TW200842014A - Apparatus and method for separating and transporting substrates - Google Patents

Apparatus and method for separating and transporting substrates Download PDF

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Publication number
TW200842014A
TW200842014A TW096148137A TW96148137A TW200842014A TW 200842014 A TW200842014 A TW 200842014A TW 096148137 A TW096148137 A TW 096148137A TW 96148137 A TW96148137 A TW 96148137A TW 200842014 A TW200842014 A TW 200842014A
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TW
Taiwan
Prior art keywords
substrate
gripper
stack
isolated
fluid
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TW096148137A
Other languages
Chinese (zh)
Inventor
Richard Herter
Konrad Kaltenbach
Original Assignee
Rena Sondermaschinen Gmbh
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Application filed by Rena Sondermaschinen Gmbh filed Critical Rena Sondermaschinen Gmbh
Publication of TW200842014A publication Critical patent/TW200842014A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)

Abstract

The invention relates in particular to the separation and transportation of a disc shaped substrate (102; 202) such as e.g. a solar wafer. The invention is characterized by the fact that separations take place within a fluid, and that adhesion forces resulting from a thin fluid film develop between a gripper (108; 208) and the substrate to be separated (102; 202) that enable adherance to the gripper (108; 208). Through unloading perpendicular to the feed direction (105; 205) or particularly in parallel to the planar design of the substrates (102; 202), a very gentle and efficient separation of disc shaped substrates (102; 202) is possible with a short cycle time.

Description

200842014 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種用於隔離 進 體為片狀…。為進行隔離,==置:該等基 備用於接_成為基體堆疊 /亥承載设 仃&離。取料設備實施隔離及搬運過程。 好 之 ^外’本發明係關於-種_及㈣ 基體的方法。 土版算®抚供 【先前技術】 "基體"為片狀或板狀,且通常呈矩形。經受鑛 自基體塊獲得該等基體〇該等 " 絡甘山 販/、頁大體平直之連續邊 緣、、中’拐角可為矩形、圓形或斜面形。 、 基體堆璺”界定上下堆疊或者 其_ . 飞者亚排或刚後排列之複數個 2。根據本發明’其中基體表面為水平之堆疊稱為上下 平放之基體的"平放式"堆疊;若基體表面為垂直的,則此 X於並排s立之基體的"&立式”堆疊。個別基體已自鋸 切過程所需之固持構件分離,且可自由且彼此獨立地進行 堆® H個別基體通常會由於U之雜切過程而益音 地相互黏附至其表面。為進行進—步處理,通常有必^ 離此等如此堆疊之基體。此意謂應藉由—裝置自基體料 移除提供於g直定位之基體堆疊之末端的基體,並將其ς 移至進一步之處理過程。 —基體於基體堆疊内之"堆疊方向"由待隔離基體之位置確 定。個別基體經定向使得其大體賢立,其表面彼此田比連。 I27488.doc 200842014 在基體表面精確且完全錢地定向之特殊情況下,堆 =與基體表面法線之方向完全對應,纟中,正向指向ς自 下待隔離之下-基體的堆疊的該末端。若此基體定位 於排列於承载設備内之"暨立式"基體堆疊的右側,則堆最 方向因此在箭頭方向中指向右侧。 ’ 堆疊之"饋送方向"大體對應於堆疊方向。200842014 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a sheet for isolating the body into a sheet. For isolation, == set: these bases are used to connect to _ become the base stack / hai set 仃 & The reclaiming equipment implements the isolation and handling process. The invention is a method of the invention relating to the species _ and (iv) substrates. Home Edition® Cares [Prior Art] "Bases" are sheet or plate and are usually rectangular. The ore is obtained from the base block, and the "corner" is a rectangular, circular or beveled shape. "Basic stacking" defines the upper and lower stacking or its _. The flying sub-row or the rear of the plurality 2. According to the invention, the stack in which the surface of the substrate is horizontal is called the flat-bottomed flat of the upper and lower flats. Stacking; if the surface of the substrate is vertical, this X is stacked in a "" vertical stack of the substrates side by side. The individual substrates have been separated from the holding members required for the sawing process and are freely and independently of each other. H Individual substrates are usually adhered to their surfaces due to the U-cut process. For the further processing, it is usually necessary to separate the substrates thus stacked. This means that the substrate provided at the end of the g-aligned substrate stack should be removed from the substrate by means of a device and transferred to further processing. - The "stacking direction" of the substrate in the stack of substrates is determined by the position of the substrate to be isolated. Individual substrates are oriented such that they are generally sturdy and their surfaces are connected to each other. I27488.doc 200842014 In the special case where the surface of the substrate is precisely and completely oriented, the stack = exactly corresponds to the direction of the normal to the surface of the substrate, in the middle, the forward direction is the bottom to be isolated - the end of the stack of the substrate . If the substrate is positioned to the right of the "cum vertical" substrate stack arranged in the carrier, the stack direction is therefore directed to the right in the direction of the arrow. 'Stacked "feed direction" generally corresponds to the stacking direction.

"堆疊起始端”表示下一待隔離基體所處之基體堆疊末 端=即指向饋送方向之末端。然、而,若其統稱為,ς疊 末端,則此不能闡明意謂堆疊起始端還是堆疊之相 端。 大體垂直或豎直定位之基體堆疊提供於,,承載設備"中, 其中,每一基體之一邊緣支撐於承載設備上。在(例如)鋸 切及/或移除粘結劑(通常用於將未經鋸切之初始基體固定 於固持板上)之後,承載設備揀取基體堆疊,並將其搬運 至取料設備,隔離將於該取料設備處進行。承載設備較佳 經設計使得其接納作為整體之基體堆疊,亦即,個別基體 彼此毗連地或前後地大體豎立。 必要時,承載設備可允許或迫使彼此毗連地接觸之基體 自原始堆疊方向成一定傾斜,從而產生基體相對於原始堆 疊方向之建設性的預定"傾角”,在本發明之上下文中,該 傾角稱為α。此角為基體表面法線與饋送方向之夾角,其 中,選擇更多地指向饋送方向之基體表面之表面法線,以 便可產生介於-90。與+90。之間的傾角。正角指示基體向後 傾斜(與饋送方向相反);負角指示基體向前傾斜(在饋送方 127488.doc 200842014 向上)。較佳傾角之範圍為+5。至+35。;尤其較佳之傾角 圍為+15。至+20。"Stacking start end" means the end of the substrate stack where the next substrate to be isolated is located = that is, the end pointing to the feeding direction. However, if they are collectively referred to as the end of the stacking, this cannot be said to mean that the stacking start or stacking A substantially vertical or vertically positioned substrate stack is provided in the carrier device, wherein one of the edges of each substrate is supported on the carrier device, for example, sawing and/or removing the bond. After the agent (usually used to fix the uncut initial substrate to the holding plate), the carrying device picks up the substrate stack and transports it to the picking device, and the isolation will be carried out at the picking device. The preferred design is such that the individual substrates are stacked as a unitary body, that is, the individual substrates are generally erected adjacent to each other or to the front and rear. If necessary, the carrier device can allow or force the substrates that are in adjoining contact with each other to be inclined from the original stacking direction, thereby A constructive predetermined "inclination angle" of the matrix relative to the original stacking direction is produced, which in the context of the present invention is referred to as alpha. This angle is the angle between the normal to the surface of the substrate and the feed direction, wherein the surface normal to the surface of the substrate in the feed direction is selected to be more than -90. With +90. The angle of inclination between. A positive angle indicates that the base is tilted backwards (opposite to the feed direction); a negative angle indicates that the base is tilted forward (on feed side 127488.doc 200842014 up). The preferred angle of inclination is +5. To +35. Especially preferred is an angle of +15. To +20.

〜根據本發明,”黏著力”意謂作用於兩個表面之間且因此 等兩個表面彼此靠近而產生的力。由於本發明所述之黏著 力產生於流體内’ 0而有必要減小兩個表面之間的液體體 積’―般而言,此可藉由移位及/或抽吸而實現。為能達 到本發明之對基體進行儘可能柔和處置之目的,只需將該 體積減小至該等表面之間剩下—流體膜或液體膜之程度。 "取料設備"用於隔離基體並將基體運離基體堆疊。此 處,取料設備揀取位於基體堆疊之一末端之基體(例如, 使用抽吸設備),使基體自堆疊分離且因此隔離,並將該 基體饋达至隨後的處理或搬運過程。取料設備用於使待 隔離基體自I體堆疊脫位,藉此可於多個丨向上實現"取 料”。一方面,可於堆疊方向上進行取料,亦即,取料設 備揀取待隔離基體,並在堆疊方向上且平行於隨後基體之 平面形狀拉開該基體,以使得在待隔離基體與隨後基體之 間歸因於現有黏著力而產生張力或壓縮力。另一方面,可 藉由相對於隨後基體之移位而移除該基體,以使得在兩個 基體之間僅產生剪力。在此情況下,在基體平面延伸之方 向上,較佳大致垂直於承載設備平面而向上移動或移除待 隔離基體。 視取料方向而定,具有不同量值之不同力作用於待隔離 基體及仍位於堆疊内之基體,藉此,此等力尤其作用於在 正被取下之基體後面的基體上。 127488.doc 200842014 為隔離基體堆疊,需將堆疊與承載設備—起配置於流體 中,此處之流體應理解為意謂i要為液態之介質。流:内 提供有”通流設備”’其可使流體分別自侧面及/或自下方或 上方流過基體堆疊。此以如下方式進行:達成_流動,該 流動指向基體堆疊並使個別基體”散開”,且使該等基體彼 此間保持一定間距。此意謂在個別基體之間產生了填充有 流體的間隙。 根據較佳實施例’可用其他合適構件支持此散開,例如 特定地定位於散開區内之超音波換能器。在彼此接觸之基 體之間的黏著力足夠強使得流體原本僅能以極慢之速度進 入該等基體之間的情況下,此實施例特別有利。 位置偵測设備"用於偵測待隔離基體及/或基體堆疊之位 置。右具有感應器之適當配置之電子設備接收到等效於待 取下之基體排列於恰當位置之信號,則啟動取料設備之操 作以進行隔離。^待隔離基體未以恰t位置抵靠位置侦測 設備,則產生不同信號且必須對其進行相應地解釋。此 外,位置債測設備亦可用於藉由使用合適限制條件(例 如,成何學限制條件)使待隔離基體移動至所要位置(此對 於發出用於取料設備之信號係必須的)及/或將基體固持於 該所要位置。 μιη至 在已知的基體製備方法(例如,用於製備太陽能晶圓或 半導體晶圓的方法)中之一者中,使用矽塊或矽柱(本文中 稱之為基體塊),將其鋸切成易碎的薄晶圓(本文中稱之為 基體)。以此方式製成之基體的典型厚度介於約 127488.doc 200842014 3 00 μηι之間,且通常為正方形或矩形形狀。較佳地,其既 而各自具有不大於21〇 mm之邊長。 為進行鋸切,通常將基體塊膠接於固持構件上。此固持 構件通常由金屬載體構成,該金屬載體上安裝有用作中間 載體之玻璃板,藉此將待處理之基體塊膠接於該玻璃板 上。作為替代方案且根據先前技術,亦可用其他材料建構 該固持構件。- According to the present invention, "adhesion" means a force acting between two surfaces and thus waiting for the two surfaces to approach each other. Since the adhesive force of the present invention is generated in the fluid '0' it is necessary to reduce the liquid volume between the two surfaces', as this can be achieved by displacement and/or suction. In order to achieve the gentlest treatment of the substrate of the present invention, it is only necessary to reduce the volume to the extent that there is a fluid film or a liquid film between the surfaces. "Reclaiming Equipment" is used to isolate the substrate and transport the substrate away from the substrate stack. Here, the take-up device picks up the substrate at one end of the stack of substrates (e. g., using a suction device), separating the substrate from the stack and thus isolating it, and feeding the substrate to a subsequent processing or handling process. The reclaiming device is used for dislocating the substrate to be isolated from the I-stack, thereby achieving "reclaiming" in a plurality of crucibles. On the one hand, the reclaiming can be performed in the stacking direction, that is, the reclaiming device picks up The substrate is to be isolated and the substrate is pulled apart in the stacking direction and parallel to the planar shape of the subsequent substrate such that tension or compressive forces are generated between the substrate to be separated and the subsequent substrate due to the existing adhesion. The substrate can be removed by displacement relative to the subsequent substrate such that only shear forces are generated between the two substrates. In this case, preferably in a direction in which the plane of the substrate extends, substantially perpendicular to the plane of the carrier device Moving up or removing the substrate to be isolated. Depending on the direction of the take-up, different forces having different magnitudes act on the substrate to be isolated and the substrate still in the stack, whereby these forces act especially on the being taken On the substrate behind the substrate. 127488.doc 200842014 For the isolation of the substrate stack, the stack and the carrying device should be placed in the fluid. The fluid here should be understood to mean the medium to be liquid. Flow: provided with a "flow-through device" which allows the fluid to flow through the substrate stack from the side and/or from below or above, respectively. This is done in the following way: to achieve a flow, which is directed to the substrate stack and to the individual substrate. Dispersing" and maintaining the substrates at a certain distance from each other. This means that a fluid-filled gap is created between the individual substrates. According to a preferred embodiment, other suitable members can be used to support this spreading, for example specifically to spread out. Ultrasonic transducers in the region. This embodiment is particularly advantageous where the adhesion between the substrates in contact with each other is strong enough that the fluid can only enter between the substrates at a very slow rate. The device " is used to detect the position of the substrate to be isolated and/or the stack of the substrate. The electronic device with the appropriate configuration of the sensor on the right receives the signal equivalent to the substrate to be removed arranged in the proper position, then starts the reclaiming The operation of the device for isolation. ^ The isolation substrate does not abut the position detection device at the exact position, and a different signal is generated and must be interpreted accordingly. The location debt measuring device can also be used to move the substrate to be isolated to a desired location (which is necessary for signaling signals for the fetching device) and/or by using suitable constraints (eg, constraints) The substrate is held at the desired position. In one of the known substrate preparation methods (for example, a method for preparing a solar wafer or a semiconductor wafer), a crucible or a crucible is used (referred to herein as The base block) is sawn into a fragile thin wafer (referred to herein as a substrate). The typical thickness of the substrate produced in this manner is between about 127488.doc 200842014 3 00 μηι, and usually Preferably, they each have a side length of no more than 21 〇 mm. For sawing, the base block is usually glued to the holding member. The holding member is usually composed of a metal carrier, the metal carrier A glass plate serving as an intermediate carrier is mounted thereon, whereby the base block to be treated is glued to the glass plate. As an alternative and according to the prior art, the holding member can also be constructed from other materials.

為製造上述基體,須將基體塊完全鋸成片狀,因此,鋸 痕自身會超出基體塊而延伸至玻璃板内。在鋸切之後,如 此製成之基體的一邊緣仍藉由黏接連接而黏附至玻璃板。 基體塊完全被隔離成個別基體後,形成梳子狀物件。 自固持構件分離此時已具有片&幾何形狀之個別基體之 前’通常會進行預清潔。 為實施鋸切過程,需要介質,該介質主要包含乙二醇及 (若有必要)其他化學添加劑以及隔離劑(例如,碳化矽顆 粒)。此介質稱為”漿體”,且用於實施鋸切過程。正常情況 下,總有一定量的漿體殘留於個別經鋸切之基體之間。在 取壞情況了’在處理期間或處理之後,漿體會變為糊狀, 口為其會與來自基體塊之⑦微粒、鋸切過程所用之鑛線的 磨粒及隔離劑混合,或者因為該混合物之某些組分彼此發 生反應。由於其稠度,漿體黏附至晶圓之表面。儘管基體 塊鑛切之後正常情況下均會進行預清潔,但多數情況下基 體之間仍會發現該混合物的殘餘。 狀基體之方法及設 WO 01/28745 A1中揭示用於分離片 127488.doc 200842014 備’其中’隔離於乾燥環境中(亦即於液槽外部)進行。只 需藉由噴嘴即可將基體潤濕,器人設備藉由抽吸設備 減待分離基體(例如,藉由真Μ线產生氣體真空), 藉此藉由該設備之振盈式移動使基體自固持構件分離。可 於不同方向上進行振i式移動。借助於配置於基體表面上 方且固定至該設備之抽吸設備來抓持待隔離基體。為釋放 基體,須於抽吸設備内部產生特定之氣體過壓,以便自該 設備再度移除已分離之基體。 DE 199 00 671 A1中揭示用於分離片狀基體(諸如,特定 言之’晶圓)之方法及設備。提議藉由精確定向之流體射 流使鑛切過程之後仍彼此黏附且其—側(邊緣)仍固定至固 持構件之基體彼此保持-定距離。楔料備用於使待分離 基體自固持構件隔離。同時’藉由具有抽吸構件之抓臂式 設備自固持構件移除已隔離之基體。 〇71 T2中揭示一種用於將藉由鑛切基體塊而 獲得的晶圓置放於儲存元件之裝置。提議—種處置設備, 其允許抓持橫截面呈圓形或方形之基體,並將其轉移至支 架式物件中。在此過程中,同時揀取若干基體,並將其轉 移至用於收納已隔離基體之置放區。 DE 199 04 834 A1中揭示-種用於分離單個的^碎之薄 片狀基體的裝置。具有已經鋸切之基體的基體塊位於填充 有流體之儲槽内9與先前技術相比,固持構件與仍固定至 固持構件之基體—起垂直配置,從而使待隔離基體平行於 流體表面而配置,形設備使得待分離基體與玻璃板隔 127488.doc 11 200842014 離。配置於基體附近之傳送帶用於搬運已分離之漂浮夷 體。推進設備確保固持構件總處於相同位置,並抵^横^ 設備而水平移動以分離各別基體。傳送帶之另一側提供有 一設備,該設備用於將已隔離之基體自動插入支架内。分 離之目的在於自固持構件移除基體之後對彼此隔離之片狀 基體進行堆疊,並將其插人預定設備㈣將上下直接贼連 地置放。 EP 〇 762 483 A1亦揭示-種裝置,其能夠對平面基體進 行隔離。已經隔離之基體提供於承載設備内,且其暫時以 其平面而彼此接觸。為對基體進行隔離並將其轉移至容器 内,使用推進器(且必要時亦借助於滾筒及/或流體射流)將 基體運離堆疊,其中,基體必須處於水平位置(亦即平放 位置)。根據先前所述,基體由此以上下平放之”平放式"美 體堆疊之形式而排列。作為替代方案,此文獻揭示藉由使 用抽吸式抓持器之隔離,該抽吸式抓持器必須於整個抓持 及搬運過程中均供以氣體真空,並與基體直接接觸,亦 即,在抓持器與基體表面之間不存在保護性流體膜。 然而,根據此項技術之儘可能柔和的各別基體隔離很難 實現,且具有一系列缺點。 若需要放棄手動操作,則必須藉由移動來實現隔離,但 該等移動需要複雜設備。然而,由於基體係極其易碎之薄 板狀基體,因而此等基體不可藉由常用之抓持器式系統來 直接揀取。為此’須提供極其精確及靈敏之設備。 因此,先前技術揭示之設備大體都借助於抽吸設備抓持 127488.doc -12- 200842014 各別基體。在抽吸設備移動至待隔離基體之平面之後,立 即藉由真空泵於抽吸設備與待隔離基體之間產生氣體真 空,以便使基體有可能附著至處置設備。然而,此處須謹 慎操作’因為待隔離基體會由於低壓過高而破裂。 與此等必須於兩個表面之間調整成至少為i mbar之真空 或低壓之方法相比,本發明之黏著力在保持流體膜或液體 膜之情況下係由低壓實現,該低壓遠弱於真空,且介於In order to manufacture the above-mentioned substrate, the base block must be completely sawn into a sheet shape, so that the saw itself extends beyond the base block into the glass sheet. After sawing, an edge of the substrate thus produced is still adhered to the glass sheet by adhesive bonding. After the base block is completely isolated into individual substrates, a comb-like member is formed. The pre-cleaning of the self-sustaining member prior to the separation of the individual substrates of the sheet & geometry is now typically performed. In order to carry out the sawing process, a medium is required which mainly comprises ethylene glycol and, if necessary, other chemical additives as well as release agents (for example, niobium carbide particles). This medium is referred to as a "slurry" and is used to carry out the sawing process. Under normal conditions, there is always a certain amount of slurry remaining between individual sawn substrates. In the case of damage, 'the slurry will become a paste during or after the treatment, and the mouth will mix with the particles from the base block, the abrasive grains and the release agent used in the sawing process, or because Certain components of the mixture react with each other. Due to its consistency, the slurry adheres to the surface of the wafer. Although the base block is normally pre-cleaned after cutting, in most cases the residue of the mixture is still found between the substrates. The method and apparatus for forming a substrate are disclosed in WO 01/28745 A1 for use in separating sheets 127488.doc 200842014 in which the 'separation' is carried out in a dry environment (i.e., outside the tank). The substrate can be wetted by the nozzle only, and the human device reduces the separation substrate by the suction device (for example, generating a gas vacuum by the true twist line), whereby the substrate is self-propelled by the vibration movement of the device. The holding members are separated. The vibrating movement can be performed in different directions. The substrate to be isolated is gripped by means of a suction device arranged above the surface of the substrate and fixed to the device. To release the substrate, a specific gas overpressure must be created inside the suction device to remove the separated substrate from the device again. A method and apparatus for separating a sheet-like substrate, such as a particular wafer, is disclosed in DE 199 00 671 A1. It is proposed that the precisely oriented fluid jets will still adhere to each other after the metallizing process and that the sides of the retaining members are still held at a distance from each other. The wedge material is prepared to isolate the substrate to be separated from the holding member. At the same time, the isolated substrate is removed from the holding member by the gripping arm device having the suction member. A device for placing a wafer obtained by ore cutting a bulk block on a storage element is disclosed in 〇71 T2. A disposal apparatus is proposed which allows gripping a base having a circular or square cross section and transferring it to the support article. During this process, several substrates are picked at the same time and transferred to the placement area for housing the isolated substrate. A device for separating individual, thin, sheet-like substrates is disclosed in DE 199 04 834 A1. The base block with the already sawed base is located in the fluid-filled reservoir 9 compared to the prior art, the retaining member is vertically disposed with the base still fixed to the retaining member, thereby arranging the substrate to be separated parallel to the fluid surface The shaped device separates the substrate to be separated from the glass plate by 127488.doc 11 200842014. A conveyor belt disposed near the substrate is used to carry the separated floats. The propulsion device ensures that the holding members are always in the same position and are horizontally moved to separate the respective substrates. The other side of the conveyor belt is provided with a device for automatically inserting the isolated substrate into the holder. The purpose of the separation is to stack the sheet-like substrates that are isolated from each other after the substrate is removed from the holding member, and insert it into the predetermined device (4) to place the upper and lower thieves. EP 762 762 483 A1 also discloses a device which is capable of isolating a planar substrate. The isolated substrates are provided in the carrying device and they are temporarily in contact with each other in their planes. In order to isolate the substrate and transfer it into the container, the substrate is transported away from the stack using a pusher (and, if necessary, by means of a roller and/or a fluid jet), wherein the substrate must be in a horizontal position (ie in a flat position) . According to the foregoing, the substrate is arranged in the form of a "flat-flat" body stack placed above and below. As an alternative, this document discloses the suction grip by using a suction gripper. The device must be supplied with a gas vacuum throughout the handling and handling process and in direct contact with the substrate, ie, there is no protective fluid film between the gripper and the surface of the substrate. However, as far as possible in accordance with this technique Soft individual substrate isolation is difficult to achieve and has a number of disadvantages. If manual operation is required, isolation must be achieved by moving, but such movement requires complex equipment. However, due to the extremely fragile thin plate of the base system The matrix, and thus such substrates, cannot be picked directly by the usual gripper system. To this end, an extremely precise and sensitive device must be provided. Therefore, the apparatus disclosed in the prior art generally uses a suction device to hold 127488. .doc -12- 200842014 Individual substrates. Immediately after the suction device has moved to the plane of the substrate to be isolated, the vacuum pump is used to pump the device to the substrate to be isolated. A gas vacuum is created to make it possible for the substrate to adhere to the disposal equipment. However, care must be taken here because the substrate to be isolated will break due to excessively high pressure. It must be adjusted between at least i mbar between the two surfaces. Compared with the vacuum or low pressure method, the adhesive force of the present invention is achieved by a low pressure while maintaining a fluid film or a liquid film, which is much weaker than vacuum and is

〇·3 bar與0.5 bar之間,且較佳為約〇·4 bar 〇 在此過程中,另一關鍵點由於以下事實而產生··必須靠 近各別基體,亦即處置設備必須接觸各別基體。由於基體 在任何情況下不得被設備推開,因而須進行精確定位^然 而,此係困難的,其原因一方面在於,因為提供了固持構 件之相對移動以將待隔離基體定位於固持構件區域内,因 此為固持構件自身提供了相應之自由纟。因此,有可能產 生可能會使待隔離基體受損之公差。另一方面,此等;;動 通常於流體内進行,因而基體經受因為設備之個別移㈣ 起的尤其朝著基體方向之流動壓力而發生脫位或甚至破裂 狀基體 手動實施之隔離的危險性在於,極其易碎之薄片 尤其會在黏著力增大之情況下破裂。 【發明内容】 本發明之目的在於提供一種設備及方 近乎無損傷之情況下移除薄的易碎之堆疊基體。件能夠在 本發明之基本思想為提供一種具有以 地 特陵之承載設備 127488.doc •13- 200842014 位有*有在㈣方向上前後依次排列之基體的基 一且)及取料设備:取料設備自基體背離基體堆疊之表 、卜幻於基體堆璺之堆疊起始端的各別基體,使該基 體自下基體輕微移開,且隨後平行於該基體之平面導引 “基體使其遂離基體堆疊且進而遠離承載設備。在此過程 土本之處在於,噴嘴所產生之流流過配置於流體内之 』堆疊,藉此使尤其配置於基體堆疊之自由端之基體彼 二持疋距離。以此方式,可避免基體彼此黏附。與 /同日二此流亦於個別基體間形成流體減震墊,從而減震 政應在罪近取料設備期間作用於待隔離基體,且可避免個 =基體破裂。取料設備之抓臂以如下方式來藉由抓持器抓 '待㈣基體:抓持器與基體之間存在的流體在很大程产 ^被提供^爪持器内之鑽孔或穿孔吸走及/或由於抓“ /、一體之罪近而被擠出’從而在形成足夠小的間隙時產生 二著力该等黏著力在無進一步抽吸及/或擠廢之情況下 得:保持,從而抓持器引起作用於基體上之平面黏著力。 因此,該任務之解決方案在於提供一種如請求項丨之裝 置及/或一種如請求項16之方法。 、本I月之-基本優點在於可在基體不發生破裂之情況下 於决速進行之循環内完全^自動地隔離基體。 該解决方案之基本思想為:藉由通流設備使大體垂直於 f送方向對準、但以一角度輕微傾斜的基體在基體堆疊内 散開。較佳地’流體喷嘴所產生之流通過前五個至前十個 基體之間’從而使個別基體間保持一定距離,並於個別基 127488.doc -14- 200842014 體間形成所謂的流體減震墊。若一力與堆疊方向或饋送方 向相反地作用於基體,則在根據本發明之方法的過程中, 將不會進一步壓縮個別基體;實情為,基體之整個表面上 將產生反作用力,該反作用力於一定限度内仍允許尤其定 • 位於堆璺起始端之基體的剩餘移動性。將此反作用力與該 • 剩餘移動性加以結合利用,以使取料設備之抓持器能夠推 壓待隔離基體。若沒有借助於位於散開的基體間之流體減 _ 震墊而實現的間接減震,則基體極有可能發生破裂。 關於丑立式堆璺,抓持器較佳自上方(亦即平行於各別 基體之縱向延伸,且因此大致垂直於堆疊方向)插入,且 Ik後再導引至待隔離基體。根據較佳實施例,較佳存在於 抓持裔中之鑽孔或穿孔用於自抓持器與待隔離基體之間的 ^間吸出流體。為此目# ’須主動施加低壓,該低壓可於 =置内部或外部藉由動態法(例如,泵)、靜態法(低壓箱) 或’、他方法而產t。若抓持器與基體最終直接接觸,從而 • 抓持裔與基體之間僅存在一極薄之流體膜(幾奈米至50微 米)’則狹窄之間隙内會產生黏著力,自此,此允許基體 , 1抓持器之自動黏附或黏著。無需再主動保持低壓。 根據替代μ施例,亦可藉由表面之彼此靠近而擠出表 ’ ^間的流體來實現所要黏著力,其中,本發明亦可設想 此等實施例之組合。 抑此等黏著力顯著大於至後續基體之黏著力,因此,抓持 平行於後續基體之表面方向實現待隔離基體之取料。 在此過私中,至多僅較小剪力作用於待隔離基體,藉此可 127488.doc 15 200842014〇·3 bar and 0.5 bar, and preferably about 〇·4 bar 〇 In this process, another key point arises from the fact that it must be close to the respective substrate, that is, the disposal equipment must be in contact with each other. Matrix. Since the substrate must not be pushed away by the device under any circumstances, precise positioning is required. However, this is difficult because, on the one hand, the relative movement of the holding member is provided to position the substrate to be isolated in the region of the holding member. Therefore, the holding member itself is provided with a corresponding freedom. Therefore, it is possible to create tolerances that may damage the substrate to be isolated. On the other hand, the movements are usually carried out in the fluid, so that the risk of the matrix being subjected to dislocation due to the flow pressure in the direction of the substrate, in particular, due to the individual movement of the device (4), or even the manual implementation of the fracture-like substrate, lies in Extremely fragile sheets, in particular, rupture with increased adhesion. SUMMARY OF THE INVENTION It is an object of the present invention to provide a device and a thin, frangible stack substrate that is removed without damage. The basic idea of the present invention is to provide a base unit having a base body that is arranged in the direction of (4) in the direction of (4), and a reclaiming device: The reclaiming device is directed away from the substrate stack, the individual substrates of the stacking start end of the substrate stack, the substrate is slightly removed from the lower substrate, and then the substrate is guided parallel to the plane of the substrate. The substrate is stacked from the substrate and further away from the carrier device. The process is based on the fact that the flow generated by the nozzle flows through the stack disposed in the fluid, thereby allowing the substrate, especially disposed at the free end of the substrate stack, to疋 distance. In this way, the bases can be prevented from sticking to each other. On the same day, the flow also forms a fluid cushion between the individual substrates, so that the shock absorbing should act on the substrate to be isolated during the sinning reclaiming device, and Avoid the rupture of the base. The gripping arm of the reclaiming device is grasped by the gripper in the following manner: (4) The base body: the fluid existing between the gripper and the base body is provided in a large distance. It The holes or perforations are sucked away and/or squeezed out due to the grasp of "/, the sin of one body" to produce a second force when forming a sufficiently small gap, without any further suction and/or squeezing Get: Keep, so that the gripper causes a plane adhesion on the substrate. Therefore, the solution to this task is to provide a device such as a request item and/or a method such as claim 16. The basic advantage of this I month is that the substrate can be completely and automatically separated in the cycle of the speed determination without breaking the substrate. The basic idea of this solution is that the substrate, which is aligned substantially perpendicular to the f-feed direction but slightly inclined at an angle, is spread out in the substrate stack by the flow-through device. Preferably, the flow generated by the fluid nozzle passes between the first five to the first ten substrates, thereby maintaining a certain distance between the individual substrates, and forming a so-called fluid damping between the individual bodies 127488.doc -14-200842014 pad. If a force acts on the substrate opposite to the stacking direction or the feeding direction, the individual substrates will not be further compressed during the process according to the invention; in fact, a reaction force will be generated on the entire surface of the substrate, the reaction force Within certain limits, it is still possible to determine, in particular, the residual mobility of the substrate at the beginning of the stack. This reaction force is combined with the • residual mobility to enable the gripper of the reclaiming device to push the substrate to be isolated. If there is no indirect shock absorption by means of a fluid damping pad located between the diffused substrates, the substrate is highly susceptible to cracking. With regard to the ugly vertical stacking, the grippers are preferably inserted from above (i.e., extending parallel to the longitudinal direction of the respective substrates, and thus substantially perpendicular to the stacking direction), and Ik is then guided to the substrate to be isolated. According to a preferred embodiment, the bore or perforation preferably present in the gripper is used to draw fluid between the gripper and the substrate to be isolated. To this end, the target must be actively applied with a low pressure, which can be generated internally or externally by a dynamic method (for example, a pump), a static method (low pressure tank) or a method of production. If the gripper is in direct contact with the substrate, so that there is only a very thin fluid film (a few nanometers to 50 micrometers) between the grasper and the substrate, then the adhesion will occur in the narrow gap. Since then, this Allow the substrate, 1 gripper to automatically adhere or stick. No need to actively maintain low pressure. According to an alternative embodiment, the desired adhesion can also be achieved by extruding the fluid between the surfaces of the surfaces, wherein a combination of such embodiments is also contemplated by the present invention. Therefore, the adhesion is significantly greater than the adhesion to the subsequent substrate. Therefore, the grasping is parallel to the surface direction of the subsequent substrate to realize the material to be separated. In this private, at most only a small shear force acts on the substrate to be isolated, thereby 127488.doc 15 200842014

大幅減小破裂率。可避免張力或壓縮力。給定足夠大之表 觸黏著力大於臨時低壓所產生之力。有可能自基體 =疊進行高頻地取料。此外,尤其#基體位於圍繞基二堆 =之抓體的外部時,即使未主動施加低壓,該等黏著力之 量值=視抓持器之幾何設計及基體重量而允許基體黏附至 ^持A A處須對抓持器表面内之鑽孔直徑及數量、抓持 器表面之尺寸以及抽出流體所需之低壓及抽吸造成的對基 體之引力的量值之間的函數關係加以考慮。 土 抓持器自身較佳以如下方式配置:其僅由一根襟構成 根據替代實施例’抓持器可為杆形抓持器、指形抓持器 ⑽抓持11、⑽抓持器、三角形抓持器及朝著抓持!Μ 動方向之頂端形成尖角的抓持器(ν形抓持器)或具有二* 設計。抓持器可建構為大體剛性之抓持器,亦可建構為: -17 π之抓持益。尤其較佳之實施例係於抓持器移動方卢 上展現低流阻及/或在自基體堆疊移除基體時以及在隨卷 進行的隔離動作期間產生儘可能小的渦旋的實施例。所肩 實施例之抓持ϋ額外具有以下優點:對於不同形式之基題 僅而使用&持窃,且抓持待隔離基體之原理甚至可恰當 地應用於已經破f而不再具有f規尺寸之基體。另 一優點在於以下辜膏:环益山 、 广争貝了猎由一抓持器實施例揀取不同形 式之基體。其原因在於以下事實:並非達成抽吸效應,而 疋達成沿抓持器與基體之間的接觸表面以平面方式延伸之 黏著力。 根據另一實施例 抓持器亦可設計為用合適材料(例 127488.doc -16 - 200842014 如’塑膠)製成之可撓性帶,其中該可撓性帶最佳以如下 式加以。又汁·其表面可被流體穿過,從而使流體既可吸 入及排出’亦可排放。為此’可提供鑽孔形式以及多孔基 弋之開口。抽吸所需之低壓可由大體固定之設備提 • # ’該設備配置於基體堆疊末端且在抓持過程開始時附接 • 於可捷性帶之自由背面,並經由開口吸出流體,直至可撓 性帶之正面與待抓持基體彼此充分靠近為止。在如前所述 • 而產生黏著力後,可撓性帶可搬運走現黏附於其上之基 體’其中’流體薄膜任何時候都得以保持。 據本發明’低壓產生於取料階段開始時。儘管此低壓 只需保持至在基體與抓持器接觸區之間獲得上述流體膜為 止但該低壓亦可保持至將基體堆放於搬運設備上為止。 承載設備自身以如下方式設計:其可接納分別由複數個 基體或晶圓構成之至少一基體堆疊。此外,承載設備具有 確保個別基體展現-定傾斜度之構件,其中,該傾斜使得 • 傾角α(為堆疊之饋送方向與基體更多地指向饋送方向之表 面法線之間的夾角)大於〇度,亦即為正角。在登立式堆疊 • m下’此意謂基體之抵靠於承載設備上之邊緣在饋送 方向上配置於其上邊緣之前。此情形之優點在於,抓持器 ‘ I平行於此定向插人流體中,且亦在此平面上移除基體°。 藉此亦可避免豎立式堆疊於承載設備在流體内轉移期間向 前傾斜,從而失去其定向。 曰° 因此,承載設備可沿至少一方向移動。較佳地,承载設 備可在饋送方向上移冑;確切地講,#先移動直至基體: 127488.doc -17- 200842014 豐之第一個待隔離基體到達位置债測設備為止。隨後表 況下在堆疊上恆定之各別基體厚度;確切地講,直至堆疊 之取後-個基體最終到達取料設備為止。作為替代方案, . =设備可設計為固定的。在此情況下,須提供可使基體 ㈣於承載設備上在饋送方向上移動之合適構件。作為替 代或額外方案,抓持設備及位置制設備在安置時可具: 較大之自由度,以便其可反向於饋送方向朝堆疊起始端方 向移動。 位置偵測設備係用於偵測待隔離基體之位置的設備。為 此,位置偵測設備提供為包含朝基體堆疊方向定向之壓 銷。藉由縮短位置偵測設備與基體堆疊之間的距離,對基 體堆®之政開起始端進行調整,直至待隔離基體抵靠於所 有所提供之壓銷為止。額外感應器元件(亦即,觸摸式感 應器形式之感應器元件)發出相應之信號,藉由該信號^ • 冑抓持器現可較佳地插入壓銷之間,且分離並搬運待隔離 之基體。 . 在基體堆疊包括厚度大於為調整壓緊元件而設定之平均 厚度因而亦大於所得步長之基體的情況下,由位置摘測設 ' 備偵測此狀態,從而使基體堆疊相應地在饋送方向上移 動,直至下一待隔離基體接觸壓緊元件為止。 作為替代或額外方案,位置偵測設備可進一步包含測角 器以此方式,待隔離基體之確切位置可得以確定,且可 視情況用作用於檢驗待隔離基體之品質的量。 127488.doc -18- 200842014 、因此,該裝置之優點在於,藉由承載設備、取料設備、 通流設備及位置偵測設備之相互作用 F ^產生特別適用於基 體隔離及搬運的裝置,藉由該裝置可自動地且以小於先前 技術之極低破裂率實施各處理步驟。此優點由基於通流設 備而提供之流體減震墊支持。Significantly reduce the rate of breakage. Can avoid tension or compressive forces. Given a sufficiently large gauge, the contact force is greater than the force generated by the temporary low pressure. It is possible to take high frequency from the substrate = stack. In addition, especially when the base body is located outside the base of the base two piles, even if the low pressure is not actively applied, the magnitude of the adhesion force=allows the base body to adhere to the AA depending on the geometric design of the gripper and the weight of the base body. The relationship between the diameter and number of drilled holes in the surface of the gripper, the size of the gripper surface, and the amount of pressure required to extract the fluid and the amount of attraction to the substrate caused by suction must be considered. The soil gripper itself is preferably configured in such a way that it consists of only one cymbal. According to an alternative embodiment, the gripper can be a rod-shaped gripper, a finger gripper (10) gripper 11, a gripper, (10), Triangle gripper and towards the grip! A sharp-pointed gripper (v-shaped gripper) is formed at the tip of the turbulent direction or has a two-* design. The gripper can be constructed as a generally rigid gripper, or it can be constructed as: -17 π. A particularly preferred embodiment is an embodiment that exhibits low flow resistance on the gripper moving side and/or produces a vortex that is as small as possible during the removal of the substrate from the substrate stack and during the isolation action with the roll. The grip of the shoulder embodiment additionally has the following advantages: the use of & theft for the different forms of the base problem, and the principle of grasping the substrate to be isolated can even be properly applied to the already broken f and no longer have the f rule The base of the size. Another advantage lies in the following anodic pastes: 环益山, 广争贝, hunting, picking up different forms of the substrate by a gripper embodiment. The reason for this is the fact that the suction effect is not achieved, and the adhesion of the contact surface between the gripper and the substrate in a planar manner is achieved. According to another embodiment, the gripper can also be designed as a flexible tape made of a suitable material (e.g., 127488.doc -16 - 200842014, such as 'plastic), wherein the flexible tape is preferably applied as follows. The juice can also be passed through by the fluid so that the fluid can be both inhaled and discharged. For this purpose, a drilled form and an opening for the porous base can be provided. The low pressure required for suction can be lifted by a generally fixed device. # ' The device is placed at the end of the stack and attached at the beginning of the gripping process. • The free back of the flexible band and the fluid is sucked through the opening until it is flexible The front side of the sexual band and the substrate to be grasped are sufficiently close to each other. After the adhesive force is generated as described above, the flexible tape can carry the substrate to which the liquid film is adhered, where the fluid film is maintained at all times. According to the invention, the low pressure is produced at the beginning of the reclaiming phase. Although this low pressure only needs to be maintained until the fluid film is obtained between the substrate and the gripper contact area, the low pressure can be maintained until the substrate is stacked on the handling equipment. The carrier device itself is designed in such a way that it can accommodate at least one substrate stack consisting of a plurality of substrates or wafers, respectively. Furthermore, the carrying device has means for ensuring that the individual substrates exhibit a constant inclination, wherein the inclination causes the inclination angle α (the angle between the feeding direction of the stack and the surface normal to the feeding direction to be more directed) than the twist , that is, a positive angle. In the case of a stacked stack, this means that the edge of the substrate against the carrying device is placed in front of its upper edge in the feed direction. The advantage of this situation is that the gripper 'I is parallel to this oriented insertion fluid and also removes the base ° on this plane. Thereby, it is also possible to avoid the vertical stacking of the carrying device tilting forward during the transfer in the fluid, thereby losing its orientation.曰° Therefore, the carrying device can be moved in at least one direction. Preferably, the carrying device is movable in the feeding direction; specifically, # moves to the base: 127488.doc -17- 200842014 The first substrate to be isolated reaches the position of the debt measuring device. The individual substrate thicknesses are then constant on the stack; in particular, until the stack is taken, the substrate finally reaches the reclaiming device. As an alternative, the device can be designed to be fixed. In this case, it is necessary to provide a suitable member for moving the substrate (4) on the carrying device in the feeding direction. As an alternative or in addition, the gripping device and the position-making device can be arranged with a greater degree of freedom so that they can be moved in the direction opposite the feeding direction towards the starting end of the stack. The position detecting device is a device for detecting the position of the substrate to be isolated. To this end, the position detecting device is provided to include a pin that is oriented toward the stacking direction of the substrate. By shortening the distance between the position detecting device and the substrate stack, the starting end of the base stack® is adjusted until the substrate to be isolated is pressed against the provided pin. The additional sensor element (i.e., the sensor element in the form of a touch sensor) emits a corresponding signal by which the gripper is now preferably inserted between the press pins and separated and transported to be isolated The base. In the case where the substrate stack includes a substrate having a thickness greater than the average thickness set for adjusting the pressing member and thus greater than the resulting step size, the position is detected by the position picking device so that the substrate stack is correspondingly in the feeding direction Move up until the next substrate to be isolated contacts the pressing element. Alternatively or additionally, the position detecting device may further comprise a goniometer in such a way that the exact position of the substrate to be isolated can be determined and used as an amount for verifying the quality of the substrate to be isolated. 127488.doc -18- 200842014 Therefore, the advantage of the device is that the interaction between the carrying device, the reclaiming device, the flow-through device and the position detecting device generates a device which is particularly suitable for substrate isolation and handling, The various processing steps can be performed by the apparatus automatically and at a very low fracture rate less than the prior art. This advantage is supported by fluid cushions based on flow-through equipment.

