JP6829467B2 - 両面研磨装置 - Google Patents

両面研磨装置 Download PDF

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Publication number
JP6829467B2
JP6829467B2 JP2017075211A JP2017075211A JP6829467B2 JP 6829467 B2 JP6829467 B2 JP 6829467B2 JP 2017075211 A JP2017075211 A JP 2017075211A JP 2017075211 A JP2017075211 A JP 2017075211A JP 6829467 B2 JP6829467 B2 JP 6829467B2
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JP
Japan
Prior art keywords
surface plate
hook
groove
driver
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017075211A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018176304A (ja
Inventor
茂 小田桐
茂 小田桐
貴史 大山
貴史 大山
井上　裕介
裕介 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP2017075211A priority Critical patent/JP6829467B2/ja
Priority to CN201810201411.5A priority patent/CN108687650B/zh
Priority to TW107111514A priority patent/TWI728241B/zh
Priority to KR1020180038133A priority patent/KR102481144B1/ko
Publication of JP2018176304A publication Critical patent/JP2018176304A/ja
Application granted granted Critical
Publication of JP6829467B2 publication Critical patent/JP6829467B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2017075211A 2017-04-05 2017-04-05 両面研磨装置 Active JP6829467B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017075211A JP6829467B2 (ja) 2017-04-05 2017-04-05 両面研磨装置
CN201810201411.5A CN108687650B (zh) 2017-04-05 2018-03-12 两面研磨装置
TW107111514A TWI728241B (zh) 2017-04-05 2018-03-31 雙面研磨裝置
KR1020180038133A KR102481144B1 (ko) 2017-04-05 2018-04-02 양면 연마 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017075211A JP6829467B2 (ja) 2017-04-05 2017-04-05 両面研磨装置

Publications (2)

Publication Number Publication Date
JP2018176304A JP2018176304A (ja) 2018-11-15
JP6829467B2 true JP6829467B2 (ja) 2021-02-10

Family

ID=63844503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017075211A Active JP6829467B2 (ja) 2017-04-05 2017-04-05 両面研磨装置

Country Status (4)

Country Link
JP (1) JP6829467B2 (ko)
KR (1) KR102481144B1 (ko)
CN (1) CN108687650B (ko)
TW (1) TWI728241B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020171996A (ja) * 2019-04-11 2020-10-22 信越半導体株式会社 両面研磨方法
CN110202528B (zh) * 2019-07-04 2023-11-17 山东太古飞机工程有限公司 飞机发动机尾喷拆除辅助工装
TWI749917B (zh) * 2020-11-30 2021-12-11 寅翊智造股份有限公司 自動化處理機之換桶裝置
TWI749916B (zh) * 2020-11-30 2021-12-11 寅翊智造股份有限公司 自動化處理機之換桶裝置
CN116810669B (zh) * 2023-08-30 2023-11-10 启东市洁慧新材料有限公司 一种研磨设备用高精度磨具及其使用方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3833774B2 (ja) * 1997-04-02 2006-10-18 スピードファム株式会社 防振機構付き平面研磨装置
JP3133300B2 (ja) * 1999-03-24 2001-02-05 システム精工株式会社 研磨方法および研磨装置
JP2003205453A (ja) * 2001-11-09 2003-07-22 Fujikoshi Mach Corp 両面研磨装置
EP1489649A1 (en) * 2002-03-28 2004-12-22 Shin-Etsu Handotai Co., Ltd Double side polishing device for wafer and double side polishing method
JP2007268679A (ja) * 2006-03-31 2007-10-18 Speedfam Co Ltd 両面研磨装置のための研磨パッド用修正治具及びこの修正治具を備えた両面研磨装置
JP2009028826A (ja) * 2007-07-26 2009-02-12 Shimadzu Corp 両面研磨機
DE112009001875B4 (de) * 2008-07-31 2023-06-22 Shin-Etsu Handotai Co., Ltd. Waferpolierverfahren und Doppelseitenpoliervorrichtung
JPWO2010150757A1 (ja) * 2009-06-24 2012-12-10 旭硝子株式会社 ガラスディスク研磨装置及びガラスディスク研磨方法
JP2011194517A (ja) * 2010-03-19 2011-10-06 Hamai Co Ltd 両面研磨装置および加工方法
JP5807583B2 (ja) * 2012-02-20 2015-11-10 旭硝子株式会社 キャリア押圧機構、及び研磨装置、及びガラス基板の研磨方法、及びガラス基板の製造方法
JP6269450B2 (ja) * 2014-11-18 2018-01-31 信越半導体株式会社 ワークの加工装置
JP6491024B2 (ja) * 2015-04-20 2019-03-27 不二越機械工業株式会社 両面研磨装置および研磨方法
JP6304132B2 (ja) * 2015-06-12 2018-04-04 信越半導体株式会社 ワークの加工装置
CN106425830A (zh) * 2016-11-14 2017-02-22 宜兴市晶科光学仪器有限公司 一种双面研磨抛光机

Also Published As

Publication number Publication date
JP2018176304A (ja) 2018-11-15
TW201902620A (zh) 2019-01-16
KR102481144B1 (ko) 2022-12-23
CN108687650A (zh) 2018-10-23
CN108687650B (zh) 2022-05-03
TWI728241B (zh) 2021-05-21
KR20180113175A (ko) 2018-10-15

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