WO2020129641A1 - セラミックヒータ - Google Patents
セラミックヒータ Download PDFInfo
- Publication number
- WO2020129641A1 WO2020129641A1 PCT/JP2019/047380 JP2019047380W WO2020129641A1 WO 2020129641 A1 WO2020129641 A1 WO 2020129641A1 JP 2019047380 W JP2019047380 W JP 2019047380W WO 2020129641 A1 WO2020129641 A1 WO 2020129641A1
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- WO
- WIPO (PCT)
- Prior art keywords
- thermocouple
- ceramic heater
- ceramic plate
- ceramic
- elongated hole
- Prior art date
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- 239000000919 ceramic Substances 0.000 title claims abstract description 128
- 230000002093 peripheral effect Effects 0.000 claims description 79
- 238000010438 heat treatment Methods 0.000 claims description 31
- 230000036581 peripheral resistance Effects 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 description 9
- 238000005259 measurement Methods 0.000 description 5
- 238000009529 body temperature measurement Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/04—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0202—Switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
- H05B1/0233—Industrial applications for semiconductors manufacturing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
Definitions
- the present invention relates to a ceramic heater.
- Patent Document 1 discloses a ceramic heater 410 with a shaft shown in FIG.
- the ceramic heater 410 with a shaft measures the temperature on the outer peripheral side of the ceramic plate 420 with an outer peripheral side thermocouple 450.
- the thermocouple guide 432 is a tubular member, and extends straight from the lower side to the upper side inside the straight shaft 440 and is then bent in an arc shape to change the direction by 90°.
- thermocouple guide 432 is attached to a slit 426a provided in a region surrounded by the straight shaft 440 on the back surface of the ceramic plate 420.
- the slit 426a forms an inlet portion of the thermocouple passage 426.
- the outer peripheral side thermocouple 450 is inserted into the cylinder of the thermocouple guide 432 and reaches the end position of the thermocouple passage 426.
- the ceramic heater 410 uses the straight shaft 440, the area ratio of the slit 426a in the area surrounded by the straight shaft 440 on the back surface of the ceramic plate 420 was large. Therefore, there is a problem that the area in which the four terminals of the two-zone heater are arranged is limited by the slit 426a.
- the present invention has been made to solve such a problem, and its main purpose is to increase the degree of freedom of arrangement of terminals and the like in a multi-zone heater.
- the ceramic heater of the present invention is A disk-shaped ceramic plate having a wafer mounting surface, A cylindrical shaft having a small-diameter portion and a large-diameter portion, the end surface of the large-diameter portion being joined to the back surface of the ceramic plate opposite to the wafer mounting surface, An inner peripheral side resistance heating element embedded in the inner peripheral portion of the ceramic plate, An outer peripheral resistance heating element embedded in the outer peripheral portion of the ceramic plate, An auxiliary component including a pair of terminals of the inner resistance heating element and a pair of terminals of the outer resistance heating element, An elongated hole extending from a starting point of an inner region of the small diameter portion of the back surface of the ceramic plate to a predetermined end position of an outer peripheral portion of the ceramic plate; Equipped with The internal space of the tubular shaft has a cylindrical space having the same diameter as the inner diameter of the small diameter portion, and an annular expansion space surrounded by the large diameter portion outside the cylindrical space, The inlet portion of the slot is a slot, The long groove is provided
- the internal space of the tubular shaft has a cylindrical space having the same diameter as the inner diameter of the small diameter part, and an annular expansion space surrounded by the large diameter part outside the cylindrical space.
- the elongated hole extends from the starting point of the inner region of the small diameter portion on the back surface of the ceramic plate to the outer peripheral portion of the ceramic plate.
- the entrance portion of the slot is a slot.
- the long groove is provided so as to extend from the starting point of the long hole to the expansion region.
- the accessory component is provided on the inner surface of the small diameter portion of the back surface of the ceramic plate at a position other than the long groove.
- the proportion of the long groove occupying the inner area of the small diameter portion of the back surface of the ceramic plate is set so that the long groove enters the expansion area, so that the long groove does not enter the expansion area (that is, there is no expansion area). Compared to this, it becomes smaller. Therefore, the area in which the accessory such as the terminal can be arranged is wider than that in the case without the expansion area. Therefore, in the multi-zone heater, the degree of freedom in arranging the terminals and the like can be increased.
- the long groove may be provided along the radial direction of the ceramic plate.
- the long groove may be provided along a direction deviating from the radial direction of the ceramic plate. In this case, since the long groove does not pass through the center of the inner region of the small diameter portion on the back surface of the ceramic plate, the degree of freedom in arranging the terminals can be further increased.
- the slot may be a thermocouple slot for inserting a thermocouple.
- the thermocouple can be inserted using the elongated hole.
- the long groove may be used to dispose the curved portion of the thermocouple guide having a curved portion that changes from a vertical direction to a horizontal direction with respect to the wafer mounting surface. ..
- the degree of freedom in arranging the terminals and the like can be increased.
- the expansion space may be a space that can swivel the curved portion of the thermocouple guide.
- the curved portion of the thermocouple guide can be arranged in the long groove while swirling in the expansion space. Therefore, the tubular thermocouple guide curved from the vertical direction to the horizontal direction can be easily set.
- the length of the long groove may be set to be equal to or longer than the length of the tip portion of the curved portion of the thermocouple guide which is arranged in the long groove. By doing so, the thermocouple guide can be set more easily.
- the outer diameter of the curved portion of the thermocouple guide may be smaller than the outer diameter of the vertical portion. By doing so, the width of the long groove can be reduced.
- the ceramic heater of the present invention may include the thermocouple guide arranged in the elongated groove, and may further include the thermocouple guide and the thermocouple inserted in the elongated hole.
- the temperature measuring portion of the thermocouple may be arranged so as to fit within the width of the outer peripheral resistance heating element. With this configuration, the temperature change of the resistance heating element on the outer peripheral side can be detected with good response by the temperature measuring unit of the thermocouple on the outer peripheral side.
- the elongated hole is a hole having a substantially rectangular cross section, and a boundary portion between the ceiling surface and the side surface of the hole is an R surface (curved surface) having a radius of curvature of 0.5 mm or more. Good. This makes it possible to prevent cracks from being generated in the ceramic plate starting from the boundary between the ceiling surface and the side surface.
- the elongated hole has a taper part in the middle from the starting point to the terminal position, a wide part from the starting point to one end of the taper part, and from the other end of the taper part. It may be a narrow portion up to the end position.
- the outer peripheral side thermocouple can be smoothly inserted into the elongated hole by being guided by the tapered portion.
- the taper portion temporarily fixes the thermocouple guide if the thermocouple guide abuts the taper portion. Therefore, it is easy to insert the outer thermocouple.
- a ceiling surface of the elongated hole has an inclined surface midway from the starting point to the terminal position, and a depth of the ceiling surface from the starting point to the inclined surface is the inclined surface. It may be deeper than the depth from to the end position.
- the temperature measuring portion of the outer peripheral side thermocouple is a convex curved surface, and the portion of the end surface of the elongated hole which is in contact with the temperature measuring portion of the outer peripheral side thermocouple is a concave curved surface. Good. By doing so, the temperature measuring portion of the outer thermocouple comes into surface contact with the end surface of the elongated hole, which is a desired measurement point, or in a state close thereto, so that the temperature measurement accuracy is improved.
- the distance between the long groove and the accessory may be 2 mm or more. In this way, it is possible to prevent the ceramic plate from being cracked because the space between the long groove and the accessory is too narrow.
- the wall of the inlet portion of the elongated hole may be curved toward the inside of the elongated hole.
- FIG. 2 is a sectional view taken along line AA of FIG. 1.
- FIG. 2 is a sectional view taken along line BB of FIG. 1.
- the front view of the thermocouple guide 32 The enlarged view of the central part of FIG.
- Explanatory drawing which shows an example of the position of the temperature measuring part 50a of the outer peripheral side thermocouple 50.
- Explanatory drawing which shows another example of the long hole 26.
- the rear view of the upper side plate P1 in which the slot 26 of another example was provided.
- FIG. 13 is a sectional view taken along line CC of FIG. 13 is a sectional view taken along line DD of FIG.
- FIG. 8 is a plan view of another example of the temperature measuring unit 50 a of the outer thermocouple 50 inserted into the elongated hole 26.
- FIG. 8 is a plan view of another example of the temperature measuring unit 50 a of the outer thermocouple 50 inserted into the elongated hole 26.
- Explanatory drawing which shows the space
- Explanatory drawing of another example of the long hole 26 and the long groove 26a Explanatory drawing of a prior art example.
- FIG. 1 is a perspective view of the ceramic heater 10
- FIG. 2 is a sectional view taken along line AA of FIG. 1
- FIG. 3 is a sectional view taken along line BB of FIG. 1
- FIG. 4 is a front view of a thermocouple guide 32, and FIG. It is an enlarged view of the central part of.
- the ceramic heater 10 is used to heat the wafer W that is subjected to processing such as etching and CVD, and is installed in a vacuum chamber (not shown).
- the ceramic heater 10 includes a disk-shaped ceramic plate 20 having a wafer mounting surface 20a and a cylindrical shaft 40 joined to a surface (back surface) 20b of the ceramic plate 20 opposite to the wafer mounting surface 20a. I have it.
- the ceramic plate 20 is a disc-shaped plate made of a ceramic material typified by aluminum nitride or alumina.
- the diameter of the ceramic plate 20 is not particularly limited, but is, for example, about 300 mm.
- the ceramic plate 20 is divided into a small circular inner peripheral side zone Z1 and an annular outer peripheral side zone Z2 by a virtual boundary 20c concentric with the ceramic plate 20 (see FIG. 3).
- An inner peripheral side resistance heating element 22 is embedded in the inner peripheral side zone Z1 of the ceramic plate 20, and an outer peripheral side resistance heating element 24 is embedded in the outer peripheral side zone Z2.
- Both resistance heating elements 22 and 24 are composed of a coil whose main component is molybdenum, tungsten or tungsten carbide, for example.
- the ceramic plate 20 is manufactured by surface-bonding an upper plate P1 and a lower plate P2 thinner than the upper plate P1.
- the tubular shaft 40 is made of ceramics such as aluminum nitride and alumina.
- the tubular shaft 40 includes a small diameter portion 40a and a large diameter portion 40b.
- the small diameter portion 40a is a portion from the lower end of the tubular shaft 40 to a predetermined height, and is a tubular portion having an inner diameter d1.
- the large diameter portion 40b is a portion from the predetermined height of the tubular shaft 40 to the upper end of the tubular shaft 40 after being expanded in diameter, and is a tubular portion having an inner diameter d2 (>d1).
- the upper end (end surface of the large diameter portion 40b) of the tubular shaft 40 is diffusion bonded to the ceramic plate 20.
- the internal space 41 of the tubular shaft 40 has a cylindrical space 41a having the same diameter as the inner diameter of the small diameter portion 40a, and an annular expansion space 41b surrounded by the large diameter portion 40b outside the cylindrical space 41a. ..
- the expansion space 41b is a space into which the tip of the bending portion 34 of the thermocouple guide 32, which will be described later, can be inserted while swirling.
- the resistance heating element 22 on the inner circumference side starts from one of the pair of terminals 22a and 22b, and is folded back at a plurality of folding parts in a one-stroke manner while being almost entirely covered by the zone Z1 on the inner circumference side. Is formed so as to reach the other of the pair of terminals 22a and 22b.
- the pair of terminals 22a and 22b are provided in a shaft inner region 20d (a region inside the small diameter portion 40a of the back surface 20b of the ceramic plate 20).
- Metal (for example, Ni) power supply rods 42a and 42b are joined to the pair of terminals 22a and 22b, respectively.
- the outer peripheral resistance heating element 24 originates from one of the pair of terminals 24a and 24b, is folded back at a plurality of folding portions in a one-stroke writing manner, and is wired in almost the entire outer peripheral zone Z2. After being formed, it is formed so as to reach the other of the pair of terminals 24a and 24b.
- the pair of terminals 24a and 24b are provided in the shaft inner region 20d of the back surface 20b of the ceramic plate 20.
- Metal (for example, Ni) power supply rods 44a and 44b are joined to the pair of terminals 24a and 24b, respectively.
- an elongated hole 26 for inserting the outer peripheral side thermocouple 50 is provided in parallel with the wafer mounting surface 20a.
- the elongated hole 26 extends from a starting point 26s of the shaft inner region 20d of the back surface 20b of the ceramic plate 20 to a predetermined end position 26e of the outer peripheral portion of the ceramic plate 20.
- the lateral width of the elongated hole 26 is gradually narrowed from the position before the end position 26e to the end position 26e.
- the elongated hole 26 is provided along a direction deviating from the radial direction of the ceramic plate 20.
- An inlet portion of the elongated hole 26 from the starting point 26s to the expansion region 20f serves as a long groove 26a for fitting the tip of the curved portion 34 of the thermocouple guide 32.
- the long groove 26 a opens into the internal space 41 of the tubular shaft 40.
- the long groove 26a extends from the starting point 26s to the outer peripheral edge of the expansion region 20f.
- the terminals 22a, 22b, 24a, 24b are provided in the shaft inner region 20d at positions other than the long groove 26a.
- the thermocouple guide 32 is a tubular member made of metal (for example, stainless steel) having a guide hole 32a as shown in FIG.
- the thermocouple guide 32 includes a vertical portion 33 that extends in the vertical direction with respect to the wafer mounting surface 20a, and a curved portion 34 that changes from the vertical direction to the horizontal direction.
- the outer diameter of the vertical portion 33 is larger than the outer diameter of the curved portion 34, but the inner diameter of the vertical portion 33 is the same as the inner diameter of the curved portion 34.
- the outer diameter of the vertical portion 33 and the outer diameter of the curved portion 34 may be the same.
- the radius of curvature R of the curved portion 34 is not particularly limited, but is, for example, about 30 mm.
- the outer peripheral thermocouple 50 is inserted into the guide hole 32 a of the thermocouple guide 32.
- the tip of the curved portion 34 may be simply fitted into the long groove 26a, or may be bonded or adhered to the long groove 26a.
- Power supply rods 44a and 44b connected to the terminals 24a and 24b, respectively, are arranged.
- an inner peripheral side thermocouple 48 for measuring the temperature near the center of the ceramic plate 20 and an outer peripheral side thermocouple 50 for measuring the temperature near the outer periphery of the ceramic plate 20 are also arranged. ing.
- the inner peripheral thermocouple 48 is inserted into a recess 49 provided in the back surface 20b of the ceramic plate 20, and the temperature measuring portion 48a at the tip is in contact with the ceramic plate 20.
- the recess 49 is provided at a position where it does not interfere with the terminals 22a, 22b, 24a, 24b and the long groove 26a.
- the outer peripheral side thermocouple 50 is a sheath thermocouple, passes through the guide hole 32a of the thermocouple guide 32 and the elongated hole 26, and the temperature measuring unit 50a at the tip reaches the end position 26e of the elongated hole 26.
- thermocouple guide 32 is attached at the end of the manufacturing process of the ceramic heater 10. The state at this time is shown in FIGS. 6 and 7. As shown in FIGS. 6 and 7, the power supply rods 42a, 42b, 44a, 44b are joined to the terminals 22a, 22b, 24a, 24b exposed on the back surface 20b of the ceramic plate 20, respectively. After joining the tubular shaft 40 to 20b, the thermocouple guide 32 is attached. In this embodiment, after aligning the direction of the curved portion 34 of the thermocouple guide 32 with the direction of the long groove 26a that is the inlet portion of the long hole 26, the thermocouple guide 32 is inserted into the small diameter portion 40a of the tubular shaft 40.
- the distance that the elongated hole 26 and its extension appear in the in-shaft region 20d is shorter than the horizontal distance from the tip of the bending portion 34 to the vertical portion 33, and the bending portion 34 is caught by the small diameter portion 40a. 32 cannot be put in the small diameter portion 40a. Therefore, first, after the curved portion 34 of the thermocouple guide 32 is placed in a posture that does not interfere with the small diameter portion 40a and the power supply rods 42a, 42b, 44a, 44b (see the thermocouple guide 32 indicated by the alternate long and short dash line in FIGS. 6 and 7), The curved portion 34 is brought close to the back surface 20b of the ceramic plate 20.
- the tip of the bending portion 34 After the tip of the bending portion 34 reaches the internal space of the large-diameter portion 40b, the tip of the bending portion 34 is inserted into the long groove 26a while rotating the thermocouple guide 32 so that the tip of the bending portion 34 enters the expansion space 41b. (Refer to the thermocouple guide 32 indicated by the solid line in FIGS. 6 and 7). After that, the outer peripheral thermocouple 50 is inserted into the guide hole 32a of the thermocouple guide 32 so that the temperature measuring unit 50a reaches the terminal position 26e of the elongated hole 26.
- the ceramic heater 10 is installed in a vacuum chamber (not shown), and the wafer W is mounted on the wafer mounting surface 20a of the ceramic heater 10. Then, the electric power supplied to the inner resistance heater 22 is adjusted so that the temperature detected by the inner thermocouple 48 becomes a predetermined inner target temperature, and the outer thermocouple 50 detects the temperature. The electric power supplied to the outer resistance heating element 24 is adjusted so that the determined temperature becomes the predetermined outer target temperature. As a result, the temperature of the wafer W is controlled to a desired temperature. Then, the inside of the vacuum chamber is set to a vacuum atmosphere or a reduced pressure atmosphere, plasma is generated in the vacuum chamber, and the wafer W is subjected to CVD film formation or etching using the plasma.
- the proportion of the long groove 26a in the shaft inner area 20d (the inner area of the small diameter portion 40a of the back surface 20b of the ceramic plate 20) is such that the long groove 26a enters the expansion area 20f. Since it is provided, it becomes smaller than the case where a long groove having the same length as the long groove 26a is provided in the straight shaft having no expansion region. Therefore, the area in which the auxiliary components such as the terminals 22a, 22b, 24a, 24b and the concave portion 49 can be arranged is wider than in the case where there is no expansion area. Therefore, in the multi-zone heater including the tubular thermocouple guide 32 that is curved from the vertical direction to the horizontal direction, the degree of freedom in arranging the terminals and the like can be increased.
- the tubular shaft 40 has the large diameter portion 40b, the heat conduction distance from the upper end of the shaft to the lower end of the shaft is longer than that of the straight shaft which does not have the large diameter portion 40b.
- the temperature can be lowered. Since the lower end of the shaft is fixed to the chamber (not shown) via the O-ring, the lower the temperature of the lower end of the shaft, the more the durability of the O-ring improves.
- the long groove 26a is provided along the direction deviating from the radial direction of the ceramic plate 20, the long groove 26a does not pass through the center of the shaft inner region 20d. Therefore, the degree of freedom in arranging the terminals can be further increased. Further, the distance of the long groove 26a occupied in the expansion region 20f can be lengthened, and the distance of the long groove 26a occupied in the shaft inner region 20d can be shortened.
- the expansion space 41b is a space of a size capable of turning the curved portion 34 of the thermocouple guide 32. Therefore, the curved portion 34 of the thermocouple guide 32 can be arranged in the long groove while swirling in the expansion space 41b. Therefore, the thermocouple guide 32 can be easily set.
- the length of the long groove 26a which is the inlet portion of the long hole 26, is determined to be equal to or longer than the length of the tip portion of the curved portion 34 of the thermocouple guide 32 of the thermocouple guide 32, which is disposed in the long groove 26a. Has been. Therefore, the thermocouple guide 32 can be set more easily.
- the width of the long groove 26a can be reduced.
- thermocouple guide 32 since the radius of curvature R of the curved portion 34 of the thermocouple guide 32 can be made relatively large, the outer peripheral side thermocouple 50 inserted in the thermocouple guide 32 can be smoothly turned.
- the temperature measuring unit 50a of the outer thermocouple 50 is set to a desired measurement point (of the ceramic plate 20). It is easy to dispose at a point near the terminal position 26e).
- the thermocouple guide 32 may include a horizontal portion 35 connected to the outlet of the bending portion 34 and extending in the horizontal direction with respect to the wafer mounting surface 20a, as shown in FIG. By doing so, the outer peripheral thermocouple 50 can be guided to the elongated hole 26 more smoothly. Further, in the thermocouple guide 32 having such a horizontal portion 35, the portion arranged in the long groove 26a becomes long. Therefore, it is preferable to set the length of the long groove 26a according to it.
- the temperature measuring unit 50a of the outer peripheral thermocouple 50 in the elongated hole 26 has the width of the outer resistance heating element 24 (that is, the coil width w when viewed from the back surface 20b, as shown in FIG. 9). You may arrange so that it may fit in the bracket.
- the resistance heating element 24 on the outer peripheral side is not a coil shape but a ribbon shape (elongated flat plate shape), it may be arranged so as to fit within the width of the ribbon. By doing so, the temperature change of the resistance heating element 24 on the outer peripheral side can be detected by the temperature measuring unit 50a of the thermocouple 50 on the outer peripheral side with good response.
- the elongated hole 26 including the elongated groove 26a is provided along the direction deviating from the radial direction of the ceramic plate 20, but as shown by the solid line in FIG. 10, along the radial direction of the ceramic plate 20. It may be provided.
- the dashed-dotted line in FIG. 10 is the elongated hole 26 of the above-described embodiment, and the solid-line elongated hole 26 is provided with the elongated groove 26a of the same length L at the same end position 26e as the elongated hole 26 of the dashed-dotted line. ..
- the length of the long hole 26 indicated by the solid line is shorter than that of the long hole 26 indicated by the alternate long and short dash line by the length of the dotted line portion in FIG. Since the elongated hole 26 is a cavity, the longer it is, the greater the influence on the temperature uniformity of the wafer W becomes. However, if the elongated hole 26 shown by the solid line in FIG. 10 is adopted, the influence of the elongated hole 26 on the temperature uniformity of the wafer W is reduced. can do.
- the resistance heating elements 22 and 24 have a coil shape.
- the resistance heating elements 22 and 24 are not particularly limited to the coil shape, and may have a print pattern, a ribbon shape, a mesh shape, or the like. Good.
- the ceramic plate 20 may include electrostatic electrodes or RF electrodes in addition to the resistance heating elements 22 and 24.
- a terminal (one of accessory parts) of the electrostatic electrode is provided in the shaft inner region 20d of the ceramic plate 20.
- the terminal of the electrostatic electrode is provided in the shaft inner region 20d at a position other than the long groove 26a.
- a terminal (one of accessory parts) of the RF electrode is provided in the shaft inner region 20d of the ceramic plate 20.
- the terminal of the RF electrode is provided at a position other than the long groove 26a in the shaft inner region 20d.
- the length of the thermocouple guide 32 in the vertical direction is set to be substantially the same as the height of the tubular shaft 40, but it may be shorter or longer than the height of the tubular shaft 40.
- the inner peripheral side zone Z1 may be divided into a plurality of inner peripheral side small zones, and the resistance heating element may be routed in a single stroke for each inner peripheral side small zone.
- the outer peripheral side zone Z2 may be divided into a plurality of outer peripheral side small zones, and the resistance heating element may be laid out in a single stroke for each outer peripheral side small zone.
- the position of the recess 49 may be determined after determining the position of the long groove 26a, or may be determined before determining the position of the long groove 26a. In the latter case, the recess 49 is regarded as one of the accessory parts, and the long groove 26a is determined so as not to pass through the recess 49.
- the power supply rods 42a, 42b, 44a, 44b are joined to the terminals 22a, 22b, 24a, 24b of the ceramic plate 20, respectively, and the tubular shaft 40 is joined to the back surface 20b of the ceramic plate 20, although the thermocouple guide 32 is attached, the attaching procedure is not limited to this.
- the power supply rods 42a, 42b, 44a and 44b are joined to the terminals 22a, 22b, 24a and 24b, respectively. Good.
- the elongated hole 26 of the above-described embodiment may have the shape shown in FIG. FIG. 11 is a perspective view when the lower plate P2 is removed from the upper plate P1 and the back surface of the upper plate P1 is directed upward.
- the long hole 26 is a hole having a substantially rectangular cross section, and the boundary portion 26b between the bottom surface and the side surface of the long hole 26 is an R surface.
- the radius of curvature of the R surface is preferably 0.5 mm or more (for example, 1 mm). This makes it possible to prevent cracks from being generated in the ceramic plate 20 starting from the boundary portion 26b between the bottom surface (the ceiling surface in FIG. 2) and the side surface of the elongated hole 26.
- the boundary portion 26b is used as a starting point. It is possible to suppress the occurrence of cracks in the ceramic plate 20. Incidentally, cracks occurred when the radius of curvature of the boundary portion 26b was set to 0.1 mm and 0.3 mm, but did not occur when they were set to 0.5 mm, 0.7 mm, and 0.9 mm.
- thermocouple guide 32 is attached to the long groove 26a and the long hole 26, but when the outer peripheral side thermocouple 50 is inserted into the long hole 26, the thermocouple guide 32 is arranged in the long groove 26a and the long hole 26, After inserting the outer peripheral side thermocouple 50 into the elongated hole 26, the thermocouple guide 32 may be removed. Alternatively, the outer thermocouple 50 may be inserted into the elongated hole 26 without using the thermocouple guide 32.
- the elongated hole 26 may be a hole having a substantially rectangular cross section and a constant lateral width from the starting point 26s to the end position 26e. It is preferable that the boundary portion between the end surface of the elongated hole 26 (the standing wall at the end position 26e) and the side surface extending in the longitudinal direction of the elongated hole 26 be a C surface or an R surface so that the edge does not stand. At this time, the lateral width of the long hole 26 and the long groove 26a is preferably 9 mm or less.
- the outer peripheral thermocouple 50 is less likely to be distorted when the outer peripheral thermocouple 50 is inserted, and the outer peripheral thermocouple 50 is located at a desired measurement point (point near the end position 26e of the ceramic plate 20). This is because it is easy to arrange the temperature measuring unit 50a of the pair 50.
- the lateral width of the elongated hole 26 and the elongated groove 26a may be larger than the outer diameter of the curved portion 34, but the clearance in the width direction (long If the value obtained by subtracting the outer diameter of the curved portion 34 from the lateral width of the hole 26 and the long groove 26a) is too large, the temperature measurement accuracy decreases due to heat loss. Therefore, the clearance in the width direction is preferably 2 mm or less. Similarly, the clearance in the depth direction is preferably 2 mm or less.
- the lateral width of the elongated hole 26 and the elongated groove 26a may be larger than the outer diameter of the outer peripheral side thermocouple 50, but the same as before. For this reason, it is preferable to set the clearance in the width direction (the value obtained by subtracting the outer diameter of the outer peripheral side thermocouple 50 from the lateral width of the elongated hole 26 and the elongated groove 26a) to 2 mm or less. Similarly, the clearance in the depth direction is preferably 2 mm or less.
- the elongated hole 26 of another example shown in FIGS. 12 to 14 may be adopted as the elongated hole 26.
- 12 is a rear view of the upper plate P1 provided with another long hole 26
- FIG. 13 is a sectional view taken along line CC of FIG. 12
- FIG. 14 is a sectional view taken along line DD of FIG.
- This elongated hole 26 has a tapered portion 261 in the middle from the starting point 26s to the terminal position 26e when viewed in a plan view, and a wide portion 262 extends from the starting point 26s to one end of the tapered portion 261 and the other end of the tapered portion 261. From the end to the end position 26e is a narrow portion 263.
- the width W of the wide portion 262 and the width w of the narrow portion 263 are preferably 9 mm or less. This is because if the widths W and w are 9 mm or less, the outer peripheral thermocouple 50 is less likely to be distorted when the outer peripheral thermocouple 50 is inserted, and the temperature measuring unit 50a can be easily arranged at the desired measurement point M.
- the width W of the wide portion 262 may be larger than the outer diameter D of the curved portion 34, and the width w of the narrow portion 263 may be the outer peripheral side thermoelectric force.
- the clearance in each width direction (the value obtained by subtracting the outer diameter D of the curved portion 34 from the width W of the wide portion 262 and the narrow portion 263).
- the value obtained by subtracting the outer diameter d of the outer peripheral thermocouple 50 from the width w) is preferably 2 mm or less.
- the clearance in the depth direction is preferably 2 mm or less.
- the gradient ⁇ of the taper portion 261 is preferably 2° or more and 5° or less, and more preferably 3° or more and 4° or less (for example, 3.4°).
- the bottom surface 26p (the ceiling surface in FIG. 2) of the elongated hole 26 is provided with an inclined step 26q on the way from the starting point 26s to the end position 26e.
- the depth from the starting point 26s to the step 26q on the bottom surface 26p is deeper than the depth from the step 26q to the terminal position 26e.
- the boundary between the bottom surface 26p and the standing wall at the end position 26e is an inclined surface 26r.
- the curved portion 34 of the thermocouple guide 32 is arranged in a portion of the bottom surface 26p from the starting point 26s to the step 26q, and the outer peripheral thermocouple 50 extends along the portion of the bottom surface 26p from the step 26q to the end position 26e. Is inserted. Therefore, the thermocouple guide 32 can be used to smoothly insert the outer thermocouple 50 into the elongated hole 26. Moreover, since the gap between the temperature measuring unit 50a and the bottom surface 26p becomes smaller due to the existence of the inclined surface 26r, the temperature measuring accuracy of the temperature measuring unit 50a is improved.
- the bottom surface 26p of the elongated hole 26 may be a flat surface.
- the width W of the wide portion 262 and the width w of the narrow portion 263 are both the outer diameter of the outer thermocouple 50. It suffices if it is larger than d, but for the same reason as above, the clearance in each width direction (from the value obtained by subtracting the outer diameter d of the outer peripheral side thermocouple 50 from the width W of the wide portion 262 and the width w of the narrow portion 263).
- the value obtained by subtracting the outer diameter d of the outer thermocouple 50 is preferably 2 mm or less.
- the clearance in the depth direction is preferably 2 mm or less.
- the outer diameter d of the outer thermocouple 50 is preferably 0.5 mm or more and 2 mm or less. If the outer diameter d is less than 0.5 mm, the outer peripheral thermocouple 50 is bent when it is inserted into the elongated hole 26, and it becomes difficult to insert it to the end position 26e. When the outer diameter d exceeds 2 mm, the outer peripheral side thermocouple 50 loses flexibility, and it becomes difficult to insert the outer peripheral side thermocouple 50 to the terminal position 26e.
- the temperature measuring portion 50a of the outer thermocouple 50 is a convex curved surface, and the temperature measuring portion of the end surface of the elongated hole 26 (the standing wall at the end position 26e) is measured.
- the portion in contact with 50a may be a concave curved surface.
- the gap G between the long groove 26a and the accessory parts be 2 mm or more. By doing so, it is possible to prevent the space between the long groove 26a and the accessory component from being too narrow and to prevent the ceramic plate 20 from being cracked.
- the standing wall on the starting point 26s side of the elongated hole 26 and the elongated groove 26a may be curved from the back surface 20b of the ceramic plate 20 toward the inside of the elongated hole 26.
- the outer peripheral thermocouple 50 can be smoothly inserted into the elongated hole 26 without using the thermocouple guide 32 by utilizing the curved standing wall at the starting point 26s.
- the present invention can be used, for example, as a member for a semiconductor manufacturing apparatus used for processing a wafer.
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Abstract
Description
ウエハ載置面を有する円盤状のセラミックプレートと、
小径部と大径部とを有し、前記セラミックプレートのうち前記ウエハ載置面とは反対側の裏面に前記大径部の端面が接合された筒状シャフトと、
前記セラミックプレートの内周部に埋設された内周側抵抗発熱体と、
前記セラミックプレートの外周部に埋設された外周側抵抗発熱体と、
前記内周側抵抗発熱体の一対の端子及び前記外周側抵抗発熱体の一対の端子を含む付帯部品と、
前記セラミックプレートの前記裏面のうち前記小径部の内側領域の起点から前記セラミックプレートの外周部の所定の終端位置に至る長穴と、
を備え、
前記筒状シャフトの内部空間は、前記小径部の内径と同じ径の円筒空間と、前記円筒空間の外側に前記大径部によって囲まれた環状の拡張空間とを有し、
前記長穴の入口部分は、長溝であり、
前記長溝は、前記起点から前記セラミックプレートの前記裏面のうち前記拡張空間内の拡張領域に至るように設けられ、
前記付帯部品は、前記セラミックプレートの前記裏面のうち前記小径部の内側領域であって前記長溝以外の位置に設けられている、
ものである。
Claims (15)
- ウエハ載置面を有する円盤状のセラミックプレートと、
小径部と大径部とを有し、前記セラミックプレートのうち前記ウエハ載置面とは反対側の裏面に前記大径部の端面が接合された筒状シャフトと、
前記セラミックプレートの内周部に埋設された内周側抵抗発熱体と、
前記セラミックプレートの外周部に埋設された外周側抵抗発熱体と、
前記内周側抵抗発熱体の一対の端子及び前記外周側抵抗発熱体の一対の端子を含む付帯部品と、
前記セラミックプレートの前記裏面のうち前記小径部の内側領域の起点から前記セラミックプレートの外周部の所定の終端位置に至る長穴と、
を備え、
前記筒状シャフトの内部空間は、前記小径部の内径と同じ径の円筒空間と、前記円筒空間の外側に前記大径部によって囲まれた環状の拡張空間とを有し、
前記長穴の入口部分は、長溝であり、
前記長溝は、前記起点から前記セラミックプレートの前記裏面のうち前記拡張空間内の拡張領域に至るように設けられ、
前記付帯部品は、前記セラミックプレートの前記裏面のうち前記小径部の内側領域であって前記長溝以外の位置に設けられている、
セラミックヒータ。 - 前記長溝は、前記セラミックプレートの半径方向に沿って設けられている、
請求項1に記載のセラミックヒータ。 - 前記長溝は、前記セラミックプレートの半径方向から外れた方向に沿って設けられている、
請求項1に記載のセラミックヒータ。 - 前記長穴は、熱電対を挿入する熱電対挿入用長穴である、
請求項1~3のいずれか1項に記載のセラミックヒータ。 - 前記長溝は、前記ウエハ載置面に対して垂直方向から水平方向に転換する湾曲部を備えた熱電対ガイドの前記湾曲部を配置するために用いられる、
請求項1~4のいずれか1項に記載のセラミックヒータ。 - 前記熱電対ガイドの前記湾曲部の外径は、前記垂直部の外径よりも小さい、
請求項5に記載のセラミックヒータ。 - 請求項5又は6に記載のセラミックヒータであって、
前記長溝に配置された前記熱電対ガイドを備える、
セラミックヒータ。 - 請求項7に記載のセラミックヒータであって、
前記熱電対ガイド及び前記長穴に挿入された熱電対を備える、
セラミックヒータ。 - 前記セラミックプレートを前記裏面からみたときに前記熱電対の測温部が前記外周側抵抗発熱体の幅の中に収まるように配置されている、
請求項8に記載のセラミックヒータ。 - 前記長穴は、断面略四角形の穴であり、前記穴の天井面と側面との境界部は、曲率半径が0.5mm以上のR面である、
請求項1~9のいずれか1項に記載のセラミックヒータ。 - 前記長穴は、前記起点から前記終端位置までの途中にテーパ部を有し、前記起点から前記テーパ部の一端までは幅広部であり、前記テーパ部の他端から前記終端位置までは幅狭部である、
請求項1~10のいずれか1項に記載のセラミックヒータ。 - 前記長穴の天井面は、前記起点から前記終端位置までの途中に傾斜状の段差を有し、前記天井面のうち前記起点から前記段差までの深さは前記段差から前記終端位置までの深さよりも深い、
請求項1~11のいずれか1項に記載のセラミックヒータ。 - 前記外周側熱電対の測温部は凸状曲面であり、前記長穴の終端面のうち前記外周側熱電対の測温部が接触する部分は凹状曲面である、
請求項1~12のいずれか1項に記載のセラミックヒータ。 - 前記長溝と前記付帯部品との間隔は、2mm以上である、
請求項1~13のいずれか1項に記載のセラミックヒータ。 - 前記長穴の前記起点側の壁は、前記セラミックプレートの前記裏面から前記長穴の奥に向かって湾曲している、
請求項1~14のいずれか1項に記載のセラミックヒータ。
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KR1020207022066A KR102432592B1 (ko) | 2018-12-20 | 2019-12-04 | 세라믹 히터 |
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JP6909910B2 (ja) | 2021-07-28 |
TW202031091A (zh) | 2020-08-16 |
KR20200103087A (ko) | 2020-09-01 |
KR102432592B1 (ko) | 2022-08-18 |
CN111788862A (zh) | 2020-10-16 |
TWI767164B (zh) | 2022-06-11 |
JP2020194784A (ja) | 2020-12-03 |
US20200350187A1 (en) | 2020-11-05 |
US11664244B2 (en) | 2023-05-30 |
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