此外’取料設備自身之設計且因此垂直於堆疊方向之基 體之預定移除具有以下效應:無或僅弱的張力_縮^ 用於待隔離基體。有利地,此取料設備以如下方式加以設 計:平行於各別基狀平面延伸而進行移除,從而儘可能 小的張力、壓縮力或彎力作用於基體。抓持器既可呈單個 抓持器之形式,亦可呈帶之形式。 進-步之搬運較佳於流體内進行。,然而,亦可設想使抓 持器離開流體,且抓持n以如下方式堆放借助於黏著力附 接至搬運構件(例如,傳送帶)之基體:使得流體經由提供 於抓持器之鑽孔在基體方向上排出,從而使平面形基體可 在不文外部張力及/或壓縮力作用之情況下簡單地自抓 器脫落。 ' 可無限地重複該循環。 本發明之另一實施例的基本優點之一在於,在抓持器靠 近基體的過程中,抓持器可展現一定公差。抓持器無需精 確地止動於待隔離基體之前方,並定位於此。實情為 有利地使用冑因於基體於流冑内及至通流設備之配置而產 生之減震,其有利之處為:抓持器以很小之力反向於饋送 方向朝基體堆疊移%,從而與待隔離基體建立平面接觸,' 127488.doc -19- 200842014 待隔離基體可 “於/、後面的流體減震墊而得以彈性 地支撐。 本發明之另-優點係關於一種裝置之提供,該 :=Γ用存在於抓持器與基體之間的黏著力,因而相 對於獨立於臬I#夕士 f t 體之大小及外部形狀,可簡單地在 裂之情況下移除每-個別基體,甚至由於在流體内:= 而料體進行部分淨化,並將其轉移至特定設傷(例如, 搬運设備)。 取料叹備之另-替代實施例係關於具有規定之可於产之 設備’因而可在相對於收納表面之平面配置的定位=虚 待隔離基體之間對公差進行補償。抓持II、處置設備及、/ 或此二個組件之間的連接設計為可撓性的且因此可變形。 根據-尤其較佳之實施例,為增加隔離之循環時間,提 供用於自取料設備承接已隔離基體之其他構件。在基體被 此其他構件堆放於傳送帶上之時間跨度内,取料設備可能 已自基體堆疊抓取其他基體。作為替代或額外方案,^ 供異相切換之兩個大體相同的取料設備。 【實施方式】 圖i[a-f]示意性描繪本發明裝置1〇1及本發明方法之基 本原理。此裝置101適用於隔離及搬運片狀基體1〇2。 土 在所描繪之實施例中,基體102配置於基體堆疊1〇3内, 其中’基體堆疊1G3支撐於承載設備1()4中。個別基體1〇2 已自固持構件分離。較佳地,個別基體1〇2之表面之更多 地指向饋送方向的表面法線朝著饋送方向傾斜角度以(傾 127488.doc •20· 200842014 角)(圖2中描繪)。在該裝置被配置於流體内時,此傾斜在 豎立式基體堆疊103之情況下避免個別基體102漂浮或無意 地離開承載設備104。此外,個別基體102可由下文將更詳 細描述之取料設備107更容易地抓取。 • 個別平面形基體1〇2以其表面彼此接觸之方式並排地排 列。黏著力作用於該等基體之間,其由該等基體之間的極 小間隙以及(例如)先前鋸切步驟所產生的可能污染物引 起。歸因於此排列,基體102確定一規定的饋送方向1〇5。 馨 在所描繪之圖式中,示意性地展示該等基體。其中,示 意性展示之方塊圖意謂此區域内之基體彼此緊密相連。該 等基體於其他區域(亦即取料區)内散開,且展示間隙。散 開基體之間的黏著力較佳為零。 此外,根據本發明,亦提供設計為抓持器式之取料設備 107。其示意性地展示於此處所描繪之例示性實施例中, 且主要展示抓持器108。在抓持器108處,配置有處置設備 φ (描、會於圖1[A]中),其允許抓持器108在不同方向上移動 或旋轉。較佳地,抓持器108可在箭頭方向110上且在 箭頭方向112上繞軸旋轉。 此外,提供搬運設備113。此搬運設備113由傳送帶114 ' 構成’藉由軸115在箭頭方向116上驅動該傳送帶114。 車又佳地,裝置101的至少某些組件(即承載設備刚、基 體堆疊103)及取料設備107之組件提供為配置於流體内。 Z此可達成基體於整個過軸間,至少在其堆放於搬運設 上之前不會變乾。視情况,亦可將取料設備iQ7之其餘 127488.doc 21 200842014 組件及搬運設備113配置於流體内,其中,作為替代方 案,搬運設備亦可具有用於潤濕基體之自有構件。 為改良對各別基體102之隔離,配置至少一具有流體嘴 嘴118的通流設備117,藉由該通流設備117可將流體注入 間隙119内,其中,此間隙119位於待隔離基體1〇2與下一 基體102之間。較佳地,各別間隙119在流體流自流體噴嘴 118中流出進入間隙119中時得以保持。有利地,兩個基體 102之間的間隙119形成於配置有若干基體1〇2之規定區域 内,〇 為避免流體流使得個別基體1〇2離開承載設備1〇4,提供 壓緊元件122,在圖中所描繪之例示性實施例中,該壓緊 元件122主要包含壓銷123。在基體堆疊於饋送方向上移動 時,待隔離基體壓抵壓緊元件122,從而使反作用力施加 至由流體流入間隙119所產生之力。 間隙119内形成所謂的流體墊,藉由該等流體墊可確保 接觸各別流體墊之個別基體102彼此間保持一定距離。此 外,此等流體墊具有以下特性:減震效應由於壓緊元件 122所施加之反作用力且亦由於抓持器1〇8接觸待隔離基體 102而產生。 在圖1[B]中,設備1〇7之抓持器ι〇8已配置為平行於基體 102之表面。抓持器108在箭頭方向u〇上平行移動,並於 隨後的其他步驟中朝基體102之表面移動;確切地講,直 至其接觸到待隔離基體102為止(如圖1 [c]中所描繪)。由於 抓持器108接觸基體1〇2時所產生之接觸壓力,兩個基體 127488.doc -22· 200842014 102之間的各別間隙會減小。由於流體於待隔離之各別基 體之間的間隙119内之配置,可產生減震效應。在此圖 UC]中,藉由如上所述產生低壓,使抓持器1〇8内之鑽孔 (圖式中未詳細描繪)開始工作。由於該低壓,抓持器1〇8吸 • 引待隔離基體102,直至基體102與抓持器1〇8之間的空隙 大幅減小且接觸表面之間產生黏著力。藉由自流體喷嘴 118射出之流體支持基體之散開。 馨 根據圖1 [D],抓持器108與黏附於其上之基體1 〇2 —起移 動,直至抓持器1〇8可將基體1〇2堆放於搬運設備ιΐ3上為 止。在此過程中,由基體及抓持器構成之整體須反向於饋 送方向105移動一小段距離,因此,壓銷123與基體表面於 隨後之取料動作期間並不接觸。作為替代方案,為釋放晶 圓,位置债測設備亦可在饋送方向上移動一小段距離。根 據本备明,亦可將此等兩個移動加以組合。根據圖1 [£], 基體102被平放於傳送帶114上。為隔離下一基體Μ?,根 瞻據圖1[F],抓持器108須再度移動至圖1[8]所示之位置。 —在抽吸造成的對待隔離基體1〇2之吸引期間所產生的黏 _ 者力之大小確定為足以於流體内搬運由抓持器108抓取之 基體102。 在圖2及圖3中,示意性地描繪裝置2〇 i,與圖i相比,其 展示基本原理之另一發展。 裝置201尤其適用於隔離及搬運片狀基體202。 在此處所描繪之例示性實施例中,基體2〇2配置於基體 堆璺203内,其中,基體堆疊2〇3支撐於承載設備^⑽中, 127488.doc -23· 200842014 且個別基體202已自固持構件分離。 較佳地,個別基體202相對於彼此傾斜配置,其傾角 α(圖2)為饋送方向2〇5與基體更多地指向饋送方向之表面 的表面法線之間所形成的夾角。藉由此傾斜,在該裝置配 置於流體内以及基體堆疊203處於豎立位置之情況下,可 避免個別基體202漂浮以及無意地離開承載設備2〇4。個別 基體202係以其表面彼此接觸之方式而配置。因此,個別 基體形成一可確定規定的饋送方向2〇5之序列。 根據本發明,進一步提供設計為抓持器式之取料設備 207 其示思性地描繪於此處展不之例示性實施例中,且 主要展示抓持器208。在抓持器208處,配置有處置設備 209,該處置設備209允許抓持器2〇8在不同方向上(箭頭方 向210、211、212)移動及旋轉。抓持器2〇8與處置設備2〇9 共同形成抓臂。 此外,提供搬運設備213。此搬運設備213由傳送帶214 構成,藉由軸115在箭頭方向216上驅動該傳送帶214。 在較佳實施例中,整個裝置201的至少某些組件(即承載 没備204、基體堆疊203)及取料設備207之組件配置於流體 内。藉此可達成基體於整個過程期間,至少在其堆放於搬 運設備上之前不會變乾。視情況,亦可將取料設備207之 其餘組件及搬運設備213配置於流體内,其中,作為替代 方案,搬運設備亦可具有用於潤濕基體之自有構件。 此外,為改良對各別基體2 0 2之隔離,具有流體噴嘴21 $ 的至少一通流設備217配置於堆疊起始端之附近,藉由該 127488,doc -24- 200842014 通流設備217可將流體注入間隙219内,其中,該間隙219 形成於待隔離基體202與下一基體202之間。流體噴嘴218 特定地配置於基體堆疊203待散開之區域内。通常,此至 少應用於配置於正被隔離之基體202後面的前四個至前九 個基體202。由此產生若干間隙219,其中,每一間隙219 限於基體202之右側及左側。於間隙219内形成具有減震性 能之流體墊。 此外,在圖2及圖3中,描繪位置偵測設備220。該位置 偵測設備22〇主要由另一處置設備221及配置於處置設備 221之一自由端的壓緊元件222構成。壓緊元件222進一步 包含壓銷223,分別根據圖2及圖3,該等壓銷223於規定位 置接觸各別基體202之表面,或由於此接觸而將基體置於 規定位置,並將其固持於該規定裝置。其他處置設備221 以可在箭頭方向230上及反向於箭頭方向230進行移動之方 式加以支樓。 此外,位置偵測設備220配有感應器元件224。此感應器 元件224之功能在於偵待隔離基體202與測壓緊元件222及/ 或壓銷223之間是否存在平面接觸。 圖2及圖3描繪此感應器元件224之特殊實施例。此感應 器元件224以機械方式感應待隔離基體202之存在。為此可 提供藉由接近開關229偵測之不同位置。感應器元件224具 有曲杆式組件,該曲杆式組件支撐於鉸鏈225處以便可在 箭頭方向226上及反向於箭頭方向226進行旋轉。一自由端 227用於支撐待偵測基體202之表面。另一端228意欲配置 127488.doc -25- 200842014 於接近開關229之區域内。若在自由端227處未偵測到基體 202,則使感應器元件224回到原位。自由端m經由—俨 想線配置於壓銷223之自由端之間,且另一自由端咖經^ 計使得自由端228與接近開關之間的距離近乎為零。自由 端227—旦受到壓力作用,感應器元件224即旋轉,且自由 端228與接近開關之間的距離增大。若此接近開關到達此 前已校準之位置,則可自動摘測是否有基體2〇2定位為接 觸壓銷223之自由端。若自由端227未受到壓力作用,則感 應器元件224移回其原位。在未較詳細描述之感應器元件 224之替代實施例中,亦可借助於其他合適設備(例如,光 學或聲學接近開關)來達成對基體之存在及位置之偵測, 其中,必要時可忽略經由曲杆及鉸鏈225對接觸資訊之機 械傳輸。 壓緊元件222較佳與處置設備221成角度配置,該角度對 應於傾角α。因此,個別壓銷223較佳具有相同長度。 作為替代方案,壓緊元件222亦可提供為垂直於處置設 備221而配置,且壓銷223具有不同長度,因而於所描繪之 位置,壓銷223之自由端總是接觸基體2〇2之表面。 位置偵測設備220之工作原理為:基體堆疊2〇3在饋送方 向205上移動,更確切地講,直至待隔離基體2〇2之表面接 觸到壓緊設備222之壓銷223的自由端為止。在待隔離基體 202置於恰當位置時,感應器元件224在箭頭方向226中之 一者上移動,且接近開關229偵測正確位置。 若待隔離基體202之位置正確地定位,則取料設備2〇7可 127488.doc -26- 200842014 插入由壓銷223形成之間隙,並抓取待隔離基體2〇2。 下面藉由圖4至圖9對個別處理步驟進行較詳細地說明。 在圖4Α及圖4Β中,描繪本發明裝置2〇1之所謂的裝料情 況。承載設備204準備好收納此處未詳細描繪之基體堆 疊。 已藉由相應構件對基體堆疊之所要傾角以加以預先設 定。取料設備207及位置偵測設備220處於起始位置,且可 分別在箭頭方向210及箭頭方向230上移動。配置於壓緊元 件222處之感應器元件224亦處於起始位置,且未偵測到接 觸壓銷223之基體。 取料設備207之抓持器208亦處於初始位置,因而其可插 入壓緊元件222之壓銷223之間。 搬運設備2 13準備好收納基體。通流設備2丨7之流體喷嘴 218仍關閉。 圖5Α及圖5Β所不之承載設備204現已裝有基體堆最 203。此承載設備2〇4或基體堆疊203分別在饋送方向2〇5上 移動,亦即,直至藉由在箭頭方向230上之移動而定位之 位置偵測設備220到達規定位置為止。在此位置處,壓緊 元件222及其壓銷223接觸待隔離基體202之表面。 為使基體202實現與某位置及外形相符之定向,通流設 備217之流體喷嘴21 8朝基體堆疊203指引流體,使得基體 堆疊203之至少部分散開,且產生空隙式間隙219。由於壓 緊元件222之壓緊作用,可避免個別基體202進一步散開。 此亦可導致基體202停留於承載設備204上。若藉由散開而 127488.doc -27- 200842014 使待隔離基體202到達適當位置,則感應器元件224偵測精 確位置。若未達到該精確位置,則位置偵測設備22〇繼續 在萷頭方向230上移動及/或使基體堆疊203進一步散開。 若兩個動作均無法使感應器元件224發出用於釋放取料設 備207之相應信號,則發出差錯訊息。 在圖6A及圖6B中,流體噴嘴218繼續將流體指引至間隙 219内,從而於間隙219中產生所謂的流體墊。該流體墊用 於在個別基體間達成適當減震效應。現由於到達基體2〇2 之所欲位置而進行釋放,此係因為感應器元件224以已啟 動接近開關229之方式旋轉。 取料設備207現在箭頭方向210上移動,其移動方式使得 抓持器208伸入位置偵測設備22〇之壓緊元件222的壓銷223 之間的空間中,並到達接觸待隔離基體2〇2之表面之區 域藉由取料叹備207在前頭方向211上之旋轉,可實現抓 持器208與基體202之表面之接觸。由於所產生之黏著力, 基體可如圖7A及圖7B所描繪而反向於箭頭方向21〇移動, 該等黏著力由於抓持器2 〇 8及待隔離基體2 〇 2之表面之間形 成低壓而特定地得到增強。作為替代或額外方案,可使抓 持器在箭頭方向212(圖7A)上旋轉,直至達成與基體2〇2之 表面發生平面接觸為止。藉此可釋放待隔離之基體,並可 如圖7A及圖7B所描繪而在箭頭方向21〇上移除待隔離之基 體’以便隨後將其安置於搬運設備213上。 然而,如圖7A及圖7B所示,為避免待隔離基體2〇2之表 面文損,使壓緊元件222向後移動一小段距離,或使具有 127488.doc -28- 200842014 基體堆疊203之承載設備204反向於饋送方向205向後移動 一小段距離。感應器元件224再度旋轉回至其處始位置, 且接近開關偵測到待隔離基體202不再接觸壓銷223。 在取料設備207或其抓持器208分別在箭頭方向212上旋 轉以將待隔離基體202堆放於搬運設備213或其傳送帶214 之時間跨度(圖8A及圖8B)内,具有基體堆疊203之承載設 備204又在饋送方向205上朝位置偵測設備220移動,直至 在待隔離基體202與具有壓銷223之壓緊元件222之間達成 接觸為止。 圖9A及圖9B描繪取料設備207對基體202之堆放。基體 2〇2被堆放於搬運設備213之傳送帶214上,並藉由在軸215 處之驅動在箭頭方向216上將基體202運走。 在此過程期間或在此過程之後,流體再度分別由通流設 備217或其流體噴嘴218指引至基體堆疊203之間隙219内, 從而使基體堆疊散開,直至待隔離基體202與位置偵測設 備220之壓緊元件222之壓銷223接觸為止。此使得感應器 元件224產生用於使取料設備207揀取待隔離基體2〇2之釋 放信號。以此方式,以所需之頻率重複該過程。 基體堆疊203内一旦無基體202存在,壓緊元件222或感 應器元件224即分別會偵測到基體202之缺失,並發出適當 差錯訊息。 在抽吸造成的對待隔離基體2 〇2之吸引期間所產生之黏 著力之大小確定為足以於流體内搬運由抓持器2〇8抓取之 基體202。 127488.doc -29- 200842014 進行了說明°當然’ 塑膠)製成之片狀基 上文就處理矽晶圓之方面對本發明 根據本發明亦可對由其他材料(諸如, 體進行處理。 【圖式簡單說明j /圖UA.F]為本發明裝置之發明原理的示意圖,詳言之為 待隔離基體之隔離及搬運過程的程序,· 圖2為圖1所示之本發明裝置之實施例的側視圖,·Furthermore, the predetermined removal of the substrate of the reclaiming device itself and thus perpendicular to the stacking direction has the effect that no or only weak tension is used for the substrate to be isolated. Advantageously, the reclaiming device is designed to be removed parallel to the respective base planes so that the smallest possible tension, compressive or bending forces act on the substrate. The gripper can be in the form of a single gripper or in the form of a strap. The step-by-step handling is preferably carried out in a fluid. However, it is also conceivable to leave the gripper out of the fluid, and the gripping n is stacked in such a way that it is attached to the base of the carrying member (for example a conveyor belt) by means of an adhesive force such that the fluid is passed through the bore provided to the gripper. The substrate is discharged in a direction such that the planar substrate can be easily detached from the gripper without the action of external tension and/or compressive forces. ' This loop can be repeated indefinitely. One of the basic advantages of another embodiment of the present invention is that the gripper can exhibit certain tolerances as the gripper approaches the base. The gripper does not need to be accurately stopped in front of the substrate to be isolated and positioned there. In fact, it is advantageous to use the shock absorption caused by the configuration of the base body in the flow raft and to the flow-through device, which is advantageous in that the gripper moves toward the base stack by a small force against the feeding direction by a small force, Thereby establishing a planar contact with the substrate to be isolated, '127488.doc -19- 200842014 The substrate to be isolated can be elastically supported "with/ behind the fluid cushion. The further advantage of the invention relates to the provision of a device, The := uses the adhesion between the gripper and the substrate, so that each individual matrix can be removed simply in the case of cracking, independent of the size and external shape of the 臬I# 士 ft body. Even due to the partial purification of the material in the fluid: = and transfer it to a specific injury (for example, handling equipment). Retrieving the sigh of the alternative - alternative embodiments are related to the provisions of the production The device 'is thus able to compensate for tolerances between the positioning = virtual standby isolation matrix arranged relative to the plane of the receiving surface. The grip II, the treatment device and/or the connection between the two components are designed to be flexible And therefore deformable According to a particularly preferred embodiment, in order to increase the cycle time of the isolation, other components for the self-reclaiming device to receive the isolated substrate are provided. During the time span in which the substrate is stacked on the conveyor by the other components, the reclaiming device may have Grasping other substrates from the substrate stack. As an alternative or in addition, two substantially identical reclaiming devices for heterogeneous switching. [Embodiment] Figure i [af] schematically depicts the device of the invention 1〇1 and the method of the invention The basic principle of the device 101 is suitable for isolating and transporting the sheet-like substrate 1〇2. In the depicted embodiment, the substrate 102 is disposed in the base stack 1〇3, wherein the 'base stack 1G3 is supported on the carrying device 1 ( 4) The individual substrates 1〇2 have been separated from the holding member. Preferably, the surface of the individual substrates 1〇2 is more inclined toward the feeding direction by the surface normal to the feeding direction (pour 127488.doc • 20· 200842014 corner) (depicted in Fig. 2). When the device is placed in a fluid, this tilt prevents the individual substrates 102 from floating or unintentionally leaving the bearing in the case of the vertical matrix stack 103 In addition, the individual substrates 102 can be more easily grasped by the take-up device 107, which will be described in more detail below. • The individual planar shaped substrates 1〇2 are arranged side by side in such a way that their surfaces contact each other. Adhesive forces act on these Between the substrates, which are caused by very small gaps between the substrates and, for example, possible contaminants from previous sawing steps. Due to this arrangement, the substrate 102 determines a defined feed direction of 1〇5. In the drawings depicted, the substrates are schematically shown, wherein the schematic representation of the block diagram means that the substrates in this region are intimately connected to each other. The substrates are dispersed in other regions (ie, the reclaiming region). And the gap is displayed. The adhesion between the diffused substrates is preferably zero. Furthermore, according to the invention, a pick-up device 107 designed as a gripper is also provided. It is shown schematically in the exemplary embodiment depicted herein, and primarily shows the gripper 108. At the gripper 108, a treatment device φ (described in Figure 1 [A]) is provided which allows the gripper 108 to move or rotate in different directions. Preferably, the gripper 108 is rotatable about the axis in the direction of the arrow 110 and in the direction of the arrow 112. Further, a handling device 113 is provided. The handling device 113 is constructed of a conveyor belt 114' that drives the conveyor belt 114 in the direction of the arrow 116 by the shaft 115. Preferably, at least some of the components of the device 101 (i.e., the load bearing device, the substrate stack 103) and the components of the picking device 107 are provided for being disposed within the fluid. This allows the substrate to be made between the entire axis, at least until it is stacked on the handling device. The remaining 127488.doc 21 200842014 components and handling equipment 113 may also be disposed within the fluid, as an alternative, wherein the handling apparatus may also have its own components for wetting the substrate. In order to improve the isolation of the respective substrates 102, at least one flow-through device 117 having a fluid nozzle 118 is provided, by which the fluid can be injected into the gap 119, wherein the gap 119 is located in the substrate to be isolated. 2 is between the next substrate 102. Preferably, the respective gaps 119 are maintained as fluid flows out of the fluid nozzles 118 into the gaps 119. Advantageously, a gap 119 between the two substrates 102 is formed in a defined area in which a plurality of substrates 1〇2 are arranged, and in order to avoid fluid flow, the individual substrates 1〇2 leave the carrier device 1〇4, providing a pressing element 122, In the exemplary embodiment depicted in the figures, the hold down element 122 primarily includes a press pin 123. When the substrate stack is moved in the feeding direction, the substrate to be isolated is pressed against the pressing member 122, so that the reaction force is applied to the force generated by the fluid flowing into the gap 119. So-called fluid pads are formed in the gap 119 by which the individual substrates 102 contacting the respective fluid pads are maintained at a distance from one another. In addition, these fluid pads have the following characteristics: the damping effect is due to the reaction force exerted by the pressing member 122 and also due to the contact of the gripper 1〇8 with the substrate 102 to be isolated. In Fig. 1 [B], the gripper ι 8 of the device 1 已 7 has been arranged parallel to the surface of the base 102. The gripper 108 moves in parallel in the direction of the arrow u and moves towards the surface of the substrate 102 in other subsequent steps; specifically, until it contacts the substrate 102 to be isolated (as depicted in Figure 1 [c]). ). Due to the contact pressure generated when the gripper 108 contacts the substrate 1 〇 2, the respective gaps between the two substrates 127488.doc -22· 200842014 102 are reduced. The damping effect can be produced due to the configuration of the fluid within the gap 119 between the individual substrates to be isolated. In this figure UC], the drilling in the gripper 1〇8 (not depicted in the drawings) is started by generating a low pressure as described above. Due to this low pressure, the gripper 1 〇 8 draws the substrate 102 to be isolated until the gap between the base 102 and the gripper 1 大幅 8 is greatly reduced and an adhesive force is generated between the contact surfaces. The dispersion of the substrate is supported by the fluid ejected from the fluid nozzle 118. According to Fig. 1 [D], the gripper 108 is moved together with the base 1 〇 2 adhered thereto until the gripper 1 〇 8 can stack the base 1 〇 2 on the transporting device ΐ 3 . During this process, the entirety of the base body and the gripper must be moved a short distance from the feed direction 105 so that the press pin 123 does not contact the surface of the substrate during subsequent take-up operations. Alternatively, to release the crystal, the positional debt measuring device can also be moved a short distance in the feed direction. According to this statement, these two movements can also be combined. According to Fig. 1 [£], the base body 102 is laid flat on the conveyor belt 114. To isolate the next substrate, the gripper 108 has to be moved again to the position shown in Figure 1 [8]. - The amount of viscous force generated during the suction of the substrate 1 〇 2 to be treated by suction is determined to be sufficient to carry the substrate 102 grasped by the gripper 108 in the fluid. In Figures 2 and 3, the device 2〇 i is schematically depicted, which shows another development of the basic principle compared to Figure i. The device 201 is particularly suitable for isolating and transporting the sheet-like substrate 202. In the exemplary embodiment depicted herein, the substrate 2〇2 is disposed within the substrate stack 203, wherein the substrate stack 2〇3 is supported in the carrier device (10), 127488.doc -23· 200842014 and the individual substrates 202 have Separated from the holding member. Preferably, the individual substrates 202 are disposed obliquely with respect to each other with an inclination angle α (Fig. 2) which is an angle formed between the feeding direction 2〇5 and the surface normal of the surface of the substrate which is directed more toward the feeding direction. By virtue of this tilting, in the event that the device is placed in the fluid and the substrate stack 203 is in the upright position, the individual substrates 202 can be prevented from floating and unintentionally leaving the carrier device 2〇4. The individual substrates 202 are arranged in such a manner that their surfaces are in contact with each other. Therefore, the individual substrates form a sequence which can determine the specified feed direction 2〇5. In accordance with the present invention, there is further provided a gripping device 207 designed as a gripper that is illustratively depicted in an exemplary embodiment that is not shown here, and that primarily displays the gripper 208. At the gripper 208, a treatment device 209 is provided that allows the gripper 2〇8 to move and rotate in different directions (arrow directions 210, 211, 212). The gripper 2〇8 together with the treatment device 2〇9 forms a gripping arm. Further, a handling device 213 is provided. This handling device 213 is comprised of a conveyor belt 214 that is driven by the shaft 115 in the direction of the arrow 216. In the preferred embodiment, at least some of the components of the overall device 201 (i.e., the carrier 204, the substrate stack 203) and the components of the picking device 207 are disposed within the fluid. This allows the substrate to be dried during the entire process, at least until it is stacked on the transport equipment. Optionally, the remaining components of the take-up device 207 and the handling device 213 may be disposed within the fluid, wherein, alternatively, the handling device may have its own components for wetting the substrate. In addition, in order to improve the isolation of the respective substrates 220, at least one flow device 217 having a fluid nozzle 21$ is disposed near the beginning of the stack, and the fluid can be fluidized by the 127488, doc-24-200842014 flow device 217 The gap 219 is formed in the gap 219, wherein the gap 219 is formed between the substrate 202 to be isolated and the next substrate 202. The fluid nozzles 218 are specifically disposed in the area of the substrate stack 203 to be dispersed. Typically, this applies at least to the first four to the first nine substrates 202 disposed behind the substrate 202 being isolated. A plurality of gaps 219 are thereby produced, wherein each gap 219 is limited to the right and left sides of the base 202. A fluid pad having shock absorbing properties is formed in the gap 219. Further, in FIGS. 2 and 3, the position detecting device 220 is depicted. The position detecting device 22 is mainly composed of another treating device 221 and a pressing member 222 disposed at one of the free ends of the treating device 221. The pressing member 222 further includes a pressing pin 223 which contacts the surface of each of the base bodies 202 at a predetermined position according to FIG. 2 and FIG. 3, respectively, or places the substrate in a predetermined position due to the contact, and holds the same. In the prescribed device. The other disposal equipment 221 is fulfiled in such a manner as to be movable in the direction of the arrow 230 and in the direction opposite to the direction of the arrow 230. Furthermore, the position detecting device 220 is equipped with an inductor element 224. The function of the sensor element 224 is to detect whether there is a planar contact between the isolation substrate 202 and the compression element 222 and/or the pressure pin 223. 2 and 3 depict a particular embodiment of the inductor element 224. This sensor element 224 mechanically senses the presence of the substrate 202 to be isolated. Different locations detected by the proximity switch 229 can be provided for this purpose. The sensor element 224 has a curved rod assembly that is supported at the hinge 225 for rotation in the direction of the arrow 226 and in the direction opposite the direction of the arrow 226. A free end 227 is used to support the surface of the substrate 202 to be inspected. The other end 228 is intended to be configured in the area of proximity switch 229 127488.doc -25- 200842014. If the substrate 202 is not detected at the free end 227, the sensor element 224 is returned to its original position. The free end m is disposed between the free ends of the press pins 223 via the 俨 line, and the other free end is such that the distance between the free end 228 and the proximity switch is nearly zero. The free end 227 is subjected to pressure, the sensor element 224 is rotated, and the distance between the free end 228 and the proximity switch is increased. If the proximity switch reaches the previously calibrated position, it is automatically measurable whether or not the base 2〇2 is positioned to contact the free end of the press pin 223. If the free end 227 is not under pressure, the sensor element 224 is moved back to its original position. In an alternative embodiment of the sensor element 224, which is not described in greater detail, the presence and location of the substrate can also be detected by means of other suitable devices (for example, optical or acoustic proximity switches), wherein negligible if necessary Mechanical transmission of contact information via a curved bar and hinge 225. The pressing member 222 is preferably disposed at an angle to the treatment device 221 that corresponds to the angle of inclination a. Therefore, the individual press pins 223 preferably have the same length. Alternatively, the compression element 222 can also be provided to be disposed perpendicular to the treatment device 221, and the compression pin 223 has a different length such that at the depicted position, the free end of the compression pin 223 always contacts the surface of the base 2〇2 . The position detecting device 220 operates on the principle that the substrate stack 2〇3 moves in the feeding direction 205, more specifically, until the surface of the substrate to be isolated 2〇2 contacts the free end of the pressing pin 223 of the pressing device 222. . When the substrate 202 to be isolated is placed in position, the sensor element 224 moves in one of the arrow directions 226 and the proximity switch 229 detects the correct position. If the position of the substrate 202 to be isolated is correctly positioned, the take-up device 2〇7 can be inserted into the gap formed by the press pin 223 and grasp the substrate 2〇2 to be isolated. The individual processing steps are described in more detail below with reference to Figures 4-9. In Fig. 4A and Fig. 4B, the so-called charging situation of the device 2〇1 of the present invention is depicted. The carrier device 204 is ready to receive a stack of substrates not detailed herein. The desired inclination of the substrate stack by the respective members has been previously set. The take-up device 207 and the position detecting device 220 are in the home position and are movable in the arrow direction 210 and the arrow direction 230, respectively. The sensor element 224 disposed at the pinch element 222 is also in the home position and the base of the contact pin 223 is not detected. The gripper 208 of the take-up device 207 is also in the initial position so that it can be inserted between the press pins 223 of the pressing members 222. The handling device 2 13 is ready to receive the substrate. The fluid nozzle 218 of the flow through device 2丨7 is still closed. The carrier device 204 of Figure 5A and Figure 5 is now equipped with a base stack 203. The carrier device 2〇4 or the substrate stack 203 is moved in the feed direction 2〇5, i.e., until the position detecting device 220 positioned by the movement in the arrow direction 230 reaches the prescribed position. At this position, the pressing member 222 and its press pin 223 contact the surface of the substrate 202 to be isolated. To achieve orientation of the substrate 202 in accordance with a position and shape, the fluid nozzles 218 of the flow-through device 217 direct fluid toward the substrate stack 203 such that at least a portion of the matrix stack 203 is spread apart and a voided gap 219 is created. Due to the compression of the pressing member 222, the individual substrates 202 can be prevented from further spreading. This can also cause the substrate 202 to stay on the carrier device 204. If the substrate 202 to be isolated is brought into position by spreading 127488.doc -27- 200842014, the sensor element 224 detects the precise position. If the precise position is not reached, the position detecting device 22 continues to move in the boring direction 230 and/or causes the base stack 203 to spread further. If neither of the actions causes the sensor element 224 to issue a corresponding signal for releasing the reclaiming device 207, an error message is issued. In Figures 6A and 6B, fluid nozzle 218 continues to direct fluid into gap 219, creating a so-called fluid pad in gap 219. The fluid pad is used to achieve an appropriate damping effect between individual substrates. The release is now due to the desired position of the substrate 2〇2, since the inductor element 224 is rotated in such a manner that the proximity switch 229 has been activated. The reclaiming device 207 is now moved in the direction of the arrow 210 in such a manner that the gripper 208 extends into the space between the press pins 223 of the pressing elements 222 of the position detecting device 22 and reaches the contact body 2 to be isolated. The area of the surface of the 2 is brought into contact with the surface of the substrate 202 by the rotation of the take-up slap 207 in the front direction 211. Due to the resulting adhesive force, the substrate can be moved in the opposite direction of the arrow 21 描绘 as depicted in Figures 7A and 7B, which are formed between the gripper 2 〇 8 and the surface of the substrate 2 〇 2 to be isolated. It is specifically enhanced by low pressure. Alternatively or additionally, the gripper can be rotated in the direction of the arrow 212 (Fig. 7A) until a planar contact is made with the surface of the substrate 2〇2. Thereby, the substrate to be isolated can be released, and the substrate to be isolated can be removed in the direction of the arrow 21A as shown in Figs. 7A and 7B for subsequent placement on the handling device 213. However, as shown in FIGS. 7A and 7B, in order to avoid surface damage of the substrate 2 to 2 to be isolated, the pressing member 222 is moved backward by a small distance, or the carrier having the substrate stack 203 of 127488.doc -28-200842014 is provided. Device 204 moves backwards a short distance back in the feed direction 205. The sensor element 224 is again rotated back to its starting position, and the proximity switch detects that the substrate 202 to be isolated is no longer in contact with the pin 223. Rotating the picking device 207 or its gripper 208 in the direction of the arrow 212, respectively, to stack the substrate 202 to be isolated in the time span of the handling device 213 or its conveyor belt 214 (Figs. 8A and 8B), having a substrate stack 203 The carrier device 204 is in turn moved in the feed direction 205 towards the position detecting device 220 until contact is made between the substrate 202 to be isolated and the pressing member 222 having the press pin 223. 9A and 9B depict the stacking of the substrate 202 by the take-up device 207. The base 2〇2 is stacked on the conveyor belt 214 of the handling equipment 213 and the substrate 202 is carried away in the direction of the arrow 216 by actuation at the shaft 215. During or after this process, the fluid is again directed by the flow-through device 217 or its fluid nozzle 218 into the gap 219 of the substrate stack 203, thereby dispersing the substrate stack until the substrate 202 and the position detecting device 220 are to be isolated. The pressing pin 223 of the pressing member 222 is in contact. This causes the sensor element 224 to generate a release signal for the picking device 207 to pick up the substrate 2〇2 to be isolated. In this way, the process is repeated at the desired frequency. Once the substrate 202 is absent within the substrate stack 203, the pinch element 222 or the sensor element 224 will detect the absence of the substrate 202 and issue an appropriate error message, respectively. The amount of adhesion generated during the suction of the substrate 2 〇 2 to be treated by suction is determined to be sufficient to carry the substrate 202 grasped by the gripper 2 〇 8 in the fluid. 127488.doc -29- 200842014 Illustrated. Of course, the sheet base made of 'plastics' has been treated with other materials (such as body) according to the invention. Brief Description of the Drawings j / Figure UA.F] is a schematic diagram of the inventive principle of the device of the present invention, in detail, a procedure for the isolation and handling process of the substrate to be isolated, and Figure 2 is an embodiment of the device of the present invention shown in Figure 1. Side view,

圖3為圖2所描繪之實施例之透視圖; 圖4 [A]為圖2所示之本發明裝置之第一處理步驊的側視 圖4[B]為圖2所示之本發明裝置之第一處理步驟的透視 m , 圖5 [A]為圖2所示之本發明裝置之第二處理步驟的側視 圖; 圖5 [B]為圖2所示之本發明裝置之第二處理步驟的透視 1SI · 圃, 圖6 [A]為圖2所示之本發明裝置之第三處理步驟的侧視 圖; 圖6 [B]為圖2所示之本發明裝置之第三處理步驟的透視 圖; 圖7 [A]為圖2所不之本發明裝置之第四處理步驟的側視 圖; 圖7[B]為圖2所示之本發明裝置之第四處理步驟的透視 圖; 127488.doc 200842014 圖8 [A]為圖2所示之本發明裝置之第五處理步驟的侧視 圖, 圖8 [B]為圖2所示之本發明裝置之第五處理步驟的透視 圖; 圖9 [A]為圖2所示之本發明裝置之第六處理步驟的侧視 圖; 圖9[B]為圖2所示之本發明裝置之第六處理步驟的透視 圖。Figure 3 is a perspective view of the embodiment depicted in Figure 2; Figure 4 [A] is a side view of the first processing step of the apparatus of the present invention shown in Figure 2 [4] is the apparatus of the present invention shown in Figure 2 The perspective m of the first processing step, FIG. 5 [A] is a side view of the second processing step of the apparatus of the present invention shown in FIG. 2; FIG. 5 [B] is the second processing of the apparatus of the present invention shown in FIG. The perspective of the step 1SI · 圃, Fig. 6 [A] is a side view of the third processing step of the apparatus of the invention shown in Fig. 2; Fig. 6 [B] is the third processing step of the apparatus of the invention shown in Fig. 2. Figure 7 [A] is a side view of a fourth processing step of the apparatus of the present invention not shown in Figure 2; Figure 7 [B] is a perspective view of a fourth processing step of the apparatus of the present invention shown in Figure 2; .doc 200842014 Figure 8 [A] is a side view of a fifth processing step of the apparatus of the present invention shown in Figure 2, and Figure 8 [B] is a perspective view of a fifth processing step of the apparatus of the present invention shown in Figure 2; 9 [A] is a side view of the sixth processing step of the apparatus of the present invention shown in Fig. 2; and Fig. 9 [B] is a perspective view of the sixth processing step of the apparatus of the present invention shown in Fig. 2.

