JP6680699B2 - 実装装置および実装方法 - Google Patents
実装装置および実装方法 Download PDFInfo
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- JP6680699B2 JP6680699B2 JP2016573362A JP2016573362A JP6680699B2 JP 6680699 B2 JP6680699 B2 JP 6680699B2 JP 2016573362 A JP2016573362 A JP 2016573362A JP 2016573362 A JP2016573362 A JP 2016573362A JP 6680699 B2 JP6680699 B2 JP 6680699B2
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- semiconductor chip
- resin sheet
- thermocompression bonding
- bonding head
- electrode
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Description
上下両面に電極を有する半導体チップを、前記半導体チップの下側に配置され、上面に電極を有する被接合物に、熱硬化性の接着剤を介した状態で熱圧着する実装装置であって、
前記半導体チップを保持した状態で加熱し、前記被接合物に圧着する機能を有する熱圧着ヘッドを備え、
前記熱圧着ヘッドは、前記半導体チップを保持する面に、吸着穴を有し、
前記吸着穴と連通し、吸着穴内部を減圧する減圧機構を備え、
前記半導体チップと前記熱圧着ヘッドの間に樹脂シートを供給する、樹脂シート供給機構を備え、
前記熱圧着ヘッドの加熱温度を設定する機能を有した制御部を更に備え、
前記減圧機構は前記吸着穴内部の圧力を測定し、測定値を前記制御部に出力する圧力計を有し、
前記制御部が、前記圧力計の測定値に応じて前記熱圧着ヘッドの加熱温度の設定値を変更する機能を有し、
前記半導体チップ上面に突出した電極を前記樹脂シートに埋没させてから熱圧着することを特徴とする。
前記樹脂シート供給機構は、前記吸着穴に対応する位置の樹脂シートに貫通穴を形成する、穴開け機能を有することを特徴とする。
前記熱圧着後に、前記熱圧着ヘッド表面に前記樹脂シートを密着させた状態で、前記樹脂シートを前記半導体チップから離間させる機能を有している。
前記熱圧着ヘッドと前記樹脂シートを離間させる移動手段を備えたことを特徴とする。
上下両面に電極を有する半導体チップを、前記半導体チップの下側に配置され、上面に電極を有する被接合物に、熱硬化性の接着剤を介した状態で熱圧着する実装方法であって、
前記半導体チップを、熱圧着ヘッドで、熱圧着ヘッドの吸着穴と対応する位置に貫通穴が形成された樹脂シートを介して吸着保持する工程と、
前記熱圧着ヘッドを所定の温度以下にした状態で、前記半導体チップ上面に突出した電極を前記樹脂シートに埋没させる工程と、
前記熱圧着ヘッドの設定温度を上げて、前記半導体チップ下面の電極と被接合物上面の電極を接合するとともに、前記接着剤を熱硬化させる工程とを備え、
前記半導体チップ上面に突出した電極を前記樹脂シートに埋没させる工程において、前記吸着穴内の圧力を監視し、前記圧力が所定の値以下になった後に、前記熱圧着ヘッドの設定温度を、前記半導体チップ下面の電極と被接合物上面の電極を接合するとともに、前記接着剤を熱硬化させる温度に上げることを特徴とする。
前記熱圧着後に、前記熱圧着ヘッド表面に前記樹脂シートを密着させた状態で、前記樹脂シートを前記半導体チップから離間させることを特徴とする。
前記樹脂シートを前記半導体チップから離間させた後に、前記熱圧着ヘッドから前記樹脂シートを離間することを特徴とする。
図1は、本発明に係る一実施形態である実装装置1である。
2 樹脂シート供給機構
2S 樹脂シート巻出部
2R 樹脂シート巻取部
2H 穿孔機
2HN 針部
3 基台
4 ステージ
5 支持フレーム
6 熱圧着ユニット
7 熱圧着ヘッド
8 ヒータ
9 アタッチメント
10 画像認識装置
11 制御部
90 吸着穴
91 減圧機構
93 圧力計
C 半導体チップ
P 樹脂シート
S 被接合物
EB 半導体チップ下面の電極
ET 半導体チップ上面の電極
ES 被接合物上面の電極
NCF 非導電性フィルム(接着剤)
Claims (7)
- 上下両面に電極を有する半導体チップを、前記半導体チップの下側に配置され、上面に電極を有する被接合物に、熱硬化性の接着剤を介した状態で熱圧着する実装装置であって、
前記半導体チップを保持した状態で加熱し、前記被接合物に圧着する機能を有する熱圧着ヘッドを備え、
前記熱圧着ヘッドは、前記半導体チップを保持する面に、吸着穴を有し、
前記吸着穴と連通し、吸着穴内部を減圧する減圧機構を備え、
前記半導体チップと前記熱圧着ヘッドの間に樹脂シートを供給する、樹脂シート供給機構を備え、
前記熱圧着ヘッドの加熱温度を設定する機能を有した制御部を更に備え、
前記減圧機構は前記吸着穴内部の圧力を測定し、測定値を前記制御部に出力する圧力計を有し、
前記制御部が、前記圧力計の測定値に応じて前記熱圧着ヘッドの加熱温度の設定値を変更する機能を有し、
前記半導体チップ上面に突出した電極を前記樹脂シートに埋没させてから熱圧着することを特徴とする実装装置。 - 請求項1に記載の実装装置であって、
前記樹脂シート供給機構は、前記吸着穴に対応する位置の樹脂シートに貫通穴を形成する、穴開け機能を有することを特徴とする実装装置。 - 請求項1または請求項2に記載の実装装置であって、
前記熱圧着後に、前記熱圧着ヘッド表面に前記樹脂シートを密着させた状態で、前記樹脂シートを前記半導体チップから離間させる機能を有している実装装置。 - 請求項3に記載の実装装置であって、
前記熱圧着ヘッドと前記樹脂シートを離間させる移動手段を備えたことを特徴とする実装装置。 - 上下両面に電極を有する半導体チップを、前記半導体チップの下側に配置され、上面に電極を有する被接合物に、熱硬化性の接着剤を介した状態で熱圧着する実装方法であって、
前記半導体チップを、熱圧着ヘッドで、熱圧着ヘッドの吸着穴と対応する位置に貫通穴が形成された樹脂シートを介して吸着保持する工程と、
前記熱圧着ヘッドを所定の温度以下にした状態で、前記半導体チップ上面に突出した電極を前記樹脂シートに埋没させる工程と、
前記熱圧着ヘッドの設定温度を上げて、前記半導体チップ下面の電極と被接合物上面の電極を接合するとともに、前記接着剤を熱硬化させる工程とを備え、
前記半導体チップ上面に突出した電極を前記樹脂シートに埋没させる工程において、前記吸着穴内の圧力を監視し、前記圧力が所定の値以下になった後に、前記熱圧着ヘッドの設定温度を、前記半導体チップ下面の電極と被接合物上面の電極を接合するとともに、前記接着剤を熱硬化させる温度に上げることを特徴とする実装方法。 - 請求項5に記載の実装方法であって、
前記熱圧着後に、前記熱圧着ヘッド表面に前記樹脂シートを密着させた状態で、前記樹脂シートを前記半導体チップから離間させることを特徴とする実装方法。 - 請求項5または請求項6の何れかに記載の実装方法であって、
前記樹脂シートを前記半導体チップから離間させた後に、前記熱圧着ヘッドから前記樹脂シートを離間することを特徴とする実装方法。
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JP6316873B2 (ja) * | 2016-05-31 | 2018-04-25 | 株式会社新川 | ダイの実装方法 |
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TWI743726B (zh) * | 2019-04-15 | 2021-10-21 | 日商新川股份有限公司 | 封裝裝置 |
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JPH1167842A (ja) * | 1997-08-19 | 1999-03-09 | Matsushita Electric Ind Co Ltd | 電子部品の実装装置および実装方法 |
JP4014481B2 (ja) * | 2002-04-30 | 2007-11-28 | 東レエンジニアリング株式会社 | ボンディング方法およびその装置 |
JP4449325B2 (ja) | 2003-04-17 | 2010-04-14 | 住友ベークライト株式会社 | 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。 |
JP4229888B2 (ja) * | 2004-08-30 | 2009-02-25 | 富士通マイクロエレクトロニクス株式会社 | 電子部品実装装置 |
JP4997802B2 (ja) * | 2006-03-24 | 2012-08-08 | パナソニック株式会社 | テープ貼付方法及びその装置 |
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JP2014060241A (ja) * | 2012-09-18 | 2014-04-03 | Toray Ind Inc | 半導体装置の製造方法 |
JP6120685B2 (ja) * | 2013-06-10 | 2017-04-26 | 三菱電機株式会社 | 電力用半導体装置の製造方法 |
CN103465267B (zh) * | 2013-08-09 | 2015-12-09 | 宁波维真显示科技有限公司 | 凹凸面真空吸附装置及其制作方法 |
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