TW200602561A - Vacuum pumping system, driving method thereof, apparatus having the same, and method of transferring substrate using the same - Google Patents

Vacuum pumping system, driving method thereof, apparatus having the same, and method of transferring substrate using the same

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Publication number
TW200602561A
TW200602561A TW094106978A TW94106978A TW200602561A TW 200602561 A TW200602561 A TW 200602561A TW 094106978 A TW094106978 A TW 094106978A TW 94106978 A TW94106978 A TW 94106978A TW 200602561 A TW200602561 A TW 200602561A
Authority
TW
Taiwan
Prior art keywords
same
pumping system
vacuum pumping
transferring substrate
driving method
Prior art date
Application number
TW094106978A
Other languages
Chinese (zh)
Other versions
TWI370874B (en
Inventor
Hong-Seub Kim
Hyun-Soo Park
Soon-Bin Jung
Sung-Ho Cha
Dong-Jin Kim
Wook-Jung Hwang
Jin-Hyuk Yoo
Original Assignee
Jusung Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jusung Eng Co Ltd filed Critical Jusung Eng Co Ltd
Publication of TW200602561A publication Critical patent/TW200602561A/en
Application granted granted Critical
Publication of TWI370874B publication Critical patent/TWI370874B/en

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental Sciences (AREA)
  • Marine Sciences & Fisheries (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

An apparatus includes a transfer unit under an atmospheric condition and having a robot therein; and at least one process chamber connected to one side of the transfer unit with a slot valve therebetween, and being alternately under a vacuum condition and under an atmospheric condition.
TW094106978A 2004-03-08 2005-03-08 Vacuum pumping system, driving method thereof, apparatus having the same, and method of transferring substrate using the same TWI370874B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20040015544 2004-03-08
KR20040017627 2004-03-16
KR20040017832 2004-03-17
KR1020050014819A KR101118914B1 (en) 2004-03-08 2005-02-23 Vacuum pumping system and method, and process apparatus using the same

Publications (2)

Publication Number Publication Date
TW200602561A true TW200602561A (en) 2006-01-16
TWI370874B TWI370874B (en) 2012-08-21

Family

ID=37148687

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106978A TWI370874B (en) 2004-03-08 2005-03-08 Vacuum pumping system, driving method thereof, apparatus having the same, and method of transferring substrate using the same

Country Status (2)

Country Link
KR (1) KR101118914B1 (en)
TW (1) TWI370874B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113161264A (en) * 2021-04-13 2021-07-23 上海广川科技有限公司 Sealing air pumping and discharging system and method for wafer transmission

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790789B1 (en) * 2006-07-03 2008-01-02 코닉시스템 주식회사 Semiconductor manufacturing apparatus
KR100839189B1 (en) * 2007-03-06 2008-06-17 세메스 주식회사 Semiconductor manufacturing apparatus and method for transporting substrate to process chamber of the semiconductor manufacturing apparatus
US20180061679A1 (en) * 2016-08-25 2018-03-01 Applied Materials, Inc. Multi chamber processing system with shared vacuum system
KR102241606B1 (en) * 2019-06-27 2021-04-20 세메스 주식회사 Apparatus and method for treating substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100274308B1 (en) * 1994-05-23 2001-01-15 히가시 데쓰로 Multi Chamber Processing System
KR100252213B1 (en) * 1997-04-22 2000-05-01 윤종용 Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device using the same
KR100417245B1 (en) * 2001-05-02 2004-02-05 주성엔지니어링(주) Cluster tool for manufacturing a wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113161264A (en) * 2021-04-13 2021-07-23 上海广川科技有限公司 Sealing air pumping and discharging system and method for wafer transmission

Also Published As

Publication number Publication date
KR101118914B1 (en) 2012-02-27
TWI370874B (en) 2012-08-21
KR20060043107A (en) 2006-05-15

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees