JP6732715B2 - ストライプ状トレンチゲート構造とゲートコネクタ構造とを有する半導体装置 - Google Patents
ストライプ状トレンチゲート構造とゲートコネクタ構造とを有する半導体装置 Download PDFInfo
- Publication number
- JP6732715B2 JP6732715B2 JP2017199091A JP2017199091A JP6732715B2 JP 6732715 B2 JP6732715 B2 JP 6732715B2 JP 2017199091 A JP2017199091 A JP 2017199091A JP 2017199091 A JP2017199091 A JP 2017199091A JP 6732715 B2 JP6732715 B2 JP 6732715B2
- Authority
- JP
- Japan
- Prior art keywords
- gate
- semiconductor device
- trench gate
- trench
- gate structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 121
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 17
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 15
- 210000000746 body region Anatomy 0.000 claims 4
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000002019 doping agent Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000005368 silicate glass Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910016570 AlCu Inorganic materials 0.000 description 1
- -1 AlSi Chemical compound 0.000 description 1
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000005360 phosphosilicate glass Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
- H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/048—Making electrodes
- H01L21/049—Conductor-insulator-semiconductor electrodes, e.g. MIS contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823462—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
101 第1の表面
110 ソースゾーン
115 本体ゾーン
116 ダイオード領域
120 ドリフト構造
129 高濃度ドレイン層
150 ストライプ状トレンチゲート構造
150z トレンチ端部
151a 第1の部分
151b 第2の部分
152 第1の副層
153 第2の副層
155 ゲート電極
171 アクティブメサ部
210 層間絶縁膜
310 第1の負荷電極
320 第2の負荷電極
330 ゲートコネクタ構造
331 ゲートフィンガ
332 ゲートパッド
333 ボンディングワイヤ
335 ゲートコンタクト
500 半導体装置
610 トランジスタセル領域
611 アクティブ領域
613 アイドル領域
690 エッジ領域
pn1 第1のpn接合
pn2 第2のpn接合
pn3 第3のpn接合
D ドレイン端子
G ゲート端子
L1 第1の負荷端子
L2 第2の負荷端子
S ソース端子
TC トランジスタセル
Claims (18)
- 第1の表面(101)から半導体本体(100)内に延びるストライプ状トレンチゲート構造(150)を含むトランジスタセル(TC)と、
前記第1の表面(101)から離れかつ前記トレンチゲート構造(150)の端部から離れたゲートコネクタ構造(330)であって、前記トレンチゲート構造(150)内のゲート電極(155)へ電気的に接続されたゲートコネクタ構造(330)と、
前記トレンチゲート構造(150)内にあり、前記ゲート電極(155)を前記半導体本体(100)から分離するゲート誘電体(151)であって、前記ゲートコネクタ構造(330)の垂直突起の外側の前記ゲート誘電体(151)の第1の部分(151a)が前記ゲートコネクタ構造(330)の前記垂直突起内の前記ゲート誘電体(151)の第2の部分(151b)より薄い、ゲート誘電体(151)と、
前記半導体本体(100)の前記第1の表面(101)と反対側の第2の表面(102)に沿ったドレイン層(129)と、
前記ドレイン層(129)と本体ゾーン(115)の間のドリフトゾーン(121)と、
前記第1の表面(101)と前記ドリフトゾーン(121)との間に延在し、かつ、前記第1の部分(151a)の2つの側壁のうちの1つと前記第2の部分(151b)の2つの側壁の両方の下に延在することで、前記ドリフトゾーン(121)とpn接合を形成するダイオード領域(116)とを含む半導体装置であって、
前記半導体本体(100)は炭化珪素に基づき、
前記トレンチゲート構造(150)の少なくとも1つの側壁に沿う前記ゲート誘電体(151)の前記第2の部分(151b)の厚さが、前記側壁に沿う前記ゲート誘電体(151)の前記第1の部分(151a)の厚さよりも大きい、半導体装置。 - 前記ゲートコネクタ構造(330)はゲートパッド(332)と前記ゲートパッド(332)に固定されたボンディングワイヤ(333)とを含む、請求項1に記載の半導体装置。
- 前記ゲートコネクタ構造(330)は、複数の前記トレンチゲート構造(150)を横切り、かつ前記複数の前記トレンチゲート構造(150)内の前記ゲート電極(155)へ電気的に接続されたストライプ状ゲートフィンガ(331)を含む、請求項1または2に記載の半導体装置。
- 前記ゲート誘電体(151)は前記トレンチゲート構造(150)のトレンチ端部(150z)内に別の第2の部分(151b)を含む、請求項1から3のいずれか一項に記載の半導体装置。
- 前記第1の部分(151a)は第1の副層(152)の第1の部分を含み、前記第2の部分(151b)は前記第1の部分(151a)内に存在しない第2の副層(153)と前記第1の副層(152)の第2の部分とを含む、請求項1から4のいずれか一項に記載の半導体装置。
- 前記第2の部分(151b)の厚さは前記第1の部分(151a)の厚さより少なくとも20%厚い、請求項1から5のいずれか一項に記載の半導体装置。
- 炭化珪素に基づく半導体本体(100)を備え、
前記半導体本体(100)は、本体領域(115)、ソース領域(110)およびトレンチゲート構造(150)を備えるトランジスタセル(TC)を備え、
前記ソース領域(110)および前記本体領域(115)は少なくとも前記トレンチゲート構造(150)の第1の側壁に隣接し、
前記トレンチゲート構造(150)は、ストライプ状であり、第1の水平方向に沿って延在し、
前記トレンチゲート構造(150)は、前記半導体本体(100)の第1の表面(101)に垂直である垂直方向において、前記第1の表面(101)から前記半導体本体(100)内へと延在し、
前記トレンチゲート構造(150)は、前記第1の水平方向において、前記トレンチゲート構造(150)の端部を終端としており、
ゲート電極(155)とゲート誘電体(151)が、前記トレンチゲート構造(150)内に配置され、前記ゲート誘電体(151)が前記ゲート電極(155)と前記半導体本体(100)との間に配置され、
前記ゲート誘電体(151)が、前記トレンチゲート構造(150)の内側部分内の第1の部分(151a)と、前記トレンチゲート構造(150)の前記端部の各々の内の第2の部分(151b)とを備え、
前記ゲート誘電体(151)が、前記第2の部分(151b)内に、前記第1の部分(151a)内よりも多い少なくとも1つの副層を含み、
前記少なくとも1つの副層は、前記トレンチゲート構造(150)の少なくとも1つの側壁を覆い、
前記第1の部分(151a)は前記ソース領域(110)に隣接し、前記第2の部分(151b)は前記ソース領域(110)に隣接しない、半導体装置。 - 前記トランジスタセル(TC)は、アクティブ部とアイドル部を含み、
前記トランジスタセル(TC)がオン状態であるときに、負荷電流が前記垂直方向に前記アクティブ部を流れ、
前記トランジスタセル(TC)がオン状態であるときに、負荷電流が前記垂直方向に前記アイドル部を流れず、
前記トレンチゲート構造(150)の前記内側部分が、前記アクティブ部内にあり、
前記トレンチゲート構造(150)の前記端部が、前記アイドル部内にある、請求項7に記載の半導体装置。 - 前記端部が、前記トレンチゲート構造(150)の集積部分である、請求項7または8に記載の半導体装置。
- 前記半導体装置が、複数の前記トレンチゲート構造(150)を備え、
前記半導体装置が、前記ゲート電極(155)へ電気的に接続され、かつ前記第1の表面(101)から離れて形成されたゲートコネクタ構造(330)を備え、
前記ゲートコネクタ構造(330)は前記複数の前記トレンチゲート構造(150)を横切るストライプ状ゲートフィンガ(331)を含む、請求項7から9のいずれか一項に記載の半導体装置。 - 前記第1および第2の部分(151a、151b)のうちの少なくとも1つは前記半導体本体(100)の熱酸化により形成される半導体酸化物層を備える、または当該半導体酸化物層から成る、請求項7から10のいずれか一項に記載の半導体装置。
- 前記第1の部分(151a)は第1の副層(152)の第1の部分を含み、前記第2の部分(151b)は前記第1の部分(151a)内に存在しない第2の副層(153)と前記第1の副層(152)の第2の部分とを含む、請求項7から11のいずれか一項に記載の半導体装置。
- 炭化珪素に基づく半導体本体(100)を備え、
前記半導体本体(100)は、本体領域(115)、ソース領域(110)およびトレンチゲート構造(150)を備えるトランジスタセル(TC)を備え、
前記ソース領域(110)および前記本体領域(115)は前記トレンチゲート構造(150)の少なくとも第1の側壁に隣接し、
前記トレンチゲート構造(150)は、ストライプ状であり、第1の水平方向に沿って延在し、
前記トレンチゲート構造(150)は、前記半導体本体(100)の第1の表面(101)に垂直である垂直方向において、前記第1の表面(101)から前記半導体本体(100)内へと延在し、
前記トレンチゲート構造(150)は、前記第1の水平方向において、前記トレンチゲート構造(150)の端部を終端としており、
ゲート電極(155)とゲート誘電体(151)が、前記トレンチゲート構造(150)内に配置され、前記ゲート誘電体(151)が前記ゲート電極(155)と前記半導体本体(100)との間に配置され、
前記ゲート誘電体(151)が、前記トレンチゲート構造(150)の内側部分内の第1の部分(151a)と、前記トレンチゲート構造(150)の前記端部の各々の内の第2の部分(151b)とを備え、
前記ゲート誘電体(151)が、前記第1の部分(151a)内において、前記第2の部分(151b)内よりも薄く、
前記第1の部分(151a)が、前記第2の部分(151b)と直接隣接し、
前記第1の部分(151a)は前記ソース領域(110)に隣接し、前記第2の部分(151b)は前記ソース領域(110)に隣接しない、半導体装置。 - 前記トランジスタセル(TC)は、アクティブ部とアイドル部を含み、
前記トランジスタセル(TC)がオン状態であるときに、負荷電流が前記垂直方向に前記アクティブ部を流れ、
前記トランジスタセル(TC)がオン状態であるときに、負荷電流が前記垂直方向に前記アイドル部を流れず、
前記トレンチゲート構造(150)の前記内側部分が、前記アクティブ部内にあり、
前記トレンチゲート構造(150)の前記端部が、前記アイドル部内にある、請求項13に記載の半導体装置。 - 前記アイドル部内の前記ゲート誘電体(151)の前記第2の部分(151b)は前記アクティブ部内の前記ゲート誘電体(151)の前記第1の部分(151a)より少なくとも1つ多い層を含む、請求項14に記載の半導体装置。
- 前記端部が、前記トレンチゲート構造(150)の集積部分である、請求項13から15のいずれか一項に記載の半導体装置。
- 前記半導体装置が、複数の前記トレンチゲート構造(150)を備え、
前記半導体装置が、前記ゲート電極(155)へ電気的に接続され、かつ前記第1の表面(101)から離れて形成されたゲートコネクタ構造(330)を備え、
前記ゲートコネクタ構造(330)は前記複数の前記トレンチゲート構造(150)を横切るストライプ状ゲートフィンガ(331)を含む、請求項13から16のいずれか一項に記載の半導体装置。 - 前記第1の部分(151a)は第1の副層(152)の第1の部分を含み、前記第2の部分(151b)は前記第1の部分(151a)内に存在しない第2の副層(153)と前記第1の副層(152)の第2の部分とを含む、請求項13から17のいずれか一項に記載の半導体装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014119466.7 | 2014-12-22 | ||
DE102014119466.7A DE102014119466A1 (de) | 2014-12-22 | 2014-12-22 | Halbleitervorrichtung mit streifenförmigen trenchgatestrukturen und gateverbinderstruktur |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015250556A Division JP2016129226A (ja) | 2014-12-22 | 2015-12-22 | ストライプ状トレンチゲート構造とゲートコネクタ構造とを有する半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018078283A JP2018078283A (ja) | 2018-05-17 |
JP6732715B2 true JP6732715B2 (ja) | 2020-07-29 |
Family
ID=56099912
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015250556A Pending JP2016129226A (ja) | 2014-12-22 | 2015-12-22 | ストライプ状トレンチゲート構造とゲートコネクタ構造とを有する半導体装置 |
JP2017199091A Active JP6732715B2 (ja) | 2014-12-22 | 2017-10-13 | ストライプ状トレンチゲート構造とゲートコネクタ構造とを有する半導体装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015250556A Pending JP2016129226A (ja) | 2014-12-22 | 2015-12-22 | ストライプ状トレンチゲート構造とゲートコネクタ構造とを有する半導体装置 |
Country Status (3)
Country | Link |
---|---|
US (2) | US9530850B2 (ja) |
JP (2) | JP2016129226A (ja) |
DE (1) | DE102014119466A1 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014119466A1 (de) * | 2014-12-22 | 2016-06-23 | Infineon Technologies Ag | Halbleitervorrichtung mit streifenförmigen trenchgatestrukturen und gateverbinderstruktur |
JP2018082010A (ja) * | 2016-11-15 | 2018-05-24 | 株式会社デンソー | 半導体装置 |
JP6632513B2 (ja) * | 2016-12-07 | 2020-01-22 | 株式会社東芝 | 半導体装置及びその製造方法 |
JP6739372B2 (ja) * | 2017-02-21 | 2020-08-12 | 株式会社東芝 | 半導体装置 |
DE102017110508B4 (de) * | 2017-05-15 | 2023-03-02 | Infineon Technologies Ag | Halbleitervorrichtung mit Transistorzellen und einer Driftstruktur und Herstellungsverfahren |
JP6871058B2 (ja) * | 2017-05-22 | 2021-05-12 | 株式会社東芝 | 半導体装置、インバータ回路、駆動装置、車両、及び、昇降機 |
JP6926869B2 (ja) * | 2017-09-13 | 2021-08-25 | 富士電機株式会社 | 半導体装置 |
WO2019077877A1 (ja) * | 2017-10-17 | 2019-04-25 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
JP7384236B2 (ja) | 2017-12-11 | 2023-11-21 | 富士電機株式会社 | 絶縁ゲート型半導体装置 |
JP7151076B2 (ja) | 2017-12-11 | 2022-10-12 | 富士電機株式会社 | 絶縁ゲート型半導体装置 |
DE102018103849B4 (de) * | 2018-02-21 | 2022-09-01 | Infineon Technologies Ag | Siliziumcarbid-Halbleiterbauelement mit einer in einer Grabenstruktur ausgebildeten Gateelektrode |
JP7176206B2 (ja) | 2018-03-14 | 2022-11-22 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体回路装置 |
DE102018106967B3 (de) * | 2018-03-23 | 2019-05-23 | Infineon Technologies Ag | SILIZIUMCARBID HALBLEITERBAUELEMENT und Halbleiterdiode |
IT201800007780A1 (it) * | 2018-08-02 | 2020-02-02 | St Microelectronics Srl | Dispositivo mosfet in carburo di silicio e relativo metodo di fabbricazione |
DE102018130385A1 (de) * | 2018-11-29 | 2020-06-04 | Infineon Technologies Ag | Siliziumcarbid-Bauelemente, Halbleiterbauelemente und Verfahren zum Bilden von Siliziumcarbid-Bauelementen und Halbleiterbauelementen |
JP7234713B2 (ja) * | 2019-03-14 | 2023-03-08 | 富士電機株式会社 | 半導体装置 |
JP2022007788A (ja) * | 2020-06-26 | 2022-01-13 | 富士電機株式会社 | 半導体装置 |
JP2022015781A (ja) * | 2020-07-10 | 2022-01-21 | 三菱電機株式会社 | 半導体装置 |
JP2022093130A (ja) | 2020-12-11 | 2022-06-23 | 株式会社東芝 | 半導体装置、インバータ回路、駆動装置、車両、及び、昇降機 |
WO2023028889A1 (zh) * | 2021-08-31 | 2023-03-09 | 长江存储科技有限责任公司 | 半导体结构、制作方法及三维存储器 |
DE102022211692A1 (de) | 2022-11-07 | 2024-05-08 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer vertikalen Feldeffekttransistorstruktur und entsprechende vertikale Feldeffekttransistorstruktur |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7009247B2 (en) * | 2001-07-03 | 2006-03-07 | Siliconix Incorporated | Trench MIS device with thick oxide layer in bottom of gate contact trench |
US6838722B2 (en) * | 2002-03-22 | 2005-01-04 | Siliconix Incorporated | Structures of and methods of fabricating trench-gated MIS devices |
DE10324754B4 (de) * | 2003-05-30 | 2018-11-08 | Infineon Technologies Ag | Halbleiterbauelement |
JP4564362B2 (ja) * | 2004-01-23 | 2010-10-20 | 株式会社東芝 | 半導体装置 |
JP4980663B2 (ja) * | 2006-07-03 | 2012-07-18 | ルネサスエレクトロニクス株式会社 | 半導体装置および製造方法 |
JP5070941B2 (ja) * | 2007-05-30 | 2012-11-14 | 株式会社デンソー | 半導体装置 |
US9484451B2 (en) * | 2007-10-05 | 2016-11-01 | Vishay-Siliconix | MOSFET active area and edge termination area charge balance |
JP5671779B2 (ja) * | 2008-12-17 | 2015-02-18 | 住友電気工業株式会社 | エピタキシャルウエハの製造方法および半導体装置の製造方法 |
CN104617145B (zh) * | 2009-04-13 | 2019-11-19 | 罗姆股份有限公司 | 半导体装置 |
JP5633992B2 (ja) * | 2010-06-11 | 2014-12-03 | トヨタ自動車株式会社 | 半導体装置および半導体装置の製造方法 |
JP2012164707A (ja) * | 2011-02-03 | 2012-08-30 | Panasonic Corp | 半導体装置およびその製造方法 |
JPWO2013161116A1 (ja) * | 2012-04-26 | 2015-12-21 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
US9293558B2 (en) * | 2012-11-26 | 2016-03-22 | Infineon Technologies Austria Ag | Semiconductor device |
JP5665206B2 (ja) * | 2013-09-11 | 2015-02-04 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
DE102014119466A1 (de) * | 2014-12-22 | 2016-06-23 | Infineon Technologies Ag | Halbleitervorrichtung mit streifenförmigen trenchgatestrukturen und gateverbinderstruktur |
-
2014
- 2014-12-22 DE DE102014119466.7A patent/DE102014119466A1/de active Pending
-
2015
- 2015-12-21 US US14/976,566 patent/US9530850B2/en active Active
- 2015-12-22 JP JP2015250556A patent/JP2016129226A/ja active Pending
-
2016
- 2016-11-22 US US15/358,316 patent/US9960243B2/en active Active
-
2017
- 2017-10-13 JP JP2017199091A patent/JP6732715B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2018078283A (ja) | 2018-05-17 |
US9530850B2 (en) | 2016-12-27 |
US20170077251A1 (en) | 2017-03-16 |
JP2016129226A (ja) | 2016-07-14 |
US20160181408A1 (en) | 2016-06-23 |
US9960243B2 (en) | 2018-05-01 |
DE102014119466A1 (de) | 2016-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6732715B2 (ja) | ストライプ状トレンチゲート構造とゲートコネクタ構造とを有する半導体装置 | |
US10211306B2 (en) | Semiconductor device with diode region and trench gate structure | |
JP6200938B2 (ja) | ストライプ状トレンチゲート構造、トランジスタメサおよびダイオードメサを有する半導体素子 | |
US9252211B2 (en) | Semiconductor device and manufacturing method thereof | |
US9240450B2 (en) | IGBT with emitter electrode electrically connected with impurity zone | |
JP6312884B2 (ja) | トランジスタセルおよび補償構造体を含む広バンドギャップ半導体デバイス | |
US9954056B2 (en) | Semiconductor device with superjunction structure and transistor cells in a transition region along a transistor cell region | |
US9209109B2 (en) | IGBT with emitter electrode electrically connected with an impurity zone | |
JP2018186305A (ja) | ダイオード領域用のゲート電極とコンタクト構造とを含んでいるトレンチ構造を備えた半導体デバイス | |
JP6143598B2 (ja) | 半導体装置 | |
CN110061051B (zh) | 半导体器件和有隔离源区的反向导电绝缘栅双极晶体管 | |
US9837498B2 (en) | Stripe-shaped electrode structure including a main portion with a field electrode and an end portion terminating the electrode structure | |
US20200013723A1 (en) | Silicon Carbide Device and Method for Forming a Silicon Carbide Device | |
US20140231928A1 (en) | Super Junction Semiconductor Device with an Edge Area Having a Reverse Blocking Capability | |
US9741835B2 (en) | Semiconductor device and insulated gate bipolar transistor with transistor cells and sensor cell | |
CN109768090A (zh) | 一种具有内嵌异质结二极管自保护的碳化硅槽型场氧功率mos器件 | |
US9515149B2 (en) | Power semiconductor device | |
KR101311540B1 (ko) | 전력 반도체 소자 | |
US9577080B2 (en) | Power semiconductor device | |
US20140077255A1 (en) | Semiconductor device | |
CN106356409A (zh) | 半导体装置 | |
CN113053992B (zh) | 一种碳化硅mosfet器件的元胞结构及功率半导体器件 | |
US8618576B1 (en) | Semiconductor device with back side metal structure | |
US20240113026A1 (en) | Silicon Carbide Device and Method for Forming a Silicon Carbide Device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171213 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20171213 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180813 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180821 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181120 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190507 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190806 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200114 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200414 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200609 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200708 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6732715 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |