JP6817796B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP6817796B2 JP6817796B2 JP2016229898A JP2016229898A JP6817796B2 JP 6817796 B2 JP6817796 B2 JP 6817796B2 JP 2016229898 A JP2016229898 A JP 2016229898A JP 2016229898 A JP2016229898 A JP 2016229898A JP 6817796 B2 JP6817796 B2 JP 6817796B2
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Description
以下、図面を参照しながら本実施の形態(実施の形態1)の半導体装置の構造について説明する。
図1は、実施の形態1の半導体装置の構成を示す平面図である。図2および図3は、実施の形態1の半導体装置の構成を示す断面図である。
次いで、図4〜図11を参照しながら、実施の形態1の半導体装置の製造方法を説明するとともに、その構成を明確にする。図4〜図11は、実施の形態1の半導体装置の製造工程中の断面図である。なお、本実施の形態の半導体装置の製造方法は、第2素子形成領域2Aおよび給電領域3Aについて説明し、第1素子形成領域1Aの製造方法は、省略する。図12は、図2のX1部の拡大断面図である。
図13は、図1に対する変形例である半導体装置の平面図である。図14は、図13のB−B線に沿う断面図である。
実施の形態2は、上記実施の形態1の変形例であり、深溝分離DTIにおいて、深溝DTの底部に金属シリサイド層を形成していない点が、上記実施の形態1と異なる。また、それに伴い、製造方法の一部が上記実施の形態1と異なるので、その工程を説明する。
上記実施の形態1において、図5を用いて説明した、「深溝DT」形成工程および「p型の不純物領域PA」形成工程に続いて、図15に示すように、絶縁膜IL1bを形成する。絶縁膜IL1bは、上記実施の形態1において、図8を用いて説明した絶縁膜IL1bと同様の絶縁膜であり、深溝DT内の絶縁膜IL1bには、空隙SPが形成されている。
実施の形態3は、上記実施の形態1の変形例であり、深溝分離DTIにおいて、深溝DTの底部に金属シリサイド層を形成していない点が、上記実施の形態1と異なる。また、上記実施の形態2とは、製造方法が異なるので、その工程を説明する。
上記実施の形態1において、図5を用いて説明した、「深溝DT」形成工程および「p型の不純物領域PA」形成工程に続いて、図21に示すように、給電領域3Aの深溝DTの側壁上に選択的に絶縁膜ZM1を形成する。上記実施の形態1において、図6を用いて説明したように、半導体基板上に、絶縁膜ZM1形成用に、例えば、酸化シリコン膜からなる絶縁膜を堆積する。実施の形態3では、絶縁膜上に第2素子形成領域2Aを覆い、給電領域3Aを露出するフォトレジスト膜PHR1を形成し、給電領域3Aの絶縁膜に異方性ドライエッチングを施し、給電領域3Aの深溝DTの側壁上に絶縁膜ZM1を形成し、深溝DTの底部を露出する。そして、フォトレジスト膜PHR1で覆われた第2素子形成領域2Aには、絶縁膜ZM1Rを残す。つまり、第2素子形成領域2Aにおいて、深溝分離DTIの深溝DTの底部は、絶縁膜ZM1Rで覆われている。次いで、フォトレジスト膜PHR1を除去する。
実施の形態4では、第2素子形成領域2Aにおいて、CMOSトランジスタのソース、ドレイン領域およびゲート電極の上部に形成する金属シリサイド層と、給電領域3Aにおいて、深溝DTの底部に形成する金属シリサイド層とを、同一工程で形成する製法を説明する。
[付記1]
第1のp型シリコン層と、前記第1のp型シリコン層上のn型シリコン層と、前記n型シリコン層上の第2のp型シリコン層と、を有する半導体基板と、
前記半導体基板の主面の第1領域において、前記第2のp型シリコン層に形成され、ゲート電極、ソース領域およびドレイン領域を有するMOSトランジスタと、
前記第1領域と異なる第2領域において、前記半導体基板の前記主面から、前記第2のp型シリコン層および前記n型シリコン層を貫通し、前記第1のp型シリコン層に達する第1溝と、
前記第1溝の底部にて、前記第1のp型シリコン層の表面に形成された、第1金属膜からなるシリサイド層と、
前記第1溝内に形成され、前記シリサイド層と接触する第2金属膜を含むプラグ電極と、
を有し、
