JP6838063B2 - 金属酸化物を含有する材料、その製造方法及びその使用方法 - Google Patents

金属酸化物を含有する材料、その製造方法及びその使用方法 Download PDF

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Publication number
JP6838063B2
JP6838063B2 JP2018527104A JP2018527104A JP6838063B2 JP 6838063 B2 JP6838063 B2 JP 6838063B2 JP 2018527104 A JP2018527104 A JP 2018527104A JP 2018527104 A JP2018527104 A JP 2018527104A JP 6838063 B2 JP6838063 B2 JP 6838063B2
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Prior art keywords
ion
composition
solvent
metal salt
group
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Japanese (ja)
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JP2019508509A5 (enExample
JP2019508509A (ja
Inventor
ヤオ・フェイロン
ラーマン・エム・ダリル
マッケンジー・ダグラス
チョ・ジュンヨン
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Merck Patent GmbH
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Merck Patent GmbH
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/006—Anti-reflective coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/48—Stabilisers against degradation by oxygen, light or heat

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Paints Or Removers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2018527104A 2015-12-22 2016-12-20 金属酸化物を含有する材料、その製造方法及びその使用方法 Active JP6838063B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/978,232 US10241409B2 (en) 2015-12-22 2015-12-22 Materials containing metal oxides, processes for making same, and processes for using same
US14/978,232 2015-12-22
PCT/EP2016/081970 WO2017108822A1 (en) 2015-12-22 2016-12-20 Materials containing metal oxides, processes for making same, and processes for using same

Publications (3)

Publication Number Publication Date
JP2019508509A JP2019508509A (ja) 2019-03-28
JP2019508509A5 JP2019508509A5 (enExample) 2020-02-06
JP6838063B2 true JP6838063B2 (ja) 2021-03-03

Family

ID=57838322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018527104A Active JP6838063B2 (ja) 2015-12-22 2016-12-20 金属酸化物を含有する材料、その製造方法及びその使用方法

Country Status (8)

Country Link
US (1) US10241409B2 (enExample)
EP (1) EP3394675B1 (enExample)
JP (1) JP6838063B2 (enExample)
KR (1) KR102324679B1 (enExample)
CN (1) CN108139673B (enExample)
IL (1) IL257619A (enExample)
TW (1) TWI689555B (enExample)
WO (1) WO2017108822A1 (enExample)

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* Cited by examiner, † Cited by third party
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EP3360933A1 (de) * 2017-02-08 2018-08-15 Evonik Degussa GmbH Direkt-strukturierbare formulierungen auf der basis von metalloxid-prekursoren zur herstellung oxidischer schichten
US20210109451A1 (en) * 2019-10-11 2021-04-15 Merck Patent Gmbh Spin-on metal oxide materials of high etch resistance useful in image reversal technique and related semiconductor manufacturing processes
WO2024128013A1 (ja) * 2022-12-16 2024-06-20 Jsr株式会社 レジスト下層膜形成用組成物、半導体基板の製造方法、レジスト下層膜の形成方法及び金属化合物の製造方法
WO2025178071A1 (ja) * 2024-02-21 2025-08-28 株式会社巴川コーポレーション ドライエッチングマスク用組成物

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Also Published As

Publication number Publication date
KR102324679B1 (ko) 2021-11-10
IL257619A (en) 2018-06-28
KR20180094850A (ko) 2018-08-24
EP3394675A1 (en) 2018-10-31
US10241409B2 (en) 2019-03-26
CN108139673A (zh) 2018-06-08
EP3394675B1 (en) 2020-01-29
TWI689555B (zh) 2020-04-01
TW201739847A (zh) 2017-11-16
CN108139673B (zh) 2021-06-15
WO2017108822A1 (en) 2017-06-29
JP2019508509A (ja) 2019-03-28
US20170176860A1 (en) 2017-06-22

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