JP7197534B2 - セラミックヒータ - Google Patents
セラミックヒータ Download PDFInfo
- Publication number
- JP7197534B2 JP7197534B2 JP2020102174A JP2020102174A JP7197534B2 JP 7197534 B2 JP7197534 B2 JP 7197534B2 JP 2020102174 A JP2020102174 A JP 2020102174A JP 2020102174 A JP2020102174 A JP 2020102174A JP 7197534 B2 JP7197534 B2 JP 7197534B2
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- JP
- Japan
- Prior art keywords
- thermocouple
- ceramic heater
- tube
- guide
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 title claims description 81
- 238000010438 heat treatment Methods 0.000 claims description 23
- 230000002093 peripheral effect Effects 0.000 claims description 18
- 238000005452 bending Methods 0.000 claims description 10
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 230000036581 peripheral resistance Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 17
- 238000005304 joining Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
- G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Resistance Heating (AREA)
Description
直線状の第1管部と、
前記第1管部に繋がり、前記第1管部の向きを変換するよう設けられた湾曲部を有する第2管部と、
を備えた熱電対ガイドであって、
前記湾曲部のうち少なくとも先端から所定長さまでの先端側部分の外径は、前記第1管部の外径よりも小さい、
ものである。
ウエハ載置面を有する円盤状のセラミックプレートと、
前記セラミックプレートのうち前記ウエハ載置面とは反対側の裏面に接合された筒状シャフトと、
前記セラミックプレートの内周部に埋設された内周側抵抗発熱体と、
前記セラミックプレートの外周部に埋設された外周側抵抗発熱体と、
前記内周側抵抗発熱体の一対の端子及び前記外周側抵抗発熱体の一対の端子を含む付帯部品と、
前記セラミックプレートの前記裏面のうち前記筒状シャフトの内側領域の起点から前記セラミックプレートの外周部の終端位置に至る長穴と、
前記長穴の入口部分である長溝と、
前記長溝に前記湾曲部の前記先端側部分が配置された上述したいずれかの熱電対ガイドと、
を備えたものである。
Claims (9)
- ウエハ載置面を有する円盤状のセラミックプレートと、
前記セラミックプレートのうち前記ウエハ載置面とは反対側の裏面に接合された筒状シャフトと、
前記セラミックプレートの内周部に埋設された内周側抵抗発熱体と、
前記セラミックプレートの外周部に埋設された外周側抵抗発熱体と、
前記内周側抵抗発熱体の一対の端子及び前記外周側抵抗発熱体の一対の端子を含む付帯部品と、
前記セラミックプレートの前記裏面のうち前記筒状シャフトの内側領域の起点から前記セラミックプレートの外周部の終端位置に至る長穴と、
前記長穴の入口部分である長溝と、
直線状の第1管部と、前記第1管部に繋がり、前記第1管部の向きを変換するよう設けられた湾曲部を有する第2管部と、を備えた熱電対ガイドであって、前記湾曲部のうち少なくとも先端から所定長さまでの先端側部分の外径は、前記第1管部の外径よりも小さく、前記長溝に前記湾曲部の前記先端側部分が配置された熱電対ガイドと、
を備えたセラミックヒータ。 - 前記長穴は、熱電対を挿入する熱電対挿入用長穴である、
請求項1に記載のセラミックヒータ。 - 前記長溝の長さは、前記熱電対ガイドの前記湾曲部のうち前記長溝に配置される前記先端側部分の長さ以上となるように定められている、
請求項1又は2に記載のセラミックヒータ。 - 請求項1~3のいずれか1項に記載のセラミックヒータであって、
前記熱電対ガイド及び前記長穴に挿入された熱電対
を備えたセラミックヒータ。 - 前記第2管部は、前記第1管部に溶接されている、
請求項1~4のいずれか1項に記載のセラミックヒータ。 - 前記湾曲部のうち少なくとも前記先端側部分の内径は、前記第1管部の内径よりも小さい、
請求項1~5のいずれか1項に記載のセラミックヒータ。 - 前記第2管部の全体の外径は、前記第1管部の外径よりも小さい、
請求項1~6のいずれか1項に記載のセラミックヒータ。 - 前記第2管部の全体の内径は、前記第1管部の内径よりも小さい、
請求項7に記載のセラミックヒータ。 - 前記湾曲部の曲率半径は、20mm以上50mm以下であり、
前記湾曲部のストローク長さは、20mm以上50mm以下であり、
前記湾曲部は、前記第1管部の向きを50°以上90°以下に変換するように設けられている、
請求項1~8のいずれか1項に記載のセラミックヒータ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020102174A JP7197534B2 (ja) | 2020-06-12 | 2020-06-12 | セラミックヒータ |
KR1020210070723A KR102594930B1 (ko) | 2020-06-12 | 2021-06-01 | 열전대 가이드 및 세라믹 히터 |
US17/303,546 US20210391193A1 (en) | 2020-06-12 | 2021-06-02 | Thermocouple guide and ceramic heater |
TW110120593A TWI811694B (zh) | 2020-06-12 | 2021-06-07 | 熱電偶導件以及陶瓷加熱器 |
CN202110656062.8A CN113811030A (zh) | 2020-06-12 | 2021-06-11 | 热电偶引导件及陶瓷加热器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020102174A JP7197534B2 (ja) | 2020-06-12 | 2020-06-12 | セラミックヒータ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021196237A JP2021196237A (ja) | 2021-12-27 |
JP7197534B2 true JP7197534B2 (ja) | 2022-12-27 |
Family
ID=78825905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020102174A Active JP7197534B2 (ja) | 2020-06-12 | 2020-06-12 | セラミックヒータ |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210391193A1 (ja) |
JP (1) | JP7197534B2 (ja) |
KR (1) | KR102594930B1 (ja) |
CN (1) | CN113811030A (ja) |
TW (1) | TWI811694B (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008128694A (ja) | 2006-11-17 | 2008-06-05 | Yamari Sangyo Kk | 測温センサ及びその設置方法 |
WO2012039453A1 (ja) | 2010-09-24 | 2012-03-29 | 日本碍子株式会社 | 半導体製造装置部材 |
US20130259090A1 (en) | 2012-03-29 | 2013-10-03 | Tuerk & Hillinger Gmbh | Immersion temperature sensor |
WO2013162000A1 (ja) | 2012-04-27 | 2013-10-31 | 日本発條株式会社 | 基板支持装置及び基板支持装置に熱電対を配設する方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5052665A (ja) * | 1973-09-03 | 1975-05-10 | ||
US4217463A (en) * | 1978-03-13 | 1980-08-12 | National Distillers And Chemical Corporation | Fast responsive, high pressure thermocouple |
US4527909A (en) * | 1983-09-23 | 1985-07-09 | Conax Corporation | Sealed temperature probe |
US5137582A (en) * | 1990-11-14 | 1992-08-11 | Kasman David H | Thermocouple assembly |
US5071258A (en) * | 1991-02-01 | 1991-12-10 | Vesuvius Crucible Company | Thermocouple assembly |
JPH0552665A (ja) * | 1991-08-23 | 1993-03-02 | Fenwall Controls Of Japan Ltd | 温度検出端 |
JP3171926B2 (ja) * | 1992-06-05 | 2001-06-04 | 日本フエンオール株式会社 | L型熱電対装置の製造方法 |
KR100334993B1 (ko) * | 1998-12-01 | 2002-05-02 | 추후제출 | 히터 |
CN2591770Y (zh) * | 2002-09-27 | 2003-12-10 | 东京毅力科创株式会社 | 热处理装置 |
US20090052498A1 (en) * | 2007-08-24 | 2009-02-26 | Asm America, Inc. | Thermocouple |
JP6579974B2 (ja) * | 2015-02-25 | 2019-09-25 | 株式会社Kokusai Electric | 基板処理装置、温度センサ及び半導体装置の製造方法 |
CN204535876U (zh) * | 2015-03-24 | 2015-08-05 | 天津大学 | 一种新型低响应时间的高压中低温热电偶 |
JP6959201B2 (ja) * | 2018-08-29 | 2021-11-02 | 日本碍子株式会社 | セラミックヒータ |
WO2020129641A1 (ja) * | 2018-12-20 | 2020-06-25 | 日本碍子株式会社 | セラミックヒータ |
-
2020
- 2020-06-12 JP JP2020102174A patent/JP7197534B2/ja active Active
-
2021
- 2021-06-01 KR KR1020210070723A patent/KR102594930B1/ko active IP Right Grant
- 2021-06-02 US US17/303,546 patent/US20210391193A1/en active Pending
- 2021-06-07 TW TW110120593A patent/TWI811694B/zh active
- 2021-06-11 CN CN202110656062.8A patent/CN113811030A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008128694A (ja) | 2006-11-17 | 2008-06-05 | Yamari Sangyo Kk | 測温センサ及びその設置方法 |
WO2012039453A1 (ja) | 2010-09-24 | 2012-03-29 | 日本碍子株式会社 | 半導体製造装置部材 |
US20130259090A1 (en) | 2012-03-29 | 2013-10-03 | Tuerk & Hillinger Gmbh | Immersion temperature sensor |
WO2013162000A1 (ja) | 2012-04-27 | 2013-10-31 | 日本発條株式会社 | 基板支持装置及び基板支持装置に熱電対を配設する方法 |
Also Published As
Publication number | Publication date |
---|---|
CN113811030A (zh) | 2021-12-17 |
KR20210154736A (ko) | 2021-12-21 |
TW202147911A (zh) | 2021-12-16 |
KR102594930B1 (ko) | 2023-10-27 |
US20210391193A1 (en) | 2021-12-16 |
TWI811694B (zh) | 2023-08-11 |
JP2021196237A (ja) | 2021-12-27 |
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