【主要元件符號說明】 10卜 201 裝置 102 、 202 基體 103 、 203 基體堆疊 104 > 204 承載設備 105 、 205 饋送方向 107 - 207 取料設備 108 、 208 抓持器 110 、 210 箭頭方向 112 、 212 箭頭方向 113 、 213 搬運設備 114 、 214 傳送帶 115 、 215 軸 116- 216 箭頭方向 117 、 217 通流設備 118 、 218 流體喷嘴 127488.doc -31 - 200842014[Main component symbol description] 10b 201 device 102, 202 base 103, 203 base stack 104 > 204 carrying device 105, 205 feeding direction 107 - 207 reclaiming device 108, 208 gripper 110, 210 arrow direction 112, 212 Arrow direction 113, 213 handling equipment 114, 214 conveyor belt 115, 215 shaft 116-216 arrow direction 117, 217 flow-through device 118, 218 fluid nozzle 127488.doc -31 - 200842014

119 、 219 間隙 122 > 222 壓緊元件 123 、 223 壓銷 206 鑽孔 209 處置設備 211 箭頭方向 220 位置偵測設備 221 額外處置設備 224 感應器元件 225 鉸鏈 226 箭頭 227 自由端 228 另一自由端 229 接近開關 230 箭頭方向 α 傾角 127488.doc -32-119, 219 Clearance 122 > 222 Pressing element 123, 223 Press pin 206 Drill hole 209 Disposal device 211 Arrow direction 220 Position detecting device 221 Additional handling device 224 Inductor element 225 Hinge 226 Arrow 227 Free end 228 Another free end 229 proximity switch 230 arrow direction α inclination 127488.doc -32-

Claims (1)

200842014 十、申請專利範圍: 1· 一種用於隔離及搬運片狀基體之裝置,其中,該裝置主 要包含以下組件群: -一配置於一流體内之承載設備(1〇4 ; 204),其中該等 個別基體(102 ; 202)於饋送方向(1〇5 ; 205)上前後依 次配置成一基體堆疊(103 ; 203)之形式, -一用於隔離及搬運至少一基體(丨〇2; 202)之取料設備 (107 ; 207),其中,該取料設備(107 ; 207)包含一抓 持器(108 ; 208),該抓持器(108 ; 208)具有可抓取該 基體(102 ; 202)並將該基體(102 ; 2〇2)運離該承載設 備(104 ; 204)之構件, -一用於使该基體堆疊(1〇3; 203)之至少一部分散開之 通流設備(117 ; 217),及 -一反作用於該等散開之基體(1〇2 ; 202)之壓緊元件 (122 ; 222)〇 2.如明求項1之裝置,其特徵在於,該壓緊元件(122 ; 222) 包含複數個壓鎖(123 ; 223),該等壓銷(123 ; 223)壓抵 該待隔離基體(102 ; 202)之表面。 3·如請求項1或2之裝置,其特徵在於,一位置偵測設備 (220)經提供以用於偵測至少該待隔離基體幻之位 4·如明求項1之裝置,其特徵在於,該抓持器(1⑽;2〇8)經 設計使得該待隔離基體⑽;搬)之移除垂直於或至少 大致垂直於該饋送方向(105 ; 2〇5)而進行。 127488.doc 200842014 5.如請求項4之裝置,其特徵在 離基體⑽;202)之平面而進行。⑨千灯於該待隔 6·如巧求項1或4之裝置,直胜外+ 2〇8)且右„ -特徵在於,該抓持器(1〇8; 〜有開口,經由該等開 7. 如請求項叫之M 或排㈣體。 抓括〜 八特徵在於,在—俯視圖中,該 抓持态(108 ; 208W系形ι , 形成為杆形、指形、0形、u形、V 形或具有一扁平形狀。 8. 之裝置’其特徵在於,該承载設備⑽;2〇4) 禮株可糟以使該待隔離基體〇〇2;叫沿一傾角以定向之 構仵。 9.如請求項8之裝置,其特徵在於,該傾角《係以-如下方 =加以選擇:使得該饋送方向⑽;2G5)與該等個別基 -2,2〇2)之更多地指向該饋送方向之該基體表面的 表法線之間的夾角為正角,從而等效於該等基體之一 向後傾斜。200842014 X. Patent application scope: 1. A device for isolating and transporting a sheet-like substrate, wherein the device mainly comprises the following component groups: - a carrier device (1〇4; 204) disposed in a first-class body, wherein The individual substrates (102; 202) are sequentially arranged in the feed direction (1〇5; 205) in the form of a matrix stack (103; 203), one for isolating and transporting at least one substrate (丨〇2; 202) a reclaiming device (107; 207), wherein the reclaiming device (107; 207) comprises a gripper (108; 208) having a grippable body (102) 202) transporting the substrate (102; 2〇2) away from the member of the carrying device (104; 204), a flow-through device for dispersing at least a portion of the substrate stack (1〇3; 203) (117; 217), and - a pressing member (122; 222) responsive to the diffused substrate (1〇2; 202). The device of claim 1, characterized in that the compacting The component (122; 222) includes a plurality of press locks (123; 223), and the press pins (123; 223) are pressed against the substrate to be isolated (102; 202) The surface. 3. The device of claim 1 or 2, characterized in that a position detecting device (220) is provided for detecting at least the device of the base to be isolated 4, such as the device of claim 1, characterized in that The gripper (1(10); 2〇8) is designed such that the removal of the substrate (10) to be isolated is performed perpendicularly or at least substantially perpendicular to the feed direction (105; 2〇5). 127488.doc 200842014 5. The device of claim 4, characterized by being in the plane of the substrate (10); 202). 9 thousand lights in the waiting room 6 · such as the device 1 or 4, straight out + 2 〇 8) and right „ - feature is that the gripper (1 〇 8; ~ has an opening through these Open 7. If the request item is called M or row (four) body. Grab the bracket ~ 八 is characterized by, in the top view, the grip state (108; 208W line shape ι , formed into a rod shape, a finger shape, a 0 shape, a u Shape, V-shape or have a flat shape. 8. The device 'is characterized in that the carrying device (10); 2〇4) can be used to make the substrate to be isolated 〇〇2; 9. The device of claim 8, wherein the inclination is selected by - as follows: such that the feed direction (10); 2G5) and the individual bases - 2, 2 〇 2) The angle between the normal to the surface of the substrate directed to the feed direction is a positive angle, thereby being equivalent to tilting one of the substrates backward. 10·如請求項1之裝置,i ^ ^ 双直具特彳政在於,該承載設備(1〇4 ; 2〇4) 可在至少一方向上移動。 月长貢1G之裝置’其特徵在於,該承載設備(104 ; 2〇4)及/或該基體堆*⑽;2〇3)可朝該壓緊元件(m ; 222)移動。 12.如明求項1〇之裝置’其特徵在於,該承載設備(2〇4)及/ 或4基體堆豐(203)可朝該位置偵測元件(22〇)移動。 13·如明求項1之裝置,其特徵在於,其進一步包含一搬運 口又備(113,213) ’該搬運設備(113 ; 213)配置於具有該等 127488.doc 200842014 待隔離基體(102 ; 202)之該基體堆疊(103 ; 203)上方。 14·如明求項3之裝置,其特徵在於,該位置偵測設備(220) ^ ^ 感應器(222),該感應器(222)用於檢查一基體 (202)之接觸。10. According to the device of claim 1, i ^ ^ is a direct stipulation that the carrying device (1〇4; 2〇4) can move in at least one direction. The device of the moon long 1G is characterized in that the carrying device (104; 2〇4) and/or the base stack*(10); 2〇3) are movable towards the pressing member (m; 222). 12. The device of claim 1 wherein the carrier device (2〇4) and/or the 4 substrate stack (203) are movable toward the position detecting element (22〇). 13. The device of claim 1, further comprising a port (113, 213) 'the handling device (113; 213) is configured to have a substrate to be isolated (102488.doc 200842014) 202) above the substrate stack (103; 203). 14. The device of claim 3, wherein the position detecting device (220) is a sensor (222) for inspecting contact of a substrate (202). 如明求項2之裝置,其特徵在於,該壓緊元件(122 ·,222) 係以一如下方式配置:可使該抓持器(108 ; 208)定位於 該壓緊元件(122 ; 222)之麗銷(123 ; 223)之間。 種使用一裝置來散開、隔離及搬運片狀基體之方法, 5亥瓜置主要包含以下組件群: -一配置於一流體内之承載設備(1〇4 ; 2〇4),其中該等 個別基體(102 ; 202)於饋送方向(1〇5 ; 2〇5)上前後依 次配置成一基體堆疊(1〇3 ; 2〇3)之形式, -一用於隔離及搬運至少一基體(1〇2; 2〇2)之取料設備 (107 , 207),其中,該取料設備(1〇7 ; 2〇7)包含一抓 持(108 ; 208),該抓持器(1〇8;2〇8)具有可抓取該 基體(102 ; 202)並將該基體(1〇2 ; 2〇2)運離該承載設 備(104 ; 204)之構件, -一用於使該基體堆疊(1〇3 ; 2〇3)之至少一部分散開之 通流設備(117 ; 217),及 _ 一反作用於該等散開之基體(1〇2 ; 2〇2)之壓緊元件 (122 ; 222), 其中,該方法包含以下步驟: a.與該基體堆疊(1〇3 ; 2〇3)一起在該饋送方向(1〇5 ; 2〇5)上朝該壓緊元件(m ; us)移動該承載設備 127488.doc 200842014 (104204),或者在該饋送方向(1〇5 ; 2〇5)上朝該壓 緊元件(123 ; 223)移動具有該基體堆疊(1〇3 ; 2〇3)之 該承載設備(104 ; 204),以便達成一用於該待隔離基 體(102 ; 202)之取料位置, b.藉由一通流設備(117 ; 217)以一產生間隙(119 ; 219)之 方式使該基體堆疊(103 ; 203)之至少一區域散開, c·隔離該基體,該隔離係藉由: -對該抓持器(108; 208)進行定位,使其幾乎平行於該 基體(102 ; 202)之平面設計, -於基體(102 ; 202)與抓持器(108 ; 2〇8)之間建立一黏 著接觸,及 •为別垂直於該饋送方向(1〇5 ; 205)或平行於該等基體 (102 ; 202)之該平面設計而於該流體内移除該基體 (102 ; 202)。 17·如明求項16之方法,其特徵在於,由於藉由該通流設備 (117,217)之該散開而於該基體堆疊(1〇3;2〇3)内產生間 隙(119 ; 219),且由於該通流設備(117 ; 217)之流體流而 於該等間隙(119 ; 219)内產生流體墊,該等流體墊在該 待隔離基體(102 ; 202)與該抓持器(〗08 ; 208)接觸時對 該待隔離基體(102 ; 202)施加一減震效應。 127488.docThe device of claim 2, wherein the pressing member (122, 222) is configured in such a manner that the gripper (108; 208) can be positioned at the pressing member (122; 222). ) between the sales (123; 223). A method for using a device to disperse, isolate, and carry a sheet-like substrate. The 5 Haigua set mainly includes the following component groups: - a carrying device (1〇4; 2〇4) disposed in a first-class body, wherein the individual The base body (102; 202) is arranged in the form of a base stack (1〇3; 2〇3) in the feeding direction (1〇5; 2〇5), and is used for isolating and transporting at least one substrate (1〇) 2; 2〇2) reclaiming device (107, 207), wherein the reclaiming device (1〇7; 2〇7) comprises a grip (108; 208), the gripper (1〇8; 2〇8) having a member capable of grasping the substrate (102; 202) and transporting the substrate (1〇2; 2〇2) away from the carrying device (104; 204), one for stacking the substrate ( 1〇3; 2〇3) at least a portion of the diffused flow device (117; 217), and _ a pressing element (122; 222) that counteracts the diffused substrate (1〇2; 2〇2) Wherein the method comprises the steps of: a. moving along the substrate stack (1〇3; 2〇3) in the feed direction (1〇5; 2〇5) towards the pressing element (m; us) The carrying device 127488.doc 2008 42014 (104204), or moving the carrying device (104) having the base stack (1〇3; 2〇3) toward the pressing member (123; 223) in the feeding direction (1〇5; 2〇5) 204) in order to achieve a reclaiming position for the substrate to be isolated (102; 202), b. stacking the substrate by a flow-through device (117; 217) in a manner to create a gap (119; 219) At least one region of (103; 203) is separated, c. isolating the substrate by: - positioning the gripper (108; 208) to be nearly parallel to the substrate (102; 202) Graphic design, - establishing an adhesive contact between the substrate (102; 202) and the gripper (108; 2〇8), and • being perpendicular to the feed direction (1〇5; 205) or parallel to the The plane of the substrate (102; 202) is designed to remove the substrate (102; 202) within the fluid. 17. The method of claim 16, wherein the gap is created in the substrate stack (1〇3; 2〇3) by the scattering of the flow-through device (117, 217) (119; 219 And generating a fluid pad in the gaps (119; 219) due to the fluid flow of the flow through device (117; 217), the fluid pads being on the substrate to be isolated (102; 202) and the gripper (〖08; 208) A shock absorption effect is applied to the substrate to be isolated (102; 202) upon contact. 127488.doc
TW096148137A 2006-12-15 2007-12-14 Apparatus and method for separating and transporting substrates TW200842014A (en)

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