JP6703104B2 - 転写フィルム - Google Patents

転写フィルム Download PDF

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Publication number
JP6703104B2
JP6703104B2 JP2018520963A JP2018520963A JP6703104B2 JP 6703104 B2 JP6703104 B2 JP 6703104B2 JP 2018520963 A JP2018520963 A JP 2018520963A JP 2018520963 A JP2018520963 A JP 2018520963A JP 6703104 B2 JP6703104 B2 JP 6703104B2
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JP
Japan
Prior art keywords
resin layer
photosensitive resin
mass
film
transfer film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018520963A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2017209193A1 (ja
Inventor
一真 両角
一真 両角
壮二 石坂
壮二 石坂
隆志 有冨
隆志 有冨
漢那　慎一
慎一 漢那
克己 篠田
克己 篠田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of JPWO2017209193A1 publication Critical patent/JPWO2017209193A1/ja
Application granted granted Critical
Publication of JP6703104B2 publication Critical patent/JP6703104B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
JP2018520963A 2016-05-31 2017-05-31 転写フィルム Active JP6703104B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016109311 2016-05-31
JP2016109311 2016-05-31
PCT/JP2017/020305 WO2017209193A1 (ja) 2016-05-31 2017-05-31 転写フィルム、加飾パターン及びタッチパネル

Publications (2)

Publication Number Publication Date
JPWO2017209193A1 JPWO2017209193A1 (ja) 2019-02-14
JP6703104B2 true JP6703104B2 (ja) 2020-06-03

Family

ID=60477556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018520963A Active JP6703104B2 (ja) 2016-05-31 2017-05-31 転写フィルム

Country Status (3)

Country Link
JP (1) JP6703104B2 (zh)
CN (1) CN109073970B (zh)
WO (1) WO2017209193A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019202708A1 (ja) * 2018-04-19 2019-10-24 日立化成株式会社 積層体及びその製造方法、樹脂フィルム、並びに、電子部品
WO2020054075A1 (ja) * 2018-09-14 2020-03-19 日立化成株式会社 転写型感光性フィルム、樹脂硬化膜の形成方法及び樹脂硬化膜付センサ基板の製造方法
WO2020158316A1 (ja) * 2019-01-29 2020-08-06 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、タッチパネルの製造方法、並びに、フィルム及びその製造方法
WO2020261512A1 (ja) * 2019-06-27 2020-12-30 昭和電工マテリアルズ株式会社 被覆膜付き基体及びその製造方法、並びに、検査センサ
JP7342246B2 (ja) * 2020-03-25 2023-09-11 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10274847A (ja) * 1997-03-31 1998-10-13 Hitachi Chem Co Ltd ブラックマトリックスパターン製造用感光性フィルム及びこのフィルムを用いたブラックマトリックスパターンの製造法
JP3788429B2 (ja) * 1999-03-18 2006-06-21 日立化成工業株式会社 レジストパターンの製造法、プリント配線板の製造法及びリードフレームの製造法
CN1940723B (zh) * 2005-09-28 2011-11-09 旭化成电子材料株式会社 感光性树脂组合物及其层合体
CN102662306B (zh) * 2006-04-18 2015-11-25 日立化成株式会社 感光性元件、抗蚀图案形成方法及印刷电路板的制造方法
US9865480B2 (en) * 2010-05-20 2018-01-09 Lg Chem, Ltd. Printed circuit board including under-fill dam and fabrication method thereof
US9235121B2 (en) * 2011-08-10 2016-01-12 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive film, permanent resist and method for producing permanent resist
WO2013141286A1 (ja) * 2012-03-23 2013-09-26 日立化成株式会社 感光性樹脂組成物、及びこれを用いた加工ガラス基板の製造方法、並びにタッチパネル及びその製造方法
CN104246611B (zh) * 2012-03-30 2018-12-04 富士胶片株式会社 黑色树脂膜、静电电容型输入装置及它们的制造方法及具备其的图像显示装置
US9971244B2 (en) * 2013-04-24 2018-05-15 Hitachi Chemical Company, Ltd. Photosensitive element, photosensitive element roll, method for producing resist pattern, and electronic component
JP2015052774A (ja) * 2013-08-07 2015-03-19 日立化成株式会社 加飾基板上におけるレジストパターン又は導電パターンの製造方法、及び転写形感光性導電フィルム

Also Published As

Publication number Publication date
JPWO2017209193A1 (ja) 2019-02-14
CN109073970B (zh) 2022-08-23
CN109073970A (zh) 2018-12-21
WO2017209193A1 (ja) 2017-12-07

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