SG11201608133PA - Film-forming device, method for measuring film thickness of organic film, and film thickness sensor for organic film - Google Patents
Film-forming device, method for measuring film thickness of organic film, and film thickness sensor for organic filmInfo
- Publication number
- SG11201608133PA SG11201608133PA SG11201608133PA SG11201608133PA SG11201608133PA SG 11201608133P A SG11201608133P A SG 11201608133PA SG 11201608133P A SG11201608133P A SG 11201608133PA SG 11201608133P A SG11201608133P A SG 11201608133PA SG 11201608133P A SG11201608133P A SG 11201608133PA
- Authority
- SG
- Singapore
- Prior art keywords
- film
- organic
- film thickness
- forming device
- measuring
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
- Physical Vapour Deposition (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014107816 | 2014-05-26 | ||
PCT/JP2015/002580 WO2015182090A1 (en) | 2014-05-26 | 2015-05-22 | Film-forming device, method for measuring film thickness of organic film, and film thickness sensor for organic film |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201608133PA true SG11201608133PA (en) | 2016-11-29 |
Family
ID=54698445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201608133PA SG11201608133PA (en) | 2014-05-26 | 2015-05-22 | Film-forming device, method for measuring film thickness of organic film, and film thickness sensor for organic film |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6078694B2 (en) |
KR (2) | KR102035146B1 (en) |
CN (1) | CN106232858A (en) |
SG (1) | SG11201608133PA (en) |
WO (1) | WO2015182090A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10818564B2 (en) * | 2016-03-11 | 2020-10-27 | Applied Materials, Inc. | Wafer processing tool having a micro sensor |
JP6628869B2 (en) | 2016-05-06 | 2020-01-15 | 株式会社アルバック | Thin film manufacturing apparatus and thin film manufacturing method |
WO2017195674A1 (en) | 2016-05-13 | 2017-11-16 | 株式会社アルバック | Apparatus for manufacturing organic thin film, and method for manufacturing organic thin film |
US10100410B2 (en) * | 2016-08-05 | 2018-10-16 | Industrial Technology Research Institute | Film thickness monitoring system and method using the same |
JP6564745B2 (en) * | 2016-09-06 | 2019-08-21 | 株式会社アルバック | Film thickness sensor |
US10763143B2 (en) | 2017-08-18 | 2020-09-01 | Applied Materials, Inc. | Processing tool having a monitoring device |
CN110257791B (en) * | 2019-04-29 | 2021-07-20 | 昆山国显光电有限公司 | Speed monitoring device, evaporation equipment and evaporation method |
TWI701641B (en) * | 2019-10-01 | 2020-08-11 | 龍翩真空科技股份有限公司 | Wireless transmission film thickness monitoring device |
CN113811634B (en) | 2019-12-17 | 2023-04-04 | 株式会社爱发科 | Measurement abnormality detection device and measurement abnormality detection method |
CN111206232A (en) * | 2020-03-03 | 2020-05-29 | 成都晶砂科技有限公司 | Vacuum steamed bun steaming equipment |
CN111188020A (en) * | 2020-03-03 | 2020-05-22 | 成都晶砂科技有限公司 | Vacuum steamed bun steaming equipment |
CN111829428B (en) * | 2020-06-17 | 2022-02-15 | 华中科技大学 | Double-quartz-crystal diaphragm thickness control instrument and error correction method |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS605619A (en) * | 1983-06-23 | 1985-01-12 | Seikosha Co Ltd | Thickness-shear piezoelectric vibrator |
JP3401112B2 (en) * | 1995-03-20 | 2003-04-28 | 株式会社アルバック | Oscillation circuit for piezoelectric crystal oscillation type film thickness meter |
JPH09250918A (en) * | 1996-03-13 | 1997-09-22 | Miyota Kk | Monitor for forming film of electrode |
JPH09326668A (en) * | 1996-04-02 | 1997-12-16 | Seiko Epson Corp | Piezoelectric element and production of the same |
JP3953301B2 (en) | 2001-11-05 | 2007-08-08 | 株式会社アルバック | Sensor head for crystal oscillation type film thickness monitor |
JP3599188B2 (en) * | 2002-02-14 | 2004-12-08 | 株式会社半導体先端テクノロジーズ | Method for analyzing film characteristics and apparatus for analyzing film characteristics |
JP2006118009A (en) * | 2004-10-22 | 2006-05-11 | Canon Inc | Method for depositing thin film |
JP4001296B2 (en) * | 2005-08-25 | 2007-10-31 | トッキ株式会社 | Method and apparatus for vacuum deposition of organic materials |
JP2008245243A (en) * | 2007-02-26 | 2008-10-09 | Epson Toyocom Corp | Contour resonator and adjustment method therefor |
CN101802251B (en) * | 2007-09-21 | 2013-01-23 | 株式会社爱发科 | Thin film forming apparatus, film thickness measuring method and film thickness sensor |
JP2009185344A (en) * | 2008-02-07 | 2009-08-20 | Sony Corp | Vapor deposition method, vapor deposition apparatus, and method for manufacturing display device |
JP4773581B2 (en) * | 2008-09-22 | 2011-09-14 | パイオニア株式会社 | Film thickness measuring instrument using PLL circuit |
JP5121645B2 (en) * | 2008-09-25 | 2013-01-16 | 日立造船株式会社 | Film thickness detector for vacuum deposition equipment |
JP2010196082A (en) * | 2009-02-23 | 2010-09-09 | Canon Inc | Vacuum vapor deposition apparatus |
CN102639746B (en) * | 2009-12-09 | 2014-03-12 | 株式会社爱发科 | Film forming device for organic thin films, and method for forming film using organic materials |
JP2014062310A (en) * | 2012-09-24 | 2014-04-10 | Hitachi High-Technologies Corp | Film thickness sensor, and vacuum evaporation apparatus and vacuum evaporation method using the same |
-
2015
- 2015-05-22 KR KR1020167026478A patent/KR102035146B1/en active IP Right Grant
- 2015-05-22 SG SG11201608133PA patent/SG11201608133PA/en unknown
- 2015-05-22 KR KR1020187015514A patent/KR20180063369A/en active Application Filing
- 2015-05-22 JP JP2016523133A patent/JP6078694B2/en active Active
- 2015-05-22 WO PCT/JP2015/002580 patent/WO2015182090A1/en active Application Filing
- 2015-05-22 CN CN201580020079.7A patent/CN106232858A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2015182090A1 (en) | 2015-12-03 |
CN106232858A (en) | 2016-12-14 |
KR102035146B1 (en) | 2019-10-22 |
KR20180063369A (en) | 2018-06-11 |
JP6078694B2 (en) | 2017-02-08 |
JPWO2015182090A1 (en) | 2017-04-20 |
KR20160127078A (en) | 2016-11-02 |
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