WO2009037754A1 - Substrate transfer system - Google Patents

Substrate transfer system Download PDF

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Publication number
WO2009037754A1
WO2009037754A1 PCT/JP2007/068187 JP2007068187W WO2009037754A1 WO 2009037754 A1 WO2009037754 A1 WO 2009037754A1 JP 2007068187 W JP2007068187 W JP 2007068187W WO 2009037754 A1 WO2009037754 A1 WO 2009037754A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrates
conveyer
transfer system
processing apparatus
storing cassettes
Prior art date
Application number
PCT/JP2007/068187
Other languages
French (fr)
Japanese (ja)
Inventor
Takehiko Hori
Toshiharu Tanaka
Original Assignee
Hirata Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corporation filed Critical Hirata Corporation
Priority to CN2007801007148A priority Critical patent/CN101801816B/en
Priority to JP2009532987A priority patent/JP4933625B2/en
Priority to KR1020107008263A priority patent/KR101215591B1/en
Priority to PCT/JP2007/068187 priority patent/WO2009037754A1/en
Priority to TW097135561A priority patent/TWI403450B/en
Publication of WO2009037754A1 publication Critical patent/WO2009037754A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

Provided is a substrate transfer system for transferring substrates between first and second storing cassettes which store substrates, and a processing apparatus. The processing apparatus is separately arranged from the first and the second storing cassettes in a direction orthogonally intersecting with the arrangement direction of the first and the second storing cassettes, and processes the substrates. The substrate transfer system is provided with a simultaneous transfer conveyer which transfers a plurality of substrates at the same time; a conveyer moving means which moves the simultaneous transfer conveyer between the first and the second storing cassettes; a separate transfer conveyer which separately transfers the substrates; and an aligning means for aligning the substrate on the separate transfer conveyer with the processing apparatus.
PCT/JP2007/068187 2007-09-19 2007-09-19 Substrate transfer system WO2009037754A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2007801007148A CN101801816B (en) 2007-09-19 2007-09-19 Substrate transfer system
JP2009532987A JP4933625B2 (en) 2007-09-19 2007-09-19 Substrate transfer system
KR1020107008263A KR101215591B1 (en) 2007-09-19 2007-09-19 substrate transfer system
PCT/JP2007/068187 WO2009037754A1 (en) 2007-09-19 2007-09-19 Substrate transfer system
TW097135561A TWI403450B (en) 2007-09-19 2008-09-17 Substrate handling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/068187 WO2009037754A1 (en) 2007-09-19 2007-09-19 Substrate transfer system

Publications (1)

Publication Number Publication Date
WO2009037754A1 true WO2009037754A1 (en) 2009-03-26

Family

ID=40467585

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/068187 WO2009037754A1 (en) 2007-09-19 2007-09-19 Substrate transfer system

Country Status (5)

Country Link
JP (1) JP4933625B2 (en)
KR (1) KR101215591B1 (en)
CN (1) CN101801816B (en)
TW (1) TWI403450B (en)
WO (1) WO2009037754A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101857126A (en) * 2009-04-06 2010-10-13 株式会社Ihi Substrate classifying device
JP2013231962A (en) * 2012-04-06 2013-11-14 Nsk Technology Co Ltd Exposure device and exposure method
TWI448861B (en) * 2012-02-29 2014-08-11 Chia Nan Wang Shorten the handling time of handling time
CN114275538A (en) * 2020-10-01 2022-04-05 日本电产三协株式会社 Conveying system

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5912764B2 (en) 2012-03-29 2016-04-27 平田機工株式会社 Transport unit and transport device
CN107546163A (en) * 2016-06-24 2018-01-05 沈阳新松机器人自动化股份有限公司 A kind of wafer transportation resources, wafer conveying arrangement and system
CN114074831B (en) * 2022-01-20 2022-06-03 百信信息技术有限公司 Assembly production line

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01290299A (en) * 1988-05-18 1989-11-22 Sanyo Electric Co Ltd Apparatus for supplying and containing boards
JP2004284772A (en) * 2003-03-24 2004-10-14 Toshiba Mitsubishi-Electric Industrial System Corp Board transporting system
JP2005060110A (en) * 2003-08-11 2005-03-10 Chi Mei Optoelectronics Corp Substrate feeder for sequential type substrate cassette
JP2005170675A (en) * 2003-11-21 2005-06-30 Ishikawajima Harima Heavy Ind Co Ltd Substrate carrying device, substrate storage and carrying device, substrate carrying-in system, substrate carrying-out system, and substrate carrying-in/carrying-out system
JP2007036227A (en) * 2005-07-22 2007-02-08 Au Optronics Corp Substrate storage cassette, transfer conveyor, and transfer system employing them
WO2007029401A1 (en) * 2005-09-02 2007-03-15 Hirata Corporation Work loading/unloading system and conveyance device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4329035B2 (en) * 2004-08-18 2009-09-09 株式会社ダイフク Article conveying device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01290299A (en) * 1988-05-18 1989-11-22 Sanyo Electric Co Ltd Apparatus for supplying and containing boards
JP2004284772A (en) * 2003-03-24 2004-10-14 Toshiba Mitsubishi-Electric Industrial System Corp Board transporting system
JP2005060110A (en) * 2003-08-11 2005-03-10 Chi Mei Optoelectronics Corp Substrate feeder for sequential type substrate cassette
JP2005170675A (en) * 2003-11-21 2005-06-30 Ishikawajima Harima Heavy Ind Co Ltd Substrate carrying device, substrate storage and carrying device, substrate carrying-in system, substrate carrying-out system, and substrate carrying-in/carrying-out system
JP2007036227A (en) * 2005-07-22 2007-02-08 Au Optronics Corp Substrate storage cassette, transfer conveyor, and transfer system employing them
WO2007029401A1 (en) * 2005-09-02 2007-03-15 Hirata Corporation Work loading/unloading system and conveyance device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101857126A (en) * 2009-04-06 2010-10-13 株式会社Ihi Substrate classifying device
CN101857126B (en) * 2009-04-06 2012-07-11 株式会社Ihi Substrate classifying device
TWI448861B (en) * 2012-02-29 2014-08-11 Chia Nan Wang Shorten the handling time of handling time
JP2013231962A (en) * 2012-04-06 2013-11-14 Nsk Technology Co Ltd Exposure device and exposure method
CN114275538A (en) * 2020-10-01 2022-04-05 日本电产三协株式会社 Conveying system
CN114275538B (en) * 2020-10-01 2024-01-16 日本电产三协株式会社 Conveying system

Also Published As

Publication number Publication date
KR20100068443A (en) 2010-06-23
KR101215591B1 (en) 2012-12-26
TW200918426A (en) 2009-05-01
CN101801816B (en) 2012-08-22
TWI403450B (en) 2013-08-01
JPWO2009037754A1 (en) 2011-01-06
CN101801816A (en) 2010-08-11
JP4933625B2 (en) 2012-05-16

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