JP6628869B2 - 薄膜製造装置、薄膜製造方法 - Google Patents
薄膜製造装置、薄膜製造方法 Download PDFInfo
- Publication number
- JP6628869B2 JP6628869B2 JP2018515709A JP2018515709A JP6628869B2 JP 6628869 B2 JP6628869 B2 JP 6628869B2 JP 2018515709 A JP2018515709 A JP 2018515709A JP 2018515709 A JP2018515709 A JP 2018515709A JP 6628869 B2 JP6628869 B2 JP 6628869B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- film thickness
- thickness sensor
- thin film
- growth rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000010409 thin film Substances 0.000 title claims description 76
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 239000010408 film Substances 0.000 claims description 214
- 230000015572 biosynthetic process Effects 0.000 claims description 52
- 239000000463 material Substances 0.000 claims description 31
- 239000010419 fine particle Substances 0.000 claims description 30
- 238000010438 heat treatment Methods 0.000 claims description 18
- 238000007599 discharging Methods 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 description 31
- 238000001704 evaporation Methods 0.000 description 31
- 239000011368 organic material Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 238000005259 measurement Methods 0.000 description 10
- 230000000903 blocking effect Effects 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 230000010355 oscillation Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016093400 | 2016-05-06 | ||
JP2016093400 | 2016-05-06 | ||
PCT/JP2017/016584 WO2017191796A1 (ja) | 2016-05-06 | 2017-04-26 | 薄膜製造装置、薄膜製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017191796A1 JPWO2017191796A1 (ja) | 2018-10-25 |
JP6628869B2 true JP6628869B2 (ja) | 2020-01-15 |
Family
ID=60202993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018515709A Active JP6628869B2 (ja) | 2016-05-06 | 2017-04-26 | 薄膜製造装置、薄膜製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6628869B2 (ko) |
KR (1) | KR102193817B1 (ko) |
CN (1) | CN109154071B (ko) |
TW (1) | TW201809327A (ko) |
WO (1) | WO2017191796A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108342699B (zh) * | 2018-02-11 | 2020-06-30 | 中国科学院上海光学精密机械研究所 | 综合沉积镀膜设备及综合镀膜方法 |
JP7064407B2 (ja) * | 2018-08-31 | 2022-05-10 | キヤノントッキ株式会社 | 成膜装置及び成膜装置の制御方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58217673A (ja) * | 1982-06-11 | 1983-12-17 | Anelva Corp | 膜厚制御方法 |
JPS5910339A (ja) * | 1982-07-09 | 1984-01-19 | Hitachi Ltd | 連続成膜装置 |
JPH07283281A (ja) * | 1994-04-05 | 1995-10-27 | Toshiba Corp | ターゲットの寿命判断方法及びスパッタ装置 |
JP4706380B2 (ja) * | 2005-08-04 | 2011-06-22 | ソニー株式会社 | 蒸着装置及び蒸着方法 |
JP4728143B2 (ja) * | 2006-02-27 | 2011-07-20 | 株式会社シンクロン | 薄膜形成装置 |
CN102639746B (zh) * | 2009-12-09 | 2014-03-12 | 株式会社爱发科 | 有机薄膜的成膜装置以及有机材料成膜方法 |
KR20120023273A (ko) * | 2010-09-01 | 2012-03-13 | (주)알파플러스 | 셔터를 이용하는 진공증착막의 두께 모니터링 방법 및 이 방법을 채용하는 진공증착장치 |
JP5910339B2 (ja) * | 2012-06-13 | 2016-04-27 | 富士通株式会社 | カプラ、ソケット及びプラグ |
KR101959975B1 (ko) * | 2012-07-10 | 2019-07-16 | 삼성디스플레이 주식회사 | 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
SG11201608133PA (en) | 2014-05-26 | 2016-11-29 | Ulvac Inc | Film-forming device, method for measuring film thickness of organic film, and film thickness sensor for organic film |
CN105177520B (zh) * | 2015-08-05 | 2016-06-08 | 京东方科技集团股份有限公司 | 膜厚调节器及其制造方法、调节方法、蒸镀设备 |
-
2017
- 2017-04-26 KR KR1020187025289A patent/KR102193817B1/ko active IP Right Grant
- 2017-04-26 WO PCT/JP2017/016584 patent/WO2017191796A1/ja active Application Filing
- 2017-04-26 JP JP2018515709A patent/JP6628869B2/ja active Active
- 2017-04-26 CN CN201780028113.4A patent/CN109154071B/zh active Active
- 2017-05-03 TW TW106114677A patent/TW201809327A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20180110004A (ko) | 2018-10-08 |
CN109154071A (zh) | 2019-01-04 |
TW201809327A (zh) | 2018-03-16 |
KR102193817B1 (ko) | 2020-12-22 |
JPWO2017191796A1 (ja) | 2018-10-25 |
WO2017191796A1 (ja) | 2017-11-09 |
CN109154071B (zh) | 2020-10-27 |
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