TWI668061B - 異物除去裝置 - Google Patents

異物除去裝置 Download PDF

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Publication number
TWI668061B
TWI668061B TW106117601A TW106117601A TWI668061B TW I668061 B TWI668061 B TW I668061B TW 106117601 A TW106117601 A TW 106117601A TW 106117601 A TW106117601 A TW 106117601A TW I668061 B TWI668061 B TW I668061B
Authority
TW
Taiwan
Prior art keywords
foreign matter
substrate
cleaning head
suction port
removing device
Prior art date
Application number
TW106117601A
Other languages
English (en)
Chinese (zh)
Other versions
TW201808477A (zh
Inventor
中村智宣
尾又洋
前田徹
西尾謙介
小林泰人
Original Assignee
日商新川股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商新川股份有限公司 filed Critical 日商新川股份有限公司
Publication of TW201808477A publication Critical patent/TW201808477A/zh
Application granted granted Critical
Publication of TWI668061B publication Critical patent/TWI668061B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
TW106117601A 2016-05-27 2017-05-26 異物除去裝置 TWI668061B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016106176 2016-05-27
JPJP2016-106176 2016-05-27

Publications (2)

Publication Number Publication Date
TW201808477A TW201808477A (zh) 2018-03-16
TWI668061B true TWI668061B (zh) 2019-08-11

Family

ID=60412752

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106117601A TWI668061B (zh) 2016-05-27 2017-05-26 異物除去裝置

Country Status (5)

Country Link
JP (1) JP6653016B2 (ja)
KR (1) KR102205607B1 (ja)
CN (1) CN109478508A (ja)
TW (1) TWI668061B (ja)
WO (1) WO2017204333A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7065650B2 (ja) * 2018-03-12 2022-05-12 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN113877891B (zh) * 2020-07-01 2022-08-19 帆宣系统科技股份有限公司 沾黏吸附式异物去除装置
JP2022034171A (ja) * 2020-08-18 2022-03-03 ファスフォードテクノロジ株式会社 ダイボンディング装置、クリーニングヘッドおよび半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60184156A (ja) * 1984-02-29 1985-09-19 三晃金属工業株式会社 既設瓦棒葺屋根の補修屋根
JP2012199458A (ja) * 2011-03-23 2012-10-18 Hitachi High-Tech Instruments Co Ltd 異物除去装置及びそれを備えたダイボンダ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6292642U (ja) * 1985-11-29 1987-06-13
JP4056858B2 (ja) * 2001-11-12 2008-03-05 東京エレクトロン株式会社 基板処理装置
JP2004074104A (ja) * 2002-08-22 2004-03-11 Hugle Electronics Inc 搬送除塵装置
JP4579071B2 (ja) * 2005-07-06 2010-11-10 ヒューグルエレクトロニクス株式会社 基板用搬送除塵装置
JP2013078701A (ja) * 2010-02-12 2013-05-02 Sharp Corp 基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60184156A (ja) * 1984-02-29 1985-09-19 三晃金属工業株式会社 既設瓦棒葺屋根の補修屋根
JP2012199458A (ja) * 2011-03-23 2012-10-18 Hitachi High-Tech Instruments Co Ltd 異物除去装置及びそれを備えたダイボンダ

Also Published As

Publication number Publication date
CN109478508A (zh) 2019-03-15
WO2017204333A1 (ja) 2017-11-30
JPWO2017204333A1 (ja) 2019-02-28
KR20190013903A (ko) 2019-02-11
TW201808477A (zh) 2018-03-16
KR102205607B1 (ko) 2021-01-21
JP6653016B2 (ja) 2020-02-26

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