前記第1金属膜は、前記第2金属膜とは異なる、半導体装置。
[付記2]
付記1記載の半導体装置において、
前記第2金属膜は、チタン膜であり、前記第1金属膜は、コバルト膜またはニッケル膜である、半導体装置。
[付記3]
付記1記載の半導体装置において、
前記第2金属膜は、前記第1溝の側壁上および前記底部に形成されており、前記底部の膜厚は、前記側壁上の膜厚よりも厚い、半導体装置。
[付記4]
付記1記載の半導体装置において、
さらに、
前記第1溝の前記底部において、平面視にて、前記シリサイド層を取り囲むp型半導体領域、
を有する、半導体装置。
[付記5]
付記1記載の半導体装置において、
さらに、
前記第1溝の側壁と、前記プラグ電極との間に介在する第1絶縁膜、
を有し、
断面視にて、前記シリサイド層は、前記第1絶縁膜との間に重なりを有する、半導体装置。
[付記6]
付記1記載の半導体装置において、
さらに、
前記第1領域において、平面視にて前記MOSトランジスタを囲み、前記半導体基板の前記主面から、前記第2のp型シリコン層および前記n型シリコン層を貫通し、前記第1のp型シリコン層に達する第2溝と、
前記MOSトランジスタを覆い、前記第2溝内を埋める第2絶縁膜と、
を有し、前記第2絶縁膜は、前記第2溝内に空隙を有する、半導体装置。
2A 第2素子形成領域
3A 給電領域
BC ボディコンタクト領域
BM1 第1バリアメタル膜
BM2 第2バリアメタル膜
C1 コンタクトホール
C2 コンタクトホール
DNW n型ウエル領域
DR ドレイン領域
DT 深溝
DT1 深溝
DT2 深溝
DT2a 深溝
DT3 深溝
DT4 深溝
DTI 深溝分離
EP エピタキシャル層
GE ゲート電極
GI ゲート絶縁膜
IL1 層間絶縁膜
IL1a 絶縁膜
IL1b 絶縁膜
M 金属膜
M1 配線
NBL n型埋め込み層
NM 低濃度n型半導体領域
NR 高濃度n型半導体領域
NW n型ウエル領域
P1 プラグ
P2 プラグ
PA p型の不純物領域
PDR p型ドリフト領域
PEP1 p型エピタキシャル層
PEP2 p型エピタキシャル層
PHR1,PHR2 フォトレジスト膜
PM 低濃度p型半導体領域
PR 高濃度p型半導体領域
PSUB プラグ
PW p型ウエル領域
S 支持基板
SIL,SIL1,SIL2,SIL3,SIL4 金属シリサイド層
SP 空隙
SR ソース領域
STI 絶縁領域
STId ドレイン絶縁領域
SW 側壁絶縁膜
ZM1 絶縁膜
ZM1R 絶縁膜
ZM2 絶縁膜
Claims (15)
- (a)第1のp型シリコン層と、前記第1のp型シリコン層上のn型シリコン層と、前記n型シリコン層上の第2のp型シリコン層と、を有する半導体基板を準備する工程、
(b)前記半導体基板の主面の第1領域において、前記第2のp型シリコン層にゲート電極、ソース領域およびドレイン領域を有するMOSトランジスタを形成する工程、
(c)前記第1領域と異なる第2領域において、前記半導体基板の前記主面から、前記第2のp型シリコン層および前記n型シリコン層を貫通し、前記第1のp型シリコン層に達する溝を形成する工程、
(d)前記溝の底部に露出した、前記第1のp型シリコン層にp型半導体領域を形成する工程、
(e)前記溝の底部の前記p型半導体領域を露出するように、前記溝の側壁上に第1絶縁膜を形成する工程、
(f)前記溝の底部に露出した、前記第1のp型シリコン層に、第1金属膜からなるシリサイド層を形成する工程、
(g)前記溝の底部の前記シリサイド層を露出するように、前記第1絶縁膜上に、第2絶縁膜を形成する工程、
(h)前記溝内にプラグ電極を形成する工程、
を有し、
前記工程(f)は、
(f‐1)前記第1のp型シリコン層上に、PVD法で前記第1金属膜を形成する工程、
(f‐2)前記半導体基板に熱処理を施し、前記第1金属膜からなるシリサイド層を形成する工程、
(f‐3)前記シリサイド層とならなかった未反応の前記第1金属膜を除去する工程、
を有する、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(h)工程は、
(h‐1)前記シリサイド層と接触するように、前記シリサイド層上に、CVD法でチタン膜を形成する工程、
を有する、半導体装置の製造方法。 - 請求項2記載の半導体装置の製造方法において、
前記(h)工程は、前記(h‐1)工程後に、
(h‐2)前記チタン膜上に、窒化チタン膜を形成する工程、
(h‐3)前記窒化チタン膜上のタングステン膜を形成する工程、
を有する、半導体装置の製造方法。 - (a)第1のp型シリコン層と、前記第1のp型シリコン層上のn型シリコン層と、前記n型シリコン層上の第2のp型シリコン層と、を有する半導体基板を準備する工程、
(b)前記半導体基板の主面の第1領域において、前記第2のp型シリコン層にゲート電極、ソース領域およびドレイン領域を有するMOSトランジスタを形成する工程、
(c)前記半導体基板の前記主面から、前記第2のp型シリコン層および前記n型シリコン層を貫通し、前記第1のp型シリコン層に達するように、前記第1領域において、平面視にて前記MOSトランジスタを囲む第1溝を、前記第1領域と異なる第2領域において、第2溝を、それぞれ形成する工程、
(d)前記第2溝の底部において、前記第1のp型シリコン層を露出するように、前記第2溝の側壁上に第1絶縁膜を形成する工程、
(e)前記第2溝の底部に露出した、前記第1のp型シリコン層に、第1金属膜からなるシリサイド層を形成する工程、
(f)前記第1溝および前記第2溝の内部を埋めるように、前記半導体基板上の第2絶縁膜を形成する工程、
(g)前記第2溝内において、前記シリサイド層の主面を露出するように、前記第2絶縁膜に第1開口を形成する工程、
(h)前記第1開口内に第1プラグ電極を形成する工程、
を有する、半導体装置の製造方法。 - 請求項4記載の半導体装置の製造方法において、
前記工程(e)は、
(e‐1)前記第1のp型シリコン層上に、PVD法で前記第1金属膜を形成する工程、
(e‐2)前記半導体基板に熱処理を施し、前記第1金属膜からなるシリサイド層を形成する工程、
(e‐3)前記シリサイド層とならなかった未反応の前記第1金属膜を除去する工程、
を有する、半導体装置の製造方法。 - 請求項4記載の半導体装置の製造方法において、
前記(h)工程は、
(h‐1)前記シリサイド層と接触するように、前記シリサイド層上に、CVD法でチタン膜を形成する工程、
を有する、半導体装置の製造方法。 - 請求項6記載の半導体装置の製造方法において、
前記(h)工程は、前記(h‐1)工程後に、
(h‐2)前記チタン膜上に、窒化チタン膜を形成する工程、
(h‐3)前記窒化チタン膜上のタングステン膜を形成する工程、
を有する、半導体装置の製造方法。 - 請求項4記載の半導体装置の製造方法において、
前記(c)工程と前記(d)工程との間に、さらに、
(i)前記第2溝の底部に露出した、前記第1のp型シリコン層にp型半導体領域を形成する工程、
を有する、半導体装置の製造方法。 - 請求項4記載の半導体装置の製造方法において、
前記(f)工程において、
前記第2絶縁膜は、前記第1溝内に、空隙を有する、半導体装置の製造方法。 - 請求項4記載の半導体装置の製造方法において、
前記(d)工程では、
前記第1溝の底部において、前記第1のp型シリコン層を露出するように、前記第1溝の側壁上にも前記第1絶縁膜を形成する、半導体装置の製造方法。 - 請求項4記載の半導体装置の製造方法において、
前記(d)工程では、
前記第1溝の底部において、前記第1のp型シリコン層を露出することなく、前記第1絶縁膜で覆った状態とする、半導体装置の製造方法。 - 請求項4記載の半導体装置の製造方法において、
前記(g)工程では、
前記ソース領域および前記ドレイン領域を露出する第2開口を、前記第2絶縁膜に形成する、半導体装置の製造方法。 - 請求項12記載の半導体装置の製造方法において、
前記(h)工程では、
前記第2開口内に、第2プラグ電極を形成する、半導体装置の製造方法。 - (a)第1のp型シリコン層と、前記第1のp型シリコン層上のn型シリコン層と、前記n型シリコン層上の第2のp型シリコン層と、を有する半導体基板を準備する工程、
(b)前記半導体基板の主面の第1領域において、前記第2のp型シリコン層にゲート電極、ソース領域およびドレイン領域を有するMOSトランジスタを形成する工程、
(c)前記半導体基板の前記主面から、前記第2のp型シリコン層および前記n型シリコン層を貫通し、前記第1のp型シリコン層に達するように、前記第1領域において、平面視にて前記MOSトランジスタを囲む第1溝を、前記第1領域と異なる第2領域において、第2溝を、それぞれ形成する工程、
(d)前記第1溝および前記第2溝の内部を埋めるように、前記半導体基板上の絶縁膜を形成する工程、
(e)前記第2溝内において、前記第1のp型シリコン層を露出するように、前記絶縁膜に開口を形成する工程、
(f)前記開口の底部に露出した、前記第1のp型シリコン層にp型半導体領域を形成する工程、
