 ) can be carried away, - a flow device ( 117 ; 217 ) for fanning at least a part of the substrate stack ( 103 ; 203 ), and - a pressure element ( 122 ; 222 ), which corresponds to the fanned-out substrates ( 102 ; 202 ) counteracts. Apparatus according to claim 1, characterized in that the pressure element ( 122 ; 222 ) several pressure pins ( 123 ; 223 ), which against the surface of the substrate to be separated ( 102 ; 202 ) to press. Device according to claim 1 or 2, characterized in that a position determining device ( 220 ) for detecting the position and / or position of at least the substrate to be separated ( 202 ) is provided. Device according to claim 1, characterized in that the gripper ( 108 ; 208 ) is designed such that the removal of the substrate to be separated ( 102 ; 202 ) transversely or at least approximately perpendicular to the feed direction ( 105 ; 205 ) he follows. Apparatus according to claim 4, characterized in that the removal parallel to the planar formation of the substrate to be separated ( 102 ; 202 ) he follows. Device according to claim 1 or 4, characterized in that the gripper ( 108 ; 208 ) Has openings through which fluid can be sucked or dispensed. Device according to claim 1 or claim 4, characterized in that the gripper ( 108 ; 208 ) in plan view bar-shaped, O-shaped, U-shaped, V-shaped or areally configured. Device according to Claim 1, characterized in that the support device ( 104 ; 204 ) Has means by which the substrates to be isolated ( 102 ; 102 ) are alignable along an inclination angle α. Apparatus according to claim 8, characterized in that the inclination angle α is selected such that between the feed direction ( 105 ; 205 ) and surface normals of the substrate surface of the individual substrates pointing in the direction of advance ( 102 ; 202 ) angle is positive, which is equivalent to an inclination of the substrates to the rear. Device according to Claim 1, characterized in that the support device ( 104 ; 204 ) is displaceable in at least one direction. Apparatus according to claim 10, characterized in that the carrier device ( 104 ; 204 ) and / or the substrate stack ( 103 ; 203 ) against the pressure element ( 122 ; 222 ) is displaceable or are. Apparatus according to claim 10, characterized in that the carrier device ( 204 ) and / or the substrate stack ( 203 ) against the orientation device ( 220 ) is displaceable or are. Device according to one of the preceding claims, characterized in that it further comprises an over the substrate stack ( 103 ; 203 ) with the substrates to be separated ( 102 ; 202 ) arranged transport device ( 113 ; 213 ). Device according to Claim 3, characterized in that the position-determining device ( 220 ) a sensor ( 222 ) for testing the installation of a substrate ( 202 ). Apparatus according to claim 2, characterized in that the pressure element ( 122 ; 222 ) is arranged such that the gripper ( 108 ; 208 ) between its pressure pins ( 123 ; 223 ) is positionable. Method for fanning, singulating and transporting disc-shaped substrates using a device which essentially comprises the following components: a carrier device arranged inside a liquid medium ( 104 ; 204 ), in which the individual substrates ( 102 ; 202 ) sequentially one behind the other in a feed direction ( 105 ; 205 ) in the form of a substrate stack ( 103 ; 203 ), - a withdrawal device ( 107 ; 207 ) for separating and transporting at least one substrate ( 102 ; 202 ), the removal device ( 107 ; 207 ) a gripper ( 108 ; 208 ) with means by which the substrate ( 102 ; 202 ) and from the carrier device ( 104 ; 204 ) can be carried away, - a flow device ( 117 ; 217 ) to the Auffä at least part of the substrate stack ( 103 ; 203 ), and - a pressure element ( 122 ; 222 ), which corresponds to the fanned-out substrates ( 102 ; 202 ) counteracts; the method comprising the steps of: a. Method of carrier device ( 104 ; 204 ) together with the substrate stack ( 103 ; 203 ) or the substrate stack ( 103 ; 203 ) in the feed direction ( 105 ; 205 ) against the pressure element ( 123 ; 223 ) for reaching a removal position for the substrate to be separated ( 102 ; 202 b. Fanning at least a portion of the substrate stack ( 103 ; 203 ) by a flow device ( 117 ; 217 ) such that spaces ( 119 ; 219 ) arise; c. Separating the substrate by - positioning the gripper ( 108 ; 208 ) almost parallel to the planar formation of the substrate ( 102 ; 202 ), - production of a bonding contact between substrate ( 102 ; 202 ) and grippers ( 108 ; 208 ), and - removing the substrate ( 102 ; 202 ) within the liquid medium transverse to the feed direction ( 105 ; 205 ) or parallel to the planar formation of the substrates ( 102 ; 202 ). Method according to claim 16, characterized in that within the substrate stack ( 103 ; 203 ) by fanning by means of the flow device ( 117 ; 217 ) Spaces ( 119 ; 219 ) are formed, and by the liquid flow of the flow device ( 117 ; 217 ) in the spaces ( 119 ; 219 ), Which have a damping effect when starting the gripper ( 108 ; 208 ) on the substrate to be separated ( 102 ; 202 ) produce.