JP6671908B2 - 研磨パッド - Google Patents

研磨パッド Download PDF

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Publication number
JP6671908B2
JP6671908B2 JP2015193635A JP2015193635A JP6671908B2 JP 6671908 B2 JP6671908 B2 JP 6671908B2 JP 2015193635 A JP2015193635 A JP 2015193635A JP 2015193635 A JP2015193635 A JP 2015193635A JP 6671908 B2 JP6671908 B2 JP 6671908B2
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Japan
Prior art keywords
polishing
polishing pad
layer
compression ratio
present
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JP2015193635A
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English (en)
Japanese (ja)
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JP2016068255A (ja
Inventor
橘　俊光
俊光 橘
玉青 福島
玉青 福島
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Nitto Denko Corp
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Nitto Denko Corp
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Publication date
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Publication of JP2016068255A publication Critical patent/JP2016068255A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2015193635A 2014-10-01 2015-09-30 研磨パッド Active JP6671908B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014203088 2014-10-01
JP2014203088 2014-10-01

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019201444A Division JP2020037182A (ja) 2014-10-01 2019-11-06 研磨パッド

Publications (2)

Publication Number Publication Date
JP2016068255A JP2016068255A (ja) 2016-05-09
JP6671908B2 true JP6671908B2 (ja) 2020-03-25

Family

ID=55629860

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015193635A Active JP6671908B2 (ja) 2014-10-01 2015-09-30 研磨パッド
JP2019201444A Withdrawn JP2020037182A (ja) 2014-10-01 2019-11-06 研磨パッド

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019201444A Withdrawn JP2020037182A (ja) 2014-10-01 2019-11-06 研磨パッド

Country Status (3)

Country Link
JP (2) JP6671908B2 (zh)
TW (1) TW201628785A (zh)
WO (1) WO2016051796A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220080238A (ko) * 2020-12-07 2022-06-14 에스케이씨솔믹스 주식회사 연마패드용 시트, 연마패드 및 반도체 소자의 제조방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200028097A (ko) * 2018-09-06 2020-03-16 에스케이실트론 주식회사 웨이퍼 연마 장치용 연마패드
JP2020055091A (ja) * 2018-10-04 2020-04-09 株式会社ディスコ 被加工物の研削方法
TWI818029B (zh) * 2019-05-31 2023-10-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法以及研磨方法
US20230211454A1 (en) 2020-05-28 2023-07-06 Tokuyama Corporation Laminated polishing pad
JP6927617B1 (ja) * 2020-11-19 2021-09-01 不二越機械工業株式会社 ワーク研磨装置およびトップリング用樹脂マット体

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08108372A (ja) * 1994-10-07 1996-04-30 Mitsubishi Electric Corp 研磨布
JP3459317B2 (ja) * 1995-06-29 2003-10-20 日東電工株式会社 研磨パッド
JP2000343411A (ja) * 1999-06-01 2000-12-12 Teijin Ltd 研磨用シート
JP2001176829A (ja) * 1999-12-20 2001-06-29 Nitto Denko Corp 半導体ウェーハの研磨方法及び半導体ウェーハ研磨用パッド
US6593240B1 (en) * 2000-06-28 2003-07-15 Infineon Technologies, North America Corp Two step chemical mechanical polishing process
CN100496896C (zh) * 2000-12-01 2009-06-10 东洋橡膠工业株式会社 研磨垫
JP4550300B2 (ja) * 2001-03-09 2010-09-22 帝人株式会社 研磨用シート
JP2002331453A (ja) * 2001-05-08 2002-11-19 Shin Etsu Handotai Co Ltd ウェーハの研磨方法及びウェーハの研磨装置
JP3455208B2 (ja) * 2001-11-13 2003-10-14 東洋紡績株式会社 半導体ウエハ研磨パッド、半導体ウエハの研磨方法、研磨パッド用研磨シート、及び研磨シート用発泡体ブロック
JP2004025407A (ja) * 2002-06-27 2004-01-29 Jsr Corp 化学機械研磨用研磨パッド
CN1684799A (zh) * 2002-09-25 2005-10-19 Ppg工业俄亥俄公司 平面化用的抛光垫片
WO2005120775A1 (en) * 2004-06-08 2005-12-22 S.O.I. Tec Silicon On Insulator Technologies Planarization of a heteroepitaxial layer
JP2006186239A (ja) * 2004-12-28 2006-07-13 Toyo Tire & Rubber Co Ltd 研磨パッドおよび半導体デバイスの製造方法
JP5291647B2 (ja) * 2010-03-08 2013-09-18 株式会社岡本工作機械製作所 取替え交換が容易な積層研磨パッド
JP2013018056A (ja) * 2011-07-07 2013-01-31 Toray Ind Inc 研磨パッド
JP2014124718A (ja) * 2012-12-26 2014-07-07 Toyo Tire & Rubber Co Ltd 積層研磨パッドの製造方法
US9186772B2 (en) * 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220080238A (ko) * 2020-12-07 2022-06-14 에스케이씨솔믹스 주식회사 연마패드용 시트, 연마패드 및 반도체 소자의 제조방법
KR102489678B1 (ko) 2020-12-07 2023-01-17 에스케이엔펄스 주식회사 연마패드용 시트, 연마패드 및 반도체 소자의 제조방법

Also Published As

Publication number Publication date
WO2016051796A1 (ja) 2016-04-07
JP2016068255A (ja) 2016-05-09
TW201628785A (zh) 2016-08-16
JP2020037182A (ja) 2020-03-12

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