JP6783205B2 - 電磁波シールドフィルム - Google Patents

電磁波シールドフィルム Download PDF

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Publication number
JP6783205B2
JP6783205B2 JP2017171417A JP2017171417A JP6783205B2 JP 6783205 B2 JP6783205 B2 JP 6783205B2 JP 2017171417 A JP2017171417 A JP 2017171417A JP 2017171417 A JP2017171417 A JP 2017171417A JP 6783205 B2 JP6783205 B2 JP 6783205B2
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JP
Japan
Prior art keywords
glossiness
insulating layer
less
electromagnetic wave
fingerprint
Prior art date
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JP2017171417A
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English (en)
Japanese (ja)
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JP2018041962A (ja
Inventor
宗悟 石岡
宗悟 石岡
善治 柳
善治 柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Publication of JP2018041962A publication Critical patent/JP2018041962A/ja
Application granted granted Critical
Publication of JP6783205B2 publication Critical patent/JP6783205B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
JP2017171417A 2016-09-06 2017-09-06 電磁波シールドフィルム Active JP6783205B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016173793 2016-09-06
JP2016173793 2016-09-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020176728A Division JP7083880B2 (ja) 2016-09-06 2020-10-21 電磁波シールドフィルム

Publications (2)

Publication Number Publication Date
JP2018041962A JP2018041962A (ja) 2018-03-15
JP6783205B2 true JP6783205B2 (ja) 2020-11-11

Family

ID=61531537

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017171417A Active JP6783205B2 (ja) 2016-09-06 2017-09-06 電磁波シールドフィルム
JP2020176728A Active JP7083880B2 (ja) 2016-09-06 2020-10-21 電磁波シールドフィルム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020176728A Active JP7083880B2 (ja) 2016-09-06 2020-10-21 電磁波シールドフィルム

Country Status (3)

Country Link
JP (2) JP6783205B2 (zh)
KR (2) KR102394462B1 (zh)
CN (3) CN111818784B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107592783A (zh) 2017-09-15 2018-01-16 中山国安火炬科技发展有限公司 一种电磁屏蔽膜及其制备方法
KR102633961B1 (ko) * 2017-10-10 2024-02-06 도레이 카부시키가이샤 필름
CN108323140A (zh) * 2018-01-24 2018-07-24 中山国安火炬科技发展有限公司 一种电磁波屏蔽膜及其制备方法和应用
JP6431998B1 (ja) * 2018-03-20 2018-11-28 タツタ電線株式会社 導電性接着剤層
JP7234698B2 (ja) * 2018-03-29 2023-03-08 東レ株式会社 二軸配向ポリプロピレンフィルム、金属膜積層フィルムおよびフィルムコンデンサ
CN108513427B (zh) * 2018-04-16 2019-09-06 东莞市航晨纳米材料有限公司 一种超薄低介电常数、低电阻电磁屏蔽膜
US12087465B2 (en) * 2018-10-12 2024-09-10 Te Connectivity Solutions Gmbh Electrical cable
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP6597927B1 (ja) * 2019-06-18 2019-10-30 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板
JP7533119B2 (ja) 2020-10-23 2024-08-14 ａｒｔｉｅｎｃｅ株式会社 粘着フィルム、および積層体
CN116419847A (zh) * 2020-11-05 2023-07-11 拓自达电线株式会社 电磁波屏蔽薄膜
TW202313328A (zh) 2021-06-18 2023-04-01 日商拓自達電線股份有限公司 電磁波屏蔽膜
TWI799134B (zh) * 2022-02-11 2023-04-11 長春石油化學股份有限公司 聚合物膜及其應用

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* Cited by examiner, † Cited by third party
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US6777045B2 (en) * 2001-06-27 2004-08-17 Applied Materials Inc. Chamber components having textured surfaces and method of manufacture
JP4201548B2 (ja) 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
WO2006090820A1 (ja) * 2005-02-25 2006-08-31 Dai Nippon Printing Co., Ltd. 電磁波シールドフィルタ
GB0505517D0 (en) * 2005-03-17 2005-04-27 Dupont Teijin Films Us Ltd Coated polymeric substrates
JP5282675B2 (ja) * 2009-06-23 2013-09-04 日立電線株式会社 プリント配線板用銅箔およびその製造方法
JP2011099744A (ja) * 2009-11-05 2011-05-19 Nippon Paint Co Ltd 耐指紋性評価方法および耐指紋性被膜
CN103120042B (zh) * 2010-06-23 2016-03-23 印可得株式会社 电磁波屏蔽膜的制备方法及由其制备的电磁波屏蔽膜
CN103080385B (zh) * 2010-08-30 2016-08-17 Ak钢铁产权公司 具有类似不锈钢成品特征的镀锌碳钢
JP5703815B2 (ja) * 2011-02-16 2015-04-22 Ｊｆｅスチール株式会社 表面処理鋼板、電磁波シールド部材および電磁波シールド筐体
JP6133218B2 (ja) * 2011-03-07 2017-05-24 インテグリス・インコーポレーテッド 化学機械平坦化パッドコンディショナー
US20140110153A1 (en) * 2012-01-17 2014-04-24 Panasonic Corporation Wiring board and method for manufacturing the same
JP6010945B2 (ja) * 2012-03-16 2016-10-19 住友ベークライト株式会社 ダイシングフィルム
CN103811654B (zh) * 2012-11-15 2017-03-08 纳米新能源（唐山）有限责任公司 具有压电效应的压电电缆及其制备方法和用途
CN104002515B (zh) * 2013-02-25 2016-08-03 南亚塑胶工业股份有限公司 复合式双面黑色铜箔及其制造方法
EP2990838B1 (en) * 2013-04-24 2018-12-12 AGC Inc. Substrate having antireflective layer
JP6454282B2 (ja) * 2013-10-11 2019-01-16 リンテック株式会社 工程シート
JP2016018068A (ja) * 2014-07-08 2016-02-01 旭硝子株式会社 防眩膜付き基材および物品
CN204087849U (zh) * 2014-08-13 2015-01-07 卜汝雪 一种具有超高屏蔽性能的电缆
JP6184025B2 (ja) * 2014-09-04 2017-08-23 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法
JP6381117B2 (ja) * 2014-09-04 2018-08-29 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法
JPWO2016104420A1 (ja) * 2014-12-25 2017-10-12 住友電気工業株式会社 プリント配線板用基板及びその製造方法、プリント配線板及びその製造方法、並びに、樹脂基材
KR101862121B1 (ko) * 2015-02-02 2018-05-29 토요잉크Sc홀딩스주식회사 전자파 차폐 시트, 프린트 배선판 및 전자 기기
JP5796690B1 (ja) * 2015-02-02 2015-10-21 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP2016150473A (ja) * 2015-02-16 2016-08-22 リンテック株式会社 粗面化フィルム及びその製造方法
CN204869869U (zh) * 2015-04-28 2015-12-16 比亚迪股份有限公司 一种防指纹壳体
CN105246313B (zh) * 2015-09-29 2018-07-27 朱春芳 一种电磁波屏蔽膜、含有该屏蔽膜的印刷线路板及该线路板的制备方法
CN205030048U (zh) * 2015-10-25 2016-02-10 东莞市导谷电子材料科技有限公司 一种新型软体电磁波屏蔽膜
CN108605425B (zh) * 2016-02-12 2020-04-07 拓自达电线株式会社 电磁波屏蔽膜
CN105907287B (zh) * 2016-05-16 2018-04-27 四川龙华光电薄膜股份有限公司 防紫外防眩光防指纹增硬涂液组合物、涂层及其制备方法

Also Published As

Publication number Publication date
CN107801366A (zh) 2018-03-13
CN111818784A (zh) 2020-10-23
KR20180027388A (ko) 2018-03-14
CN111818784B (zh) 2023-03-24
KR102394462B1 (ko) 2022-05-03
JP2021010032A (ja) 2021-01-28
JP2018041962A (ja) 2018-03-15
CN111800997B (zh) 2023-08-29
JP7083880B2 (ja) 2022-06-13
CN111800997A (zh) 2020-10-20
KR20220058520A (ko) 2022-05-09
KR102567422B1 (ko) 2023-08-14
CN107801366B (zh) 2020-07-17

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