JP6861602B2 - 保持部材、保持部材の製造方法、保持機構及び製品の製造装置 - Google Patents

保持部材、保持部材の製造方法、保持機構及び製品の製造装置 Download PDF

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Publication number
JP6861602B2
JP6861602B2 JP2017177223A JP2017177223A JP6861602B2 JP 6861602 B2 JP6861602 B2 JP 6861602B2 JP 2017177223 A JP2017177223 A JP 2017177223A JP 2017177223 A JP2017177223 A JP 2017177223A JP 6861602 B2 JP6861602 B2 JP 6861602B2
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JP
Japan
Prior art keywords
holding member
product
bga
cured resin
held
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017177223A
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English (en)
Japanese (ja)
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JP2019051645A (ja
JP2019051645A5 (https=
Inventor
幹司 石橋
幹司 石橋
貴俊 尾関
貴俊 尾関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2017177223A priority Critical patent/JP6861602B2/ja
Priority to KR1020180080962A priority patent/KR102157533B1/ko
Priority to CN201810889280.4A priority patent/CN109509708B/zh
Priority to TW107128275A priority patent/TWI726230B/zh
Publication of JP2019051645A publication Critical patent/JP2019051645A/ja
Publication of JP2019051645A5 publication Critical patent/JP2019051645A5/ja
Application granted granted Critical
Publication of JP6861602B2 publication Critical patent/JP6861602B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Dicing (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2017177223A 2017-09-15 2017-09-15 保持部材、保持部材の製造方法、保持機構及び製品の製造装置 Active JP6861602B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017177223A JP6861602B2 (ja) 2017-09-15 2017-09-15 保持部材、保持部材の製造方法、保持機構及び製品の製造装置
KR1020180080962A KR102157533B1 (ko) 2017-09-15 2018-07-12 보유 지지 부재, 보유 지지 부재의 제조 방법, 보유 지지 기구 및 제품의 제조 장치
CN201810889280.4A CN109509708B (zh) 2017-09-15 2018-08-07 保持构件及其制造方法、保持机构以及制品的制造装置
TW107128275A TWI726230B (zh) 2017-09-15 2018-08-14 保持構件、保持構件的製造方法、保持機構以及製品的製造裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017177223A JP6861602B2 (ja) 2017-09-15 2017-09-15 保持部材、保持部材の製造方法、保持機構及び製品の製造装置

Publications (3)

Publication Number Publication Date
JP2019051645A JP2019051645A (ja) 2019-04-04
JP2019051645A5 JP2019051645A5 (https=) 2019-10-24
JP6861602B2 true JP6861602B2 (ja) 2021-04-21

Family

ID=65745574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017177223A Active JP6861602B2 (ja) 2017-09-15 2017-09-15 保持部材、保持部材の製造方法、保持機構及び製品の製造装置

Country Status (4)

Country Link
JP (1) JP6861602B2 (https=)
KR (1) KR102157533B1 (https=)
CN (1) CN109509708B (https=)
TW (1) TWI726230B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240071983A1 (en) * 2022-08-30 2024-02-29 Samsung Electronics Co., Ltd. Solder ball attaching apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6952737B2 (ja) * 2019-05-24 2021-10-20 Ｔｏｗａ株式会社 保持部材、検査機構、切断装置、保持対象物の製造方法及び保持部材の製造方法
CN110853507B (zh) * 2019-06-14 2022-08-09 荣耀终端有限公司 一种显示屏和电子设备
KR102888135B1 (ko) * 2021-03-18 2025-11-19 토와 가부시기가이샤 가공 장치 및 가공품의 제조 방법
JP7464575B2 (ja) * 2021-12-14 2024-04-09 Ｔｏｗａ株式会社 切断装置、及び切断品の製造方法
JP7586067B2 (ja) * 2021-12-23 2024-11-19 三菱電機株式会社 チップトレイおよび半導体装置の製造方法
JP7822349B2 (ja) * 2023-07-26 2026-03-02 Ｔｏｗａ株式会社 保持部材、搬送装置、切断用テーブル、切断装置、半導体製造装置、保持部材の製造方法、及び、半導体装置の製造方法
CN119451321B (zh) * 2025-01-03 2025-10-17 惠州市弘正光电有限公司 Smd-led灯珠及其封装工艺

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2801655B2 (ja) 1989-07-03 1998-09-21 電気化学工業株式会社 半導体集積回路装置搬送用トレーの製造法
JPH10209260A (ja) * 1997-01-20 1998-08-07 Kyokuto Shokai:Kk シンジオタクチックスポリスチレンを用いた半導体用搬送トレー
JP3771084B2 (ja) 1999-04-30 2006-04-26 Ｎｅｃエレクトロニクス株式会社 半導体集積回路装置用トレイ
JP2001139089A (ja) 1999-11-17 2001-05-22 Nec Corp 半導体パッケージの収納トレー
JP5366452B2 (ja) * 2008-06-23 2013-12-11 東芝機械株式会社 被成型品の成型方法および成型装置
JP5250868B2 (ja) * 2008-08-04 2013-07-31 セイコーＮｐｃ株式会社 チップ収納トレイ
WO2010114483A1 (en) * 2009-04-03 2010-10-07 Ether Precision, Inc. Methods and devices for manufacturing an array of lenses
KR20130066234A (ko) * 2011-12-12 2013-06-20 삼성전자주식회사 반도체 장치의 제조 방법 및 이에 사용되는 반도체 장치의 픽업 장치
JP5627618B2 (ja) * 2012-02-23 2014-11-19 Ｔｏｗａ株式会社 固定治具の製造方法及び固定治具
JP5918003B2 (ja) * 2012-04-27 2016-05-18 Ｔｏｗａ株式会社 個片化装置用真空吸着シート及びそれを用いた固定治具の製造方法
JP6000902B2 (ja) * 2013-06-24 2016-10-05 Ｔｏｗａ株式会社 電子部品用の収容治具、その製造方法及び個片化装置
JP6333648B2 (ja) * 2014-07-16 2018-05-30 Ｔｏｗａ株式会社 個片化物品の移送方法、製造方法及び製造装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240071983A1 (en) * 2022-08-30 2024-02-29 Samsung Electronics Co., Ltd. Solder ball attaching apparatus
US12544846B2 (en) * 2022-08-30 2026-02-10 Samsung Electronics Co., Ltd. Fixing apparatus

Also Published As

Publication number Publication date
JP2019051645A (ja) 2019-04-04
CN109509708B (zh) 2022-07-12
KR102157533B1 (ko) 2020-09-18
KR20190031130A (ko) 2019-03-25
CN109509708A (zh) 2019-03-22
TW201914797A (zh) 2019-04-16
TWI726230B (zh) 2021-05-01

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