JP6877319B2 - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JP6877319B2 JP6877319B2 JP2017220209A JP2017220209A JP6877319B2 JP 6877319 B2 JP6877319 B2 JP 6877319B2 JP 2017220209 A JP2017220209 A JP 2017220209A JP 2017220209 A JP2017220209 A JP 2017220209A JP 6877319 B2 JP6877319 B2 JP 6877319B2
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- insulating film
- film
- semiconductor device
- gate electrode
- insulating
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
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Description
<シングルゲート型のメモリ素子>
本実施の形態の半導体装置を図面を参照して説明する。図1は、本実施の形態の半導体装置の要部断面図である。図2は、図1の半導体装置の一部を拡大して示した部分拡大断面図である。
上記「シングルゲート型のメモリ素子」の欄では、本実施の形態をシングルゲート型のメモリ素子に適用した場合について説明したが、ここでは、本実施の形態を、スプリットゲート型のメモリ素子に適用した場合について説明する。
次に、本発明者の検討の経緯について説明する。
本実施の形態の半導体装置は、半導体基板SBと、半導体基板SB上に形成されたメモリ素子(MC1,MC2)用のゲート絶縁膜である絶縁膜MZと、絶縁膜MZ上に形成されたメモリ素子(MC1,MC2)用のゲート電極(MG1,MG2)とを有している。絶縁膜MZは、絶縁膜MZ1(第1絶縁膜)と、絶縁膜MZ1上の絶縁膜MZ2(第2絶縁膜)と、絶縁膜MZ2上の絶縁膜MZ3(第3絶縁膜)と、絶縁膜MZ3上の絶縁膜MZ4(第4絶縁膜)と、絶縁膜MZ4上の絶縁膜MZ5(第5絶縁膜)とを有し、絶縁膜MZ2は、電荷蓄積機能を有する絶縁膜である。絶縁膜MZ1および絶縁膜MZ3のそれぞれのバンドギャップは、絶縁膜MZ2のバンドギャップよりも大きい。そして、絶縁膜MZ3は、金属元素と酸素とを含有する高誘電率材料からなる多結晶膜であり、絶縁膜MZ5は、絶縁膜MZ3と同じ材料からなる多結晶膜であり、絶縁膜MZ4は、絶縁膜MZ3とは異なる材料からなる。このことは、上記図1および図2のメモリ素子MC1と上記図15のメモリ素子MC2とで共通である。すなわち、上記図1および図2のメモリ素子MC1の場合は、半導体基板SB上に、メモリ素子MC1用のゲート絶縁膜である絶縁膜MZを介して、メモリ素子MC1用のゲート電極MG1が形成され、上記図15のメモリ素子MC2の場合は、半導体基板SB上に、メモリ素子MC2用のゲート絶縁膜である絶縁膜MZを介して、メモリ素子MC2用のメモリゲート電極MG2が形成されている。
CT コンタクトホール
EX,EX1,EX2 n−型半導体領域
GB1,GB2,GB3,GB4,GB5,GB101 粒界
LK1,LK101 リーク経路
GF 絶縁膜
GR1,GR2,GR3,GR101 結晶粒
IL1,IL2 絶縁膜
MG1 ゲート電極
MG2 メモリゲート電極
MZ,MZ1,MZ2,MZ3,MZ4,MZ5 絶縁膜
MZ100 ゲート絶縁膜
MZ101 ボトム絶縁膜
MZ102 電荷蓄積膜
MZ103 トップ絶縁膜
PG プラグ
PS,PS1,PS2 シリコン膜
PS2a シリコンスペーサ
PW1,PW2 p型ウエル
M1 配線
MC1,MC2 メモリ素子
MD 半導体領域
MS 半導体領域
SB 半導体基板
SD,SD1,SD2 n+型半導体領域
SL 金属シリサイド層
SW サイドウォールスペーサ
Claims (16)
- 半導体基板と、
前記半導体基板上に形成された、メモリ素子用のゲート絶縁膜と、
前記ゲート絶縁膜上に形成された、前記メモリ素子用のゲート電極と、
を有し、
前記ゲート絶縁膜は、第1絶縁膜と、前記第1絶縁膜上の第2絶縁膜と、前記第2絶縁膜上の第3絶縁膜と、前記第3絶縁膜上の第4絶縁膜と、前記第4絶縁膜上の第5絶縁膜と、を有し、
前記第2絶縁膜は、電荷蓄積機能を有する絶縁膜であり、
前記第1絶縁膜および前記第3絶縁膜のそれぞれのバンドギャップは、前記第2絶縁膜のバンドギャップよりも大きく、
前記第3絶縁膜は、金属元素と酸素とを含有する高誘電率材料からなる多結晶膜であり、
前記第5絶縁膜は、前記第3絶縁膜と同じ材料からなる多結晶膜であり、
前記第4絶縁膜は、前記第3絶縁膜とは異なる材料からなり、かつ、非晶質膜である、半導体装置。 - 請求項1記載の半導体装置において、
前記第3絶縁膜は、酸化アルミニウム膜、酸窒化アルミニウム膜またはアルミニウムシリケート膜である、半導体装置。 - 請求項1記載の半導体装置において、
前記第3絶縁膜は、酸化アルミニウム膜である、半導体装置。 - 請求項1記載の半導体装置において、
前記第2絶縁膜は、ハフニウムと酸素とを含有する高誘電率材料からなる、半導体装置。 - 請求項1記載の半導体装置において、
前記第2絶縁膜は、酸化ハフニウム膜またはハフニウムシリケート膜である、半導体装置。 - 請求項1記載の半導体装置において、
前記第1絶縁膜は、酸化シリコン膜または酸窒化シリコン膜である、半導体装置。 - 請求項1記載の半導体装置において、
前記第3絶縁膜を構成する複数の第1結晶粒と、前記第5絶縁膜を構成する複数の第2結晶粒とは、前記第4絶縁膜によって離間されている、半導体装置。 - 請求項7記載の半導体装置において、
前記第3絶縁膜を構成する前記複数の第1結晶粒は、前記第2絶縁膜および前記第4絶縁膜に隣接する第3結晶粒を含み、
前記第5絶縁膜を構成する前記複数の第2結晶粒は、前記第4絶縁膜および前記ゲート電極に隣接する第4結晶粒を含む、半導体装置。 - 請求項1記載の半導体装置において、
前記第4絶縁膜は、酸化シリコン膜、酸窒化シリコン膜または窒化シリコン膜である、半導体装置。 - 請求項1記載の半導体装置において、
前記第4絶縁膜は、前記第3絶縁膜および前記第5絶縁膜のそれぞれよりも薄い、半導体装置。 - 請求項10記載の半導体装置において、
前記第4絶縁膜の厚さは、1nm以上である、半導体装置。 - 請求項11記載の半導体装置において、
前記第3絶縁膜および前記第5絶縁膜のそれぞれの厚さは、2nm以上である、半導体装置。 - 請求項10記載の半導体装置において、
前記第3絶縁膜は、前記第5絶縁膜よりも薄い、半導体装置。 - 請求項10記載の半導体装置において、
前記第5絶縁膜は、前記第3絶縁膜よりも薄い、半導体装置。 - メモリ素子を有する半導体装置の製造方法であって、
(a)半導体基板を用意する工程、
(b)前記半導体基板上に、前記メモリ素子のゲート絶縁膜用の積層膜であって、第1絶縁膜と、前記第1絶縁膜上の第2絶縁膜と、前記第2絶縁膜上の第3絶縁膜と、前記第3絶縁膜上の第4絶縁膜と、前記第4絶縁膜上の第5絶縁膜との前記積層膜を形成する工程、
(c)前記(b)工程後に、熱処理を行って、前記第3絶縁膜および前記第5絶縁膜を結晶化させる工程、
(d)前記(c)工程後に、前記積層膜上に、前記メモリ素子用のゲート電極を形成する工程、
を有し、
前記第2絶縁膜は、電荷蓄積機能を有する絶縁膜であり、
前記第1絶縁膜および前記第3絶縁膜のそれぞれのバンドギャップは、前記第2絶縁膜のバンドギャップよりも大きく、
前記第3絶縁膜は、金属元素と酸素とを含有する高誘電率材料からなり、
前記第5絶縁膜は、前記第3絶縁膜と同じ材料からなり、
前記第4絶縁膜は、前記第3絶縁膜とは異なる材料からなり、かつ、非晶質膜である、半導体装置の製造方法。 - 請求項15記載の半導体装置の製造方法において、
前記第3絶縁膜は、酸化アルミニウム膜、酸窒化アルミニウム膜またはアルミニウムシリケート膜である、半導体装置の製造方法。
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JP2019091820A (ja) | 2019-06-13 |
US20200251599A1 (en) | 2020-08-06 |
TWI776983B (zh) | 2022-09-11 |
CN109786449A (zh) | 2019-05-21 |
TW201935668A (zh) | 2019-09-01 |
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