JP6646978B2 - 高アスペクト比構造におけるコンタクト洗浄 - Google Patents

高アスペクト比構造におけるコンタクト洗浄 Download PDF

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Publication number
JP6646978B2
JP6646978B2 JP2015167336A JP2015167336A JP6646978B2 JP 6646978 B2 JP6646978 B2 JP 6646978B2 JP 2015167336 A JP2015167336 A JP 2015167336A JP 2015167336 A JP2015167336 A JP 2015167336A JP 6646978 B2 JP6646978 B2 JP 6646978B2
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plasma
substrate
aspect ratio
silicon
high aspect
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JP2016051900A (ja
JP2016051900A5 (enExample
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バユ・テドジョイスワード
ヘレン・ジュウ
リンダ・マルケス
ジュン・パク
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Lam Research Corp
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Lam Research Corp
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    • H10P50/283—
    • H10P70/234—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H10P50/267—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Plasma Technology (AREA)
JP2015167336A 2014-08-29 2015-08-27 高アスペクト比構造におけるコンタクト洗浄 Active JP6646978B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462044117P 2014-08-29 2014-08-29
US62/044,117 2014-08-29
US14/577,977 2014-12-19
US14/577,977 US9558928B2 (en) 2014-08-29 2014-12-19 Contact clean in high-aspect ratio structures

Publications (3)

Publication Number Publication Date
JP2016051900A JP2016051900A (ja) 2016-04-11
JP2016051900A5 JP2016051900A5 (enExample) 2018-10-04
JP6646978B2 true JP6646978B2 (ja) 2020-02-14

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JP2015167336A Active JP6646978B2 (ja) 2014-08-29 2015-08-27 高アスペクト比構造におけるコンタクト洗浄

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US (1) US9558928B2 (enExample)
JP (1) JP6646978B2 (enExample)
KR (1) KR102402866B1 (enExample)
CN (1) CN105390389B (enExample)
TW (1) TWI673791B (enExample)

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Publication number Publication date
KR20160027925A (ko) 2016-03-10
TW201626451A (zh) 2016-07-16
KR102402866B1 (ko) 2022-05-26
US9558928B2 (en) 2017-01-31
CN105390389B (zh) 2018-05-11
JP2016051900A (ja) 2016-04-11
TWI673791B (zh) 2019-10-01
US20160064212A1 (en) 2016-03-03
CN105390389A (zh) 2016-03-09

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