(g)前記開口の底部の前記p型半導体領域を露出するように、前記開口の側壁上に第1絶縁膜を形成する工程、
(h)前記開口から露出した、前記第1のp型シリコン層に、金属膜からなるシリサイド層を形成する工程、
(i)前記開口の底部の前記シリサイド層を露出するように、前記第1絶縁膜上に、第2絶縁膜を形成する工程、
(j)前記開口内にプラグ電極を形成する工程、
を有し、
前記工程(h)は、
(h‐1)前記第1のp型シリコン層上に、PVD法で前記金属膜を形成する工程、
(h‐2)前記半導体基板に熱処理を施し、前記金属膜からなるシリサイド層を形成する工程、
(h‐3)前記シリサイド層とならなかった未反応の前記金属膜を除去する工程、
を有し、
前記絶縁膜は、前記第1溝内および前記第2溝内に、空隙を有する、半導体装置の製造方法。 - (a)第1のp型シリコン層と、前記第1のp型シリコン層上のn型シリコン層と、前記n型シリコン層上の第2のp型シリコン層と、を有する半導体基板を準備する工程、
(b)前記半導体基板の主面の第1領域において、前記第2のp型シリコン層にゲート電極、ソース領域およびドレイン領域を有するMOSトランジスタを形成する工程、
(c)前記第1領域と異なる第2領域において、前記半導体基板の前記主面から、前記第2のp型シリコン層および前記n型シリコン層を貫通し、前記第1のp型シリコン層に達するように、第1溝を形成する工程、
(d)前記第1溝の底部に露出した、前記第1のp型シリコン層の表面、ならびに、前記ソース領域および前記ドレイン領域の表面に第1金属膜からなるシリサイド層を形成する工程、
(e)前記第1領域において、平面視にて前記MOSトランジスタを囲み、前記半導体基板の前記主面から、前記第2のp型シリコン層および前記n型シリコン層を貫通し、前記第1のp型シリコン層に達する第2溝を形成する工程、
(f)前記第1溝および前記第2溝の内部を埋めるように、前記半導体基板上の絶縁膜を形成する工程、
(g)前記第1溝内において、前記シリサイド層の主面を露出するように、前記絶縁膜に開口を形成する工程、
(h)前記開口内にプラグ電極を形成する工程、
を有し、
前記絶縁膜は、前記第1溝内および前記第2溝内に、空隙を有する、半導体装置の製造方法。
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US20180138081A1 (en) * | 2016-11-15 | 2018-05-17 | Vanguard International Semiconductor Corporation | Semiconductor structures and method for fabricating the same |
US10680100B2 (en) * | 2018-07-03 | 2020-06-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Field structure and methodology |
JP7195167B2 (ja) * | 2019-02-08 | 2022-12-23 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
US10971632B2 (en) * | 2019-06-24 | 2021-04-06 | Semiconductor Components Industries, Llc | High voltage diode on SOI substrate with trench-modified current path |
JP7299769B2 (ja) * | 2019-06-24 | 2023-06-28 | ローム株式会社 | 半導体装置 |
US11101168B2 (en) * | 2019-10-30 | 2021-08-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Profile of deep trench isolation structure for isolation of high-voltage devices |
US11502036B2 (en) * | 2020-02-07 | 2022-11-15 | Renesas Electronics Corporation | Semiconductor device and method of manufacturing the same |
