JP6627143B2 - 基板の基板位置を押下するためのダウンホルダ - Google Patents

基板の基板位置を押下するためのダウンホルダ Download PDF

Info

Publication number
JP6627143B2
JP6627143B2 JP2014243892A JP2014243892A JP6627143B2 JP 6627143 B2 JP6627143 B2 JP 6627143B2 JP 2014243892 A JP2014243892 A JP 2014243892A JP 2014243892 A JP2014243892 A JP 2014243892A JP 6627143 B2 JP6627143 B2 JP 6627143B2
Authority
JP
Japan
Prior art keywords
plate
down holder
opening
drive
holder plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014243892A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015115606A (ja
Inventor
グイド スーター，
グイド スーター，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Besi Switzerland AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland AG filed Critical Besi Switzerland AG
Publication of JP2015115606A publication Critical patent/JP2015115606A/ja
Application granted granted Critical
Publication of JP6627143B2 publication Critical patent/JP6627143B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Actuator (AREA)
  • Die Bonding (AREA)
  • Road Paving Machines (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2014243892A 2013-12-09 2014-12-02 基板の基板位置を押下するためのダウンホルダ Expired - Fee Related JP6627143B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH02035/13A CH708932B1 (de) 2013-12-09 2013-12-09 Niederhalter zum Niederhalten der Substratplätze eines Substrats zwecks Montage von Halbleiterbauteilen.
CH02035/13 2013-12-09

Publications (2)

Publication Number Publication Date
JP2015115606A JP2015115606A (ja) 2015-06-22
JP6627143B2 true JP6627143B2 (ja) 2020-01-08

Family

ID=53185405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014243892A Expired - Fee Related JP6627143B2 (ja) 2013-12-09 2014-12-02 基板の基板位置を押下するためのダウンホルダ

Country Status (7)

Country Link
JP (1) JP6627143B2 (de)
KR (1) KR20150067019A (de)
CN (1) CN104701220B (de)
CH (1) CH708932B1 (de)
DE (1) DE102014116939A1 (de)
HK (1) HK1206867A1 (de)
SG (1) SG10201407399PA (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023110438A1 (de) 2023-04-24 2024-10-24 Besi Switzerland Ag Vorrichtung mit einer verbesserten Niederhaltevorrichtung

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120834A (ja) * 1987-11-04 1989-05-12 Nec Corp 半導体素子のダイボンディング装置
JPH0538884U (ja) * 1991-10-28 1993-05-25 関西日本電気株式会社 リードボンダ
JPH06252210A (ja) * 1993-02-25 1994-09-09 Nec Kansai Ltd インナーリードボンダ
US5556808A (en) * 1994-06-30 1996-09-17 Motorola Inc. Method for aligning a semiconductor device
JP2000021930A (ja) * 1998-07-01 2000-01-21 Nippon Avionics Co Ltd 熱圧着装置
DE10058145B4 (de) * 1999-11-26 2006-12-28 Smc K.K. Zylindervorrichtung
JP3850351B2 (ja) * 2002-04-25 2006-11-29 京セラ株式会社 電子部品素子の実装方法
US7048174B2 (en) * 2003-08-25 2006-05-23 The Boeing Company Adaptable spring force clamping apparatus and methods
JP4241683B2 (ja) * 2005-07-06 2009-03-18 パナソニック株式会社 部品押圧装置
FR2905883B1 (fr) * 2006-09-14 2008-12-05 Valeo Electronique Sys Liaison Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre
JP4839407B2 (ja) * 2007-11-08 2011-12-21 株式会社アルバック 貼合せ基板製造装置および貼合せ基板製造方法
JP5359009B2 (ja) * 2008-04-18 2013-12-04 株式会社ニコン 半導体基板の貼り合わせ装置
CN201262949Y (zh) * 2008-09-04 2009-06-24 浙江华越芯装电子股份有限公司 集成电路热压超声球焊机改进型压焊夹具
WO2011036900A1 (ja) * 2009-09-28 2011-03-31 株式会社ニコン 加圧モジュール、加圧装置及び基板貼り合せ装置
JP5580163B2 (ja) * 2010-10-13 2014-08-27 東レエンジニアリング株式会社 実装装置の平行度調整方法および平行度調整装置
TWI564106B (zh) * 2011-03-28 2017-01-01 山田尖端科技股份有限公司 接合裝置以及接合方法
JP2013143542A (ja) * 2012-01-12 2013-07-22 Tokyo Electron Ltd 半導体デバイス製造システム及び半導体デバイス製造方法
SG11201405431TA (en) * 2012-03-07 2014-10-30 Toray Industries Method and apparatus for manufacturing semiconductor device

Also Published As

Publication number Publication date
SG10201407399PA (en) 2015-07-30
HK1206867A1 (en) 2016-01-15
CH708932B1 (de) 2017-04-13
CN104701220B (zh) 2019-07-23
KR20150067019A (ko) 2015-06-17
CN104701220A (zh) 2015-06-10
CH708932A1 (de) 2015-06-15
DE102014116939A1 (de) 2015-06-11
JP2015115606A (ja) 2015-06-22

Similar Documents

Publication Publication Date Title
US10578646B2 (en) Testing head comprising vertical probes with internal openings
ES2310313T3 (es) Componente electrico, especialmente armadura de rele con bornes elasticos y procedimiento para su produccion.
JP5467547B2 (ja) 照明器具
JP6450891B1 (ja) 照明装置の熱感度の低減
US20090323347A1 (en) Led lamp
JP2012064391A (ja) 照明器具
TWI586917B (zh) 陣列燈座以及具有該陣列燈座的ｌｅｄ模組
US20160138769A1 (en) Lamp for use in a lighting strip system and lighting strip system
JP5565955B2 (ja) 照明器具
US9890933B2 (en) Holder of light-emitting module, and lighting apparatus
JP6627143B2 (ja) 基板の基板位置を押下するためのダウンホルダ
JP6641818B2 (ja) プローブピン、および、これを備えた検査治具
US20060162920A1 (en) Heat sink
JP2011023227A (ja) 光源ユニット及び照明器具
JP2011103298A (ja) モジュラー的に組立可能なランプホルダー
JP4379731B2 (ja) 発光装置
KR102462714B1 (ko) 조명 기구, 부착 금구 및 부착 금구 세트
US20090316407A1 (en) Light emitting module and light emitting module array
JP2006073963A5 (de)
CN103796470B (zh) 一种功率管固定装置
JPWO2013038493A1 (ja) 半導体モジュール
TW201825833A (zh) 發光配置及發光系統
RU2239732C2 (ru) Зажимное устройство для крепления на детали фасонной формы
US7292443B1 (en) Heat sink mounting assembly
US20180288901A1 (en) Heat dissipation device having compact vapor chamber

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20171110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180320

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180809

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180821

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20181120

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20190115

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190513

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20190628

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190723

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190821

R150 Certificate of patent or registration of utility model

Ref document number: 6627143

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees