JP6748891B2 - ダイシング装置及びダイシング方法 - Google Patents

ダイシング装置及びダイシング方法 Download PDF

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Publication number
JP6748891B2
JP6748891B2 JP2018211634A JP2018211634A JP6748891B2 JP 6748891 B2 JP6748891 B2 JP 6748891B2 JP 2018211634 A JP2018211634 A JP 2018211634A JP 2018211634 A JP2018211634 A JP 2018211634A JP 6748891 B2 JP6748891 B2 JP 6748891B2
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JP
Japan
Prior art keywords
cutting
blade
dicing
dicing tape
cutting trace
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018211634A
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English (en)
Japanese (ja)
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JP2020037169A (ja
JP2020037169A5 (enrdf_load_stackoverflow
Inventor
朋来 福家
朋来 福家
翼 清水
翼 清水
真生 西山
真生 西山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
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Publication date
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Publication of JP2020037169A publication Critical patent/JP2020037169A/ja
Publication of JP2020037169A5 publication Critical patent/JP2020037169A5/ja
Application granted granted Critical
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2018211634A 2018-02-08 2018-11-09 ダイシング装置及びダイシング方法 Active JP6748891B2 (ja)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2018021222 2018-02-08
JP2018021222 2018-02-08
JP2018163615 2018-08-31
JP2018163615 2018-08-31
JP2018163613 2018-08-31
JP2018163613 2018-08-31
JP2018163614 2018-08-31
JP2018163614 2018-08-31

Publications (3)

Publication Number Publication Date
JP2020037169A JP2020037169A (ja) 2020-03-12
JP2020037169A5 JP2020037169A5 (enrdf_load_stackoverflow) 2020-08-06
JP6748891B2 true JP6748891B2 (ja) 2020-09-02

Family

ID=67549577

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2018211634A Active JP6748891B2 (ja) 2018-02-08 2018-11-09 ダイシング装置及びダイシング方法
JP2018211635A Active JP6768185B2 (ja) 2018-02-08 2018-11-09 ダイシング方法及び装置
JP2018211636A Active JP6748892B2 (ja) 2018-02-08 2018-11-09 ダイシング装置及びダイシング方法並びにダイシングテープ

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2018211635A Active JP6768185B2 (ja) 2018-02-08 2018-11-09 ダイシング方法及び装置
JP2018211636A Active JP6748892B2 (ja) 2018-02-08 2018-11-09 ダイシング装置及びダイシング方法並びにダイシングテープ

Country Status (3)

Country Link
JP (3) JP6748891B2 (enrdf_load_stackoverflow)
CN (3) CN112536700B (enrdf_load_stackoverflow)
WO (1) WO2019155707A1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7266398B2 (ja) * 2018-12-11 2023-04-28 株式会社ディスコ 切削装置及び切削装置を用いたウエーハの加工方法
JP7562230B2 (ja) * 2020-08-31 2024-10-07 株式会社ディスコ ウェーハの加工方法
JP2022080757A (ja) * 2020-11-18 2022-05-30 株式会社ディスコ 切削ブレードの直径測定方法
CN114057384B (zh) * 2021-12-10 2024-06-11 青岛天仁微纳科技有限责任公司 一种扫描电镜辅助定位裂片装置及使用方法
CN117301328A (zh) * 2023-10-20 2023-12-29 北京中电科电子装备有限公司 一种晶片切割装置、划膜测高方法及切割方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03227557A (ja) * 1990-02-01 1991-10-08 Mitsubishi Electric Corp ダイシング装置
JP2003124155A (ja) * 2001-10-12 2003-04-25 Disco Abrasive Syst Ltd 切削装置
JP2005203540A (ja) * 2004-01-15 2005-07-28 Disco Abrasive Syst Ltd ウエーハの切削方法
JP4554265B2 (ja) * 2004-04-21 2010-09-29 株式会社ディスコ 切削ブレードの位置ずれ検出方法
JP4748643B2 (ja) * 2005-01-28 2011-08-17 株式会社ディスコ 切削ブレードの基準位置検出方法
JP4943688B2 (ja) * 2005-10-21 2012-05-30 株式会社ディスコ 切削装置
JP5340808B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
JP5647510B2 (ja) * 2010-12-27 2014-12-24 株式会社小金井精機製作所 切削加工装置及び切削加工方法
JP5858684B2 (ja) * 2011-08-15 2016-02-10 株式会社ディスコ 切削方法
JP6219628B2 (ja) * 2013-07-17 2017-10-25 株式会社ディスコ 切削ブレード先端形状検出方法
JP6228044B2 (ja) * 2014-03-10 2017-11-08 株式会社ディスコ 板状物の加工方法
JP2016019249A (ja) * 2014-07-11 2016-02-01 キヤノン株式会社 表示制御装置
JP2016063060A (ja) * 2014-09-18 2016-04-25 株式会社ディスコ ウエーハの加工方法
JP2016192494A (ja) * 2015-03-31 2016-11-10 株式会社ディスコ ウエーハの分割方法
CN106334989A (zh) * 2016-11-02 2017-01-18 佛山市百思科铁芯制造有限公司 一种变压器铁芯专用切割机

Also Published As

Publication number Publication date
CN112536700B (zh) 2022-04-29
WO2019155707A1 (ja) 2019-08-15
JP2020037169A (ja) 2020-03-12
CN113290484A (zh) 2021-08-24
CN111699545A (zh) 2020-09-22
CN112536700A (zh) 2021-03-23
JP2020037171A (ja) 2020-03-12
CN111699545B (zh) 2021-09-14
JP2020037170A (ja) 2020-03-12
JP6768185B2 (ja) 2020-10-14
CN113290484B (zh) 2023-04-25
JP6748892B2 (ja) 2020-09-02

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