JP6953810B2 - 圧電素子、及び圧電素子応用デバイス - Google Patents
圧電素子、及び圧電素子応用デバイス Download PDFInfo
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- JP6953810B2 JP6953810B2 JP2017114181A JP2017114181A JP6953810B2 JP 6953810 B2 JP6953810 B2 JP 6953810B2 JP 2017114181 A JP2017114181 A JP 2017114181A JP 2017114181 A JP2017114181 A JP 2017114181A JP 6953810 B2 JP6953810 B2 JP 6953810B2
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- layer
- piezoelectric
- perovskite
- electrode
- piezoelectric element
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/16—Production of nozzles
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- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
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- H—ELECTRICITY
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/802—Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits
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- H10N30/00—Piezoelectric or electrostrictive devices
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- H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
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- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
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Description
かかる態様では、リーク特性に優れた圧電素子応用デバイスを実現することができる。
図1は本発明の実施形態に係る圧電素子応用デバイスの一例である記録ヘッドを備えた液体噴射装置の一例であるインクジェット式記録装置である。図示するように、インクジェット式記録装置Iにおいて、複数のインクジェット式記録ヘッドを有するインクジェット式記録ヘッドユニット(ヘッドユニット)IIが、インク供給手段を構成するカートリッジ2A及び2Bが着脱可能に設けられている。ヘッドユニットIIを搭載したキャリッジ3は、装置本体4に取り付けられたキャリッジ軸5に軸方向移動自在に設けられており、例えば各々ブラックインク組成物及びカラーインク組成物を吐出するものとされている。
(0.1≦X≦0.9)
(0.1≦x≦0.9,好ましくは0.3≦x≦0.7,より好ましくは0.4≦x≦0.6)
(実施例1)
流路形成基板10となる6インチのシリコン基板の表面を熱酸化することで、シリコン基板上に二酸化シリコンからなる弾性膜51を形成した。次に、弾性膜51上にジルコニウム膜をスパッタリング法によって成膜し、ジルコニウム膜を熱酸化することで酸化ジルコニウムからなる絶縁体膜52を形成した。次に、絶縁体膜52上にチタンをスパッタリング法によって成膜し、熱酸化することにより酸化チタンからなる密着層56を形成した。そして、密着層56上に白金をスパッタリング法によって成膜した後、所定形状にパターニングすることで厚さ50nmの第1電極60を形成した。
第1ペロブスカイト層171の下地層に、Bi(Fe0.5Ti0.5)O3からなる配向制御層を設けた以外は、実施例1と同様とした。
第1ペロブスカイト層171及び第2ペロブスカイト層172を設けない以外は、実施例1と同様にした。
上記実施例1、比較例1のセラミックス膜のP−Eヒステリシスを、東陽テクニカ社製「FCE−1A」を用い周波数1kHzで測定した。図12及び図13に結果を示す。図12に示す実施例1は絶縁性が高く、優れたヒステリシスを描いているが、図13に示す比較例1は絶縁性が悪く、リークしていることがわかった。
Bruker AXS社製「D8 Discover」を用いた。線源にはCu−Kα、検出器は2次元検出器(GADDS)を使用して室温にて測定した。実施例1、2の結果は図14及び図15に示す。この結果、図14に示すように、実施例1の圧電体層は2θが22−23°付近にペロブスカイトの(100)面配向のピークが見られ、(100)面に優先配向したものであることがわかった。比較例1も同様であった。
図12から図15及び表1の結果から、BFO系の第1ペロブスカイト層及び第2ペロブスカイト層で圧電体層を挟んだ構成を有する実施例1、2は、第1ペロブスカイト層及び第2ペロブスカイト層を設けない比較例1と比較して、絶縁性が高く、リーク特性が良好であることがわかった。
以上、本発明の圧電材料や圧電素子、この圧電素子が搭載される液体噴射ヘッド及び液体噴射装置の一実施形態を説明したが、本発明の基本的構成は上記のものに限定されるものではない。例えば、上記の実施形態1では、流路形成基板10としてシリコン基板を例示したが、これに限定されず、例えば、SOI基板、ガラス等の材料を用いるようにしてもよい。
Claims (9)
- 第1電極と、
第2電極と、
前記第1電極と前記第2電極との間に設けられたカリウムと、ナトリウムと、ニオブと
、を含む圧電体層と、を備えた圧電素子であって、
前記圧電体層と前記第1電極側との間に設けられた、前記圧電体層とは組成が異なるペ
ロブスカイト型酸化物からなる第1ペロブスカイト層と、前記圧電体層と前記第2電極側
との間に設けられた、前記圧電体層とは組成が異なるペロブスカイト型酸化物からなる第
2ペロブスカイト層と、前記第1電極と前記第1ペロブスカイト層との間に設けられた配
向制御層と、を備え、
前記配向制御層は、カリウムと、ナトリウムと、ニオブと、カルシウムと、を含むこと
を特徴とする圧電素子。 - 前記第1ペロブスカイト層及び前記第2ペロブスカイト層は、ビスマスおよび鉄からな
る群から選択される少なくとも一方を含むことを特徴とする請求項1記載の圧電素子。 - 前記圧電体層が、(100)面に優先配向していることを特徴とする請求項1又は2記
載の圧電素子。 - 前記第1ペロブスカイト層が、ビスマスまたは鉄を含むペロブスカイト型酸化物からな
り、(100)面に優先配向していることを特徴とする請求項1〜3の何れか一項記載の
圧電素子。 - 前記第2ペロブスカイト層が、ビスマスまたは鉄を含むペロブスカイト型酸化物からな
り、(100)面に優先配向していることを特徴とする請求項1〜4の何れか一項記載の
圧電素子。 - 前記第1ペロブスカイト層及び第2ペロブスカイト層のそれぞれは、前記圧電体層より
薄いことを特徴とする請求項1〜5の何れか一項記載の圧電素子。 - 前記第1電極及び前記第2電極は、Pt、Ir及びこれらの酸化物から選択される少な
くとも一種の材料から選択されることを特徴とする請求項1〜6の何れか一項記載の圧電
素子。 - 前記第1電極が設けられた基板と前記第1電極との間に、ジルコニウム又は酸化ジルコ
ニウムからなる層を具備することを特徴とする請求項1〜7の何れか一項記載の圧電素子
。 - 請求項1〜8の何れか一項に記載の圧電素子を具備することを特徴とする圧電素子応用
デバイス。
Priority Applications (4)
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JP2017114181A JP6953810B2 (ja) | 2017-06-09 | 2017-06-09 | 圧電素子、及び圧電素子応用デバイス |
CN201810463082.1A CN109037431B (zh) | 2017-06-09 | 2018-05-15 | 压电元件以及压电元件应用器件 |
EP18176489.5A EP3413362B1 (en) | 2017-06-09 | 2018-06-07 | Piezoelectric element and piezoelectric element applied device |
US16/003,427 US20180358540A1 (en) | 2017-06-09 | 2018-06-08 | Piezoelectric Element And Piezoelectric Element Applied Device |
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JP2017114181A JP6953810B2 (ja) | 2017-06-09 | 2017-06-09 | 圧電素子、及び圧電素子応用デバイス |
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JP6953810B2 true JP6953810B2 (ja) | 2021-10-27 |
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EP (1) | EP3413362B1 (ja) |
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JP7423978B2 (ja) * | 2019-10-28 | 2024-01-30 | セイコーエプソン株式会社 | 圧電素子、液体吐出ヘッド、およびプリンター |
KR102540032B1 (ko) * | 2022-11-16 | 2023-06-07 | 한국원자력연구원 | 압전 세라믹 적층체 |
CN116835980B (zh) * | 2023-05-17 | 2024-05-31 | 合肥工业大学 | 铌酸钾钠纳米粉的制备方法、压电支架及其制备方法 |
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JP4165347B2 (ja) * | 2003-06-25 | 2008-10-15 | セイコーエプソン株式会社 | 圧電素子の製造方法 |
US7298018B2 (en) * | 2004-12-02 | 2007-11-20 | Agency For Science, Technology And Research | PLT/PZT ferroelectric structure |
JP5044902B2 (ja) * | 2005-08-01 | 2012-10-10 | 日立電線株式会社 | 圧電薄膜素子 |
JP4735840B2 (ja) * | 2005-12-06 | 2011-07-27 | セイコーエプソン株式会社 | 圧電体積層体、表面弾性波素子、薄膜圧電共振子および圧電アクチュエータ |
CN102165618B (zh) * | 2009-04-20 | 2013-12-04 | 松下电器产业株式会社 | 压电体薄膜及其制造方法、喷墨头、用喷墨头形成图像的方法、角速度传感器、用角速度传感器测定角速度的方法、压电发电元件和用压电发电元件发电的方法 |
JP2011181764A (ja) * | 2010-03-02 | 2011-09-15 | Tdk Corp | 圧電体素子及びその製造方法 |
JP2012089600A (ja) * | 2010-10-18 | 2012-05-10 | Seiko Epson Corp | 圧電素子、液滴噴射ヘッドおよび液滴噴射装置ならびに圧電素子の製造方法 |
JP5672443B2 (ja) * | 2010-11-10 | 2015-02-18 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置、圧電素子及び圧電素子の製造方法 |
JP5812243B2 (ja) * | 2010-12-09 | 2015-11-11 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置、圧電素子、超音波デバイス及びirセンサー |
JP2013225605A (ja) | 2012-04-23 | 2013-10-31 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置並びに圧電素子 |
US8994251B2 (en) * | 2012-08-03 | 2015-03-31 | Tdk Corporation | Piezoelectric device having first and second non-metal electroconductive intermediate films |
CN104512115B (zh) * | 2013-09-26 | 2016-08-24 | 精工爱普生株式会社 | 压电元件、液体喷射头以及液体喷射装置 |
JP6299338B2 (ja) * | 2014-03-31 | 2018-03-28 | セイコーエプソン株式会社 | 圧電素子、液体噴射ヘッド、液体噴射装置及びセンサー |
JP6558526B2 (ja) * | 2015-03-27 | 2019-08-14 | セイコーエプソン株式会社 | 圧電素子及び圧電素子応用デバイス並びに圧電素子の製造方法 |
JP6521241B2 (ja) * | 2015-05-28 | 2019-05-29 | セイコーエプソン株式会社 | 圧電素子及び圧電素子応用デバイス |
JP6606866B2 (ja) * | 2015-05-29 | 2019-11-20 | セイコーエプソン株式会社 | 圧電デバイスおよびプローブ並びに電子機器および超音波画像装置 |
JP6455669B2 (ja) * | 2015-06-02 | 2019-01-23 | セイコーエプソン株式会社 | 圧電素子、及び圧電素子応用デバイス |
JP6874351B2 (ja) * | 2016-12-07 | 2021-05-19 | Tdk株式会社 | 圧電薄膜積層体、圧電薄膜基板、圧電薄膜素子、圧電アクチュエータ、圧電センサ、ヘッドアセンブリ、ヘッドスタックアセンブリ、ハードディスクドライブ、プリンタヘッド、及びインクジェットプリンタ装置 |
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CN109037431A (zh) | 2018-12-18 |
CN109037431B (zh) | 2023-04-18 |
EP3413362A1 (en) | 2018-12-12 |
US20180358540A1 (en) | 2018-12-13 |
EP3413362B1 (en) | 2019-10-16 |
JP2018207064A (ja) | 2018-12-27 |
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