JP6653016B2 - 異物除去装置 - Google Patents
異物除去装置 Download PDFInfo
- Publication number
- JP6653016B2 JP6653016B2 JP2018519632A JP2018519632A JP6653016B2 JP 6653016 B2 JP6653016 B2 JP 6653016B2 JP 2018519632 A JP2018519632 A JP 2018519632A JP 2018519632 A JP2018519632 A JP 2018519632A JP 6653016 B2 JP6653016 B2 JP 6653016B2
- Authority
- JP
- Japan
- Prior art keywords
- foreign matter
- removing device
- matter removing
- substrate
- suction port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 claims description 45
- 238000002347 injection Methods 0.000 claims description 31
- 239000007924 injection Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 description 73
- 239000004065 semiconductor Substances 0.000 description 15
- 230000003749 cleanliness Effects 0.000 description 10
- 239000000126 substance Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Description
Claims (7)
- 水平方向に搬送される平板状部材の表面に帯状に空気を噴射する噴射口と、前記噴射口に隣接して配置される長方形状の吸引口と、を含む直方体状のクリーニングヘッドと、
前記クリーニングヘッドを前記平板状部材の表面に沿って搬送方向と直交方向に移動させる駆動部と、を備え、前記平板状部材の表面の異物を除去する異物除去装置であって、
前記クリーニングヘッドの長手方向の吸引口側端面が、搬送方向と直交方向から搬送方向と反対方向に向かって傾斜し、
前記吸引口は、前記平板状部材の前記表面に向かう方向に開口し、
前記噴射口は、搬送方向側に位置する長手方向の吸引口側端面のみに隣接して配置され、前記平板状部材の前記表面に対して前記吸引口に向かう方向に傾斜していること、
を特徴とする異物除去装置。 - 請求項1に記載の異物除去装置であって、
前記噴射口は、直線状のスリットである異物除去装置。 - 請求項1に記載の異物除去装置であって、
前記噴射口は、直線状に配置された孔列である異物除去装置。 - 請求項1に記載の異物除去装置であって、
前記吸引口の長手方向長さは、前記噴射口の長手方向長さよりも長い異物除去装置。 - 請求項2に記載の異物除去装置であって、
前記吸引口の長手方向長さは、前記噴射口の長手方向長さよりも長い異物除去装置。 - 請求項3に記載の異物除去装置であって、
前記吸引口の長手方向長さは、前記噴射口の長手方向長さよりも長い異物除去装置。 - 請求項1に記載の異物除去装置であって、
前記駆動部は、前記クリーニングヘッドを前記平板状部材の搬送方向と直交方向の幅に応じて設定された長さだけ移動させる異物除去装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016106176 | 2016-05-27 | ||
JP2016106176 | 2016-05-27 | ||
PCT/JP2017/019706 WO2017204333A1 (ja) | 2016-05-27 | 2017-05-26 | 異物除去装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017204333A1 JPWO2017204333A1 (ja) | 2019-02-28 |
JP6653016B2 true JP6653016B2 (ja) | 2020-02-26 |
Family
ID=60412752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018519632A Active JP6653016B2 (ja) | 2016-05-27 | 2017-05-26 | 異物除去装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6653016B2 (ja) |
KR (1) | KR102205607B1 (ja) |
CN (1) | CN109478508A (ja) |
TW (1) | TWI668061B (ja) |
WO (1) | WO2017204333A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7065650B2 (ja) * | 2018-03-12 | 2022-05-12 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
CN113877891B (zh) * | 2020-07-01 | 2022-08-19 | 帆宣系统科技股份有限公司 | 沾黏吸附式异物去除装置 |
JP2022034171A (ja) * | 2020-08-18 | 2022-03-03 | ファスフォードテクノロジ株式会社 | ダイボンディング装置、クリーニングヘッドおよび半導体装置の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60184156A (ja) * | 1984-02-29 | 1985-09-19 | 三晃金属工業株式会社 | 既設瓦棒葺屋根の補修屋根 |
JPS6292642U (ja) * | 1985-11-29 | 1987-06-13 | ||
JP4056858B2 (ja) * | 2001-11-12 | 2008-03-05 | 東京エレクトロン株式会社 | 基板処理装置 |
JP2004074104A (ja) * | 2002-08-22 | 2004-03-11 | Hugle Electronics Inc | 搬送除塵装置 |
JP4579071B2 (ja) * | 2005-07-06 | 2010-11-10 | ヒューグルエレクトロニクス株式会社 | 基板用搬送除塵装置 |
JP2013078701A (ja) * | 2010-02-12 | 2013-05-02 | Sharp Corp | 基板処理装置 |
JP5889537B2 (ja) * | 2011-03-23 | 2016-03-22 | ファスフォードテクノロジ株式会社 | ダイボンダ |
-
2017
- 2017-05-26 KR KR1020187037468A patent/KR102205607B1/ko active IP Right Grant
- 2017-05-26 CN CN201780044149.1A patent/CN109478508A/zh active Pending
- 2017-05-26 TW TW106117601A patent/TWI668061B/zh active
- 2017-05-26 WO PCT/JP2017/019706 patent/WO2017204333A1/ja active Application Filing
- 2017-05-26 JP JP2018519632A patent/JP6653016B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TW201808477A (zh) | 2018-03-16 |
TWI668061B (zh) | 2019-08-11 |
WO2017204333A1 (ja) | 2017-11-30 |
KR20190013903A (ko) | 2019-02-11 |
CN109478508A (zh) | 2019-03-15 |
JPWO2017204333A1 (ja) | 2019-02-28 |
KR102205607B1 (ko) | 2021-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6653016B2 (ja) | 異物除去装置 | |
KR101332986B1 (ko) | 다이본더 | |
TWI573637B (zh) | Cleaning head | |
KR20120035033A (ko) | 이물질 제거 유닛과, 이를 이용한 반도체 패키징 장치 및 방법 | |
KR101825231B1 (ko) | 전자 부품의 세정 장치 및 세정 방법 | |
KR102133214B1 (ko) | 이물 제거 장치 | |
TW201713419A (zh) | 除塵噴嘴及除塵裝置 | |
KR101704995B1 (ko) | 파티클의 비산 방지 기능이 구비된 공기 분사식 세정기 | |
KR102374339B1 (ko) | 절단 장치 및 절단품의 제조 방법 | |
KR102446950B1 (ko) | 기판 세정 모듈 및 이를 구비하는 기판 이송 장치 | |
KR102545475B1 (ko) | 다이 본딩 장치, 클리닝 헤드 및 반도체 장치의 제조 방법 | |
KR20190089182A (ko) | 이물질 제거 장치 및 이물질 제거 방법 | |
KR102634455B1 (ko) | 클리닝 유닛 및 이를 포함하는 기판 처리 장치 | |
KR101061979B1 (ko) | 와이어 본딩기 오염물질 제거장치 | |
JP7436267B2 (ja) | 洗浄ノズルおよび洗浄方法 | |
JP2019098250A (ja) | 非接触型基板クリーナー | |
KR20110114800A (ko) | 반도체 패키지 제조용 비접촉식 픽업 툴 | |
KR20090019249A (ko) | 트레이 세정 방법 및 장치 | |
KR20070092541A (ko) | 반도체 패키지 제조장비의 건조장치 | |
JPH07325311A (ja) | 付着液晶除去装置 | |
JP2004305930A (ja) | 洗浄用スリットノズルおよびこれを備えた洗浄装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A529 | Written submission of copy of amendment under article 34 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A5211 Effective date: 20181009 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181009 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20191114 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191210 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191219 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200107 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200124 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6653016 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |