JP6635908B2 - 圧電薄膜共振器、フィルタおよびマルチプレクサ - Google Patents
圧電薄膜共振器、フィルタおよびマルチプレクサ Download PDFInfo
- Publication number
- JP6635908B2 JP6635908B2 JP2016228266A JP2016228266A JP6635908B2 JP 6635908 B2 JP6635908 B2 JP 6635908B2 JP 2016228266 A JP2016228266 A JP 2016228266A JP 2016228266 A JP2016228266 A JP 2016228266A JP 6635908 B2 JP6635908 B2 JP 6635908B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- piezoelectric
- hole
- piezoelectric thin
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010409 thin film Substances 0.000 title claims description 48
- 239000010408 film Substances 0.000 claims description 245
- 230000001681 protective effect Effects 0.000 claims description 61
- 239000000758 substrate Substances 0.000 claims description 52
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 10
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000011241 protective layer Substances 0.000 claims 1
- 238000012986 modification Methods 0.000 description 22
- 230000004048 modification Effects 0.000 description 22
- 238000000034 method Methods 0.000 description 20
- 238000005530 etching Methods 0.000 description 14
- 238000009792 diffusion process Methods 0.000 description 13
- 238000004544 sputter deposition Methods 0.000 description 11
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 239000011651 chromium Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 230000000149 penetrating effect Effects 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- XLYOFNOQVPJJNP-ZSJDYOACSA-N Heavy water Chemical compound [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229910052805 deuterium Inorganic materials 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910021480 group 4 element Inorganic materials 0.000 description 2
- 229910021478 group 5 element Inorganic materials 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical group [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/175—Acoustic mirrors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02118—Means for compensation or elimination of undesirable effects of lateral leakage between adjacent resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
- H03H9/0523—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps for flip-chip mounting
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0571—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including bulk acoustic wave [BAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/566—Electric coupling means therefor
- H03H9/568—Electric coupling means therefor consisting of a ladder configuration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/703—Networks using bulk acoustic wave devices
- H03H9/706—Duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/021—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the air-gap type
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
図2(a)から図4(c)は、実施例1に係る圧電薄膜共振器の製造方法を示す断面図である。図1(a)のB−B断面に相当する。図2(a)に示すように、平坦主面を有する基板10上に空隙を形成するための犠牲層38を形成する。犠牲層38の膜厚は、例えば10〜100nmであり、MgO(酸化マグネシウム)、ZnO、Ge(ゲルマニウム)またはSiO2(酸化シリコン)等のエッチング液またはエッチングガスに容易に溶解できる材料から選択される。その後、犠牲層38を、フォトリソグラフィ技術およびエッチング技術を用い所望の形状にパターニングする。犠牲層38の形状は、空隙30の平面形状に相当する形状であり、例えば共振領域50となる領域を含む。犠牲層38は、例えば、スパッタリング法、真空蒸着法またはCVD(Chemical Vapor Deposition)法を用い成膜される。
図5(a)から図5(c)は、実施例1の圧電薄膜共振器の別の製造方法を示す断面図である。図5(a)に示すように、図3(b)の後に、圧電膜14、下部電極12および保護膜20aを貫通する貫通孔35を形成する。貫通孔35は犠牲層38に接している。
保護膜20の耐湿性を評価した。シリコン基板上にスパッタリング法を用いSiO 2 膜を成膜した。D2O(重水)を用い温度が85℃湿度が100%の環境に評価する絶縁膜を放置した。D2Oを用いるのは絶縁膜内に元々残存しているH2O(軽水)と分離するためである。
図9(a)は、実施例1の変形例1に係る圧電薄膜共振器の平面図、図9(b)および図9(c)は、図9(a)のA−A断面図およびB−B断面図である。図9(a)から図9(c)に示すように、圧電膜14と基板10との間に保護膜20が設けられていない。その他の構成は実施例1と同じであり説明を省略する。
12 下部電極
14 圧電膜
16 上部電極
20、20a、20b 保護膜
30 空隙
35、37 貫通孔
39 開口
40 基板
50 共振領域
60−64 フィルタ
Claims (6)
- 基板と、
前記基板上に空隙を介し設けられ、前記空隙と通じる孔である貫通孔を有し、窒化アルミニウムを主成分とする圧電膜と、
前記圧電膜の少なくとも一部を挟んで対向した下部電極および上部電極と、
前記圧電膜の上面、前記圧電膜の前記貫通孔以外の側面および前記貫通孔の内面を覆い、波長が632.8nmの光の屈折率が1.7以上の窒化酸化シリコン膜、密度が3g/cm3以上の酸化アルミニウム膜、またはダイヤモンドライクカーボン膜である保護膜と、
を具備し、
前記圧電膜は直接空気に触れない圧電薄膜共振器。 - 前記保護膜は、前記圧電膜の下面を覆う請求項1記載の圧電薄膜共振器。
- 前記上部電極上の前記保護膜に開口が設けられ、前記開口の内面および前記開口から露出する前記上部電極を覆うようにパッドが設けられている請求項1または2記載の圧電薄膜共振器。
- 前記圧電膜の少なくとも一部を挟み前記上部電極と前記下部電極とが対向する共振領域内の上部電極上に設けられた保護膜は、前記圧電膜の上面のうち前記共振領域以外の領域を覆う保護膜より薄い請求項1から3のいずれか一項記載の圧電薄膜共振器。
- 請求項1から4のいずれか一項記載の圧電薄膜共振器を含むフィルタ。
- 請求項5記載のフィルタを含むマルチプレクサ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016228266A JP6635908B2 (ja) | 2016-11-24 | 2016-11-24 | 圧電薄膜共振器、フィルタおよびマルチプレクサ |
US15/796,503 US11075614B2 (en) | 2016-11-24 | 2017-10-27 | Piezoelectric thin film resonator, filter, and multiplexer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016228266A JP6635908B2 (ja) | 2016-11-24 | 2016-11-24 | 圧電薄膜共振器、フィルタおよびマルチプレクサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018085651A JP2018085651A (ja) | 2018-05-31 |
JP6635908B2 true JP6635908B2 (ja) | 2020-01-29 |
Family
ID=62147894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016228266A Active JP6635908B2 (ja) | 2016-11-24 | 2016-11-24 | 圧電薄膜共振器、フィルタおよびマルチプレクサ |
Country Status (2)
Country | Link |
---|---|
US (1) | US11075614B2 (ja) |
JP (1) | JP6635908B2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019208614A1 (ja) | 2018-04-26 | 2019-10-31 | 三菱瓦斯化学株式会社 | 樹脂組成物、積層体、樹脂組成物層付き半導体ウェハ、樹脂組成物層付き半導体搭載用基板、及び半導体装置 |
WO2021053892A1 (ja) * | 2019-09-17 | 2021-03-25 | 株式会社村田製作所 | 圧電デバイスおよびその製造方法 |
KR20210045588A (ko) | 2019-10-17 | 2021-04-27 | 삼성전기주식회사 | 체적 음향 공진기 |
KR102574423B1 (ko) * | 2020-11-09 | 2023-09-04 | 삼성전기주식회사 | 체적 음향 공진기 |
CN114679150A (zh) * | 2020-12-24 | 2022-06-28 | 联华电子股份有限公司 | 半导体元件结构及其制造方法 |
WO2023033147A1 (ja) * | 2021-09-06 | 2023-03-09 | 株式会社村田製作所 | 弾性波装置 |
CN118020250A (zh) * | 2021-09-30 | 2024-05-10 | 株式会社村田制作所 | 弹性波装置 |
WO2023234321A1 (ja) * | 2022-05-31 | 2023-12-07 | 株式会社村田製作所 | 弾性波装置 |
WO2024142439A1 (ja) * | 2022-12-26 | 2024-07-04 | 株式会社村田製作所 | 圧電振動子 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0191600B1 (en) | 1985-02-08 | 1991-12-27 | Ajinomoto Co., Inc. | Polyphenyl-based ester compounds and liquid crystal compositions containing same |
JPH09130199A (ja) | 1995-10-27 | 1997-05-16 | Mitsubishi Electric Corp | 圧電薄膜素子およびその製法 |
JP3432997B2 (ja) * | 1996-04-23 | 2003-08-04 | 株式会社東芝 | 半導体装置に使用する絶縁膜 |
JP2004222244A (ja) * | 2002-12-27 | 2004-08-05 | Toshiba Corp | 薄膜圧電共振器およびその製造方法 |
US6954121B2 (en) * | 2003-06-09 | 2005-10-11 | Agilent Technologies, Inc. | Method for controlling piezoelectric coupling coefficient in film bulk acoustic resonators and apparatus embodying the method |
JP2005173106A (ja) * | 2003-12-10 | 2005-06-30 | Seiko Epson Corp | 電気光学装置及びその製造方法 |
JP4534158B2 (ja) * | 2003-12-19 | 2010-09-01 | 宇部興産株式会社 | 圧電薄膜デバイスの製造方法 |
JP2006210474A (ja) * | 2005-01-26 | 2006-08-10 | Victor Co Of Japan Ltd | 半導体レーザ素子の製造方法 |
JP2008160322A (ja) * | 2006-12-21 | 2008-07-10 | Toshiba Corp | 薄膜圧電共振器及び半導体装置 |
CN101842742B (zh) * | 2007-12-04 | 2013-02-13 | 夏普株式会社 | 显示装置及其制造方法 |
JP5202287B2 (ja) * | 2008-12-25 | 2013-06-05 | 京セラ株式会社 | 圧電共振器 |
JP2012004063A (ja) * | 2010-06-21 | 2012-01-05 | Seiko Epson Corp | 発光装置、電気光学装置、ならびに電子機器 |
CN103765770B (zh) * | 2011-09-01 | 2018-03-30 | 株式会社村田制作所 | 压电体波装置及其制造方法 |
JP5839103B2 (ja) * | 2012-02-20 | 2016-01-06 | 株式会社村田製作所 | 圧電バルク弾性波素子の製造方法及び圧電バルク弾性波素子 |
JP6175740B2 (ja) * | 2012-03-30 | 2017-08-09 | 株式会社Joled | 薄膜トランジスタおよびその製造方法並びに表示装置および電子機器 |
JP2014060384A (ja) * | 2012-08-23 | 2014-04-03 | Canon Inc | 面発光レーザー、光源装置、光源装置の駆動方法及び光干渉断層撮像装置 |
KR20150060343A (ko) * | 2013-11-26 | 2015-06-03 | 삼성전기주식회사 | 수정 진동자 및 그 제조방법 |
US9853626B2 (en) * | 2014-03-31 | 2017-12-26 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator comprising acoustic redistribution layers and lateral features |
-
2016
- 2016-11-24 JP JP2016228266A patent/JP6635908B2/ja active Active
-
2017
- 2017-10-27 US US15/796,503 patent/US11075614B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20180145655A1 (en) | 2018-05-24 |
JP2018085651A (ja) | 2018-05-31 |
US11075614B2 (en) | 2021-07-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6635908B2 (ja) | 圧電薄膜共振器、フィルタおよびマルチプレクサ | |
JP6886357B2 (ja) | 圧電薄膜共振器、フィルタおよびマルチプレクサ | |
JP6510987B2 (ja) | 圧電薄膜共振器、フィルタおよびデュプレクサ | |
JP6510996B2 (ja) | 圧電薄膜共振器、フィルタおよびデュプレクサ | |
JP7017364B2 (ja) | ラダー型フィルタ、圧電薄膜共振器およびその製造方法 | |
JP6302263B2 (ja) | 圧電薄膜共振器、フィルタおよびデュプレクサ | |
JP6556099B2 (ja) | 圧電薄膜共振器、フィルタおよびマルチプレクサ | |
JP5792554B2 (ja) | 弾性波デバイス | |
JP6374653B2 (ja) | 弾性波フィルタ及び分波器 | |
JP6573853B2 (ja) | 弾性波デバイスおよびその製造方法 | |
US9496848B2 (en) | Piezoelectric thin-film resonator, filter and duplexer utilizing a piezoelectric film having an air space | |
JP6298796B2 (ja) | 圧電薄膜共振器およびその製造方法 | |
JP6668201B2 (ja) | 圧電薄膜共振器、フィルタおよびマルチプレクサ。 | |
US10886889B2 (en) | Acoustic wave device and method of fabricating the same, filter and multiplexer | |
US10680576B2 (en) | Piezoelectric thin film resonator, filter, and duplexer | |
JP6302437B2 (ja) | 弾性波フィルタ、分波器、及びモジュール | |
JP2018125762A (ja) | 圧電薄膜共振器、フィルタおよびマルチプレクサ | |
KR20180080875A (ko) | 음향 공진기 및 그 제조방법 | |
JP6923365B2 (ja) | 弾性波デバイス | |
JP7343991B2 (ja) | 圧電薄膜共振器、弾性波デバイス、フィルタおよびマルチプレクサ | |
JP6909059B2 (ja) | 圧電薄膜共振器、フィルタおよびマルチプレクサ | |
JP7190313B2 (ja) | 圧電薄膜共振器、フィルタおよびマルチプレクサ | |
JP2018117194A (ja) | 圧電薄膜共振器およびその製造方法、フィルタ並びにマルチプレクサ | |
JP2022025884A (ja) | 弾性波デバイス、フィルタ、及びマルチプレクサ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180305 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180305 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20181219 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190108 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190308 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190618 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190808 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190917 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191002 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191126 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191217 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6635908 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |