KR102157533B1 - 보유 지지 부재, 보유 지지 부재의 제조 방법, 보유 지지 기구 및 제품의 제조 장치 - Google Patents

보유 지지 부재, 보유 지지 부재의 제조 방법, 보유 지지 기구 및 제품의 제조 장치 Download PDF

Info

Publication number
KR102157533B1
KR102157533B1 KR1020180080962A KR20180080962A KR102157533B1 KR 102157533 B1 KR102157533 B1 KR 102157533B1 KR 1020180080962 A KR1020180080962 A KR 1020180080962A KR 20180080962 A KR20180080962 A KR 20180080962A KR 102157533 B1 KR102157533 B1 KR 102157533B1
Authority
KR
South Korea
Prior art keywords
holding member
holding
bga
cured resin
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020180080962A
Other languages
English (en)
Korean (ko)
Other versions
KR20190031130A (ko
Inventor
간지 이시바시
다카토시 오제키
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20190031130A publication Critical patent/KR20190031130A/ko
Application granted granted Critical
Publication of KR102157533B1 publication Critical patent/KR102157533B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H01L23/053—
    • H01L23/13—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Dicing (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020180080962A 2017-09-15 2018-07-12 보유 지지 부재, 보유 지지 부재의 제조 방법, 보유 지지 기구 및 제품의 제조 장치 Active KR102157533B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017177223A JP6861602B2 (ja) 2017-09-15 2017-09-15 保持部材、保持部材の製造方法、保持機構及び製品の製造装置
JPJP-P-2017-177223 2017-09-15

Publications (2)

Publication Number Publication Date
KR20190031130A KR20190031130A (ko) 2019-03-25
KR102157533B1 true KR102157533B1 (ko) 2020-09-18

Family

ID=65745574

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180080962A Active KR102157533B1 (ko) 2017-09-15 2018-07-12 보유 지지 부재, 보유 지지 부재의 제조 방법, 보유 지지 기구 및 제품의 제조 장치

Country Status (4)

Country Link
JP (1) JP6861602B2 (https=)
KR (1) KR102157533B1 (https=)
CN (1) CN109509708B (https=)
TW (1) TWI726230B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6952737B2 (ja) * 2019-05-24 2021-10-20 Ｔｏｗａ株式会社 保持部材、検査機構、切断装置、保持対象物の製造方法及び保持部材の製造方法
CN110853507B (zh) * 2019-06-14 2022-08-09 荣耀终端有限公司 一种显示屏和电子设备
KR102888135B1 (ko) * 2021-03-18 2025-11-19 토와 가부시기가이샤 가공 장치 및 가공품의 제조 방법
JP7464575B2 (ja) * 2021-12-14 2024-04-09 Ｔｏｗａ株式会社 切断装置、及び切断品の製造方法
JP7586067B2 (ja) * 2021-12-23 2024-11-19 三菱電機株式会社 チップトレイおよび半導体装置の製造方法
KR20240030352A (ko) * 2022-08-30 2024-03-07 삼성전자주식회사 솔더볼 부착 장치
JP7822349B2 (ja) * 2023-07-26 2026-03-02 Ｔｏｗａ株式会社 保持部材、搬送装置、切断用テーブル、切断装置、半導体製造装置、保持部材の製造方法、及び、半導体装置の製造方法
CN119451321B (zh) * 2025-01-03 2025-10-17 惠州市弘正光电有限公司 Smd-led灯珠及其封装工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001139089A (ja) 1999-11-17 2001-05-22 Nec Corp 半導体パッケージの収納トレー
KR100390324B1 (ko) 1999-04-30 2003-07-16 스미또모 가가꾸 고오교오 가부시끼가이샤 반도체 집적회로장치용 트레이
JP2010040681A (ja) * 2008-08-04 2010-02-18 Seiko Npc Corp チップ収納トレイ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2801655B2 (ja) 1989-07-03 1998-09-21 電気化学工業株式会社 半導体集積回路装置搬送用トレーの製造法
JPH10209260A (ja) * 1997-01-20 1998-08-07 Kyokuto Shokai:Kk シンジオタクチックスポリスチレンを用いた半導体用搬送トレー
JP5366452B2 (ja) * 2008-06-23 2013-12-11 東芝機械株式会社 被成型品の成型方法および成型装置
WO2010114483A1 (en) * 2009-04-03 2010-10-07 Ether Precision, Inc. Methods and devices for manufacturing an array of lenses
KR20130066234A (ko) * 2011-12-12 2013-06-20 삼성전자주식회사 반도체 장치의 제조 방법 및 이에 사용되는 반도체 장치의 픽업 장치
JP5627618B2 (ja) * 2012-02-23 2014-11-19 Ｔｏｗａ株式会社 固定治具の製造方法及び固定治具
JP5918003B2 (ja) * 2012-04-27 2016-05-18 Ｔｏｗａ株式会社 個片化装置用真空吸着シート及びそれを用いた固定治具の製造方法
JP6000902B2 (ja) * 2013-06-24 2016-10-05 Ｔｏｗａ株式会社 電子部品用の収容治具、その製造方法及び個片化装置
JP6333648B2 (ja) * 2014-07-16 2018-05-30 Ｔｏｗａ株式会社 個片化物品の移送方法、製造方法及び製造装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100390324B1 (ko) 1999-04-30 2003-07-16 스미또모 가가꾸 고오교오 가부시끼가이샤 반도체 집적회로장치용 트레이
JP2001139089A (ja) 1999-11-17 2001-05-22 Nec Corp 半導体パッケージの収納トレー
JP2010040681A (ja) * 2008-08-04 2010-02-18 Seiko Npc Corp チップ収納トレイ

