CN110310930B - 半导体封装件 - Google Patents

半导体封装件 Download PDF

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Publication number
CN110310930B
CN110310930B CN201910221792.8A CN201910221792A CN110310930B CN 110310930 B CN110310930 B CN 110310930B CN 201910221792 A CN201910221792 A CN 201910221792A CN 110310930 B CN110310930 B CN 110310930B
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China
Prior art keywords
semiconductor package
resin
cover
package according
internal wiring
Prior art date
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Active
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CN201910221792.8A
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English (en)
Chinese (zh)
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CN110310930A (zh
Inventor
大坪义贵
安藤正之
大原孝太
小田敬雅
森琢郎
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
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Publication of CN110310930A publication Critical patent/CN110310930A/zh
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Fuses (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
CN201910221792.8A 2018-03-27 2019-03-22 半导体封装件 Active CN110310930B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018060114A JP6895126B2 (ja) 2018-03-27 2018-03-27 半導体パッケージ
JP2018-060114 2018-03-27

Publications (2)

Publication Number Publication Date
CN110310930A CN110310930A (zh) 2019-10-08
CN110310930B true CN110310930B (zh) 2023-06-30

Family

ID=67910315

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910221792.8A Active CN110310930B (zh) 2018-03-27 2019-03-22 半导体封装件

Country Status (4)

Country Link
US (1) US10593605B2 (https=)
JP (1) JP6895126B2 (https=)
CN (1) CN110310930B (https=)
DE (1) DE102019201158B4 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11527456B2 (en) * 2019-10-31 2022-12-13 Ut-Battelle, Llc Power module with organic layers
JP7209615B2 (ja) * 2019-11-13 2023-01-20 三菱電機株式会社 半導体装置
WO2021195871A1 (zh) * 2020-03-30 2021-10-07 华为技术有限公司 埋入式基板、电路板组件及电子设备
JP7735655B2 (ja) * 2020-10-15 2025-09-09 富士電機株式会社 半導体装置
JP7784974B2 (ja) * 2022-09-08 2025-12-12 三菱電機株式会社 半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012806A (ja) * 1996-06-24 1998-01-16 Toshiba Corp 半導体装置
US5859772A (en) * 1996-09-25 1999-01-12 Abb Daimler-Benz Transportation (Technology) Gmbh Parallel connection of controllable semiconductor components
CN104112730A (zh) * 2013-06-09 2014-10-22 广东美的制冷设备有限公司 智能功率模块及其制造方法
CN107818950A (zh) * 2016-09-13 2018-03-20 三菱电机株式会社 半导体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233953A (ja) * 1988-07-22 1990-02-05 Mitsubishi Electric Corp 半導体装置
JP3506733B2 (ja) * 1993-07-09 2004-03-15 ローム株式会社 安全ヒューズ付き面実装型電子部品の構造
JP3019679B2 (ja) * 1993-09-08 2000-03-13 富士電機株式会社 半導体装置の内部配線構造
US5744860A (en) 1996-02-06 1998-04-28 Asea Brown Boveri Ag Power semiconductor module
JP2000138107A (ja) 1998-11-04 2000-05-16 Mitsubishi Materials Corp 半導体サージ吸収素子
JP3778268B2 (ja) * 2001-03-21 2006-05-24 オムロン株式会社 過電流遮断構造の製造方法
JP4615289B2 (ja) * 2004-11-12 2011-01-19 三菱電機株式会社 半導体装置
US20070075822A1 (en) * 2005-10-03 2007-04-05 Littlefuse, Inc. Fuse with cavity forming enclosure
JP2008235502A (ja) * 2007-03-20 2008-10-02 Mitsubishi Electric Corp 樹脂封止型半導体装置
JP6916997B2 (ja) * 2016-03-17 2021-08-11 富士電機株式会社 半導体装置
JP2018060114A (ja) 2016-10-07 2018-04-12 キヤノン株式会社 投影型表示装置
US9865537B1 (en) * 2016-12-30 2018-01-09 Texas Instruments Incorporated Methods and apparatus for integrated circuit failsafe fuse package with arc arrest

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012806A (ja) * 1996-06-24 1998-01-16 Toshiba Corp 半導体装置
US5859772A (en) * 1996-09-25 1999-01-12 Abb Daimler-Benz Transportation (Technology) Gmbh Parallel connection of controllable semiconductor components
CN104112730A (zh) * 2013-06-09 2014-10-22 广东美的制冷设备有限公司 智能功率模块及其制造方法
CN107818950A (zh) * 2016-09-13 2018-03-20 三菱电机株式会社 半导体装置

Also Published As

Publication number Publication date
JP2019175923A (ja) 2019-10-10
US20190304859A1 (en) 2019-10-03
JP6895126B2 (ja) 2021-06-30
DE102019201158A1 (de) 2019-10-02
CN110310930A (zh) 2019-10-08
DE102019201158B4 (de) 2022-01-27
US10593605B2 (en) 2020-03-17

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