JP6895126B2 - 半導体パッケージ - Google Patents

半導体パッケージ Download PDF

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Publication number
JP6895126B2
JP6895126B2 JP2018060114A JP2018060114A JP6895126B2 JP 6895126 B2 JP6895126 B2 JP 6895126B2 JP 2018060114 A JP2018060114 A JP 2018060114A JP 2018060114 A JP2018060114 A JP 2018060114A JP 6895126 B2 JP6895126 B2 JP 6895126B2
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JP
Japan
Prior art keywords
sealing resin
semiconductor package
package according
lid
internal wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018060114A
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English (en)
Japanese (ja)
Other versions
JP2019175923A (ja
JP2019175923A5 (https=
Inventor
義貴 大坪
義貴 大坪
正之 安藤
正之 安藤
孝太 大原
孝太 大原
敬雅 小田
敬雅 小田
琢郎 森
琢郎 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2018060114A priority Critical patent/JP6895126B2/ja
Priority to US16/188,772 priority patent/US10593605B2/en
Priority to DE102019201158.6A priority patent/DE102019201158B4/de
Priority to CN201910221792.8A priority patent/CN110310930B/zh
Publication of JP2019175923A publication Critical patent/JP2019175923A/ja
Publication of JP2019175923A5 publication Critical patent/JP2019175923A5/ja
Application granted granted Critical
Publication of JP6895126B2 publication Critical patent/JP6895126B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Fuses (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
JP2018060114A 2018-03-27 2018-03-27 半導体パッケージ Active JP6895126B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018060114A JP6895126B2 (ja) 2018-03-27 2018-03-27 半導体パッケージ
US16/188,772 US10593605B2 (en) 2018-03-27 2018-11-13 Semiconductor package
DE102019201158.6A DE102019201158B4 (de) 2018-03-27 2019-01-30 Halbleiterbaugruppe
CN201910221792.8A CN110310930B (zh) 2018-03-27 2019-03-22 半导体封装件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018060114A JP6895126B2 (ja) 2018-03-27 2018-03-27 半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2019175923A JP2019175923A (ja) 2019-10-10
JP2019175923A5 JP2019175923A5 (https=) 2020-08-20
JP6895126B2 true JP6895126B2 (ja) 2021-06-30

Family

ID=67910315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018060114A Active JP6895126B2 (ja) 2018-03-27 2018-03-27 半導体パッケージ

Country Status (4)

Country Link
US (1) US10593605B2 (https=)
JP (1) JP6895126B2 (https=)
CN (1) CN110310930B (https=)
DE (1) DE102019201158B4 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11527456B2 (en) * 2019-10-31 2022-12-13 Ut-Battelle, Llc Power module with organic layers
JP7209615B2 (ja) * 2019-11-13 2023-01-20 三菱電機株式会社 半導体装置
WO2021195871A1 (zh) * 2020-03-30 2021-10-07 华为技术有限公司 埋入式基板、电路板组件及电子设备
JP7735655B2 (ja) * 2020-10-15 2025-09-09 富士電機株式会社 半導体装置
JP7784974B2 (ja) * 2022-09-08 2025-12-12 三菱電機株式会社 半導体装置の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233953A (ja) * 1988-07-22 1990-02-05 Mitsubishi Electric Corp 半導体装置
JP3506733B2 (ja) * 1993-07-09 2004-03-15 ローム株式会社 安全ヒューズ付き面実装型電子部品の構造
JP3019679B2 (ja) * 1993-09-08 2000-03-13 富士電機株式会社 半導体装置の内部配線構造
US5744860A (en) 1996-02-06 1998-04-28 Asea Brown Boveri Ag Power semiconductor module
JPH1012806A (ja) * 1996-06-24 1998-01-16 Toshiba Corp 半導体装置
DE19639279C2 (de) * 1996-09-25 2002-01-17 Daimlerchrysler Rail Systems Stromrichterschaltung
JP2000138107A (ja) 1998-11-04 2000-05-16 Mitsubishi Materials Corp 半導体サージ吸収素子
JP3778268B2 (ja) * 2001-03-21 2006-05-24 オムロン株式会社 過電流遮断構造の製造方法
JP4615289B2 (ja) * 2004-11-12 2011-01-19 三菱電機株式会社 半導体装置
US20070075822A1 (en) * 2005-10-03 2007-04-05 Littlefuse, Inc. Fuse with cavity forming enclosure
JP2008235502A (ja) * 2007-03-20 2008-10-02 Mitsubishi Electric Corp 樹脂封止型半導体装置
CN104112730A (zh) * 2013-06-09 2014-10-22 广东美的制冷设备有限公司 智能功率模块及其制造方法
JP6916997B2 (ja) * 2016-03-17 2021-08-11 富士電機株式会社 半導体装置
JP6627698B2 (ja) * 2016-09-13 2020-01-08 三菱電機株式会社 半導体装置
JP2018060114A (ja) 2016-10-07 2018-04-12 キヤノン株式会社 投影型表示装置
US9865537B1 (en) * 2016-12-30 2018-01-09 Texas Instruments Incorporated Methods and apparatus for integrated circuit failsafe fuse package with arc arrest

Also Published As

Publication number Publication date
JP2019175923A (ja) 2019-10-10
US20190304859A1 (en) 2019-10-03
DE102019201158A1 (de) 2019-10-02
CN110310930A (zh) 2019-10-08
DE102019201158B4 (de) 2022-01-27
US10593605B2 (en) 2020-03-17
CN110310930B (zh) 2023-06-30

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