Also Published As

Publication number Publication date
JP2019051645A (ja) 2019-04-04
CN109509708B (zh) 2022-07-12
KR20190031130A (ko) 2019-03-25
CN109509708A (zh) 2019-03-22
JP6861602B2 (ja) 2021-04-21
TW201914797A (zh) 2019-04-16
TWI726230B (zh) 2021-05-01

Similar Documents

Publication Publication Date Title
KR102157533B1 (ko) 보유 지지 부재, 보유 지지 부재의 제조 방법, 보유 지지 기구 및 제품의 제조 장치
KR101739199B1 (ko) 워크 흡착판, 워크 절단 장치, 워크 절단 방법 및 워크 흡착판의 제조 방법
KR102157530B1 (ko) 보유 지지 부재의 제조 방법
CN107533965B (zh) 吸附机构、吸附方法、制造装置及制造方法
JP6000902B2 (ja) 電子部品用の収容治具、その製造方法及び個片化装置
CN1638071A (zh) 半导体器件的制造方法
KR20200018314A (ko) 워크 반송 장치, 수지 반송 장치 및 수지 몰드 장치
CN104952767A (zh) 检查用夹具、切断装置以及切断方法
KR20190073353A (ko) 유지 장치, 검사 장치, 검사 방법, 수지 밀봉 장치, 수지 밀봉 방법 및 수지 밀봉품의 제조 방법
KR102813002B1 (ko) 캐리어판의 제거 방법
TWI718447B (zh) 成型模、樹脂成型裝置及樹脂成型品的製造方法
JP7068409B2 (ja) 切断装置及び切断品の製造方法
KR102477355B1 (ko) 캐리어 기판 및 이를 이용한 기판 처리 장치
JP2023090298A (ja) デバイスパッケージの製造方法
KR20220026496A (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
KR102890672B1 (ko) 보유 지지 부재, 반송 장치, 절단용 테이블, 절단 장치, 반도체 제조 장치, 보유 지지 부재의 제조 방법 및 반도체 장치의 제조 방법
KR102890671B1 (ko) 보유 지지 부재, 절단용 테이블, 절단 장치, 및 반도체 장치의 제조 방법
KR100889591B1 (ko) 반도체 패키지 이송장치용 흡착패드
KR20020058212A (ko) 반도체 패키지용 다이 본딩장치의 히트 블록 구조
KR20090058625A (ko) 반도체 패키지 이송장치의 흡착패드 성형방법 및 이에 의해제조된 반도체 패키지 이송장치의 흡착패드
KR20200067747A (ko) 가공 장치

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000