JP2022016842A (ja) | 2020-07-13 | 2022-01-25 | 富士電機株式会社 | 半導体装置 |
US11955530B2 (en) * | 2021-10-29 | 2024-04-09 | Texas Instruments Incorporated | RF MOS varactor |
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JPH02222139A (ja) * | 1989-02-22 | 1990-09-04 | Mitsubishi Electric Corp | 半導体装置 |
JP2871943B2 (ja) * | 1992-04-06 | 1999-03-17 | 日本電気株式会社 | 半導体装置の製造方法 |
JP2007287813A (ja) * | 2006-04-14 | 2007-11-01 | Renesas Technology Corp | 半導体装置およびその製造方法 |
US7982284B2 (en) * | 2006-06-28 | 2011-07-19 | Infineon Technologies Ag | Semiconductor component including an isolation structure and a contact to the substrate |
JP2009181978A (ja) * | 2008-01-29 | 2009-08-13 | Sony Corp | 半導体装置およびその製造方法 |
KR101149043B1 (ko) * | 2009-10-30 | 2012-05-24 | 에스케이하이닉스 주식회사 | 매립형 비트라인을 구비하는 반도체 장치 및 그 제조방법 |
JP5672819B2 (ja) * | 2010-07-27 | 2015-02-18 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
US8378445B2 (en) * | 2010-08-31 | 2013-02-19 | Infineon Technologies Ag | Trench structures in direct contact |
JP5955064B2 (ja) | 2012-04-17 | 2016-07-20 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP2014093306A (ja) * | 2012-10-31 | 2014-05-19 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
US9269789B2 (en) * | 2013-03-15 | 2016-02-23 | Semiconductor Components Industries, Llc | Method of forming a high electron mobility semiconductor device and structure therefor |
JP6130755B2 (ja) * | 2013-08-12 | 2017-05-17 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP6076224B2 (ja) * | 2013-09-05 | 2017-02-08 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
WO2017124220A1 (en) * | 2016-01-18 | 2017-07-27 | Texas Instruments Incorporated | Power mosfet with metal filled deep source contact |
US10038061B2 (en) * | 2016-07-08 | 2018-07-31 | International Business Machines Corporation | High voltage laterally diffused MOSFET with buried field shield and method to fabricate same |
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