JP6680910B2 - ハイブリッド型感光性樹脂およびその製造方法 - Google Patents
ハイブリッド型感光性樹脂およびその製造方法 Download PDFInfo
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- JP6680910B2 JP6680910B2 JP2018568217A JP2018568217A JP6680910B2 JP 6680910 B2 JP6680910 B2 JP 6680910B2 JP 2018568217 A JP2018568217 A JP 2018568217A JP 2018568217 A JP2018568217 A JP 2018568217A JP 6680910 B2 JP6680910 B2 JP 6680910B2
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- photosensitive resin
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- 229920005989 resin Polymers 0.000 title claims description 33
- 239000011347 resin Substances 0.000 title claims description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 24
- 125000000217 alkyl group Chemical group 0.000 claims description 23
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 239000003054 catalyst Substances 0.000 claims description 15
- -1 -NH- Chemical group 0.000 claims description 13
- 229910052736 halogen Inorganic materials 0.000 claims description 10
- 150000002367 halogens Chemical class 0.000 claims description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 10
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 8
- 125000003342 alkenyl group Chemical group 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 8
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 125000001316 cycloalkyl alkyl group Chemical group 0.000 claims description 6
- 125000003566 oxetanyl group Chemical group 0.000 claims description 6
- 238000005886 esterification reaction Methods 0.000 claims description 5
- 150000005839 radical cations Chemical class 0.000 claims description 5
- 238000005809 transesterification reaction Methods 0.000 claims description 5
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 4
- 150000002431 hydrogen Chemical class 0.000 claims description 4
- 125000005119 alkyl cycloalkyl group Chemical group 0.000 claims description 3
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 3
- 238000000016 photochemical curing Methods 0.000 claims description 3
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims description 2
- 125000006376 (C3-C10) cycloalkyl group Chemical group 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 229910000288 alkali metal carbonate Inorganic materials 0.000 claims description 2
- 150000008041 alkali metal carbonates Chemical class 0.000 claims description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 2
- 230000032050 esterification Effects 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 150000002642 lithium compounds Chemical class 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 150000007522 mineralic acids Chemical group 0.000 claims description 2
- 150000007524 organic acids Chemical class 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 238000007142 ring opening reaction Methods 0.000 claims description 2
- 150000001298 alcohols Chemical class 0.000 claims 1
- AFRJJFRNGGLMDW-UHFFFAOYSA-N lithium amide Chemical class [Li+].[NH2-] AFRJJFRNGGLMDW-UHFFFAOYSA-N 0.000 claims 1
- 238000001723 curing Methods 0.000 description 32
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 150000003254 radicals Chemical class 0.000 description 15
- 239000000178 monomer Substances 0.000 description 13
- 239000011247 coating layer Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- 239000003999 initiator Substances 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 125000002091 cationic group Chemical group 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 150000001768 cations Chemical class 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000005764 inhibitory process Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 238000011056 performance test Methods 0.000 description 5
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000007935 neutral effect Effects 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 229940126062 Compound A Drugs 0.000 description 3
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- PSQWUOJNMMZDKW-UHFFFAOYSA-N 3-ethyl-3-(oxiran-2-ylmethoxymethyl)oxetane Chemical compound C1OC1COCC1(CC)COC1 PSQWUOJNMMZDKW-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000003849 aromatic solvent Substances 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- ITZGNPZZAICLKA-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate Chemical compound C1C2OC2CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 ITZGNPZZAICLKA-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229940125904 compound 1 Drugs 0.000 description 2
- 229940125782 compound 2 Drugs 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- ZCSHNCUQKCANBX-UHFFFAOYSA-N lithium diisopropylamide Chemical compound [Li+].CC(C)[N-]C(C)C ZCSHNCUQKCANBX-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- MFRIHAYPQRLWNB-UHFFFAOYSA-N sodium tert-butoxide Chemical compound [Na+].CC(C)(C)[O-] MFRIHAYPQRLWNB-UHFFFAOYSA-N 0.000 description 2
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- 238000005292 vacuum distillation Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- KTXWGMUMDPYXNN-UHFFFAOYSA-N 2-ethylhexan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCC(CC)C[O-].CCCCC(CC)C[O-].CCCCC(CC)C[O-].CCCCC(CC)C[O-] KTXWGMUMDPYXNN-UHFFFAOYSA-N 0.000 description 1
- QUVMSYUGOKEMPX-UHFFFAOYSA-N 2-methylpropan-1-olate;titanium(4+) Chemical compound [Ti+4].CC(C)C[O-].CC(C)C[O-].CC(C)C[O-].CC(C)C[O-] QUVMSYUGOKEMPX-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- YNESATAKKCNGOF-UHFFFAOYSA-N lithium bis(trimethylsilyl)amide Chemical compound [Li+].C[Si](C)(C)[N-][Si](C)(C)C YNESATAKKCNGOF-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- ITNVWQNWHXEMNS-UHFFFAOYSA-N methanolate;titanium(4+) Chemical compound [Ti+4].[O-]C.[O-]C.[O-]C.[O-]C ITNVWQNWHXEMNS-UHFFFAOYSA-N 0.000 description 1
- 241000345420 miki group Species 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 1
- NHKJPPKXDNZFBJ-UHFFFAOYSA-N phenyllithium Chemical compound [Li]C1=CC=CC=C1 NHKJPPKXDNZFBJ-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- RPDAUEIUDPHABB-UHFFFAOYSA-N potassium ethoxide Chemical compound [K+].CC[O-] RPDAUEIUDPHABB-UHFFFAOYSA-N 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 229940086066 potassium hydrogencarbonate Drugs 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- FVSKHRXBFJPNKK-UHFFFAOYSA-N propionitrile Chemical compound CCC#N FVSKHRXBFJPNKK-UHFFFAOYSA-N 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D305/00—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms
- C07D305/02—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings
- C07D305/04—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
- C07D305/06—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to the ring atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D407/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00
- C07D407/02—Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00 containing two hetero rings
- C07D407/12—Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00 containing two hetero rings linked by a chain containing hetero atoms as chain links
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/62—Monocarboxylic acids having ten or more carbon atoms; Derivatives thereof
- C08F20/68—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F22/10—Esters
- C08F22/12—Esters of phenols or saturated alcohols
- C08F22/20—Esters containing oxygen in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
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Description
前記工程(2)は、中間体と(メタ)アクリル酸又は(メタ)アクリル酸エステルとを触媒存在の条件下で反応させ、生成物を得る
エステル化/エステル交換反応工程である、上記の一般式(I)で示されるハイブリッド型感光性樹脂の製造方法にも関するものである。
MS(m/e):272(M)
1H-NMR(CDCl3,500MHz):δ0.96(3H,m),δ1.13(2H,m),δ1.25(2H,m),δ3.29(2H,s),δ3.42(2H,m),δ3.61(4H,d),δ4.61(1H,m),δ4.66(4H,s),δ5.82-6.42(3H,m)。
実施例1および2の方法を参考にして、相応な試薬により、表1で示される構造を有する化合物3〜11を合成した。
1.硬化性能試験
上記実施例の化合物を例として、光開始剤を配合して、本発明の感光性樹脂の硬化性能を試験した。
表2で示される配合に従って原料を選択し、暗室で均一に攪拌した後、PETフィルム上にサンプリングし、25#ワイヤバーで塗布し、厚さ約25μmの塗膜を形成した。塗布層が塗布されたPETフィルムをクローラ露光機(RW-UV.70201、波長300〜500nm)に置いて露光し、1回の露光で得られたエネルギーを80mj/cm2とし、各グループの配合で完全に硬化するのに必要な最低エネルギーを記録した。
表3で示される配合に従って、試験1で示される方法を参考にして、本発明化合物および相応なラジカル官能度を有するモノマーに対して、硬化性能試験を行った。
例示的光硬化組成物に適用することにより、本発明のハイブリッド型感光性樹脂の硬化成膜後の性能を評価した。主にフィルム硬度、付着性、柔軟性および耐熱性(ガラス転移温度で判断する)が含まれる。その中、
本発明の光硬化組成物は、以下の割合で製造された。
本発明の感光性樹脂 98質量部
カチオン開始剤PAG-202 1質量部
ラジカル開始剤184 1質量部;
カチオン重合モノマーE-51 98質量部
カチオン開始剤PAG-202 2質量部;
ラジカル重合モノマーTMPTA 98質量部
ラジカル開始剤184 2質量部;
光硬化重合モノマー即ち化合物A 98質量部
カチオン開始剤PAG-202 1質量部
ラジカル開始剤184 1質量部
本発明および比較例の硬化フィルムを温度23℃、相対湿度50%の条件下で試験し、GB/T 6739-2006に規定された鉛筆硬度評価方法に基づき、鉛筆を試験器具に挿入し、クリップで固定した。水平に保持し、鉛筆の先端を塗膜表面に置いて、1mm/sの速度で自分から離れる方向へ少なくとも7mmの距離を押した。スクラッチが発生していない場合、試験していない領域で実験を繰り返し、少なくとも長さ3mm以上のスクラッチが出るまで硬度のより高い鉛筆に交換して、塗布層にスクラッチがない最も硬い鉛筆の硬度を塗布層の硬度とする。
本発明および比較例の硬化フィルムを温度23℃、相対湿度50%の条件下で試験し、GB/T 9286-1998に規定される塗膜クロスカット評価方法に基づき、塗膜に100個のマスを切った。ナイフの先端は切断中に基材まで到達し、先端が鋭く、先端と塗膜が45度の角をなす。柔らかいブラシを使用してスクラップを除去し、3Mの透明テープを切られた100個のマスに貼り付け、テープを塗膜面およびマス部位にしっかりと接着させた。2分以内に、3Mテープの一端を60度の角度で1秒以内かけて穏やかに剥がし、以下の基準で評価する。
レベル0:切断縁は非常に平滑であり、剥がれることは全くない。
レベル1:切口交差部には塗布層が少し剥がれているが、クロスカット面積への影響は5%を有意に超えてはいけない。
レベル2:切口交差部、及び/又は、切口縁に沿って塗布層が剥がれており、影響は5%を有意に超えるが、15%を有意に超えてはいけない。
レベル3:切断縁に沿って塗布層が一部又は全体大きな破片として剥がれており、及び/又は、マスの異なる部分において一部又は全体剥がれており、影響されたクロスカット面積は15%を有意に超えるが、35%を有意に超えてはいけない。
