JP6743325B1 - セラミックヒータ - Google Patents
セラミックヒータ Download PDFInfo
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- JP6743325B1 JP6743325B1 JP2020514637A JP2020514637A JP6743325B1 JP 6743325 B1 JP6743325 B1 JP 6743325B1 JP 2020514637 A JP2020514637 A JP 2020514637A JP 2020514637 A JP2020514637 A JP 2020514637A JP 6743325 B1 JP6743325 B1 JP 6743325B1
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- thermocouple
- ceramic plate
- ceramic heater
- elongated hole
- ceramic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/04—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0202—Switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
- H05B1/0233—Industrial applications for semiconductors manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
Abstract
Description
ウエハ載置面を有する円盤状のセラミックプレートと、
小径部と大径部とを有し、前記セラミックプレートのうち前記ウエハ載置面とは反対側の裏面に前記大径部の端面が接合された筒状シャフトと、
前記セラミックプレートの内周部に埋設された内周側抵抗発熱体と、
前記セラミックプレートの外周部に埋設された外周側抵抗発熱体と、
前記内周側抵抗発熱体の一対の端子及び前記外周側抵抗発熱体の一対の端子を含む付帯部品と、
前記セラミックプレートの前記裏面のうち前記小径部の内側領域の起点から前記セラミックプレートの外周部の所定の終端位置に至る長穴と、
を備え、
前記筒状シャフトの内部空間は、前記小径部の内径と同じ径の円筒空間と、前記円筒空間の外側に前記大径部によって囲まれた環状の拡張空間とを有し、
前記長穴の入口部分は、長溝であり、
前記長溝は、前記起点から前記セラミックプレートの前記裏面のうち前記拡張空間内の拡張領域に至るように設けられ、
前記付帯部品は、前記セラミックプレートの前記裏面のうち前記小径部の内側領域であって前記長溝以外の位置に設けられている、
ものである。
底面、26q 段差、26r 傾斜面、26s 起点、32,432 熱電対ガイド、32a ガイド穴、33 垂直部、34 湾曲部、35 水平部、40 筒状シャフト、40a 小径部、40b 大径部、41 内部空間、41a 円筒空間、41b 拡張空間、42a,42b,44a,44b 給電棒、48 内周側熱電対、48a 測温部、49 凹部、50 外周側熱電対、50a 測温部、261 テーパ部、262 幅広部、263 幅狭部、450 外周側熱電対、426 熱電対通路、426a スリット、440 ストレートシャフト、G 間隔、P1 上側プレート、P2 下側プレート、W
ウエハ、Z1 内周側ゾーン、Z2 外周側ゾーン。
Claims (13)
- ウエハ載置面を有する円盤状のセラミックプレートと、
小径部と大径部とを有し、前記セラミックプレートのうち前記ウエハ載置面とは反対側の裏面に前記大径部の端面が接合された筒状シャフトと、
前記セラミックプレートの内周部に埋設された内周側抵抗発熱体と、
前記セラミックプレートの外周部に埋設された外周側抵抗発熱体と、
前記内周側抵抗発熱体の一対の端子及び前記外周側抵抗発熱体の一対の端子を含む付帯部品と、
前記セラミックプレートの前記裏面のうち前記小径部の内側領域の起点から前記セラミックプレートの外周部の所定の終端位置に至る長穴と、
を備え、
前記筒状シャフトの内部空間は、前記小径部の内径と同じ径の円筒空間と、前記円筒空間の外側に前記大径部によって囲まれた環状の拡張空間とを有し、
前記長穴の入口部分は、長溝であり、
前記長溝は、前記起点から前記セラミックプレートの前記裏面のうち前記拡張空間内の拡張領域に至るように設けられ、
前記付帯部品は、前記セラミックプレートの前記裏面のうち前記小径部の内側領域であって前記長溝以外の位置に設けられ、
前記長溝は、前記ウエハ載置面に対して垂直方向から水平方向に転換する湾曲部を備えた熱電対ガイドの前記湾曲部を配置するために用いられ、
前記熱電対ガイドの前記湾曲部の外径は、垂直部の外径よりも小さい、
セラミックヒータ。 - 前記長溝は、前記セラミックプレートの半径方向に沿って設けられている、
請求項1に記載のセラミックヒータ。 - 前記長溝は、前記セラミックプレートの半径方向から外れた方向に沿って設けられている、
請求項1に記載のセラミックヒータ。 - 前記長穴は、熱電対を挿入する熱電対挿入用長穴である、
請求項1〜3のいずれか1項に記載のセラミックヒータ。 - 請求項1〜4のいずれか1項に記載のセラミックヒータであって、
前記長溝に配置された前記熱電対ガイドを備える、
セラミックヒータ。 - 請求項5に記載のセラミックヒータであって、
前記熱電対ガイド及び前記長穴に挿入された熱電対を備える、
セラミックヒータ。 - 前記セラミックプレートを前記裏面からみたときに前記熱電対の測温部が前記外周側抵抗発熱体の幅の中に収まるように配置されている、
請求項6に記載のセラミックヒータ。 - 前記長穴は、断面略四角形の穴であり、前記穴の天井面と側面との境界部は、曲率半径が0.5mm以上のR面である、
請求項1〜7のいずれか1項に記載のセラミックヒータ。 - 前記長穴は、前記起点から前記終端位置までの途中にテーパ部を有し、前記起点から前記テーパ部の一端までは幅広部であり、前記テーパ部の他端から前記終端位置までは幅狭部である、
請求項1〜8のいずれか1項に記載のセラミックヒータ。 - 前記長穴の天井面は、前記起点から前記終端位置までの途中に傾斜状の段差を有し、前記天井面のうち前記起点から前記段差までの深さは前記段差から前記終端位置までの深さよりも深い、
請求項1〜9のいずれか1項に記載のセラミックヒータ。 - 前記外周側熱電対の測温部は凸状曲面であり、前記長穴の終端面のうち前記外周側熱電対の測温部が接触する部分は凹状曲面である、
請求項1〜10のいずれか1項に記載のセラミックヒータ。 - 前記長溝と前記付帯部品との間隔は、2mm以上である、
請求項1〜11のいずれか1項に記載のセラミックヒータ。 - 前記長穴の前記起点側の壁は、前記セラミックプレートの前記裏面から前記長穴の奥に向かって湾曲している、
請求項1〜12のいずれか1項に記載のセラミックヒータ。
Priority Applications (1)
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JP2020128159A JP6909910B2 (ja) | 2018-12-20 | 2020-07-29 | セラミックヒータ |
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JP2018238226 | 2018-12-20 | ||
JP2018238226 | 2018-12-20 | ||
PCT/JP2019/047380 WO2020129641A1 (ja) | 2018-12-20 | 2019-12-04 | セラミックヒータ |
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JP6743325B1 true JP6743325B1 (ja) | 2020-08-19 |
JPWO2020129641A1 JPWO2020129641A1 (ja) | 2021-02-15 |
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JP2020128159A Active JP6909910B2 (ja) | 2018-12-20 | 2020-07-29 | セラミックヒータ |
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US (1) | US11664244B2 (ja) |
JP (2) | JP6743325B1 (ja) |
KR (1) | KR102432592B1 (ja) |
CN (1) | CN111788862B (ja) |
TW (1) | TWI767164B (ja) |
WO (1) | WO2020129641A1 (ja) |
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JP7197534B2 (ja) * | 2020-06-12 | 2022-12-27 | 日本碍子株式会社 | セラミックヒータ |
JP7372224B2 (ja) * | 2020-10-16 | 2023-10-31 | 日本碍子株式会社 | ウエハ載置台 |
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KR20200103087A (ko) | 2020-09-01 |
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