JP6876637B2 - 成形型、樹脂成形装置及び樹脂成形品の製造方法 - Google Patents

成形型、樹脂成形装置及び樹脂成形品の製造方法 Download PDF

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Publication number
JP6876637B2
JP6876637B2 JP2018008487A JP2018008487A JP6876637B2 JP 6876637 B2 JP6876637 B2 JP 6876637B2 JP 2018008487 A JP2018008487 A JP 2018008487A JP 2018008487 A JP2018008487 A JP 2018008487A JP 6876637 B2 JP6876637 B2 JP 6876637B2
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Japan
Prior art keywords
resin
molding
mold
lower mold
molded
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JP2018008487A
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English (en)
Japanese (ja)
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JP2019126927A5 (ko
JP2019126927A (ja
Inventor
大西　洋平
洋平 大西
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Towa Corp
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Towa Corp
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Priority to JP2018008487A priority Critical patent/JP6876637B2/ja
Priority to KR1020180148683A priority patent/KR102192243B1/ko
Priority to TW107144013A priority patent/TWI718447B/zh
Priority to CN201811566727.0A priority patent/CN110065191B/zh
Priority to SG10201900307RA priority patent/SG10201900307RA/en
Publication of JP2019126927A publication Critical patent/JP2019126927A/ja
Publication of JP2019126927A5 publication Critical patent/JP2019126927A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B29C2043/3605—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/006—Using vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2018008487A 2018-01-22 2018-01-22 成形型、樹脂成形装置及び樹脂成形品の製造方法 Active JP6876637B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018008487A JP6876637B2 (ja) 2018-01-22 2018-01-22 成形型、樹脂成形装置及び樹脂成形品の製造方法
KR1020180148683A KR102192243B1 (ko) 2018-01-22 2018-11-27 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법
TW107144013A TWI718447B (zh) 2018-01-22 2018-12-07 成型模、樹脂成型裝置及樹脂成型品的製造方法
CN201811566727.0A CN110065191B (zh) 2018-01-22 2018-12-20 成型模、树脂成型装置及树脂成型品的制造方法
SG10201900307RA SG10201900307RA (en) 2018-01-22 2019-01-14 Molding die, resin molding apparatus, and method for producing a resin molded product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018008487A JP6876637B2 (ja) 2018-01-22 2018-01-22 成形型、樹脂成形装置及び樹脂成形品の製造方法

Publications (3)

Publication Number Publication Date
JP2019126927A JP2019126927A (ja) 2019-08-01
JP2019126927A5 JP2019126927A5 (ko) 2020-03-05
JP6876637B2 true JP6876637B2 (ja) 2021-05-26

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JP2018008487A Active JP6876637B2 (ja) 2018-01-22 2018-01-22 成形型、樹脂成形装置及び樹脂成形品の製造方法

Country Status (5)

Country Link
JP (1) JP6876637B2 (ko)
KR (1) KR102192243B1 (ko)
CN (1) CN110065191B (ko)
SG (1) SG10201900307RA (ko)
TW (1) TWI718447B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112428501B (zh) * 2020-10-29 2022-09-23 台州耘智科技有限公司 一种节能橡胶成型机

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3994705B2 (ja) * 2001-09-13 2007-10-24 松下電工株式会社 メモリーカードの製造方法
JP4953619B2 (ja) * 2005-11-04 2012-06-13 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP5539814B2 (ja) * 2010-08-30 2014-07-02 Ｔｏｗａ株式会社 基板露出面を備えた樹脂封止成形品の製造方法及び装置
JP5237346B2 (ja) * 2010-10-14 2013-07-17 Ｔｏｗａ株式会社 半導体チップの圧縮成形方法及び圧縮成形型
JP5799422B2 (ja) * 2011-02-14 2015-10-28 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置
JP5682033B2 (ja) * 2011-03-14 2015-03-11 アピックヤマダ株式会社 樹脂封止装置
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
SG11201508166RA (en) * 2013-05-29 2015-12-30 Apic Yamada Corp Resin molding apparatus and resin molding method
JP5694486B2 (ja) * 2013-11-12 2015-04-01 アピックヤマダ株式会社 樹脂封止装置
JP6307374B2 (ja) * 2014-07-22 2018-04-04 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
TWI689396B (zh) * 2014-07-22 2020-04-01 日商山田尖端科技股份有限公司 成形模具、成形裝置及成形品的製造方法
JP6525580B2 (ja) * 2014-12-24 2019-06-05 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
WO2017010319A1 (ja) * 2015-07-15 2017-01-19 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置
JP6438913B2 (ja) * 2015-07-15 2018-12-19 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置
JP6506680B2 (ja) * 2015-11-09 2019-04-24 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP2017177554A (ja) * 2016-03-30 2017-10-05 株式会社ケーヒン 回路装置、回路装置の製造装置及びその製造方法
JP2017212419A (ja) * 2016-05-27 2017-11-30 Ｔｏｗａ株式会社 樹脂封止品製造方法及び樹脂封止装置

Also Published As

Publication number Publication date
SG10201900307RA (en) 2019-08-27
CN110065191A (zh) 2019-07-30
TW201932273A (zh) 2019-08-16
JP2019126927A (ja) 2019-08-01
KR20190089711A (ko) 2019-07-31
CN110065191B (zh) 2021-12-03
KR102192243B1 (ko) 2020-12-16
TWI718447B (zh) 2021-02-11

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