JP6782702B2 - 高品質fcvd膜バックグラウンド用の先進的処理フロー - Google Patents
高品質fcvd膜バックグラウンド用の先進的処理フロー Download PDFInfo
- Publication number
- JP6782702B2 JP6782702B2 JP2017535912A JP2017535912A JP6782702B2 JP 6782702 B2 JP6782702 B2 JP 6782702B2 JP 2017535912 A JP2017535912 A JP 2017535912A JP 2017535912 A JP2017535912 A JP 2017535912A JP 6782702 B2 JP6782702 B2 JP 6782702B2
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- JP
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- Prior art keywords
- fcvd
- film
- ion implantation
- dielectric film
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562100888P | 2015-01-07 | 2015-01-07 | |
| US62/100,888 | 2015-01-07 | ||
| US14/635,589 | 2015-03-02 | ||
| US14/635,589 US9777378B2 (en) | 2015-01-07 | 2015-03-02 | Advanced process flow for high quality FCVD films |
| PCT/US2015/065846 WO2016111815A1 (en) | 2015-01-07 | 2015-12-15 | Advanced process flow for high quality fcvd films |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020176093A Division JP2021044555A (ja) | 2015-01-07 | 2020-10-20 | 高品質fcvd膜バックグラウンド用の先進的処理フロー |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018503259A JP2018503259A (ja) | 2018-02-01 |
| JP2018503259A5 JP2018503259A5 (enExample) | 2019-01-31 |
| JP6782702B2 true JP6782702B2 (ja) | 2020-11-11 |
Family
ID=56286182
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017535912A Active JP6782702B2 (ja) | 2015-01-07 | 2015-12-15 | 高品質fcvd膜バックグラウンド用の先進的処理フロー |
| JP2020176093A Pending JP2021044555A (ja) | 2015-01-07 | 2020-10-20 | 高品質fcvd膜バックグラウンド用の先進的処理フロー |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020176093A Pending JP2021044555A (ja) | 2015-01-07 | 2020-10-20 | 高品質fcvd膜バックグラウンド用の先進的処理フロー |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9777378B2 (enExample) |
| JP (2) | JP6782702B2 (enExample) |
| KR (1) | KR102438577B1 (enExample) |
| CN (1) | CN107109643B (enExample) |
| TW (1) | TWI676700B (enExample) |
| WO (1) | WO2016111815A1 (enExample) |
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| US10421766B2 (en) * | 2015-02-13 | 2019-09-24 | Versum Materials Us, Llc | Bisaminoalkoxysilane compounds and methods for using same to deposit silicon-containing films |
| JP6844176B2 (ja) * | 2016-09-29 | 2021-03-17 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
| US11189487B2 (en) | 2016-09-30 | 2021-11-30 | Intel Corporation | Method and apparatus for high pressure cure of flowable dielectric films |
| US10811251B2 (en) | 2016-09-30 | 2020-10-20 | Intel Corporation | Dielectric gap-fill material deposition |
| US10822458B2 (en) * | 2017-02-08 | 2020-11-03 | Versum Materials Us, Llc | Organoamino-functionalized linear and cyclic oligosiloxanes for deposition of silicon-containing films |
| JP6817845B2 (ja) * | 2017-02-22 | 2021-01-20 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理装置およびプログラム |
| US10224224B2 (en) | 2017-03-10 | 2019-03-05 | Micromaterials, LLC | High pressure wafer processing systems and related methods |
| JP7118511B2 (ja) * | 2017-04-04 | 2022-08-16 | アプライド マテリアルズ インコーポレイテッド | シリコン間隙充填のための二段階プロセス |
| JP7168586B2 (ja) | 2017-05-13 | 2022-11-09 | アプライド マテリアルズ インコーポレイテッド | 高品質のボイド充填法のための流動性堆積及び高密度プラズマ処理工程サイクル |
| US10622214B2 (en) | 2017-05-25 | 2020-04-14 | Applied Materials, Inc. | Tungsten defluorination by high pressure treatment |
| CN109148373A (zh) * | 2017-06-16 | 2019-01-04 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
| US11990332B2 (en) | 2017-08-08 | 2024-05-21 | Applied Materials, Inc. | Methods and apparatus for deposition of low-k films |
| WO2019036157A1 (en) | 2017-08-18 | 2019-02-21 | Applied Materials, Inc. | HIGH PRESSURE AND HIGH TEMPERATURE RECOVERY CHAMBER |
| US10276411B2 (en) | 2017-08-18 | 2019-04-30 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
| SG11202001450UA (en) | 2017-09-12 | 2020-03-30 | Applied Materials Inc | Apparatus and methods for manufacturing semiconductor structures using protective barrier layer |
| CN117936417A (zh) | 2017-11-11 | 2024-04-26 | 微材料有限责任公司 | 用于高压处理腔室的气体输送系统 |
| JP2021503714A (ja) | 2017-11-17 | 2021-02-12 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 高圧処理システムのためのコンデンサシステム |
| KR102612989B1 (ko) | 2017-12-01 | 2023-12-11 | 어플라이드 머티어리얼스, 인코포레이티드 | 고 에칭 선택성 비정질 탄소 막 |
| CN109994484A (zh) * | 2017-12-28 | 2019-07-09 | 中芯国际集成电路制造(上海)有限公司 | Nand存储器及其形成方法 |
| US10211045B1 (en) * | 2018-01-24 | 2019-02-19 | Globalfoundries Inc. | Microwave annealing of flowable oxides with trap layers |
| CN111656510A (zh) | 2018-02-22 | 2020-09-11 | 应用材料公司 | 处理掩模基板以实现更佳的膜质量的方法 |
| KR102536820B1 (ko) | 2018-03-09 | 2023-05-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 금속 함유 재료들을 위한 고압 어닐링 프로세스 |
| WO2019195188A1 (en) * | 2018-04-03 | 2019-10-10 | Applied Materials, Inc. | Flowable film curing using h2 plasma |
| US10950429B2 (en) | 2018-05-08 | 2021-03-16 | Applied Materials, Inc. | Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom |
| US10748783B2 (en) | 2018-07-25 | 2020-08-18 | Applied Materials, Inc. | Gas delivery module |
| KR102018318B1 (ko) * | 2018-09-11 | 2019-09-04 | 주식회사 유진테크 | 박막 형성 방법 |
| WO2020117462A1 (en) | 2018-12-07 | 2020-06-11 | Applied Materials, Inc. | Semiconductor processing system |
| US11107674B2 (en) * | 2019-01-24 | 2021-08-31 | Applied Materials, Inc. | Methods for depositing silicon nitride |
| US10896855B2 (en) * | 2019-06-10 | 2021-01-19 | Applied Materials, Inc. | Asymmetric gate spacer formation using multiple ion implants |
| TWI894152B (zh) * | 2019-07-02 | 2025-08-21 | 美商應用材料股份有限公司 | 形成積體電路結構的方法、整合系統與電腦可讀媒介 |
| CN114174555A (zh) * | 2019-07-25 | 2022-03-11 | 弗萨姆材料美国有限责任公司 | 用于沉积含硅膜的包含硅杂环烷烃的组合物及其使用方法 |
| US11972943B2 (en) * | 2019-09-20 | 2024-04-30 | Applied Materials, Inc. | Methods and apparatus for depositing dielectric material |
| US11114606B2 (en) * | 2019-09-23 | 2021-09-07 | International Business Machines Corporation | MRAM devices containing a harden gap fill dielectric material |
| US20210175075A1 (en) * | 2019-12-09 | 2021-06-10 | Applied Materials, Inc. | Oxygen radical assisted dielectric film densification |
| US11901222B2 (en) | 2020-02-17 | 2024-02-13 | Applied Materials, Inc. | Multi-step process for flowable gap-fill film |
| US11615984B2 (en) * | 2020-04-14 | 2023-03-28 | Applied Materials, Inc. | Method of dielectric material fill and treatment |
| US12004431B2 (en) | 2020-10-30 | 2024-06-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method for MRAM devices |
| US11659771B2 (en) | 2020-11-25 | 2023-05-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method for integrating MRAM and logic devices |
| US20220375747A1 (en) * | 2021-05-20 | 2022-11-24 | Applied Materials, Inc. | Flowable CVD Film Defect Reduction |
| US12094709B2 (en) | 2021-07-30 | 2024-09-17 | Applied Materials, Inc. | Plasma treatment process to densify oxide layers |
| US20230155007A1 (en) * | 2021-11-16 | 2023-05-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Fin profile modulation |
| US20240145217A1 (en) * | 2022-11-02 | 2024-05-02 | Applied Materials, Inc. | Method for forming highly uniform dielectric film |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH02230735A (ja) * | 1989-03-03 | 1990-09-13 | Fujitsu Ltd | 半導体装置の製造方法 |
| US5319212A (en) * | 1992-10-07 | 1994-06-07 | Genus, Inc. | Method of monitoring ion beam current in ion implantation apparatus for use in manufacturing semiconductors |
| JP3015738B2 (ja) * | 1995-06-21 | 2000-03-06 | 三洋電機株式会社 | 半導体装置の製造方法 |
| JPH10189578A (ja) * | 1996-12-20 | 1998-07-21 | Toshiba Corp | 半導体装置の製造方法 |
| JP3348084B2 (ja) * | 1999-12-28 | 2002-11-20 | キヤノン販売株式会社 | 成膜方法及び半導体装置 |
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| JP2008263097A (ja) * | 2007-04-13 | 2008-10-30 | Toshiba Corp | 半導体装置及び半導体装置の製造方法 |
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| US7803722B2 (en) | 2007-10-22 | 2010-09-28 | Applied Materials, Inc | Methods for forming a dielectric layer within trenches |
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| US8980382B2 (en) * | 2009-12-02 | 2015-03-17 | Applied Materials, Inc. | Oxygen-doping for non-carbon radical-component CVD films |
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| KR101674057B1 (ko) * | 2010-04-01 | 2016-11-08 | 삼성전자 주식회사 | 강화된 복합 절연막을 포함하는 반도체 칩 구조 및 그 제조 방법 |
| US8318584B2 (en) * | 2010-07-30 | 2012-11-27 | Applied Materials, Inc. | Oxide-rich liner layer for flowable CVD gapfill |
| US20130217243A1 (en) * | 2011-09-09 | 2013-08-22 | Applied Materials, Inc. | Doping of dielectric layers |
| SG11201505371UA (en) | 2013-02-19 | 2015-09-29 | Applied Materials Inc | Hdd patterning using flowable cvd film |
| US20140273530A1 (en) * | 2013-03-15 | 2014-09-18 | Victor Nguyen | Post-Deposition Treatment Methods For Silicon Nitride |
-
2015
- 2015-03-02 US US14/635,589 patent/US9777378B2/en active Active
- 2015-12-15 JP JP2017535912A patent/JP6782702B2/ja active Active
- 2015-12-15 KR KR1020177021938A patent/KR102438577B1/ko active Active
- 2015-12-15 CN CN201580064621.9A patent/CN107109643B/zh not_active Expired - Fee Related
- 2015-12-15 WO PCT/US2015/065846 patent/WO2016111815A1/en not_active Ceased
- 2015-12-18 TW TW104142763A patent/TWI676700B/zh active
-
2020
- 2020-10-20 JP JP2020176093A patent/JP2021044555A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018503259A (ja) | 2018-02-01 |
| CN107109643A (zh) | 2017-08-29 |
| KR20170101997A (ko) | 2017-09-06 |
| KR102438577B1 (ko) | 2022-08-30 |
| JP2021044555A (ja) | 2021-03-18 |
| US20160194758A1 (en) | 2016-07-07 |
| US9777378B2 (en) | 2017-10-03 |
| TWI676700B (zh) | 2019-11-11 |
| TW201629254A (zh) | 2016-08-16 |
| WO2016111815A1 (en) | 2016-07-14 |
| CN107109643B (zh) | 2019-09-24 |
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