JP6627510B2 - ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 - Google Patents

ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 Download PDF

Info

Publication number
JP6627510B2
JP6627510B2 JP2015550949A JP2015550949A JP6627510B2 JP 6627510 B2 JP6627510 B2 JP 6627510B2 JP 2015550949 A JP2015550949 A JP 2015550949A JP 2015550949 A JP2015550949 A JP 2015550949A JP 6627510 B2 JP6627510 B2 JP 6627510B2
Authority
JP
Japan
Prior art keywords
polyimide
polyimide precursor
chemical formula
repeating unit
bis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015550949A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2015080139A1 (ja
Inventor
卓也 岡
卓也 岡
幸徳 小濱
幸徳 小濱
久野　信治
信治 久野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Publication of JPWO2015080139A1 publication Critical patent/JPWO2015080139A1/ja
Application granted granted Critical
Publication of JP6627510B2 publication Critical patent/JP6627510B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2015550949A 2013-11-27 2014-11-26 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 Active JP6627510B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013245482 2013-11-27
JP2013245482 2013-11-27
PCT/JP2014/081208 WO2015080139A1 (ja) 2013-11-27 2014-11-26 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板

Publications (2)

Publication Number Publication Date
JPWO2015080139A1 JPWO2015080139A1 (ja) 2017-03-16
JP6627510B2 true JP6627510B2 (ja) 2020-01-08

Family

ID=53199079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015550949A Active JP6627510B2 (ja) 2013-11-27 2014-11-26 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板

Country Status (5)

Country Link
JP (1) JP6627510B2 (zh)
KR (1) KR102188483B1 (zh)
CN (1) CN105764990B (zh)
TW (1) TWI641631B (zh)
WO (1) WO2015080139A1 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6672815B2 (ja) * 2015-04-14 2020-03-25 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶素子
JP6705661B2 (ja) * 2016-02-26 2020-06-03 東京応化工業株式会社 カルボン酸エステル含有組成物
KR102472822B1 (ko) * 2016-09-13 2022-12-02 도쿄 오카 고교 가부시키가이샤 감광성 수지 조성물, 폴리아미드 수지, 폴리아미드 수지의 제조 방법, 화합물, 화합물의 제조 방법, 경화막의 제조 방법 및 경화막
CN108727588B (zh) * 2017-04-20 2022-06-17 三星电子株式会社 聚(酰胺-酰亚胺)共聚物、包括聚(酰胺-酰亚胺)共聚物的制品、和包括其的显示设备
KR102015769B1 (ko) 2018-01-12 2019-08-29 경희대학교 산학협력단 폴리아믹산 공중합체, 이를 이용하여 제조된 고내열성 투명 폴리이미드 필름 및 이의 제조방법
CN108898073A (zh) * 2018-06-12 2018-11-27 武汉天马微电子有限公司 显示面板及其制备方法和显示装置
CN114621440A (zh) * 2018-12-18 2022-06-14 苏州予信天材新材料应用技术有限公司 一种耐高温型聚酰胺-聚醚酰亚胺增韧聚合物及其制备方法
JP2020158744A (ja) * 2019-03-19 2020-10-01 三菱ケミカル株式会社 ポリイミド及びポリイミドフィルム
KR102615490B1 (ko) 2019-09-20 2023-12-19 유비이 가부시키가이샤 폴리이미드 전구체 조성물 및 플렉시블 전자 디바이스의 제조 방법
KR102347589B1 (ko) * 2019-11-07 2022-01-10 피아이첨단소재 주식회사 저유전 폴리이미드 필름 및 그 제조방법
KR102362385B1 (ko) * 2019-11-13 2022-02-15 피아이첨단소재 주식회사 고탄성 및 고내열 폴리이미드 필름 및 그 제조방법
JP2021175790A (ja) * 2020-04-24 2021-11-04 旭化成株式会社 ポリイミド前駆体及びそれを含む樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
JPWO2021261177A1 (zh) * 2020-06-23 2021-12-30
KR20230056652A (ko) * 2020-08-26 2023-04-27 가부시키가이샤 가네카 폴리아미드산 조성물, 폴리이미드, 폴리이미드막, 적층체, 적층체의 제조 방법 및 전자 디바이스
CN116057109B (zh) 2020-09-10 2024-05-14 三菱瓦斯化学株式会社 聚合物组合物、清漆、和聚酰亚胺薄膜
CN116096820A (zh) 2020-09-10 2023-05-09 三菱瓦斯化学株式会社 聚合物组合物、清漆、和聚酰亚胺薄膜
TW202227535A (zh) * 2020-11-27 2022-07-16 日商宇部興產股份有限公司 聚醯亞胺前驅體組合物、聚醯亞胺膜、及聚醯亞胺膜/基材積層體
JP2024521539A (ja) * 2021-06-07 2024-05-31 デュポン エレクトロニクス インコーポレイテッド 電子デバイスで使用するためのポリマー
KR20240131021A (ko) * 2023-02-23 2024-08-30 피아이첨단소재 주식회사 그라파이트 시트용 폴리이미드 필름 및 이로부터 제조된 그라파이트 시트

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3634745A (en) * 1970-05-27 1972-01-11 Ibm Digital velocity servo for dc servomotor
JP2673547B2 (ja) * 1988-07-15 1997-11-05 鐘淵化学工業株式会社 改良されたポリイミドフィルム及び該製造方法
JP3138993B2 (ja) 1992-07-30 2001-02-26 ジェイエスアール株式会社 液晶配向剤および液晶表示素子
JP2002069179A (ja) 2000-08-29 2002-03-08 Ube Ind Ltd 可溶性、透明なポリイミドおよびその製造法
JP2002146021A (ja) 2000-11-10 2002-05-22 Ube Ind Ltd 可溶性、透明なポリイミドおよびその製造法
JP2003168800A (ja) 2001-11-30 2003-06-13 Mitsubishi Gas Chem Co Inc 薄膜トランジスタ基板
JP3824533B2 (ja) 2001-12-28 2006-09-20 三井化学株式会社 無色透明ポリイミド
JP2004083814A (ja) 2002-08-29 2004-03-18 Mitsui Chemicals Inc 新規なポリアミド酸およびポリイミド
JP4254357B2 (ja) * 2003-06-10 2009-04-15 東レ株式会社 ポリエステル樹脂組成物およびそのフィルム
CN1288194C (zh) * 2005-01-31 2006-12-06 南京工业大学 一种挠性印刷线路板用聚酰亚胺薄膜的制备方法
JP2007002023A (ja) 2005-06-21 2007-01-11 Fujifilm Holdings Corp フィルムおよび画像表示装置
JP2008038141A (ja) * 2006-07-12 2008-02-21 Toray Ind Inc 耐熱性樹脂組成物およびそれを用いた金属樹脂複合体
JP5589384B2 (ja) 2007-05-24 2014-09-17 三菱瓦斯化学株式会社 無色透明樹脂フィルムの製造方法及び製造装置
JP5270865B2 (ja) 2007-06-13 2013-08-21 三井化学株式会社 接着剤並びにその用途
JP4767931B2 (ja) * 2007-09-19 2011-09-07 信越化学工業株式会社 難燃性ポリイミドシリコーン樹脂組成物
KR101292886B1 (ko) 2009-09-29 2013-08-02 코오롱인더스트리 주식회사 내용제성이 개선된 무색투명한 폴리이미드 필름
WO2011059089A1 (ja) * 2009-11-16 2011-05-19 旭化成イーマテリアルズ株式会社 ポリイミド前駆体及び該ポリイミド前駆体を含む感光性樹脂組成物
JP5345709B2 (ja) 2010-02-09 2013-11-20 Ｊｘ日鉱日石エネルギー株式会社 ノルボルナン−２−スピロ−α−シクロアルカノン−α’−スピロ−２’’−ノルボルナン−５，５’’，６，６’’−テトラカルボン酸二無水物類、ノルボルナン−２−スピロ−α−シクロアルカノン−α’−スピロ−２’’−ノルボルナン−５，５’’，６，６’’−テトラカルボン酸及びそのエステル類、ノルボルナン−２−スピロ−α−シクロアルカノン−α’−スピロ−２’’−ノルボルナン−５，５’’，６，６’’−テトラカルボン酸二無水物類の製造方法、それを用いて得られるポリイミド、並びに、ポリイミドの製造方法
JP2012041473A (ja) * 2010-08-20 2012-03-01 Kaneka Corp ポリイミドフィルムおよび該フィルムの製造方法
CN103732404B (zh) * 2011-06-14 2016-05-25 宇部兴产株式会社 制备聚酰亚胺层压制品的方法以及该聚酰亚胺层压制品
JP6032202B2 (ja) * 2011-06-14 2016-11-24 宇部興産株式会社 ポリイミド積層体の製造方法、およびポリイミド積層体
JP6060695B2 (ja) * 2012-01-20 2017-01-18 宇部興産株式会社 ポリイミド前駆体及びポリイミド

Also Published As

Publication number Publication date
TW201525025A (zh) 2015-07-01
TWI641631B (zh) 2018-11-21
JPWO2015080139A1 (ja) 2017-03-16
WO2015080139A1 (ja) 2015-06-04
KR20160091935A (ko) 2016-08-03
CN105764990A (zh) 2016-07-13
KR102188483B1 (ko) 2020-12-08
CN105764990B (zh) 2018-03-20

Similar Documents

Publication Publication Date Title
JP6627510B2 (ja) ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
JP6721070B2 (ja) ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
JP6531812B2 (ja) ポリイミド前駆体及びポリイミド
JP6669074B2 (ja) ポリイミドフィルム、ポリイミド前駆体、及びポリイミド
JP5978288B2 (ja) ポリイミド前駆体、ポリイミド、ポリイミドフィルム、ワニス、及び基板
JP6283954B2 (ja) ポリイミド前駆体、ポリイミド、ワニス、ポリイミドフィルム、及び基板
JP6607193B2 (ja) ポリイミド前駆体、ポリイミド、及びポリイミドフィルム
WO2015053312A1 (ja) ポリイミド前駆体、ポリイミド、ポリイミドフィルム、ワニス、及び基板
KR102076877B1 (ko) 폴리이미드 전구체, 폴리이미드, 바니시, 폴리이미드 필름, 및 기판
JP7047852B2 (ja) ポリイミド前駆体、ポリイミド、ポリイミドフィルム、ワニス、及び基板
JP7069478B2 (ja) ポリイミド、ポリイミド溶液組成物、ポリイミドフィルム、及び基板
JP6638744B2 (ja) ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
WO2015080156A1 (ja) ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170928

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170928

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20180420

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180807

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181005

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190402

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20191105

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20191118

R150 Certificate of patent or registration of utility model

Ref document number: 6627510

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250