JP6806285B2 - ベーパーチャンバー、及び電子機器 - Google Patents

ベーパーチャンバー、及び電子機器 Download PDF

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Publication number
JP6806285B2
JP6806285B2 JP2020522602A JP2020522602A JP6806285B2 JP 6806285 B2 JP6806285 B2 JP 6806285B2 JP 2020522602 A JP2020522602 A JP 2020522602A JP 2020522602 A JP2020522602 A JP 2020522602A JP 6806285 B2 JP6806285 B2 JP 6806285B2
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Japan
Prior art keywords
flow path
region
sheet
vapor chamber
working fluid
Prior art date
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JP2020522602A
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English (en)
Japanese (ja)
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JPWO2019230911A1 (ja
Inventor
伸一郎 高橋
伸一郎 高橋
太田　貴之
貴之 太田
和範 小田
小田　　和範
武田　利彦
利彦 武田
清隆 竹松
清隆 竹松
輝寿 百瀬
輝寿 百瀬
陽子 中村
陽子 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Publication of JPWO2019230911A1 publication Critical patent/JPWO2019230911A1/ja
Application granted granted Critical
Publication of JP6806285B2 publication Critical patent/JP6806285B2/ja
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Fuel Cell (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Push-Button Switches (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Casings For Electric Apparatus (AREA)
JP2020522602A 2018-05-30 2019-05-30 ベーパーチャンバー、及び電子機器 Active JP6806285B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2018103620 2018-05-30
JP2018103633 2018-05-30
JP2018103633 2018-05-30
JP2018103620 2018-05-30
PCT/JP2019/021609 WO2019230911A1 (ja) 2018-05-30 2019-05-30 ベーパーチャンバー、及び電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020174031A Division JP6809643B1 (ja) 2018-05-30 2020-10-15 ベーパーチャンバー、及び電子機器

Publications (2)

Publication Number Publication Date
JPWO2019230911A1 JPWO2019230911A1 (ja) 2020-12-17
JP6806285B2 true JP6806285B2 (ja) 2021-01-06

Family

ID=68698266

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2020522602A Active JP6806285B2 (ja) 2018-05-30 2019-05-30 ベーパーチャンバー、及び電子機器
JP2020174031A Active JP6809643B1 (ja) 2018-05-30 2020-10-15 ベーパーチャンバー、及び電子機器
JP2020204946A Active JP7318628B2 (ja) 2018-05-30 2020-12-10 ベーパーチャンバー、及び電子機器

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Application Number Title Priority Date Filing Date
JP2020174031A Active JP6809643B1 (ja) 2018-05-30 2020-10-15 ベーパーチャンバー、及び電子機器
JP2020204946A Active JP7318628B2 (ja) 2018-05-30 2020-12-10 ベーパーチャンバー、及び電子機器

Country Status (6)

Country Link
US (3) US11903167B2 (enExample)
JP (3) JP6806285B2 (enExample)
KR (1) KR102501074B1 (enExample)
CN (2) CN112166294B (enExample)
TW (3) TWI856760B (enExample)
WO (1) WO2019230911A1 (enExample)

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WO2020255513A1 (ja) * 2019-06-21 2020-12-24 株式会社村田製作所 ベーパーチャンバー
WO2021045211A1 (ja) * 2019-09-06 2021-03-11 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、ベーパーチャンバ用の中間体が多面付けされたシート、ベーパーチャンバ用の中間体が多面付けされたシートが巻かれたロール、ベーパーチャンバ用の中間体
JP7565002B2 (ja) * 2020-01-07 2024-10-10 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
KR20220125246A (ko) * 2020-01-10 2022-09-14 다이니폰 인사츠 가부시키가이샤 베이퍼 챔버용의 윅 시트, 베이퍼 챔버 및 전자 기기
TWI738602B (zh) * 2020-01-22 2021-09-01 訊凱國際股份有限公司 多通道薄熱交換器
EP4113596A4 (en) * 2020-02-26 2024-03-27 Kyocera Corporation HEAT DISSIPATION PART
TWI778605B (zh) * 2020-09-02 2022-09-21 雙鴻科技股份有限公司 薄型均溫板
TWI804767B (zh) * 2020-11-05 2023-06-11 大陸商尼得科巨仲電子（昆山）有限公司 均溫板結構及其毛細層結構
JPWO2022168891A1 (enExample) * 2021-02-03 2022-08-11
JP7635359B2 (ja) * 2021-02-26 2025-02-25 京セラ株式会社 熱デバイス
TWI878479B (zh) * 2021-03-04 2025-04-01 宸寰科技有限公司 薄型化封裝接著結構
KR102851862B1 (ko) * 2021-04-02 2025-08-28 에스케이하이닉스 주식회사 방열 모듈
JP2023006702A (ja) * 2021-06-30 2023-01-18 尼得科超▲しゅう▼科技股▲ふん▼有限公司 熱伝導部材
CN113473807A (zh) * 2021-07-06 2021-10-01 中国电子科技集团公司第三十八研究所 一种基于毛细力驱动的整体式两相流散热装置
TWI872435B (zh) * 2023-01-12 2025-02-11 薩摩亞商塔普林克科技有限公司 整合式均熱板

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Also Published As

Publication number Publication date
CN112166294B (zh) 2023-03-24
TW202012865A (zh) 2020-04-01
US20240130083A1 (en) 2024-04-18
US11903167B2 (en) 2024-02-13
JP6809643B1 (ja) 2021-01-06
JP7318628B2 (ja) 2023-08-01
CN112902717A (zh) 2021-06-04
TWI812723B (zh) 2023-08-21
TWI878179B (zh) 2025-03-21
KR102501074B1 (ko) 2023-02-21
JPWO2019230911A1 (ja) 2020-12-17
JP2021014981A (ja) 2021-02-12
TW202500939A (zh) 2025-01-01
CN112902717B (zh) 2022-03-11
KR20210016537A (ko) 2021-02-16
JP2021055992A (ja) 2021-04-08
TW202344791A (zh) 2023-11-16
WO2019230911A1 (ja) 2019-12-05
TWI856760B (zh) 2024-09-21
US12382610B2 (en) 2025-08-05
US20250338441A1 (en) 2025-10-30
US20210168969A1 (en) 2021-06-03
CN112166294A (zh) 2021-01-01

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