JP6866662B2 - 圧電素子、圧電素子応用デバイス、及び圧電素子の製造方法 - Google Patents
圧電素子、圧電素子応用デバイス、及び圧電素子の製造方法 Download PDFInfo
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- JP6866662B2 JP6866662B2 JP2017018981A JP2017018981A JP6866662B2 JP 6866662 B2 JP6866662 B2 JP 6866662B2 JP 2017018981 A JP2017018981 A JP 2017018981A JP 2017018981 A JP2017018981 A JP 2017018981A JP 6866662 B2 JP6866662 B2 JP 6866662B2
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Images
Classifications
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
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- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
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- H—ELECTRICITY
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- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14258—Multi layer thin film type piezoelectric element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14419—Manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
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Description
かかる態様では、圧電体層における面内方向と膜厚方向の組成分布が均一な圧電素子とすることができる。また、圧電体層の膜厚方向の組成については、各圧電体膜内でカリウム及びナトリウムの濃度が傾斜するが、各圧電体膜の分布の形状と変動が全ての圧電体膜で略同一となるため、圧電体層全体としての均一性を確保した圧電素子を得ることができる。
かかる態様では、圧電・誘電特性が安定し、外部応力に対する強靭性(機械特性)を実現した圧電素子応用デバイスを提供できる。
かかる態様では、圧電体層における面内方向と膜厚方向の組成分布を均一にすることができる。また、圧電体層の膜厚方向の組成については、各圧電体膜内でカリウム及びナトリウムの濃度が傾斜するが、各圧電体膜の分布の形状と変動が全ての圧電体膜で略同一となるため、圧電体層全体としての均一性を確保することができる。
図1は、圧電素子応用デバイスの一例である記録ヘッドを備えた液体噴射装置の一例であるインクジェット式記録装置である。図示するように、インクジェット式記録装置(記録装置)Iにおいて、複数のインクジェット式記録ヘッドを有するインクジェット式記録ヘッドユニット(ヘッドユニット)IIとして、インク供給手段を構成するカートリッジ2A,2Bが着脱可能に設けられている。ヘッドユニットIIを搭載したキャリッジ3は、装置本体4に取り付けられたキャリッジ軸5に軸方向移動自在に設けられており、例えば各々ブラックインク組成物及びカラーインク組成物を吐出するものとされている。
(0.1≦X≦0.9)
(0.1≦x≦0.9、好ましくは0.3≦x≦0.7、より好ましくは0.35≦x≦0.55)
基板10となるシリコン基板の表面を熱酸化することで、シリコン基板上に二酸化シリコンからなる弾性膜51を形成した。次に、弾性膜51上にジルコニウム膜をスパッタリング法によって成膜し、ジルコニウム膜を熱酸化することで酸化ジルコニウムからなる絶縁体膜52を形成した。次に、絶縁体膜52上にチタン膜をスパッタリング法によって成膜し、チタン膜を熱酸化することで酸化チタンからなる密着層56を形成した。そして、密着層56上に白金をスパッタリング法によって成膜した後、所定形状にパターニングすることで厚さ50nmの第1電極60を形成した。
厚さが35nmの第1の圧電体膜71を形成し、7層の圧電体膜で構成された厚さが515nmとなる圧電体層70を形成したこと以外は実施例1と同様にして、実施例2の圧電体層70を形成した。
厚さが80nmの第1の圧電体膜71を形成し、7層の圧電体膜で構成された厚さが560nmとなる圧電体層70を形成したこと以外は実施例1と同様にして、比較例1の圧電体層70を形成した。
厚さが112nmの第1の圧電体膜71を形成し、7層の圧電体膜で構成された厚さが592nmとなる圧電体層70を形成したこと以外は実施例1と同様にして、比較例2の圧電体層70を形成した。
厚さが27nmの第1の圧電体膜71を形成し、7層の圧電体膜で構成された厚さが507nmとなる圧電体層70を形成したこと以外は実施例1と同様にして、比較例3の圧電体層70を形成した。
実施例1及び比較例1について、二次イオン質量分析法(SIMS:Secondary Ion Mass Spectrometry)により、各圧電体層70の表面側から第1電極60までのナトリウム(Na)及びカリウム(K)の深さ方向濃度プロファイルをそれぞれ測定した。図15に実施例1の圧電体層70、図16に比較例1の圧電体層70のSIMS分析プロファイルをそれぞれ示した。
実施例1、実施例2、及び比較例1〜比較例3について、X線回折(XRD:X−ray diffraction)法により、X線回折パターンの測定をそれぞれ行った。図17に実施例1及び比較例1のX線回折パターンを、図18に実施例1,2及び比較例2,3のX線回折パターンをそれぞれ示した。
NaNbO3の単体組成で形成した膜を550℃で焼成して成膜したサンプルa、KNbO3の単体組成で形成した膜を550℃で焼成して成膜したサンプルb、及び、KNbO3の単体組成で形成した膜を650℃で焼成して成膜したサンプルcについて、X線回折パターンの測定をそれぞれ行った。図19にサンプルaのX線回折パターンを、図20にサンプルbのX線回折パターンを、図21にサンプルcのX線回折パターンをそれぞれ示した。
以上、本発明の圧電材料や圧電素子、この圧電素子が搭載される液体噴射ヘッド及び液体噴射装置の一実施形態を説明したが、本発明の基本的構成は上記のものに限定されるものではない。
Claims (4)
- 第1電極と、
前記第1電極上に湿式法により形成され、カリウム、ナトリウム、及びニオブを含む第1の圧電体膜と、前記第1の圧電体膜上に湿式法により形成され、カリウム、ナトリウム、及びニオブを含む複数の第2の圧電体膜とからなる圧電体層と、
前記圧電体層上に形成された第2電極と
を有する圧電素子であって、
前記圧電体層は、複数の圧電体膜の積層体であり、
前記第1の圧電体膜は、30nm以上70nm以下の厚さを有し、
それぞれの前記圧電体膜内におけるナトリウムの濃度は膜厚方向に傾斜しており、前記第1電極側が高く、前記第2電極側が低いことを特徴とする圧電素子。 - チタン膜を介さずに前記第1電極上に形成された前記第1の圧電体膜を含むことを特徴とする請求項1に記載の圧電素子。
- 請求項1又は請求項2に記載の圧電素子を具備することを特徴とする圧電素子応用デバイス。
- 第1電極を形成する工程と、
前記第1電極上に、カリウム、ナトリウム、及びニオブを含む30nm以上70nm以下の厚さの第1の圧電体膜を湿式法で形成し、前記第1の圧電体膜上に、カリウム、ナトリウム、及びニオブを含む複数の第2の圧電体膜を湿式法で形成することによって、圧電体層を形成する工程と、
前記圧電体層上に第2電極を形成する工程と
を有し、
前記圧電体層を形成する工程では、それぞれの圧電体膜内におけるナトリウムの濃度は膜厚方向に傾斜しており、前記第1電極側が高く、前記第2電極側が低くなることを特徴とする圧電素子の製造方法。
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