KR102394462B1 - 전자파 실드 필름 - Google Patents
전자파 실드 필름 Download PDFInfo
- Publication number
- KR102394462B1 KR102394462B1 KR1020170113944A KR20170113944A KR102394462B1 KR 102394462 B1 KR102394462 B1 KR 102394462B1 KR 1020170113944 A KR1020170113944 A KR 1020170113944A KR 20170113944 A KR20170113944 A KR 20170113944A KR 102394462 B1 KR102394462 B1 KR 102394462B1
- Authority
- KR
- South Korea
- Prior art keywords
- glossiness
- insulating layer
- less
- electromagnetic wave
- fingerprint
- Prior art date
Links
- 230000003746 surface roughness Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 28
- 239000010410 layer Substances 0.000 description 147
- 239000011342 resin composition Substances 0.000 description 32
- 239000002245 particle Substances 0.000 description 31
- 239000012790 adhesive layer Substances 0.000 description 26
- 230000000052 comparative effect Effects 0.000 description 25
- 239000010419 fine particle Substances 0.000 description 23
- 238000002845 discoloration Methods 0.000 description 20
- 239000000203 mixture Substances 0.000 description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 239000011859 microparticle Substances 0.000 description 13
- 238000002156 mixing Methods 0.000 description 10
- 239000003086 colorant Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000000049 pigment Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000004840 adhesive resin Substances 0.000 description 4
- 229920006223 adhesive resin Polymers 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000004049 embossing Methods 0.000 description 3
- 229940100688 oral solution Drugs 0.000 description 3
- 239000011164 primary particle Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 101000661807 Homo sapiens Suppressor of tumorigenicity 14 protein Proteins 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000011158 quantitative evaluation Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000002087 whitening effect Effects 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000772568 Cresia Species 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005678 polyethylene based resin Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 230000001953 sensory effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electrostatic Charge, Transfer And Separation In Electrography (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020220053435A KR102567422B1 (ko) | 2016-09-06 | 2022-04-29 | 전자파 실드 필름 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016173793 | 2016-09-06 | ||
JPJP-P-2016-173793 | 2016-09-06 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020220053435A Division KR102567422B1 (ko) | 2016-09-06 | 2022-04-29 | 전자파 실드 필름 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180027388A KR20180027388A (ko) | 2018-03-14 |
KR102394462B1 true KR102394462B1 (ko) | 2022-05-03 |
Family
ID=61531537
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170113944A KR102394462B1 (ko) | 2016-09-06 | 2017-09-06 | 전자파 실드 필름 |
KR1020220053435A KR102567422B1 (ko) | 2016-09-06 | 2022-04-29 | 전자파 실드 필름 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020220053435A KR102567422B1 (ko) | 2016-09-06 | 2022-04-29 | 전자파 실드 필름 |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP6783205B2 (zh) |
KR (2) | KR102394462B1 (zh) |
CN (3) | CN111818784B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107592783A (zh) | 2017-09-15 | 2018-01-16 | 中山国安火炬科技发展有限公司 | 一种电磁屏蔽膜及其制备方法 |
CN111201137B (zh) * | 2017-10-10 | 2022-11-01 | 东丽株式会社 | 膜 |
CN108323140A (zh) * | 2018-01-24 | 2018-07-24 | 中山国安火炬科技发展有限公司 | 一种电磁波屏蔽膜及其制备方法和应用 |
JP6431998B1 (ja) * | 2018-03-20 | 2018-11-28 | タツタ電線株式会社 | 導電性接着剤層 |
JP7234698B2 (ja) * | 2018-03-29 | 2023-03-08 | 東レ株式会社 | 二軸配向ポリプロピレンフィルム、金属膜積層フィルムおよびフィルムコンデンサ |
CN108513427B (zh) * | 2018-04-16 | 2019-09-06 | 东莞市航晨纳米材料有限公司 | 一种超薄低介电常数、低电阻电磁屏蔽膜 |
US12087465B2 (en) * | 2018-10-12 | 2024-09-10 | Te Connectivity Solutions Gmbh | Electrical cable |
US10581081B1 (en) | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
JP6597927B1 (ja) * | 2019-06-18 | 2019-10-30 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
JP7533119B2 (ja) | 2020-10-23 | 2024-08-14 | artience株式会社 | 粘着フィルム、および積層体 |
KR20230098792A (ko) * | 2020-11-05 | 2023-07-04 | 타츠타 전선 주식회사 | 전자파 차폐 필름 |
TW202313328A (zh) * | 2021-06-18 | 2023-04-01 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜 |
TWI799134B (zh) * | 2022-02-11 | 2023-04-11 | 長春石油化學股份有限公司 | 聚合物膜及其應用 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016143751A (ja) * | 2015-02-02 | 2016-08-08 | 東洋インキScホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6777045B2 (en) * | 2001-06-27 | 2004-08-17 | Applied Materials Inc. | Chamber components having textured surfaces and method of manufacture |
JP4201548B2 (ja) | 2002-07-08 | 2008-12-24 | タツタ電線株式会社 | シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法 |
DE112006000453T5 (de) * | 2005-02-25 | 2008-01-10 | Dai Nippon Printing Co., Ltd. | Filter zur Abschirmung elektromagnetischer Wellen |
GB0505517D0 (en) * | 2005-03-17 | 2005-04-27 | Dupont Teijin Films Us Ltd | Coated polymeric substrates |
JP5282675B2 (ja) * | 2009-06-23 | 2013-09-04 | 日立電線株式会社 | プリント配線板用銅箔およびその製造方法 |
JP2011099744A (ja) * | 2009-11-05 | 2011-05-19 | Nippon Paint Co Ltd | 耐指紋性評価方法および耐指紋性被膜 |
US9167735B2 (en) * | 2010-06-23 | 2015-10-20 | Inktec Co., Ltd. | Method for manufacturing electromagnetic interference shielding film |
AU2011296224B2 (en) * | 2010-08-30 | 2014-11-27 | Ak Steel Properties, Inc. | Galvanized carbon steel with stainless steel-like finish |
JP5703815B2 (ja) * | 2011-02-16 | 2015-04-22 | Jfeスチール株式会社 | 表面処理鋼板、電磁波シールド部材および電磁波シールド筐体 |
CN103688343B (zh) * | 2011-03-07 | 2016-09-07 | 恩特格里公司 | 化学机械抛光垫修整器 |
CN103314652A (zh) * | 2012-01-17 | 2013-09-18 | 松下电器产业株式会社 | 配线基板及其制造方法 |
JP6010945B2 (ja) * | 2012-03-16 | 2016-10-19 | 住友ベークライト株式会社 | ダイシングフィルム |
CN103811654B (zh) * | 2012-11-15 | 2017-03-08 | 纳米新能源(唐山)有限责任公司 | 具有压电效应的压电电缆及其制备方法和用途 |
CN104002515B (zh) * | 2013-02-25 | 2016-08-03 | 南亚塑胶工业股份有限公司 | 复合式双面黑色铜箔及其制造方法 |
JP6653171B2 (ja) * | 2013-04-24 | 2020-02-26 | Agc株式会社 | 反射防止層付き基材 |
JP6454282B2 (ja) * | 2013-10-11 | 2019-01-16 | リンテック株式会社 | 工程シート |
JP2016018068A (ja) * | 2014-07-08 | 2016-02-01 | 旭硝子株式会社 | 防眩膜付き基材および物品 |
CN204087849U (zh) * | 2014-08-13 | 2015-01-07 | 卜汝雪 | 一种具有超高屏蔽性能的电缆 |
JP6381117B2 (ja) * | 2014-09-04 | 2018-08-29 | 信越ポリマー株式会社 | 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法 |
JP6184025B2 (ja) * | 2014-09-04 | 2017-08-23 | 信越ポリマー株式会社 | 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法 |
WO2016104420A1 (ja) * | 2014-12-25 | 2016-06-30 | 住友電気工業株式会社 | プリント配線板用基板及びその製造方法、プリント配線板及びその製造方法、並びに、樹脂基材 |
KR101862121B1 (ko) * | 2015-02-02 | 2018-05-29 | 토요잉크Sc홀딩스주식회사 | 전자파 차폐 시트, 프린트 배선판 및 전자 기기 |
JP2016150473A (ja) * | 2015-02-16 | 2016-08-22 | リンテック株式会社 | 粗面化フィルム及びその製造方法 |
CN204869869U (zh) * | 2015-04-28 | 2015-12-16 | 比亚迪股份有限公司 | 一种防指纹壳体 |
CN105246313B (zh) * | 2015-09-29 | 2018-07-27 | 朱春芳 | 一种电磁波屏蔽膜、含有该屏蔽膜的印刷线路板及该线路板的制备方法 |
CN205030048U (zh) * | 2015-10-25 | 2016-02-10 | 东莞市导谷电子材料科技有限公司 | 一种新型软体电磁波屏蔽膜 |
KR102432750B1 (ko) * | 2016-02-12 | 2022-08-12 | 타츠타 전선 주식회사 | 전자파 차폐 필름 |
CN105907287B (zh) * | 2016-05-16 | 2018-04-27 | 四川龙华光电薄膜股份有限公司 | 防紫外防眩光防指纹增硬涂液组合物、涂层及其制备方法 |
-
2017
- 2017-09-06 KR KR1020170113944A patent/KR102394462B1/ko active IP Right Grant
- 2017-09-06 JP JP2017171417A patent/JP6783205B2/ja active Active
- 2017-09-06 CN CN202010489806.7A patent/CN111818784B/zh active Active
- 2017-09-06 CN CN202010489211.1A patent/CN111800997B/zh active Active
- 2017-09-06 CN CN201710796140.8A patent/CN107801366B/zh active Active
-
2020
- 2020-10-21 JP JP2020176728A patent/JP7083880B2/ja active Active
-
2022
- 2022-04-29 KR KR1020220053435A patent/KR102567422B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016143751A (ja) * | 2015-02-02 | 2016-08-08 | 東洋インキScホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
CN107801366A (zh) | 2018-03-13 |
CN107801366B (zh) | 2020-07-17 |
CN111818784B (zh) | 2023-03-24 |
JP2021010032A (ja) | 2021-01-28 |
KR20180027388A (ko) | 2018-03-14 |
KR102567422B1 (ko) | 2023-08-14 |
KR20220058520A (ko) | 2022-05-09 |
CN111800997B (zh) | 2023-08-29 |
JP7083880B2 (ja) | 2022-06-13 |
CN111800997A (zh) | 2020-10-20 |
JP2018041962A (ja) | 2018-03-15 |
JP6783205B2 (ja) | 2020-11-11 |
CN111818784A (zh) | 2020-10-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102394462B1 (ko) | 전자파 실드 필름 | |
CN112586096B (zh) | 印制线路基材用贴附膜 | |
KR101956091B1 (ko) | 전자파 차폐 필름 | |
CN112136368B (zh) | 印制线路基材用贴附膜及屏蔽线路基材 | |
KR102432750B1 (ko) | 전자파 차폐 필름 | |
JP6426865B1 (ja) | 電磁波シールドフィルム | |
JP6511550B1 (ja) | 電磁波シールドフィルム | |
JP6863908B2 (ja) | 電磁波シールドフィルム | |
JP7410182B2 (ja) | 形状転写フィルム | |
JP6978994B2 (ja) | 転写フィルム | |
WO2024004991A1 (ja) | 電磁波シールドフィルム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |