JP6670293B2 - 熱硬化性樹脂組成物、当該熱硬化性樹脂組成物を含有する絶縁材、封止剤および導電ペースト、当該熱硬化性樹脂組成物を硬化させた硬化物、当該熱硬化性樹脂組成物を有する基板材料、当該熱硬化性樹脂組成物を基材に含浸させたプリプレグ、当該プリプレグの熱硬化性樹脂組成物を硬化させた部材、熱膨張率の調整方法、ならびに当該調整方法を用いて製造された部材 - Google Patents
熱硬化性樹脂組成物、当該熱硬化性樹脂組成物を含有する絶縁材、封止剤および導電ペースト、当該熱硬化性樹脂組成物を硬化させた硬化物、当該熱硬化性樹脂組成物を有する基板材料、当該熱硬化性樹脂組成物を基材に含浸させたプリプレグ、当該プリプレグの熱硬化性樹脂組成物を硬化させた部材、熱膨張率の調整方法、ならびに当該調整方法を用いて製造された部材 Download PDFInfo
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- JP6670293B2 JP6670293B2 JP2017503372A JP2017503372A JP6670293B2 JP 6670293 B2 JP6670293 B2 JP 6670293B2 JP 2017503372 A JP2017503372 A JP 2017503372A JP 2017503372 A JP2017503372 A JP 2017503372A JP 6670293 B2 JP6670293 B2 JP 6670293B2
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- 239000011342 resin composition Substances 0.000 title claims description 98
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- -1 glycoluril derivative compound Chemical class 0.000 claims description 39
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- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
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- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- LSWYGACWGAICNM-UHFFFAOYSA-N 2-(prop-2-enoxymethyl)oxirane Chemical compound C=CCOCC1CO1 LSWYGACWGAICNM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- PESXPUCWMKUMSI-UHFFFAOYSA-N 3-[2-(dimethylcarbamoylamino)phenyl]-1,1-dimethylurea Chemical compound CN(C)C(=O)NC1=CC=CC=C1NC(=O)N(C)C PESXPUCWMKUMSI-UHFFFAOYSA-N 0.000 description 1
- KDQTUCKOAOGTLT-UHFFFAOYSA-N 3-[3-(dimethylcarbamoylamino)-4-methylphenyl]-1,1-dimethylurea Chemical compound CN(C)C(=O)NC1=CC=C(C)C(NC(=O)N(C)C)=C1 KDQTUCKOAOGTLT-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- IWLNQHOWNNVIEM-UHFFFAOYSA-N 6-(triphenyl-$l^{5}-phosphanylidene)cyclohexa-2,4-dien-1-one Chemical compound O=C1C=CC=CC1=P(C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 IWLNQHOWNNVIEM-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical class C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229940126062 Compound A Drugs 0.000 description 1
- 229910000759 E-Material Inorganic materials 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
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- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
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- 238000000280 densification Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000001046 glycoluril group Chemical class [H]C12N(*)C(=O)N(*)C1([H])N(*)C(=O)N2* 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 235000014380 magnesium carbonate Nutrition 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- XDOBJOBITOLMFI-UHFFFAOYSA-N pyrrole-2,5-dione;toluene Chemical compound CC1=CC=CC=C1.O=C1NC(=O)C=C1 XDOBJOBITOLMFI-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- IUURMAINMLIZMX-UHFFFAOYSA-N tris(2-nonylphenyl)phosphane Chemical compound CCCCCCCCCC1=CC=CC=C1P(C=1C(=CC=CC=1)CCCCCCCCC)C1=CC=CC=C1CCCCCCCCC IUURMAINMLIZMX-UHFFFAOYSA-N 0.000 description 1
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3236—Heterocylic compounds
- C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D487/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
- C07D487/02—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00 in which the condensed system contains two hetero rings
- C07D487/04—Ortho-condensed systems
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/26—Di-epoxy compounds heterocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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Description
特許文献3には、特定の熱硬化性樹脂組成物を用いて線熱膨張率係数を低下させることが記載されている。しかし、同文献に記載されている熱硬化性樹脂組成物は、基材に含浸させて用いられるものであって、熱硬化性樹脂組成物のみからなる硬化物の線熱膨張係数を低下させるものではない。
〔1〕下記式(1)のグリコールウリル誘導体化合物およびビスマレイミド化合物を含有する熱硬化性樹脂組成物。
〔3〕〔1〕に記載の熱硬化性樹脂組成物を含有する封止材。
〔4〕〔1〕に記載の熱硬化性樹脂組成物を含有する導電ペースト。
〔6〕線熱膨張係数が40ppm/℃以下である〔5〕に記載の硬化物。
[7〕ガラス転移温度が180℃以上である〔5〕に記載の硬化物。
〔9〕〔1〕に記載の熱硬化性樹脂組成物を基材に含浸させたプリプレグ。
〔10〕〔3〕に記載の封止材、〔4〕に記載の導電性ペースト、〔8〕に記載の基板材料の前記熱硬化性樹脂組成物または〔9〕に記載のプリプレグの前記熱硬化性樹脂組成物を硬化させた部材。
本発明の熱膨張性調整剤は、下記の式(1)のグリコールウリル誘導体化合物を含有する。
ガラス転移温度を上記範囲内とすることにより、硬化物よりなる部材の剛性や耐熱性を良好にすることができる。ガラス転移温度は、示唆熱分析法(TMA)を用いて40℃から300℃まで毎分10℃で昇温して測定して得られた値をいう。
以下の、実施例および比較例の性能評価において用いた試験方法は次のとおりである。
(1)ガラス転移温度
実施例で得られたプリプレグ1枚の上下部分にセパニウム(アルミニウム箔表面を耐熱離型皮膜で処理した離型剤)を配し、4MPa、180〜230℃で120分加熱し、熱硬化させた。得られた試料(サンプル)のガラス転移温度を測定した。測定装置、測定条件等は以下のとおりであった。
測定機器:リガク社製「TMA8310evo」
雰囲気:窒素中
測定温度:30〜300℃
昇温速度:10℃/min
荷重:47mN
(2)線熱膨張係数
樹脂フィルムはその状態のままで、プリプレグは1枚の上下部分にセパニウムを配し、4MPa、180〜230℃で120分加熱し、熱硬化させた。得られた成形品の線熱膨張係数を測定した。測定装置、測定条件等は以下のとおりであった。
測定機器:リガク社製「TMA8310evo」
雰囲気:窒素中
測定温度:50〜100℃
昇温速度:10℃/min
荷重:47mN
(1)グリコールウリル誘導体:1,3,4,6−テトラグリシジルクリコールウリル、TG−G(商品名、四国化成(株)社製)
(2)エポキシ樹脂A:ビスフェノールエポキシ樹脂、JER828EL(商品名、三菱化学(株)社製)
エポキシ樹脂B:ビフェニルアラルキルエポキシ樹脂、NC3000(商品名、日本化薬(株)社製)
(3)ビスマレイミド化合物A:フェニルメタンマレイミド、BMI−2000(商品名、大和化成工業(株)社製)
(4)ビスマレイミド化合物B:4,4’−ジフェニルメタンビスマレイミド、BMI−1000(商品名、大和化成工業(株)社製)
(5)フェノール樹脂:ナフトールアラルキル樹脂、SN−485(商品名、新日鉄住金化学(株)社製)
(6)硬化促進剤:U−CAT 3513N(商品名、三洋化成工業(株)社製)
(7)反応希釈剤:ネオアリルG(商品名、ダイソー(株)社製)
(ワニス(I)の合成)
攪拌機、温度計、冷却管を設置した丸底フラスコに4,4’−ジフェニルメタンビスマレイミド(BMI−1000)270質量部、ナフトールアラルキル樹脂(SN−485)82質量部、ビフェニルアラルキルエポキシ樹脂(NC−3000)221質量部、メチルエチルケトン(MEK)120質量部を仕込み、内温が80℃に到達後2時間混合攪拌した。その後、反応性希釈剤(アリルグリシジルエーテル)27質量部、N−メチル−2−ピロリドン(NMP)12質量部を添加し、80℃を4時間保持した。
次にNMP28質量部を添加して更に80℃で18時間保持した。MEK200質量部、NMP40質量部を添加して2時間攪拌して、均一に溶解した状態の変性ポリイミド樹脂組成物のワニス(I)を得た。
TG−G:30質量部とワニス(I):70質量部とを混合し、硬化促進剤としてU−CAT3513N:0.2質量部加え、150℃から230℃で6時間硬化して薄い膜状の樹脂フィルムを得た。TG−G用の溶剤として、メチルエチルケトン20質量部を用いた。
(実施例2)
実施例1のTG−Gを20質量部としたこと、ワニス(I):70質量部をワニス(I):78.4質量部とJER828EL:1.6質量部とを混合したものとしたこと、および、TG−G用の溶剤としてのメチルエチルケトンを15質量部としたこと以外、実施例1と同じ方法で薄い膜状の樹脂フィルムを得た。
TG−G:30質量部およびワニス(I):70質量部の代わりに、ワニス(I):100質量部を用いたこと、TG−G用の溶剤としてのメチルエチルケトンを用いなかったこと以外、実施例1と同じ方法で薄い膜状の樹脂フィルムを得た。
(比較例2)
TG−G:30質量部およびワニス(I):70質量部の代わりに、JER828EL:100質量部およびSN−485:115.0質量部を用いたこと以外、実施例1と同じ方法で薄い膜状の樹脂フィルムを得た。
TG−G:100質量部に、硬化促進剤としてU−CAT3513N:0.2質量部を加え、150℃から230℃で6時間硬化して薄い膜状の樹脂フィルムを得た。
(実施例4)
TG−G:100質量部をTG−G:30質量部およびBMI−2000:70質量部としたこと、SN485:64質量部を加えたこと、およびTG−G用の溶剤としてジメチルアセトアミドを110質量部用いたこと以外は、実施例3と同じ方法で樹脂フィルムを得た。
(実施例5)
SN485を47質量部としたこと以外は、実施例4と同じ方法で樹脂フィルムを得た。
(実施例6)
BMI−2000:70質量部をBMI−1000:70質量部としたこと以外は、実施例4と同じ方法で樹脂フィルムを得た。
(実施例7)
BMI−2000:70質量部をBMI−1000:70質量部としたこと以外は、実施例5と同じ方法で樹脂フィルムを得た。
TG−G:10質量部に、ワニス(I):88.2質量部、JER828EL:1.8質量部、メチルエチルケトン:7質量部、硬化促進剤としてU−CAT3513N:0.5質量部、添加剤(レベリング剤):0.01質量部、無機充填剤(球状シリカ):65質量部を加え均一に攪拌し、樹脂ワニスを調製した。
これをガラスクロス(旭化成イーマテリアル(株)社製2319)に含浸し、230℃で2時間乾燥して、プリプレグを得た。このプリプレグを2枚重ね合わせ、さらにその上下の最外層に18μmの銅箔を配して、2〜4MPaの圧力で、180〜230℃、120分の加熱条件で成形して銅張積層板を得た。
TG−G:10質量部、ワニス(I):88.2質量部、JER828EL:1.8質量部およびメチルエチルケトン:7質量部を、TG−G:20質量部、ワニス(I):78.4質量部、JER828EL:1.6質量部、メチルエチルケトン:13質量部にしたこと以外は、実施例8と同じ方法で銅張積層板を得た。
TG−G:10質量部、ワニス(I):88.2質量部、JER828EL:1.8質量部およびメチルエチルケトン:7質量部を、TG−G:30質量部、ワニス(I):68.6質量部、JER828EL:1.4質量部およびメチルエチルケトン:20質量部にした以外は、実施例8と同じ方法で銅張積層板を得た。
Claims (12)
- 下記式(1)のグリコールウリル誘導体化合物およびビスマレイミド化合物を含有する熱硬化性樹脂組成物。
- 請求項1に記載の熱硬化性樹脂組成物を含有する絶縁材。
- 請求項1に記載の熱硬化性樹脂組成物を含有する封止材。
- 請求項1に記載の熱硬化性樹脂組成物を含有する導電ペースト。
- 請求項1に記載の熱硬化性樹脂組成物を硬化させた硬化物。
- 線熱膨張係数が40ppm/℃以下である請求項5に記載の硬化物。
- ガラス転移温度が180℃以上である請求項5に記載の硬化物。
- 請求項1に記載の熱硬化性樹脂組成物を有する基板材料。
- 請求項1に記載の熱硬化性樹脂組成物を基材に含浸させたプリプレグ。
- 請求項3に記載の封止材、請求項4に記載の導電性ペースト、請求項8に記載の基板材料の前記熱硬化性樹脂組成物または請求項9に記載のプリプレグの前記熱硬化性樹脂組成物を硬化させた部材。
- 請求項1に記載の熱硬化性樹脂組成物を硬化させた部材の線熱膨張係数を測定する測定工程と、
前記測定された線熱膨張係数に基づいて、前記熱硬化性樹脂組成物における前記式(1)のグリコールウリル誘導体化合物の含有量を調整する調整工程と、
を備える部材の線熱膨張係数の調整方法。 - 前記式(1)のグリコールウリル誘導体化合物の含有量が、請求項11に記載の線熱膨張係数の調整方法を用いて設定されたものである請求項10に記載の部材。
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PCT/JP2016/052422 WO2016139989A1 (ja) | 2015-03-04 | 2016-01-28 | 熱膨張性調整剤、熱膨張性調整剤としての使用、熱硬化性樹脂組成物、当該熱硬化性樹脂組成物を含有する絶縁材、封止剤および導電ペースト、当該熱硬化性樹脂組成物を硬化させた硬化物、当該熱硬化性樹脂組成物を有する基板材料、当該熱硬化性樹脂組成物を基材に含浸させたプリプレグ、当該プリプレグの熱硬化性樹脂組成物を硬化させた部材、熱膨張率の調整方法、ならびに当該調整方法を用いて製造された部材 |
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DE1932305A1 (de) * | 1968-09-13 | 1970-03-19 | Akad Wissenschaften Ddr | Verfahren zur Herstellung von Epoxydharzformstoffen |
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