レベル4:切断縁に沿って塗布層が大きな破片として剥がれており、及び/又は、一部のマスが一部又は全体剥がれており、影響されたクロスカット面積は35%を有意に超えるが、65%を有意に超えてはいけない。
レベル5:剥がれのレベルはレベル4を超えている。
実施例および比較例の硬化フィルムを温度23℃、相対湿度70%の条件下で試験し、GB/T1731-93塗膜柔軟性試験方法に基づき、硬化塗布層を塗布したブリキ板の外側を長手方向に沿って10、5、4、3、2、1mmのロッド軸に順次に巻き付け、2〜3秒間曲げて、拡大鏡で観察した。塗布層が破壊する最も小さいロッド軸の直径を光硬化塗布層の柔軟性とする。
示差走査熱量計(PE DSC8000)を用いて、本発明および比較例で得られた硬化フィルムのガラス転移温度について試験を行った。試験条件は、窒素雰囲気下で、-20℃から200℃まで10℃/minの速度で加熱し、200℃で1min保持した後、200℃から-20℃まで10℃/minの速度で冷却し、-20℃で1min保持して、次いで-20℃から200℃まで10℃/minの速度で加熱することにより、ガラス転移温度Tg(℃)を測定した。
Claims (13)
- 下記の一般式(I)で示される構造を有することを特徴とするハイブリッド型感光性樹脂。
R1はC1〜C40の直鎖又は分岐のm価のアルキル基、C2〜C20のm価のアルケニル基、又はC6〜C40のm価のアリール基を表し、これらの基における-CH2-は酸素原子、-NH-又は1,4-フェニレン基で置換されてもよく、但し、2つの-O-が直接に結合することはなく、また、これらの基における1つ又は複数の水素原子はそれぞれ独立にアルキル基、ハロゲン、およびニトロ基からなる群から選ばれる基で置換されてもよい。
R2はC1〜C20の直鎖又は分岐のアルキレン基を表し、その主鎖における-CH2-は酸素原子で置換されてもよく、但し、2つの-O-が直接に結合することはなく、また、これらの基における1つ又は複数の水素原子はそれぞれ独立にアルキル基、ハロゲン、およびニトロ基からなる群から選ばれる基で置換されてもよい。
R3は水素、ハロゲン、ニトロ基、C1〜C20の直鎖又は分岐のアルキル基、C3〜C20のシクロアルキル基、C4〜C20のシクロアルキルアルキル基、C4〜C20のアルキルシクロアルキル基、C2〜C10のアルケニル基又はC6〜C20のアリール基を表し、これらの基における1つ又は複数の水素原子はそれぞれ独立にアルキル基、ハロゲン、およびニトロ基からなる群から選ばれる基で置換されてもよい。
Rは水素又はメチル基を表す。
mは1〜8の整数を表す。] - R1はC1〜C40の直鎖又は分岐のm価のアルキル基、C2〜C10の直鎖又は分岐のm価のアルケニル基、又はC6〜C30のm価のアリール基を表し、これらの基における-CH2-は酸素原子、-NH-又は1,4-フェニレン基で置換されてもよく、但し、2つの-O-が直接に結合することはなく、また、これらの基における1つ又は複数の水素原子はそれぞれ独立にアルキル基、ハロゲン、およびニトロ基からなる群から選ばれる基で置換されてもよいことを特徴とする請求項1に記載のハイブリッド型感光性樹脂。
- R2はC1〜C10の直鎖又は分岐のアルキレン基を表し、その主鎖における-CH2-は酸素原子で置換されてもよく、但し、2つの-O-が直接に結合することはないことを特徴とする請求項1に記載のハイブリッド型感光性樹脂。
- R 2 はC 1 〜C 6 の直鎖又は分岐のアルキレン基を表し、その主鎖における-CH 2 -は酸素原子で置換されてもよく、但し、2つの-O-が直接に結合することはないことを特徴とする請求項4に記載のハイブリッド型感光性樹脂。
- R3は水素、C1〜C10の直鎖又は分岐のアルキル基、C3〜C10のシクロアルキル基、C4〜C10のシクロアルキルアルキル基、C4〜C10のアルキルシクロアルキル基、C2〜C8のアルケニル基、又はフェニル基を表すことを特徴とする請求項1に記載のハイブリッド型感光性樹脂。
- R 3 はC 1 〜C 4 の直鎖又は分岐のアルキル基、又はC 4 〜C 8 のシクロアルキルアルキル基を表すことを特徴とする請求項6に記載のハイブリッド型感光性樹脂。
- mが1〜6の整数であることを特徴とする請求項1に記載のハイブリッド型感光性樹脂。
- mが1〜4の整数であることを特徴とする請求項8に記載のハイブリッド型感光性樹脂。
- 請求項1〜9のいずれか一項に記載のハイブリッド型感光性樹脂を製造する方法であって、
一般式(II)で示される水酸基含有化合物および一般式(III)で示されるオキセタン基含有化合物を原料として、工程(1)および工程(2)を含み、
前記工程(2)は、前記中間体と(メタ)アクリル酸又は(メタ)アクリル酸エステルとを、触媒存在の条件下で反応させ、生成物を得る
エステル化/エステル交換反応工程であることを特徴とする製造方法。 - 工程(1)の反応で使用される触媒は、アルカリ金属水酸化物、アルコールのアルカリ金属塩、アルカリ金属炭酸塩、アルカリ金属炭酸水素塩、アルキル金属リチウム化合物、およびリチウムアミド化合物からなる群から選ばれる1種又は2種以上の組合せであることを特徴とする請求項10に記載の製造方法。
- 工程(2)において、前記中間体と(メタ)アクリル酸とをエステル化反応させ、或いは(メタ)アクリル酸エステルとエステル交換反応させることにより、生成物を得、前記エステル化反応で使用される触媒が無機酸又は有機酸であり、前記エステル交換反応で使用される触媒がチタン酸エステル類化合物であることを特徴とする請求項10に記載の製造方法。
- 請求項1〜9のいずれか一項に記載のハイブリッド型感光性樹脂の、ラジカル-カチオン光硬化系への使用。
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-
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-
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- 2017-07-07 EP EP17826941.1A patent/EP3486724B1/en active Active
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CN107621752B (zh) | 2019-11-12 |
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EP3486724A1 (en) | 2019-05-22 |
US20190391491A1 (en) | 2019-12-26 |
KR20190027868A (ko) | 2019-03-15 |
US10642155B2 (en) | 2020-05-05 |
WO2018010605A1 (zh) | 2018-01-18 |
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